CN201365394Y - Non-destructive arc forming mechanism of integrated circuit pin - Google Patents
Non-destructive arc forming mechanism of integrated circuit pin Download PDFInfo
- Publication number
- CN201365394Y CN201365394Y CNU2009201352375U CN200920135237U CN201365394Y CN 201365394 Y CN201365394 Y CN 201365394Y CN U2009201352375 U CNU2009201352375 U CN U2009201352375U CN 200920135237 U CN200920135237 U CN 200920135237U CN 201365394 Y CN201365394 Y CN 201365394Y
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- die
- integrated circuit
- forming
- forming blocks
- pin
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a non-destructive arc forming mechanism of an integrated circuit pin, which comprises an upper die and a lower die. The lower die comprises a lower die seat and a lower forming concave die; the upper die comprises an elastic ejector rod, a forming concave die arranged at the lower end of the elastic ejector rod, a concave-convex platform arranged on the outer surface of the elastic ejector rod, a forming block symmetrically arranged at two sides of the elastic ejector rod, an intermediate movable die coated at the periphery of the forming block, and an intermediate die seat which is positioned above the intermediate moving die and connected with the concave-convex platform and the elastic ejector rod. The upper end of the forming block is hinged with a long-shaft roller and leans against the concave-convex platform; the lower end of the forming block is shaped like a strip and forms a concave die downwards; the upper part of the forming block is transversely provided with a blind hole; a spring leans between the bottom part of the blind hole and the intermediate movable die; the central part of the forming block is movably sleeved with a rotating shaft; two ends of a rotor lean against the intermediate movable die; the guide shaft is arranged beside the elastic ejector rod vertically, the lower end of the guide shaft is connected with the top part of the intermediate movable die, and the upper part thereof penetrates through the intermediate die seat movably. The forming mechanism realizes non-destructive punch forming of the pin by arc motion trail of the forming block, avoids surface damage of the integrated circuit pin caused by the traditional vertical punch forming and ensures weldable parts of the integrated circuit pin to be horizontal.
Description
Technical field
The utility model relates to the processing unit (plant) of integrated circuit, relates in particular to a kind of shaping mechanism that is used to process minitype paster encapsulated integrated circuit pin.
Background technology
The integrated circuit pin shaping mechanism is based on a kind of novel mechanism of the Demand Design of surface mounting technology (SMT), is used for the straight pin with integrated circuit, and being processed into can be for the pin shape of surface mount use.The Forming Quality of integrated circuit pin will directly have influence on the quality of surface mount product, and the integrated circuit pin moulding is the peripheral techniques of SMT, be again its important step.The moulding of integrated circuit pin requires to be solderability height, consistency height.Traditional pin moulding process adopts fixedly compound stalk forming mould, directly carries out the pin moulding from top to down.Briquetting is direct rigid the contact with integrated circuit pin in the forming process, and in the moulding sliding process, the sliding friction between itself and pin is very big to the damage of pin, all can bring very big influence to its solderability and image appearance.
Summary of the invention
Very big and influence the technical problem of pin solderability and image appearance when the utility model will solve existing integrated circuit pin moulding to the pin damage, a kind of not damaged camber line shaping mechanism of minitype paster packaged integrated circuits pin is proposed.
For solving the problems of the technologies described above, the technical solution of the utility model is the not damaged camber line shaping mechanism of a kind of integrated circuit pin of structure, and it comprises upper die and lower die.Wherein counterdie comprises die shoe and the compacted under die of being located at this die holder top.Patrix comprises the elastic push rod vertically set up, be located at this elastic push rod lower end and with the adaptive last molding concave die of described compacted under die, be located at concavo-convex of the elastic push rod periphery, be symmetrically set in the elastic push rod both sides forming blocks, be placed in the intermediate active mould of forming blocks periphery, the middle die holder that is positioned at this intermediate active mould top and is connected with described concavo-convex and elastic push rod.The hinged major axis roller in the upper end of described forming blocks and with described concavo-convex periphery against, the lower end of forming blocks is strip and towards described compacted under die, the outside on forming blocks top laterally has blind hole, one spring, one end props up blind hole bottom, the other end against the intermediate active mould, middle part kink one rotating shaft of forming blocks, the axis of the described major axis roller of the parallel axes of this rotating shaft and two ends are against the intermediate active mould, and the top edge of this intermediate active mould is compressing the top of described major axis roller; The next door of described elastic push rod vertically is provided with the axis of guide, its lower end be connected with the top of intermediate active mould and top movable pass described in the middle of die holder.
