CN201357522Y - Base structure of semiconductor wafer processing machine - Google Patents
Base structure of semiconductor wafer processing machine Download PDFInfo
- Publication number
- CN201357522Y CN201357522Y CNU2009201048731U CN200920104873U CN201357522Y CN 201357522 Y CN201357522 Y CN 201357522Y CN U2009201048731 U CNU2009201048731 U CN U2009201048731U CN 200920104873 U CN200920104873 U CN 200920104873U CN 201357522 Y CN201357522 Y CN 201357522Y
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- China
- Prior art keywords
- peripheral steel
- semiconductor wafer
- steel framework
- filler
- grid shaped
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- Expired - Fee Related
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- Mechanical Treatment Of Semiconductor (AREA)
- Machine Tool Units (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Disclosed is a base structure of a semiconductor wafer processing machine, which mainly comprises a peripheral steel frame, wherein the concave cavity of the peripheral steel frame is fixedly provided with a three-dimensional grid integral type inner framework formed by connecting a plurality of reinforcement bars; the periphery of the three-dimensional grid integral type inner framework is welded with the contact part of the inner peripheral wall of the peripheral steel frame; the peripheral steel frame is filled with filling material which fills the hollow part of the three-dimensional grid integral type inner framework; and the filling material, the three-dimensional grid integral type inner framework and the peripheral steel frame are connected to form an integral base, therefore the strength, rigidity and stability of the base can be improved.
Description
Technical field
The utility model relates to the specific purpose tool of wafer process, is specifically related to a kind of base construction of semiconductor wafer machine table.
Background technology
People know, the requirement on machining accuracy of semiconductor wafer is high especially, therefore, equipment to processing, for example the stability of polishing semiconductor wafer machine self and required precision are also quite high, and grinder is made of top board and lower base, and that the intensity of bottom support and the stability stability when the top board work causes the pass is important.The pedestal of 8 at present used inch diameter semiconductor wafer machine tables, all form by the metal group structure, but find in actual use, because it is the non-physical structure of hollow, its rigidity and intensity are relatively poor, little oscillation phenomenon is arranged during use, influenced the stability of the wafer process equipment work of fixing on it and the quality of converted products.For 8 inches more small-sized wafer process equipment, its vibration is also within tolerance band, but the quality of converted products is not best.
Summary of the invention
The purpose of this utility model is to overcome the above-mentioned technical problem that exists in the prior art, and a kind of rigidity is strong, the base construction of the semiconductor wafer machine table of good stability and provide, and 12 inches semiconductor wafers with interior diameter are improved the quality.
The technical solution of the utility model: a kind of base construction of semiconductor wafer machine table, mainly comprise a peripheral steel framework body, it is characterized in that: in the cavity of peripheral steel framework body, be installed with a stereo grid shaped all-in-one-piece inner skeleton that connects into by some reinforcing bars, the internal perisporium contact site solid welding of the periphery of this stereo grid shaped integral and internal skeleton and peripheral steel framework body together, at peripheral steel framework perfusion in vivo filler is arranged, filler is full of the hollow-out parts of stereo grid shaped integral and internal skeleton, and makes filler, stereo grid shaped integral and internal skeleton and peripheral steel framework body solidify the formula pedestal that links into an integrated entity.
The utility model also can be realized by following scheme: described filler is concrete, cement or lead.
Described stereo grid shaped integral and internal skeleton is the support body with the hollow-out parts that interpenetrates that is overlapped to form by some longitudinal reinforcements, transverse steel and vertical reinforcing bar, then is welded as a whole mutually by solder joint in the lap-joint that respectively crosses of support body.
Advantage of the present invention and beneficial effect are, because the solid netted integral and internal skeleton and the mutual solid welding of peripheral steel framework body that are welded into, and again three-dimensional inner skeleton is covered, fills and solidifies by filler and be combined as a whole and constitute a solid integrated footings, not only improved the intensity of pedestal, rigidity and stability, and the own wt of pedestal has also strengthened, and also helps the raising of its stability and resistance to shock.
Description of drawings
Fig. 1 is stereoscopic figure of the present utility model;
Fig. 2 does not pour into filler structural perspective before for Fig. 1;
Fig. 3 is the partial structurtes enlarged drawing of inner skeleton among Fig. 2.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is further described.Following examples only are used for technical scheme of the present invention more clearly is described, and can not limit protection scope of the present invention with this.
