CN201397904Y - Connector lap-joint structure and connector lap-joint multilayer board structure - Google Patents

Connector lap-joint structure and connector lap-joint multilayer board structure Download PDF

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Publication number
CN201397904Y
CN201397904Y CN2009201471251U CN200920147125U CN201397904Y CN 201397904 Y CN201397904 Y CN 201397904Y CN 2009201471251 U CN2009201471251 U CN 2009201471251U CN 200920147125 U CN200920147125 U CN 200920147125U CN 201397904 Y CN201397904 Y CN 201397904Y
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CN
China
Prior art keywords
connector
ground area
area
ground
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009201471251U
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Chinese (zh)
Inventor
郑仁达
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Corp
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN2009201471251U priority Critical patent/CN201397904Y/en
Application granted granted Critical
Publication of CN201397904Y publication Critical patent/CN201397904Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a connector lap-joint structure and a connector lap-joint multilayer board structure. The lap-joint structure comprises a circuit board, a first earthing area, a second earthing area and a groove on the circuit board. The groove forms a closed area to surround the second earthing area to isolate the first earthing area and the second earthing area.

Description

The multi-layer sheet structure that connector lap connected structure and connector splice
Technical field
The utility model is the lap connected structure about a kind of a plurality of connectors, particularly the lap connected structure that disturbs about a kind of signal transmission that can effectively solve a plurality of connectors that splice.
Background technology
Because slim computer housing has certain limitation for connector on area occupied on the circuit board and height, the connector that is disposed on this kind of casing generally can design with the framework of folded structure coexistence.For example, for cooperating the limited board area of this kind of casing, image (Video) signal connector and serial port communication signal (RS232) the connector mode with folded structure coexistence can be designed together, to save connector required configuration area on circuit board.
But, the lap connected structure of a plurality of connectors will influence electrical relation to each other.For example, signal of video signal and serial port communication signal belong to simulation and digital signal respectively, if the connector that will transmit the connector of analog image signal and transmit digital serial signal splices when disposing, often have the situation generation that simulation and digital signal interfere with each other, and then influence Electro Magnetic Compatibility, cause the instability of signal transmission.
Therefore, need a kind of lap connected structure of new connector, can save board area, and can avoid the interference between signals phenomenon.
The utility model content
Therefore, a purpose of the present utility model is to provide a kind of connector lap connected structure, can dwindle the area occupied of connector on circuit board, reduces electromagnetic interference problem simultaneously.
The multi-layer sheet structure that provides a kind of connector to splice is provided another purpose of the present utility model, can dwindle the area occupied of connector on circuit board, and reduce electromagnetic interference problem simultaneously.
According to an embodiment of the present utility model, the utility model provides a kind of connector lap connected structure, comprise a circuit board, one first ground area and one second ground area are positioned on the circuit board, one groove is then isolated first ground area and second ground area, and wherein this groove forms a closed area to center on second ground area.
According to another embodiment of the present utility model, the multi-layer sheet structure that the utility model provides a kind of connector to splice in addition, a signals layer that comprises a ground plane and carry at least one holding wire.Ground plane comprises a circuit board, and one first ground area and one second ground area are positioned on this circuit board, and wherein second ground area electrically connects an earth terminal of PORT COM.One first groove is then isolated first ground area and second ground area, and wherein first groove forms a closed area to center on second ground area.
Connector lap connected structure of the foregoing description and the multi-layer sheet structure that connector splices are that several connectors are spliced dwindling the shared board area of connector, and therefore can avoid signal to interfere with each other with the ground area of each connector of trench isolations.
Description of drawings
For above-mentioned and other purpose of the present utility model, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 is the electrical connector front view that illustrates the utility model one execution mode;
Fig. 2 illustrates the multi-layer sheet structure tangent plane schematic diagram that the connector of the utility model one execution mode splices;
Fig. 3 is a kind of connector lap connected structure vertical view that illustrates the utility model one execution mode.
[primary clustering symbol description]
101: sequence PORT COM 103: VGA connecting port
201: earth terminal 203: earth terminal
205: ground plane 207: signals layer
209: 211: the first ground areas of bus plane
215: the first grooves in 213: the second ground areas
217: 221: the second grooves of signal end
301: digital grounding zone 303: magnetic bead
Embodiment
Connector lap connected structure of following examples and the multi-layer sheet structure that connector splices are that several connectors are spliced dwindling the shared board area of connector, and therefore can avoid signal to interfere with each other with the ground area of each connector of trench isolations.
Please refer to Fig. 1, it is the electrical connector front view that illustrates the utility model one execution mode.This execution mode is to design at the circuit board of being installed in computer housing and the casing (PCB), so shared board area and the connector height of connector can limit to some extent.Electrical connector comprises sequence PORT COM (the com port) 101 and the VGA connecting port (video graphics arrayport) 103 of splicing, and wherein sequence PORT COM 101 positions and VGA connecting port 103 positions are overlapping up and down.
Please refer to Fig. 2, it is to illustrate the multi-layer sheet structure tangent plane schematic diagram that the connector of the utility model one execution mode splices.In the middle of the multi-layer sheet structure that this connector splices, the position of sequence PORT COM 101 and VGA connecting port (video graphics array port) 103 is overlapping up and down, the multi-layer sheet structure that connector splices comprises ground plane 205, signals layer 207 and the bus plane 209 that is made of circuit board, wherein signals layer 207 carries the signal end 217 of sequence PORT COM (com port) 101, and 209 of bus planes provide power supply.Ground plane 205 and bus plane 209 have first groove 215 and second groove 221 respectively, this two groove all forms the closed area, and the position of the position of second groove 221 and first groove 215 is overlapping up and down, to avoid the zone, ground, noise transfer to the second street 213 of first ground area 211.
In the middle of the multi-layer sheet structure that this connector splices, second ground area 213 electrically connects 211 earth terminals 203 that electrically connect VGA connecting port 103 in earth terminal 201, the first ground areas of sequence PORT COM 101.
Please refer to Fig. 3, it is a kind of connector lap connected structure vertical view that illustrates the utility model one execution mode.The connector lap connected structure comprises that the formed ground plane 205 of circuit board, first ground area 211 and second ground area 213 are positioned on the ground plane 205.First groove 215 is isolated first ground area 211 and second ground area 213, and wherein first groove, 215 formation closed areas are come around second ground area 213.
In the middle of this connector lap connected structure, second ground area 213 electrically connects the earth terminal of sequence PORT COM (comport), 211 earth terminals that electrically connect VGA connecting port (videographics array port) in first ground area.This connector lap connected structure also comprises digital grounding zone 301 and magnetic bead 303, and wherein magnetic bead 303 electrically connects 301 and second ground area 213, digital grounding zone, makes 301 and second ground area, digital grounding zone, 213 equipotentials.
First groove 215 is isolated first ground area 211 and second ground area 213, the earth terminal of sequence PORT COM and the earth terminal of VGA connecting port have been isolated indirectly, therefore the noise of VGA connecting port can not import the sequence PORT COM, but sequence PORT COM thereby operate as normal.
According to the foregoing description, the multi-layer sheet structure that connector lap connected structure and connector splice is that several connectors are spliced dwindling the shared board area of connector, and with the ground area of each connector of trench isolations, therefore can avoid signal to interfere with each other.
Though the utility model discloses as above with execution mode; right its is not in order to limit the utility model; any person skilled in the art; in not breaking away from spirit and scope of the present utility model; when being used for a variety of modifications and variations, therefore protection range of the present utility model is when being as the criterion with the scope that claims were defined.

