CN201362369Y - Fluid loop control device with forced-convection heat-transferring function - Google Patents
Fluid loop control device with forced-convection heat-transferring function Download PDFInfo
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- CN201362369Y CN201362369Y CNU2009201065296U CN200920106529U CN201362369Y CN 201362369 Y CN201362369 Y CN 201362369Y CN U2009201065296 U CNU2009201065296 U CN U2009201065296U CN 200920106529 U CN200920106529 U CN 200920106529U CN 201362369 Y CN201362369 Y CN 201362369Y
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Abstract
The utility model discloses a fluid loop control device with a forced-convection heat-transferring function; the device comprises a plurality of microflute heat exchangers, a multi-section pipeline, a shunting pipeline, an electric control valve, a minitype pump and a temperature difference power generating sheet; the fluid loop control device combines microflute heat exchanging technology and electricity conversion technology, so as to lead a fluid loop of a nano-satellite thermal control system to form forced-convection and heat-transferring. The device adopts an active thermal control way of main loop self-driving and by-pass auxiliary control, the way lead waste heat of the nano-satellite to be converted into eclectic energy, so as to drive the fluid loop to carry out forced-convection and heat-transferring, realize closed loop control of the thermal control system, reduce the electric energy consumption of the nano-satellite and realize the control of the inner temperature of the nano-satellite. In the device, the microflute heat exchangers are arranged on onboard equipment of the existing nano-satellite, two end of each microflute heat exchanger are respectively connected with guide pipes for forming a fluid loop with forced convection, the fluid loop can recycle the heat generated by the onboard equipment when in working, therefore, the energy of the nano-satellite is saved, and a condition of long-time service of the nano-satellite is provided.
Description
Technical field
The utility model relates to a kind of fluid circuit control device that is applicable to that nano-satellite hot control system is used.More particularly say, be meant a kind of based on the self-driven and bypass aux. controls and the fluid circuit control device that have the forced-convection heat transfer form in main line.
Background technology
The satellite of receiving is meant the micro-satellite of quality between 1Kg～10Kg, owing to adopt the design philosophy and the manufacturing process of large-scale integration circuit, thereby receive that satellite has that volume is little, light weight, manufacturing and the low advantage of launch cost, in aspect extensive application such as communication, military affairs, geoexploration, environment and disaster monitoring, communications and transportation, Meteorological Services, scientific experiment, surveies of deep space.
The required electric energy of the satellite of receiving absorbs solar energy converting by solar array usually and obtains.The satellite of receiving also will be considered loss to electric energy on the one hand in the active time in cosmic space.But owing to receiving the little supply that limits its energy of satellite own vol, simultaneously, can produce a large amount of heats when receiving each subsystem work on the satellite, these heats have formed nano-satellite hot control system, these heats such as untimely shed to cause receive the variation of inside satellite thermal environment, thereby influence the normal operation of each subsystem.The external packets of satellite received is covered with receives satellite covering 10, receives the radiating treatment of satellite, is that the heat that produces during with work is transmitted on its heat delivery surface that deviates from the sun 11, and this heat looses to cosmic space (referring to shown in Figure 1) with forms of radiation row.Realize the difference of function according to receiving satellite, can be divided into (referring to shown in Figure 3) such as power subsystem, heat control subsystem, structure subsystem, attitude control subsystem 12, communication subsystem 13, computing subsystem 14 and capacity weights 15 receiving satellite.
Micro-channel heat exchanger is a kind of emerging thermal design technology, is seen in a kind of water-cooled cold face temperature etc. that forms with the silicon manufacturing that American scholar T uckerman and Pease introduce the early 1980s the earliest.The characteristics of micro-channel heat exchanger are: (1) is simple in structure, and micro-channel heat exchanger mainly adopts rectangle, triangle, circular rib chip architecture, and channel architecture is simple, adopts line cutting or chemical corrosion processing, and is easy to process; (2) volume is little, and the little heat exchanger volume in microchannel is little, can directly act on millimeter even micron-sized heat source position; (3) has very high heat exchange efficiency.Micro-channel heat exchanger is owing to the dimensional effect of passage, and thermal resistance is very low, can directly act on heat source position again simultaneously, so heat exchange efficiency is very high.If adopt micro channels liquid forced convection form, then can reach better radiating effect; (4) fluid state mainly is laminar flow, to power system require lowly, only is the water column pressure drop of tens millimeters heads generally; (5) can under bad working environment, work.