Referring to Fig. 1-3, a kind of base construction of semiconductor wafer machine table, it is provided with a peripheral steel framework body 3, wherein: in the cavity of peripheral steel framework body 3, be fixed with a stereo grid shaped all-in-one-piece inner skeleton 2 that connects into by some reinforcing bars, the internal perisporium contact site solid welding of the periphery of this stereo grid shaped integral and internal skeleton 2 and peripheral steel framework body 3 together, and in peripheral steel framework body 3, be perfused with filler 4, this filler 4 is full of the hollow-out parts of stereo grid shaped integral and internal skeleton 2, and make filler 4, stereo grid shaped integral and internal skeleton 2 and peripheral steel framework body 3 solidify the formula pedestal 1 that links into an integrated entity, to reach 12 inches (300mm) with the interior diameter wafer effect person that improves the quality.This filler is concrete, cement or lead.
This stereo grid shaped integral and internal skeleton 2 is overlapped to form by some longitudinal reinforcements 6, transverse steel 7 and vertical reinforcing bar 8, support body with the hollow-out parts 10 that interpenetrates, the lap-joint that crosses of this support body is welded to each other by solder joint 9 and is integral (as shown in Figure 3).
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (3)
1, a kind of base construction of semiconductor wafer machine table, mainly comprise a peripheral steel framework body, it is characterized in that: in the cavity of peripheral steel framework body, be installed with a stereo grid shaped all-in-one-piece inner skeleton that connects into by some reinforcing bars, the internal perisporium contact site solid welding of the periphery of this stereo grid shaped integral and internal skeleton and peripheral steel framework body together, at peripheral steel framework perfusion in vivo filler is arranged, filler is full of the hollow-out parts of stereo grid shaped integral and internal skeleton, and makes filler, stereo grid shaped integral and internal skeleton and peripheral steel framework body solidify the formula pedestal that links into an integrated entity.
2, the base construction of semiconductor wafer machine table as claimed in claim 1 is characterized in that, described filler is concrete, cement or lead.
3, the base construction of semiconductor wafer machine table as claimed in claim 2, it is characterized in that, described stereo grid shaped integral and internal skeleton is the support body with the hollow-out parts that interpenetrates that is overlapped to form by some longitudinal reinforcements, transverse steel and vertical reinforcing bar, then is welded as a whole mutually by solder joint in the lap-joint that respectively crosses of support body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201048731U CN201357522Y (en) | 2009-01-09 | 2009-01-09 | Base structure of semiconductor wafer processing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201048731U CN201357522Y (en) | 2009-01-09 | 2009-01-09 | Base structure of semiconductor wafer processing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201357522Y true CN201357522Y (en) | 2009-12-09 |
Family
ID=41423284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009201048731U Expired - Fee Related CN201357522Y (en) | 2009-01-09 | 2009-01-09 | Base structure of semiconductor wafer processing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201357522Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102601872A (en) * | 2011-01-25 | 2012-07-25 | 财团法人精密机械研究发展中心 | Combined type machine part |
| CN104760322A (en) * | 2015-03-25 | 2015-07-08 | 重庆平伟汽车模具股份有限公司 | Strengthened stamping die and manufacturing method |
| WO2023217272A1 (en) * | 2022-05-12 | 2023-11-16 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Base and compressor apparatus |
-
2009
- 2009-01-09 CN CNU2009201048731U patent/CN201357522Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102601872A (en) * | 2011-01-25 | 2012-07-25 | 财团法人精密机械研究发展中心 | Combined type machine part |
| CN102601872B (en) * | 2011-01-25 | 2014-11-19 | 财团法人精密机械研究发展中心 | Combined type machine part |
| CN104760322A (en) * | 2015-03-25 | 2015-07-08 | 重庆平伟汽车模具股份有限公司 | Strengthened stamping die and manufacturing method |
| CN104760322B (en) * | 2015-03-25 | 2017-06-06 | 重庆平伟汽车科技股份有限公司 | One kind strengthens stamping die cantilever and manufacture method |
| WO2023217272A1 (en) * | 2022-05-12 | 2023-11-16 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Base and compressor apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20130109 |