Wherein, described major axis roller can adopt nonstandard long bearing.
The bottom surface of described forming blocks lower end edge strip inwardly tilts, and becomes 3 ° angle with horizontal plane.
The width of the depression of described upper and lower molding concave die is that 3.81mm～1 5.24mm, length are 4.8mm～29mm.
The shaping mechanism of the integrated circuit pin that application the utility model proposes can solve the problem of pin surface damage in the forming process effectively.Promptly after integrated circuit placed the compacted under die of shaping mechanism, last shaping mould then drops to was close to the height that integrated circuit can not cause damage again to it.At this moment, last shaping mould no longer descends, and the forming blocks in the moulding mechanism then under the promotion that the continuation of intermediate active mould descends, makes the major axis roller be moved down into concavo-convex raised surface by the surface of concavo-convex indent.At this moment, forming blocks is the axle center with the rotating shaft, and under the effect that is positioned at the side spring, outwards move in the upper end, inwardly move in the lower end, and promptly the lower end of forming blocks is movement in a curve.Forming blocks contacts for point with the way of contact of the pin of integrated circuit simultaneously, and contact point is the following curved outside of pin, and its movement locus that clamps motion process that descends is the above curved inboard center of circle that is, upper and lower curved distance is the circular arc of radius.Forming blocks is only put an outer side contacts with following bending in the forming process, has eliminated the fretting wear to pin thus.In addition, the inside upper angle in the bottom of forming blocks tilts, and from the horizontal by 3 ° angle, guarantees that thus the pin of integrated circuit can weld part of horizontal.
Compare with conventional art, this project product has the following advantages:
1. the design of the utility model shaping mechanism, realize the punch forming of undamaged pin with the movement in a curve track of forming blocks, avoid traditional vertical punch forming mode and caused the appearance of integrated circuit pin to damage, and guaranteed the welded part of horizontal of integrated circuit pin.
2. the utility model shaping mechanism has satisfied the condition that is connected with automation control system, can realize automation, enhances productivity, the stability and the consistency of product.
Description of drawings
Below in conjunction with drawings and Examples the utility model is described in detail, wherein:
Fig. 1 is the structural representation of the punching press state of the utility model shaping mechanism;
Fig. 2 is the forming blocks schematic perspective view of shaping mechanism;
Fig. 3 is the end view of forming blocks;
Fig. 4 is the enlarged diagram at A place among Fig. 3;
Fig. 5 is the schematic diagram of forming blocks punching press initial condition;
Fig. 6 is the schematic diagram of forming blocks matched moulds state;
Fig. 7 is the schematic diagram behind the muscle in the integrated circuit excision;
Fig. 8 is the schematic diagram behind the integrated circuit excision tail muscle;
Fig. 9 is the schematic diagram before the integrated circuit pin moulding;
Figure 10 is the enlarged diagram at D place among Fig. 9;
The schematic diagram of punching press pin when Figure 11 is the forming blocks matched moulds;
Figure 12 is the schematic diagram after the integrated circuit pin moulding.
Embodiment
Fig. 1 shows the basic structure of the utility model preferred embodiment shaping mechanism punching press state, present embodiment is the not damaged camber line shaping mechanism that is used for minitype paster packaged integrated circuits pin, and it comprises fixing counterdie and is located at the patrix of ramming motion about can relative counterdie the doing of counterdie top.Counterdie comprises die shoe 1 and is located at the compacted under die 2 at this die holder top.Patrix comprises the elastic push rod 9 vertically set up, be located at these elastic push rod 9 lower ends and with described compacted under die 2 cooperate punching presses last molding concave die 3, be located at concavo-convex 7 of the elastic push rod outer surface, be symmetrically set in the forming blocks 4 of elastic push rod 9 left and right sides, middle die holder 8 that the intermediate active mould 11. that is placed in the forming blocks periphery is positioned at above this intermediate active mould and is connected with concavo-convex 7 and elastic push rod 9.The upper end of forming blocks 4 is by slender axles 5 hinged major axis rollers 6, this major axis roller and concavo-convex 's 7 periphery against, the lower end of forming blocks is strip and towards compacted under die 2, the outside on forming blocks top laterally has blind hole 21 (consulting Fig. 2, Fig. 3), one spring, 12 1 ends prop up the bottom, the other end of forming blocks blind hole against intermediate active mould 11, are pressed in all the time on concavo-convex 7 the working face at major axis roller 6 under the effect of spring 12.Middle part kink one rotating shaft 13 of forming blocks 4, the axis of the parallel axes major axis roller 6 of this rotating shaft and two ends be against intermediate active mould 11, forming blocks 4 13 rotations around the shaft.The next door of elastic push rod 9 vertically is provided with the axis of guide 10, its lower end fixedly connected with the top of intermediate active mould 11 and top pass described in the middle of die holder 8, axis of guide centre die holder slippage relatively, can promote intermediate active mould 11 moves downward, thereby promotion major axis roller 6 moves up and down along concavo-convex 7 outer surface, under the effect that is positioned at side spring 12 elastic force, 4 of forming blocks are axle with rotating shaft 13 simultaneously, and its lower end is opened or clamped.In the present embodiment, major axis roller 6 can adopt nonstandard long bearing, the inside upper angle in the bottom surface of forming blocks 4 lower end edge strips tilts, and becoming 3 ° angle (consulting Fig. 3 and Fig. 4) with horizontal plane, the width of the depression of last molding concave die 3 and compacted under die 2 is that 3.81mm～15.24mm, length are 4.8mm～29mm.Shaping mechanism of the present utility model and process are applicable to width W=3.81mm～15.24mm, all the minitype paster packaged integrated circuits pin moulding in length L=4.8mm～29mm scope.