Traditional nano-satellite hot control system is based on passive mode, whole process heat transmits uncontrollable, when receiving each subsystem temperatures environment reduction of satellite, also need to heat for each subsystem by electrically heated mode, thereby increased and received the burden of power subsystem of satellite, shortened and received the active time of satellite.
Summary of the invention
To receive the heat that produces when satellite is worked in order effectively utilizing in universe, and to prolong and receive the active time of satellite, the utility model proposes a kind of fluid circuit control device with forced-convection heat transfer.This fluid circuit control device has adopted the micro-channel heat transfer technology to combine with heat-power conversion technology, makes the nano-satellite hot control system fluid circuit form forced-convection heat transfer.This fluid circuit control device is by installing the micro-channel heat exchanger on the existing satellite borne equipment of receiving on the satellite, two ends to each micro-channel heat exchanger connect the fluid circuit that upper conduit is formed a forced convection respectively then, the heat that produces when this fluid circuit can be worked to satellite borne equipment utilizes again, saved and received the energy of satellite, provide condition for receiving the long-time military service of satellite.In fluid circuit, adopted the active heat control mode of the self-driven and bypass aux. controls of major loop.Self-driven design will be received satellite used heat and be converted to electric energy drive fluid loop heat radiation, realized the closed loop control of heat control system, reduced and received the power consumption of satellite, bypass aux. controls design can realize receiving the inside satellite temperature controlling by to receiving satellite to the control of cosmic space radiations heat energy.
A kind of fluid circuit control device with forced-convection heat transfer of the present utility model includes:
A plurality of micro-channel heat exchangers, multistage pipeline, shunt conduit, electric control valve, micropump and thermo-electric generation sheet; A plurality of micro-channel heat exchangers are meant A micro-channel heat exchanger, B micro-channel heat exchanger, C micro-channel heat exchanger, D micro-channel heat exchanger and E micro-channel heat exchanger; The multistage pipeline is meant A pipeline, B pipeline, C pipeline, D pipeline, E pipeline, F pipeline, G pipeline and H pipeline; The A end of A pipeline is connected on the mouth of A micro-channel heat exchanger, and the B of A pipeline end is connected on the input end of B micro-channel heat exchanger; A micro-channel heat exchanger is bonded on the attitude control subsystem; The A end of B pipeline is connected on the mouth of B micro-channel heat exchanger, and the B of B pipeline end is connected on the input end of C micro-channel heat exchanger; B micro-channel heat exchanger is bonded on the communication subsystem; The A end of C pipeline is connected on the mouth of C micro-channel heat exchanger, and the B of C pipeline end is connected on the input end of D micro-channel heat exchanger; C micro-channel heat exchanger is bonded on the computing subsystem; The A end of D pipeline is connected on the mouth of D micro-channel heat exchanger, and the B of D pipeline end is connected on the inlet of electronic micropump; Be bonded with the thermo-electric generation sheet on the D micro-channel heat exchanger, the other end of thermo-electric generation sheet is bonded on the capacity weight; The positive pole of thermo-electric generation sheet is connected with electronic micropump by electrical lead respectively with negative pole; The A end of E pipeline is connected on the miniature delivery side of pump of motor, and the B of E pipeline end is connected on second interface of A T-pipe joint; The A end of F pipeline is connected on the 3rd interface of A T-pipe joint, and the B of F pipeline end is connected on the input end of E micro-channel heat exchanger; The A end of G pipeline is connected on the mouth of E micro-channel heat exchanger, and the B of G pipeline end is connected on the 3rd interface of B T-pipe joint; The A end of H pipeline is connected on second interface of B T-pipe joint, and the B of H pipeline end is connected on the input end of A micro-channel heat exchanger.
