CN201392135Y - Radiating device adopting large granular single crystal diamond heat sink material for radiation - Google Patents
Radiating device adopting large granular single crystal diamond heat sink material for radiation Download PDFInfo
- Publication number
- CN201392135Y CN201392135Y CN200920089841U CN200920089841U CN201392135Y CN 201392135 Y CN201392135 Y CN 201392135Y CN 200920089841 U CN200920089841 U CN 200920089841U CN 200920089841 U CN200920089841 U CN 200920089841U CN 201392135 Y CN201392135 Y CN 201392135Y
- Authority
- CN
- China
- Prior art keywords
- single crystal
- sink material
- heat sink
- heat
- large granular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiating device adopting a large granular single crystal diamond heat sink material for radiation, comprising a heat conducting plate and a large granular single crystal diamond; the large granular single crystal diamond is embedded on the heat conducting plate and is a polyhedron; one surface of the large granular single crystal diamond and one surface of the heat conducting plate are positioned on the same surface; the quantity of the large granular single crystal diamonds embedded on the heat conducting plate is larger than or equal to two; the heat conducting plate is a copper plate; the embedding arrangement of the large granular single crystal diamond on the copper plate can be regular and also can be disordered. The radiating device has simple structure and higher radiating efficiency.
Description
Technical field
The utility model belongs to the applications of diamond field, particularly a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material.
Background technology
The segment chip caloric value is very big in the electronics industry at present, in order to guarantee the operate as normal of these chips, just need distribute as early as possible at the heat that the very big radiating element of these chip surface installation volume produces during with chip operation, and the radiating element that uses now is to adopt copper and copper alloy, metal material such as aluminium and aluminium alloy is made, and the thermal conductivity of these metal materials is not high relatively, and therefore the efficient of heat radiation is also lower.
The utility model content
The utility model purpose is to provide a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material, can improve radiating efficiency greatly.
To achieve these goals, the utility model adopts following technical scheme: a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material, comprise heat-conducting plate and large-particle monocrystal diamond, and large-particle monocrystal diamond is embedded on the heat-conducting plate.
Described large-particle monocrystal diamond is a polyhedron, and a face of large-particle monocrystal diamond and a face of heat-conducting plate are in on the one side.
The quantity of the large-particle monocrystal diamond of inlaying on the described heat-conducting plate is more than or equal to two.
The size of described large-particle monocrystal diamond is more than or equal to 0.6mm.
Described heat-conducting plate is a copper coin.
It can be regular that described large-particle monocrystal diamond inlaying on copper coin arranged, and also can be unordered.
The utility model is simple in structure, and the efficient of heat radiation is higher.Adopting oarse-grained diamond single crystal is heat sink material, because diamond is that its thermal conductivity of phonon radiating mode is the metal of electronic radiation mode and several times to tens times of alloy, the radiating effect of the heat sink material that the use large-particle monocrystal diamond is made is far longer than by the compounded heat sink material of several metal materials.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
Embodiment: the radiating element of employing large-particle monocrystal diamond heat sink material heat radiation as shown in Figure 1, large-particle monocrystal diamond 1 is a polyhedron, the size of large-particle monocrystal diamond 1 is more than or equal to 0.6mm, large-particle monocrystal diamond 1 is embedded on the sheet copper 2, and a face of all large-particle monocrystal diamonds 1 and a face place of copper coin 2 are at grade.Large-particle monocrystal diamond 1 quantity that each heat sink material is inlayed is more than or equal to two, and large-particle monocrystal diamond 1 is that arrangement mode can be regularly arranged on copper coin 2, also can be random alignment.
Claims (6)
1, a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material, it is characterized in that: comprise heat-conducting plate and large-particle monocrystal diamond, large-particle monocrystal diamond is embedded on the heat-conducting plate.
2, a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material according to claim 1, it is characterized in that: described large-particle monocrystal diamond is a polyhedron, and a face of large-particle monocrystal diamond and a face of heat-conducting plate are in on the one side.
3, a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material according to claim 2, it is characterized in that: the quantity of the large-particle monocrystal diamond of inlaying on the described heat-conducting plate is more than or equal to two.
4, according to arbitrary described a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material of claim 1-3, it is characterized in that: the size of described large-particle monocrystal diamond is more than or equal to 0.6mm.
5, a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material according to claim 4, it is characterized in that: described heat-conducting plate is a copper coin.