The operation principle of the utility model shaping mechanism is: after integrated circuit 20 places compacted under die 2 (shown in Figure 5), patrix is whole to descend, cause molding concave die 3 to be close to integrated circuit, but can not cause the height (as shown in Figure 6) of damage to it, at this moment, last molding concave die 3 no longer descends, intermediate active mould 11 continues to descend under the promotion of the axis of guide 10, and compressing forming blocks 4 is downward, thereby make major axis roller 6 arrive the position of concavo-convex 7 lower end evagination, forming blocks 4 is the axle center with rotating shaft 13 simultaneously, under the effect that is positioned at side spring 12, outwards move in the upper end, inwardly move in the lower end, i.e. the movement in a curve of forming blocks lower end, thus by with the cooperating of compacted under die 2, finish punch forming (as described in Figure 1) to integrated circuit pin.
Moulding technique step of the present utility model is as follows: at first excise the middle muscle between integrated circuit 20 frame outer pins 22 and obtain semi-finished product (consulting Fig. 7); Excise 23 (as shown in Figure 8) of integrated circuit frame outer pin tail muscle again, make the pin length conformance with standard; As Fig. 1, Fig. 9, shown in Figure 10, integrated circuit 20 is delivered on the compacted under die 2 of shaping mechanism, the contact point of compacted under die 2 and pin 22 be pin on a b that bends; Last molding concave die 3 drops on the face of integrated circuit pin 22; A c outside of bending under forming blocks 4 lower ends and the pin is made point and contact, its movement locus of clamping motion process of descending be above curved inboard be the center of circle, upper and lower curved apart from being the circular arc of radius (seeing also Fig. 1, Figure 11).With pin brake forming (as shown in figure 12); Forming blocks is only put an outer side contacts with following bending in the forming process, has eliminated the fretting wear to pin thus.The inside upper angle in forming blocks 4 bottoms tilts, and from the horizontal by 3 °, guarantees that thus pin can weld part of horizontal.Divide mould after molding procedure is finished, under the axis of guide 10 and 11 liftings of intermediate active mould, forming blocks 4 is upwards outwards left integrated circuit 20 do circular motion.It is indeformable that described moulding process had both guaranteed that pin can weld part of horizontal, can realize the not damaged moulding again.
Shaping mechanism of the present utility model is realized the punch forming of undamaged pin with the movement in a curve track of forming blocks, avoid traditional vertical punch forming mode and caused the appearance of integrated circuit pin to damage, and guaranteed the welded part of horizontal of integrated circuit pin.The utility model shaping mechanism has satisfied the condition that is connected with automation control system, can realize automation, enhances productivity, the stability and the consistency of product.