A kind of fluid circuit control device advantage with forced-convection heat transfer of the present utility model is:
(1) utilize the micro-channel heat exchanger to absorb the used heat that produces when receiving each subsystem normal operation of satellite, and a micro-channel heat exchanger is installed respectively on each subsystem, connecting tube forms the thermal exchange loop on the input end of micro-channel heat exchanger and mouth then, utilizes this thermal exchange loop band to walk heat.
(2) adopt the thermo-electric generation technology, be converted to electric energy, improved and received the satellite energy utilization ratio receiving the used heat that satellite produces.
(3) adopt the micro-channel heat transfer technology because micro-channel low thermal resistance, size are little, almost can be installed in receive that satellite is any can the heat-dissipation place, improved thermal exchange efficient.
(4) adopt the self-driven heat exchange of major loop, the electric energy that utilizes the thermo-electric generation sheet to produce drives electronic micropump, has realized the closed loop control of nano-satellite hot control system.
(5) in the thermal exchange loop, adopt electric control valve and shunt conduit to form the aux. controls of bypass flow, realized receiving the control of satellite heat loss through radiation, and then realized receiving the control of inside satellite temperature by the aperture of regulating electric control valve.
Description of drawings
Fig. 1 be receive heat delivery surface on the satellite the position schematic diagram is set.
Fig. 2 is the heat control structure block diagram of the utility model fluid circuit control device.
Fig. 3 is a kind of specific embodiments constructional drawing of the utility model fluid circuit control device.
Among the figure: 1. shunt conduit 2. electric control valves 3. electronic micropump 4. leads
5. thermo-electric generation sheet 10. is received satellite covering 11. heat delivery surfaces 12. attitude control subsystem
13. communication subsystem 14. computing subsystems 15. capacity weight 22.A micro-channel heat exchangers
23.B micro-channel heat exchanger 24.C micro-channel heat exchanger 25.D micro-channel heat exchanger
26.E micro-channel heat exchanger 31.A pipeline 32.B pipeline 33.C pipeline
34.D pipeline 35.E pipeline 36.F pipeline 37.G pipeline 38.H pipeline
51. heat collection module 52. fluid circuit driver modules
53. heat-electric modular converter 54. bypass flow control modules
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail.
A kind of fluid circuit control device of the present utility model with forced-convection heat transfer, form and receive the heat control system of satellite receiving attitude control subsystem 12, communication subsystem 13, computing subsystem 14 and capacity weight 15 in the satellite, can be divided into heat collection module 51, fluid circuit driver module 52, heat-electric modular converter 53 and bypass flow control module 54 according to transformational relation the utility model of energy.
(1) the heat collection module 51
The used heat that heat collection module 51 produces when being used for attitude control subsystem 12, communication subsystem 13, computing subsystem 14 and capacity weight 15 work compiles, compile the utility model for used heat and adopt micro-channel heat exchanger and pipeline group syntype, by the cooling media that exists in the pipeline, used heat is conducted to heat delivery surface 11 discharge, to guarantee to receive the normal operation of satellite under hot environment.Concern Q=cm Δ T according to what material was inhaled thermal output, wherein Q is that material is inhaled thermal output, and c is a specific heat capacity, and m is the quality of cooling media, and Δ T is the difference variation amount of cooling media.Receiving under the limited bulk condition of satellite, generation for heat, and to heat dispel the heat (heat delivery surface 11) all need to receive the entrained energy of satellite to its work done, therefore this will want energy loss, reduce and to receive the active time of satellite, if a kind of can the utilization again receiving the heat that satellite self produces arranged, this will prolong receives the active time of satellite.In order to solve self utilizing again of heat, the utility model people is receiving under the satellite structure system now according to energy conservation, does not enlarge to receive the volume of satellite, adopts the interior cooling media of micro-channel heat exchanger and micro-tube and pipeline to be combined to form the thermal exchange loop.Be that heat collection module 51 can form the thermal exchange loop in the fluid circuit control device.
In the utility model, thermal exchange loop required device has A micro-channel heat exchanger 22, B micro-channel heat exchanger 23, C micro-channel heat exchanger 24, D micro-channel heat exchanger 25, E micro-channel heat exchanger 26, A pipeline 31, B pipeline 32, C pipeline 33, D pipeline 34, E pipeline 35, F pipeline 36, G pipeline 37 and H pipeline 38.Cooling media can flow in this thermal exchange loop, can be deionized water.