Claims (9)

1, a kind of connector lap connected structure is characterized in that, comprises:
One circuit board;
One first ground area is positioned on this circuit board;
One second ground area is positioned on this circuit board; And
One groove, to isolate this first ground area and this second ground area, wherein this groove forms a closed area to center on this second ground area.
2, connector lap connected structure according to claim 1 is characterized in that, this second ground area electrically connects the earth terminal of a sequence PORT COM.
3, connector lap connected structure according to claim 1 is characterized in that, this first ground area electrically connects an earth terminal of a VGA connecting port.
4, connector lap connected structure according to claim 3 is characterized in that, also comprises:
One digital grounding zone; And
One magnetic bead electrically connects this digital grounding zone and this second ground area.
5, a kind of connector multi-layer sheet structure of splicing is characterized in that, comprises:
One signals layer is to carry a signal end of a PORT COM; And
One ground plane, this ground plane comprises:
One circuit board;
One first ground area is positioned on this circuit board;
One second ground area is positioned on this circuit board and electrically connects an earth terminal of this PORT COM; And
One first groove, to isolate this first ground area and this second ground area, wherein this first groove forms a closed area to center on this second ground area.
6, the connector according to claim 5 multi-layer sheet structure of splicing, it is characterized in that, also comprise a bus plane, one second groove of this bus plane forms a closed area, and wherein the position of the position of this second groove and this first groove is overlapping up and down.
7, the connector according to claim 5 multi-layer sheet structure of splicing is characterized in that this PORT COM is a sequence PORT COM.
8, the connector according to claim 5 multi-layer sheet structure of splicing is characterized in that this first ground area electrically connects an earth terminal of a VGA connecting port.
9, the connector according to claim 8 multi-layer sheet structure of splicing is characterized in that, also comprises:
One digital grounding zone; And
One magnetic bead electrically connects this digital grounding zone and this second ground area.
CN2009201471251U 2009-04-15 2009-04-15 Connector lap-joint structure and connector lap-joint multilayer board structure Expired - Fee Related CN201397904Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201471251U CN201397904Y (en) 2009-04-15 2009-04-15 Connector lap-joint structure and connector lap-joint multilayer board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201471251U CN201397904Y (en) 2009-04-15 2009-04-15 Connector lap-joint structure and connector lap-joint multilayer board structure

Publications (1)

Publication Number Publication Date
CN201397904Y true CN201397904Y (en) 2010-02-03

Family

ID=41620431

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201471251U Expired - Fee Related CN201397904Y (en) 2009-04-15 2009-04-15 Connector lap-joint structure and connector lap-joint multilayer board structure

Country Status (1)

Country Link
CN (1) CN201397904Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113614914A (en) * 2019-03-28 2021-11-05 华为技术有限公司 Semiconductor device, chip packaging structure and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113614914A (en) * 2019-03-28 2021-11-05 华为技术有限公司 Semiconductor device, chip packaging structure and electronic equipment
CN113614914B (en) * 2019-03-28 2024-04-09 华为技术有限公司 Semiconductor device, chip packaging structure and electronic equipment

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100203

Termination date: 20130415