Claims (4)
1, a kind of not damaged camber line shaping mechanism of integrated circuit pin comprises upper die and lower die, it is characterized in that, described counterdie comprises die shoe (1), is located at the compacted under die (2) at this die holder top; Described patrix comprises the elastic push rod (9) vertically set up, be located at this elastic push rod (9) lower end and with the adaptive last molding concave die (3) of described compacted under die (2), be located at the elastic push rod outer surface concavo-convex (7), be symmetrically set in elastic push rod (9) both sides forming blocks (4), fit over the intermediate active mould (11) of forming blocks periphery, the middle die holder (8) that is positioned at this intermediate active mould top and is connected with described concavo-convex (7) and elastic push rod (9); The hinged major axis roller (6) in the upper end of described forming blocks (4) and with the periphery of described concavo-convex (7) against, the lower end of forming blocks is strip and towards described compacted under die (2), the outside on forming blocks top laterally has blind hole (21), one spring (12) one ends prop up blind hole bottom, the other end against intermediate active mould (11), middle part kink one rotating shaft (13) of forming blocks (4), the two ends of this rotating shaft are against intermediate active mould (11); The next door of described elastic push rod (9) vertically is provided with the axis of guide (10), its lower end be connected with the top of intermediate active mould (11) and top movable pass described in the middle of die holder (8).
2, the not damaged camber line shaping mechanism of integrated circuit pin as claimed in claim 1 is characterized in that, described major axis roller (6) is nonstandard long bearing.
3, the not damaged camber line shaping mechanism of integrated circuit pin as claimed in claim 2 is characterized in that, the inside upper angle in the bottom surface of described forming blocks (4) lower end edge strip tilts, and becomes 3 ° angle with horizontal plane.
4, the not damaged camber line shaping mechanism of integrated circuit pin as claimed in claim 3 is characterized in that, the width of the depression of described upper and lower molding concave die (3,2) is that 3.81mm～15.24mm, length are 4.8mm～29mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201352375U CN201365394Y (en) | 2009-02-27 | 2009-02-27 | Non-destructive arc forming mechanism of integrated circuit pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201352375U CN201365394Y (en) | 2009-02-27 | 2009-02-27 | Non-destructive arc forming mechanism of integrated circuit pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201365394Y true CN201365394Y (en) | 2009-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009201352375U Expired - Fee Related CN201365394Y (en) | 2009-02-27 | 2009-02-27 | Non-destructive arc forming mechanism of integrated circuit pin |
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| CN (1) | CN201365394Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101973050A (en) * | 2010-09-01 | 2011-02-16 | 铜陵三佳科技股份有限公司 | Punching molding mold of integrated circuit product |
| CN102013401A (en) * | 2009-02-27 | 2011-04-13 | 伟仕高(肇庆)半导体有限公司 | Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof |
| CN103579040A (en) * | 2013-10-30 | 2014-02-12 | 山东泰吉星电子科技有限公司 | No-damage chip molding and packaging process |
| CN104624857A (en) * | 2015-01-13 | 2015-05-20 | 无锡万洪电子机械有限公司 | Capacitor pin bending device |
| CN104668401A (en) * | 2015-01-13 | 2015-06-03 | 无锡万洪电子机械有限公司 | Electronic component lead pin bending device |
| CN107072066A (en) * | 2016-12-28 | 2017-08-18 | 中国北方车辆研究所 | A kind of axial lead component shaped device |
| CN107278120A (en) * | 2017-08-18 | 2017-10-20 | 中国科学院长春光学精密机械与物理研究所 | A kind of axial lead building mortion of through-hole mounting element |
-
2009
- 2009-02-27 CN CNU2009201352375U patent/CN201365394Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102013401A (en) * | 2009-02-27 | 2011-04-13 | 伟仕高(肇庆)半导体有限公司 | Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof |
| CN101973050A (en) * | 2010-09-01 | 2011-02-16 | 铜陵三佳科技股份有限公司 | Punching molding mold of integrated circuit product |
| CN103579040A (en) * | 2013-10-30 | 2014-02-12 | 山东泰吉星电子科技有限公司 | No-damage chip molding and packaging process |
| CN104624857A (en) * | 2015-01-13 | 2015-05-20 | 无锡万洪电子机械有限公司 | Capacitor pin bending device |
| CN104668401A (en) * | 2015-01-13 | 2015-06-03 | 无锡万洪电子机械有限公司 | Electronic component lead pin bending device |
| CN107072066A (en) * | 2016-12-28 | 2017-08-18 | 中国北方车辆研究所 | A kind of axial lead component shaped device |
| CN107072066B (en) * | 2016-12-28 | 2019-03-15 | 中国北方车辆研究所 | A kind of axial lead component molding machine |
| CN107278120A (en) * | 2017-08-18 | 2017-10-20 | 中国科学院长春光学精密机械与物理研究所 | A kind of axial lead building mortion of through-hole mounting element |
| CN107278120B (en) * | 2017-08-18 | 2019-10-25 | 中国科学院长春光学精密机械与物理研究所 | A kind of axial lead forming device of through-hole mounting element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091216 Termination date: 20120227 |