Micro-channel heat exchanger volume I to be acting on millimeter even micron-sized heat source position, because its thermal resistance is little and can directly contact under the forced convection situation with thermal source and can reach good heat-radiation effect.Therefore the utility model adopts and receives the heat that the bonding micro-channel heat exchanger of each subsystem of satellite comes absorption equipment to come out.Again because of, the temperature at satellite heat delivery surface 11 places received is lower, makes that the heat in the thermal exchange loop is dispersed into the cosmic space by heat delivery surface 11.
(2) the bypass flow control module 54
In order to solve in the thermal exchange loop the excessive problem of thermal losses behind heat delivery surface 11, the contriver has designed a bypass flow control module 56 of being made up of electric control valve and pipeline (shunt conduit 1), by the collection to E micro-channel heat exchanger 26 mouth temperature, this temperature is designated as the heat exchange temperature T
1, if the heat exchange temperature T
1Be lower than the normal temperature T when receiving the satellite normal operation
0The time, motorized adjustment opening of valves (entry condition T
1＜T
0), make the heat in the thermal exchange loop enter H pipeline 38, and carry out thermal exchange, thereby guarantee to receive the normal operation of satellite under low temperature environment without heat delivery surface 11 from bypass.
In the utility model, design bypass flow control module 56 is main is to solve to receive satellite and need receive the entrained energy of satellite it is heated the energy loss that causes when low temperature.Be that bypass flow control module 54 is used for regulating thermal exchange loop heat exchange temperature T
1Be lower than the normal temperature T when receiving the satellite normal operation
0The time, the flow velocity of the cooling media in the adjusting thermal exchange loop.
In the utility model, the required trigger voltage of electric control valve is provided by spaceborne power subsystem.。
(3) self-driven control module 52
Self-driven control module 52 provides forced convection institute energy requirement for the thermal exchange loop.
In order on the thermal exchange loop, to make the cooling media in the pipeline form forced convection, the subsystem of receiving on the satellite is everywhere dispelled the heat rapidly with time faster, the utility model people designs an electronic micropump on the thermal exchange loop, this electronic micropump can provide power for the thermal exchange loop, makes the cooling media in the thermal exchange loop form forced convection.In order to provide electric energy, a bonding thermo-electric generation sheet 5 between capacity weight 15 and D micro-channel heat exchanger 25 for electronic micropump.
In the utility model, for not needing to receive the energy that satellite carries, electronic micropump 3 is not its power supply by thermo-electric generation sheet 5, therefore be called self-driven control module 52.
In the utility model, the required voltage of electronic micropump is provided by the thermo-electric generation sheet.Be that the positive pole of thermo-electric generation sheet and two leads of negative pole are connected on the positive pole and negative pole of electronic micropump.The required driving voltage of electronic micropump is 0V～5V.
(4) heat-electric modular converter 53
Heat-electric modular converter 53 provides electric energy for the thermal exchange major loop.
For to receiving the saving that satellite carries the energy, the utility model adopts heat-electric conversion plan.It is a bonding thermo-electric generation sheet 5 between capacity weight 15 and D micro-channel heat exchanger 25.The one side of thermo-electric generation sheet 5 contacts with capacity weight 15 surfaces, the another side of thermo-electric generation sheet 5 contacts with D micro-channel heat exchanger 25, when 5 two surface temperature overbalances of thermo-electric generation sheet, just have voltage and produce, thereby realize the used heat that capacity weight 15 produces is converted to electric energy.This thermo-electric generation sheet is according to the Seebeck effect, and when there was the temperature difference in thermo-electric generation sheet two ends, the thermo-electric generation sheet just had electro-motive force and produces.
