CN201424518Y - Electroplating device - Google Patents

Electroplating device Download PDF

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Publication number
CN201424518Y
CN201424518Y CN2009201354690U CN200920135469U CN201424518Y CN 201424518 Y CN201424518 Y CN 201424518Y CN 2009201354690 U CN2009201354690 U CN 2009201354690U CN 200920135469 U CN200920135469 U CN 200920135469U CN 201424518 Y CN201424518 Y CN 201424518Y
Authority
CN
China
Prior art keywords
plate
baffle
negative
washer
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009201354690U
Other languages
Chinese (zh)
Inventor
王笑冰
李建兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REFLECTIVE MATERIALS MANUFACTORY Co SZU
Original Assignee
REFLECTIVE MATERIALS MANUFACTORY Co SZU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REFLECTIVE MATERIALS MANUFACTORY Co SZU filed Critical REFLECTIVE MATERIALS MANUFACTORY Co SZU
Priority to CN2009201354690U priority Critical patent/CN201424518Y/en
Application granted granted Critical
Publication of CN201424518Y publication Critical patent/CN201424518Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an electroplating device, in particular to an electroplating device used for manufacturing embossing plate. The electroplating device comprises an electroplating bath filled with electroplating liquid; and a cathode plate and an anode plate are arranged in the electroplating liquid. The utility model is characterized in that the cathode plate and the anode plate are arranged in parallel; a baffle is arranged between the cathode plate and the anode plate; the front side of the baffle is a plane; through holes are uniformly distributed on the baffle; the axle centersof the through holes are perpendicular to the front side of the baffle; and the back side of the baffle is an internal spherical surface. The utility model provides an improved electroplating devicewhich can enable the plated layer of the embossing plate to be uniform.

Description

A kind of electroplanting device
Technical field
The utility model relates to a kind of electroplanting device, relates in particular to a kind of electroplanting device that coining plate is used of making.
Background technology
Counterfeit and shoddy goods seriously disturb commodity market, infringement human consumer's interests.Be protection manufacturer and human consumer's interests, increase the ability that the human consumer discerns certified products, on product, use anti-counterfeiting mark usually.
The most frequently used anti-counterfeiting mark is exactly a holographic anti-counterfeiting film, and holographic anti-counterfeiting film is generally made by the impression mode, promptly makes the coining plate that has specific identifier in advance, finishes the stamp work of sign then on stamping press.Coining plate itself also is kind of a thin nickel plate, and certain thickness in the back re-plating of front reproducing holographic sign during work, prints to the hologram marking on the metallic nickel version on the holographic anti-counterfeiting film by impression.
The existing plating device comprises negative plate and positive plate, all is arranged in the electroplate liquid in the plating tank, and the coining plate that is plated places between negative plate and the positive plate.The coining plate that this kind device plates out, the coating of its edge always is thicker than the middle part, adjusts the position of current parameters and negative plate, positive plate repeatedly, also can't improve.This kind coining plate is when the impression holographic anti-counterfeiting film, can cause the edge to print to, middle but print less than or the uneven phenomenon of seal, has only the mode that adopts pressure boost, the whole breadth of holographic anti-counterfeiting film all can be printed to, can make deformation of thin membrane again, influence impression quality but pressure is excessive, and because the pressure of edge and middle part is inhomogeneous, the impression effect is difficult to ideal.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art part and provides a kind of and can make the uniform improved type electric plating appts of coining plate coating.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of electroplanting device, comprise plating tank, electroplate liquid is housed in the plating tank, negative plate, positive plate are set in the electroplate liquid, it is characterized in that: negative plate and positive plate be arranged in parallel, and between negative plate and positive plate plate washer are set, the baffle plate front is the plane, be evenly distributed with through hole on the baffle plate, the axle center of through hole is perpendicular to the front of described baffle plate, and the reverse side of described plate washer is an Internal Spherical Surface.
A kind of electroplanting device is characterized in that, described negative plate has two, is arranged on two sides of positive plate, and described accordingly baffle plate also has two, is arranged between two negative plates and the positive plate.
A kind of electroplanting device is characterized in that, described plate washer is the PC material.
A kind of electroplanting device is characterized in that, described plate washer links together by fastening piece and negative plate, and the front of described plate washer is provided with contour pad towards described negative plate between described plate washer and the described negative plate.
The electroplanting device that the utility model relates to, between negative plate and positive plate, be provided with the plate washer that has through hole, part has intercepted power line in the electroplate liquid, because the distribution of power line is not to be parallel to the through hole axle center fully,, the obstruct at the position that the thicker position of plate washer approaches wants big so making effect.The reverse side of plate washer is arranged to Internal Spherical Surface, and the thinnest in the middle of it so, the edge is the thickest, thereby in the middle of the barriering effect at edge is greater than, so that reduce to be pressure-plated with the thickness of printing plate edge coating.The electroplanting device that the utility model relates to compared with prior art, has and makes the coating effect of uniform that is pressure-plated with forme.
Description of drawings
Fig. 1 is the synoptic diagram of first embodiment of the utility model.
Fig. 2 is the synoptic diagram of the baffle plate of first embodiment of the utility model.
Fig. 3 is an A-A view among Fig. 2.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.First embodiment of the present utility model is a kind of electroplanting device, comprise plating tank 101 with reference to figure 1, Fig. 2, Fig. 3 electroplanting device, electroplate liquid 105 is housed in the plating tank 101, negative plate 103, positive plate 102 are set in the electroplate liquid 105, negative plate 103 and positive plate 102 be arranged in parallel, and between negative plate 103 and positive plate 102, plate washer 104 is set, baffle plate 104 fronts are planes, be evenly distributed with through hole 1041 on the baffle plate 104, the axle center of through hole 1041 is perpendicular to the front of described baffle plate 104, and the reverse side of described plate washer 104 is Internal Spherical Surface.In the present embodiment, described negative plate 103 has two, is arranged on two sides of positive plate 102, and described accordingly baffle plate 104 also has two, is arranged between two negative plates 103 and the positive plate 102.In the present embodiment, described plate washer 104 is the PC material.In the present embodiment, described plate washer 104 links together by screw and negative plate 103, and the front of described plate washer 104 is provided with contour pad towards described negative plate 103 between described plate washer 104 and the described negative plate 103.