6, a kind of radiating element that adopts the heat radiation of large-particle monocrystal diamond heat sink material according to claim 5, it is characterized in that: it can be regular that described large-particle monocrystal diamond inlaying on copper coin arranged, and also can be unordered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920089841U CN201392135Y (en) | 2009-04-27 | 2009-04-27 | Radiating device adopting large granular single crystal diamond heat sink material for radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920089841U CN201392135Y (en) | 2009-04-27 | 2009-04-27 | Radiating device adopting large granular single crystal diamond heat sink material for radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201392135Y true CN201392135Y (en) | 2010-01-27 |
Family
ID=41598957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920089841U Expired - Fee Related CN201392135Y (en) | 2009-04-27 | 2009-04-27 | Radiating device adopting large granular single crystal diamond heat sink material for radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201392135Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103496215A (en) * | 2013-09-25 | 2014-01-08 | 华南理工大学 | Embedded type combined heat sink as well as preparation method thereof |
| CN104117933A (en) * | 2014-06-20 | 2014-10-29 | 广东工业大学 | Flattop diamond brazing product and preparation method and application thereof |
| CN108174330A (en) * | 2017-12-11 | 2018-06-15 | 广东欧珀移动通信有限公司 | A kind of loudspeaker assembly and mobile terminal |
| CN109099616A (en) * | 2018-08-09 | 2018-12-28 | 宁夏欣达节能技术有限公司 | Graphene film type refrigerant evaporation tube and its device |
-
2009
- 2009-04-27 CN CN200920089841U patent/CN201392135Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103496215A (en) * | 2013-09-25 | 2014-01-08 | 华南理工大学 | Embedded type combined heat sink as well as preparation method thereof |
| CN103496215B (en) * | 2013-09-25 | 2015-07-29 | 华南理工大学 | A kind of embedded combination is heat sink and preparation method thereof |
| CN104117933A (en) * | 2014-06-20 | 2014-10-29 | 广东工业大学 | Flattop diamond brazing product and preparation method and application thereof |
| CN104117933B (en) * | 2014-06-20 | 2017-02-15 | 广东工业大学 | Flattop diamond brazing product and preparation method and application thereof |
| CN108174330A (en) * | 2017-12-11 | 2018-06-15 | 广东欧珀移动通信有限公司 | A kind of loudspeaker assembly and mobile terminal |
| CN108174330B (en) * | 2017-12-11 | 2020-05-08 | Oppo广东移动通信有限公司 | Loudspeaker assembly and mobile terminal |
| CN109099616A (en) * | 2018-08-09 | 2018-12-28 | 宁夏欣达节能技术有限公司 | Graphene film type refrigerant evaporation tube and its device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201796891U (en) | Radiating device for integrated LED | |
| CN200990750Y (en) | A radiating structure and equipment including the same radiating structure | |
| CN201392135Y (en) | Radiating device adopting large granular single crystal diamond heat sink material for radiation | |
| CN201584403U (en) | Chip cooling device and chip | |
| CN201607152U (en) | Perforated multi-facet radiator | |
| CN102368482B (en) | High-efficiency heat sink of porous metal structure | |
| CN203607389U (en) | Reinforced chip conduction radiator | |
| CN204539684U (en) | A kind of large power supply module heat dissipation structure | |
| CN201844377U (en) | Light-emitting diode (LED) light source heat sink | |
| CN202042473U (en) | Base plate for high-power electronic device module | |
| CN202629991U (en) | Heat radiation component of LED lamp | |
| CN208028050U (en) | A kind of spliced uniform-temperature plate heat dissipating device | |
| CN202374623U (en) | Radiator section bar capable of enlarging radiating area | |
| CN201184990Y (en) | Radiator for display card | |
| CN201286062Y (en) | Heat radiator in transducer | |
| CN201819608U (en) | Section bar for radiator | |
| CN204011403U (en) | A kind of heat sink compound | |
| CN201623946U (en) | Heat radiator | |
| CN202329332U (en) | Cylindrical needle type heat radiator | |
| CN201393357Y (en) | Large granular single crystal diamond radiator | |
| CN202979555U (en) | Insertion fin type heat dissipation device adopting heat pipes as auxiliary heat transfer devices | |
| CN203025634U (en) | Display card radiating device | |
| CN201844733U (en) | Aluminum profile used for radiator | |
| CN201859868U (en) | Heat radiation body | |
| CN202511088U (en) | High heat conduction light-emitting diode (LED) lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100127 Termination date: 20140427 |