According to shown in Figure 2, the inventor has designed a concrete structure as shown in Figure 3, the layout of each micro-channel heat exchanger, pipeline, shunt conduit, thermo-electric generation sheet, electronic micropump, electric control valve:
Fluid circuit control device with forced-convection heat transfer of the present utility model includes a plurality of micro-channel heat exchangers, multistage pipeline, shunt conduit 1, electric control valve 2, electronic micropump 3 and thermo-electric generation sheet 5; A plurality of micro-channel heat exchangers are meant A micro-channel heat exchanger 22, B micro-channel heat exchanger 23, C micro-channel heat exchanger 24, D micro-channel heat exchanger 25 and E micro-channel heat exchanger 26; The multistage pipeline is meant A pipeline 31, B pipeline 32, C pipeline 33, D pipeline 34, E pipeline 35, F pipeline 36, G pipeline 37, H pipeline 38; Pipeline adopts copper pipe, aluminum pipe, titanium aluminium alloy pipe, Ti-Ni alloy pipe etc., and internal diameter of the pipeline is 4mm～6mm, and the cooling media in the pipeline can be a deionized water.The utility model fluid circuit control device is with the connection mode explanation relative position relation separately of pipeline.
The A end of shunt conduit 1 is connected with first interface of A T-pipe joint 6, and the B end of shunt conduit 1 is connected with first interface of B T-pipe joint 7; Electric control valve 2 is installed on the shunt conduit 1;
The A end of A pipeline 31 is connected on the mouth of A micro-channel heat exchanger 22, and the B of A pipeline 31 end is connected on the input end of B micro-channel heat exchanger 23; A micro-channel heat exchanger 22 is bonded on the attitude control subsystem 12, the heat Q that this A micro-channel heat exchanger 22 produces when being used for 12 work of attitude control subsystem
22(be called the first heat Q
22) be passed on the cooling media in the A pipeline 1, by this cooling media with the first heat Q
22Take away;
The A end of B pipeline 32 is connected on the mouth of B micro-channel heat exchanger 23, and the B of B pipeline 32 end is connected on the input end of C micro-channel heat exchanger 24; B micro-channel heat exchanger 23 is bonded on the communication subsystem 13, the heat Q that this B micro-channel heat exchanger 23 produces when being used for communication subsystem 13 work
23(be called the second heat Q
23) be delivered on the cooling media in the B pipeline 32, by this cooling media with the second heat Q
23Take away;
The A end of C pipeline 33 is connected on the mouth of C micro-channel heat exchanger 24, and the B of C pipeline 23 end is connected on the input end of D micro-channel heat exchanger 25; C micro-channel heat exchanger 24 is bonded on the computing subsystem 14, the heat Q that this C micro-channel heat exchanger 24 produces when being used for computing subsystem 14 work
24(be called the 3rd heat Q
24) be delivered on the cooling media in the C pipeline 33, by this cooling media with the 3rd heat Q
24Take away;
The A end of D pipeline 34 is connected on the mouth of D micro-channel heat exchanger 25, and the B of D pipeline 34 end is connected on the inlet of electronic micropump 3; Be bonded with thermo-electric generation sheet 5 on the D micro-channel heat exchanger 25, the other end of thermo-electric generation sheet 5 is bonded on the capacity weight 15; The positive pole of thermo-electric generation sheet 5 is connected with electronic micropump 3 by lead 4 (cable or copper core) with negative pole, and this thermo-electric generation sheet 5 provides the electric energy of 0V～5V for electronic micropump 3; The heat Q that this D micro-channel heat exchanger 25 produces when being used for capacity weight 15 work on the one hand
25(be called the 4th heat Q
25) be delivered on the cooling media in the D pipeline 34, by this cooling media with the 4th heat Q
25Take away; Because thermo-electric generation sheet 5 is bonded between D micro-channel heat exchanger 25 and the capacity weight 15, as long as have heal differential between D micro-channel heat exchanger 25 and the capacity weight 15, just provide energy for thermo-electric generation sheet 5, this thermo-electric generation sheet 5 can be an electric energy with thermal power transfer just, i.e. thermo-electric generation sheet 5 generatings.This electric energy affacts on the electronic micropump 3 then, and electronic micropump 3 provides flow control according to the electric energy that receives for forced convection.The positive pole of thermo-electric generation sheet 5 is connected with negative pole with the positive pole of electronic micropump 3 respectively by lead 4 with negative pole, and electrical lead 4 can be cable or copper core.