Claims (4)

1, a kind of electroplanting device, comprise plating tank, electroplate liquid is housed in the plating tank, negative plate, positive plate are set in the electroplate liquid, it is characterized in that: negative plate and positive plate be arranged in parallel, and between negative plate and positive plate plate washer are set, the baffle plate front is the plane, be evenly distributed with through hole on the baffle plate, the axle center of through hole is perpendicular to the front of described baffle plate, and the reverse side of described plate washer is an Internal Spherical Surface.
2, a kind of electroplanting device according to claim 1, it is characterized in that: described negative plate has two, is arranged on two sides of positive plate, and described accordingly baffle plate also has two, is arranged between two negative plates and the positive plate.
3, a kind of electroplanting device according to claim 1 is characterized in that: described plate washer is the PC material.
4, a kind of electroplanting device according to claim 1, it is characterized in that: described plate washer links together by fastening piece and negative plate, and the front of described plate washer is provided with contour pad towards described negative plate between described plate washer and the described negative plate.
CN2009201354690U 2009-03-10 2009-03-10 Electroplating device Expired - Fee Related CN201424518Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201354690U CN201424518Y (en) 2009-03-10 2009-03-10 Electroplating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201354690U CN201424518Y (en) 2009-03-10 2009-03-10 Electroplating device

Publications (1)

Publication Number Publication Date
CN201424518Y true CN201424518Y (en) 2010-03-17

Family

ID=42023959

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201354690U Expired - Fee Related CN201424518Y (en) 2009-03-10 2009-03-10 Electroplating device

Country Status (1)

Country Link
CN (1) CN201424518Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103205786A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A cathode baffle plate and a production method thereof, and a mask plate electroforming device
CN109735892A (en) * 2019-03-20 2019-05-10 广东天承科技有限公司 A kind of VCP electroplanting device
CN110306224A (en) * 2015-05-14 2019-10-08 朗姆研究公司 Using the resistive ion of ion can piercing elements plating metal device and method
CN114686955A (en) * 2020-12-29 2022-07-01 矽磐微电子(重庆)有限公司 Anode assembly, electroplating apparatus, and method of manufacturing anode assembly

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103205786A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A cathode baffle plate and a production method thereof, and a mask plate electroforming device
CN103205786B (en) * 2012-01-16 2016-01-27 昆山允升吉光电科技有限公司 Cathode baffle and preparation method thereof, mask plate electroforming apparatus
CN110306224A (en) * 2015-05-14 2019-10-08 朗姆研究公司 Using the resistive ion of ion can piercing elements plating metal device and method
CN110306224B (en) * 2015-05-14 2022-04-05 朗姆研究公司 Apparatus and method for electroplating metals using an ionically resistive ionically permeable element
CN109735892A (en) * 2019-03-20 2019-05-10 广东天承科技有限公司 A kind of VCP electroplanting device
CN114686955A (en) * 2020-12-29 2022-07-01 矽磐微电子(重庆)有限公司 Anode assembly, electroplating apparatus, and method of manufacturing anode assembly
CN114686955B (en) * 2020-12-29 2024-02-27 矽磐微电子(重庆)有限公司 Anode assembly, electroplating device and manufacturing method of anode assembly

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100317

Termination date: 20150310

EXPY Termination of patent right or utility model