The A end of E pipeline 35 is connected in the outlet of electronic micropump 3, and the B of E pipeline 35 end is connected on second interface of A T-pipe joint 6;
The A end of F pipeline 36 is connected on the 3rd interface of A T-pipe joint 6, and the B of F pipeline 36 end is connected on the input end of E micro-channel heat exchanger 26;
The A end of G pipeline 37 is connected on the mouth of E micro-channel heat exchanger 26, and the B of G pipeline 37 end is connected on the 3rd interface of B T-pipe joint 7; E micro-channel heat exchanger 26 is used for fluid circuit heat Q
26(be called the 5th heat Q
26) give off to the cosmic space through heat delivery surface 11, reach the purpose that reduces heat in the fluid circuit;
The A end of H pipeline 38 is connected on second interface of B T-pipe joint 7, and the B of H pipeline 38 end is connected on the input end of A micro-channel heat exchanger 22.
In the utility model, the flow of electric control valve 2 is 0.1～0.4L/min.
In the utility model, the driving voltage of electronic micropump 3 is 0V～5V, and flow is 0.1～0.4L/min, and 180 type gear type pumps of Micropump company connect the respective drive device.
In the utility model, the output voltage of thermo-electric generation sheet 5 is 0V～5V, chooses the 50mm * 50mm of Komatsu company * 4.2mm temperature-difference power generation module.
In the utility model, the absorbed power of micro-channel heat exchanger is 100W～500W.
In the utility model, receive to have adopted being connected between each subsystem and micro-channel heat exchanger on the satellite, micro-channel heat exchanger and the fluid line and have the good silicon materials of heat conductivility and carry out bonding.Under the effect of electronic micropump 3, cooling media forms forced convection motion in pipeline, and the used heat that produces during with each subsystem normal operation of receiving on the satellite is delivered to be received on the satellite heat delivery surface 11, thereby realizes the heat radiation of satellite borne equipment.
Claims (6)
1, a kind of fluid circuit control device with forced-convection heat transfer is characterized in that this fluid circuit control device includes:
A plurality of micro-channel heat exchangers, multistage pipeline, shunt conduit (1), electric control valve (2), micropump (3) and thermo-electric generation sheet (5);
A plurality of micro-channel heat exchangers are meant A micro-channel heat exchanger (22), B micro-channel heat exchanger (23), C micro-channel heat exchanger (24), D micro-channel heat exchanger (25) and E micro-channel heat exchanger (26);
The multistage pipeline is meant A pipeline (31), B pipeline (32), C pipeline (33), D pipeline (34), E pipeline (35), F pipeline (36), G pipeline (37) and H pipeline (38);
The A end of A pipeline (31) is connected on the mouth of A micro-channel heat exchanger (22), and the B of A pipeline (31) end is connected on the input end of B micro-channel heat exchanger (23); A micro-channel heat exchanger (22) is bonded on the attitude control subsystem (12);
The A end of B pipeline (32) is connected on the mouth of B micro-channel heat exchanger (23), and the B of B pipeline (32) end is connected on the input end of C micro-channel heat exchanger (24); B micro-channel heat exchanger (23) is bonded on the communication subsystem (13);
The A end of C pipeline (33) is connected on the mouth of C micro-channel heat exchanger (24), and the B of C pipeline (23) end is connected on the input end of D micro-channel heat exchanger (25); C micro-channel heat exchanger (24) is bonded on the computing subsystem (14);
The A end of D pipeline (34) is connected on the mouth of D micro-channel heat exchanger (25), and the B of D pipeline (34) end is connected on the inlet of electronic micropump (3); Be bonded with thermo-electric generation sheet (5) on the D micro-channel heat exchanger (25), the other end of thermo-electric generation sheet (5) is bonded on the capacity weight (15); The positive pole of thermo-electric generation sheet (5) is connected with electronic micropump (3) by electrical lead (4) respectively with negative pole;
The A end of E pipeline (35) is connected in the outlet of motor micropump (3), and the B end of E pipeline (35) is connected on second interface of A T-pipe joint (6);
The A end of F pipeline (36) is connected on the 3rd interface of A T-pipe joint (6), and the B of F pipeline (36) end is connected on the input end of E micro-channel heat exchanger (26);
The A end of G pipeline (37) is connected on the mouth of E micro-channel heat exchanger (26), and the B of G pipeline (37) end is connected on the 3rd interface of B T-pipe joint (7);
The A end of H pipeline (38) is connected on second interface of B T-pipe joint (7), and the B of H pipeline (38) end is connected on the input end of A micro-channel heat exchanger (22).
2, the fluid circuit control device that is applicable to nano-satellite hot control system according to claim 1 is characterized in that: pipeline adopts copper pipe or aluminum pipe or titanium aluminium alloy pipe or Ti-Ni alloy pipe, and internal diameter of the pipeline is 4mm～6mm.
3, the fluid circuit control device that is applicable to nano-satellite hot control system according to claim 1 is characterized in that: cooling media is a deionized water.
4, the fluid circuit control device that is applicable to nano-satellite hot control system according to claim 1 is characterized in that: the driving voltage of electronic micropump (4) is 0V～5V.
5, the fluid circuit control device that is applicable to nano-satellite hot control system according to claim 1 is characterized in that: the output voltage of thermo-electric generation sheet (5) is 0V～5V.
6, the fluid circuit control device that is applicable to nano-satellite hot control system according to claim 1 is characterized in that: the absorbed power of micro-channel heat exchanger is 300W～500W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201065296U CN201362369Y (en) | 2009-03-17 | 2009-03-17 | Fluid loop control device with forced-convection heat-transferring function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201065296U CN201362369Y (en) | 2009-03-17 | 2009-03-17 | Fluid loop control device with forced-convection heat-transferring function |
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| CN201362369Y true CN201362369Y (en) | 2009-12-16 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102514733A (en) * | 2011-12-28 | 2012-06-27 | 北京航空航天大学 | Microgravity environment-based spray cooling loop device |
| CN104216864A (en) * | 2014-08-22 | 2014-12-17 | 航天东方红卫星有限公司 | Heat design method of cubesat |
| CN106455450A (en) * | 2016-11-22 | 2017-02-22 | 上海卫星工程研究所 | High-isothermal lightweight application method of satellite heat pipes |
| CN108458619A (en) * | 2018-03-21 | 2018-08-28 | 西北工业大学 | A kind of coupled thermomechanics radiator of thermo-electric generation driving cooling fluid |
| CN109312883A (en) * | 2016-06-01 | 2019-02-05 | 恩特格里斯公司 | The fluid circuit inhibited with integrated electrostatic discharge |
-
2009
- 2009-03-17 CN CNU2009201065296U patent/CN201362369Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102514733A (en) * | 2011-12-28 | 2012-06-27 | 北京航空航天大学 | Microgravity environment-based spray cooling loop device |
| CN102514733B (en) * | 2011-12-28 | 2014-04-09 | 北京航空航天大学 | Microgravity environment-based spray cooling loop device |
| CN104216864A (en) * | 2014-08-22 | 2014-12-17 | 航天东方红卫星有限公司 | Heat design method of cubesat |
| CN104216864B (en) * | 2014-08-22 | 2017-04-19 | 航天东方红卫星有限公司 | Heat design method of cubesat |
| CN109312883A (en) * | 2016-06-01 | 2019-02-05 | 恩特格里斯公司 | The fluid circuit inhibited with integrated electrostatic discharge |
| US11384879B2 (en) | 2016-06-01 | 2022-07-12 | Entegris, Inc. | Fluid circuit with integrated electrostatic discharge mitigation |
| CN106455450A (en) * | 2016-11-22 | 2017-02-22 | 上海卫星工程研究所 | High-isothermal lightweight application method of satellite heat pipes |
| CN106455450B (en) * | 2016-11-22 | 2019-01-25 | 上海卫星工程研究所 | The high isothermal lightweight application method of star heat pipe |
| CN108458619A (en) * | 2018-03-21 | 2018-08-28 | 西北工业大学 | A kind of coupled thermomechanics radiator of thermo-electric generation driving cooling fluid |
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