CN201355893Y - 电子设备及其散热基板 - Google Patents
电子设备及其散热基板 Download PDFInfo
- Publication number
- CN201355893Y CN201355893Y CNU2009201297503U CN200920129750U CN201355893Y CN 201355893 Y CN201355893 Y CN 201355893Y CN U2009201297503 U CNU2009201297503 U CN U2009201297503U CN 200920129750 U CN200920129750 U CN 200920129750U CN 201355893 Y CN201355893 Y CN 201355893Y
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation region
- heat
- pcb
- radiating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009201297503U CN201355893Y (zh) | 2009-01-21 | 2009-01-21 | 电子设备及其散热基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009201297503U CN201355893Y (zh) | 2009-01-21 | 2009-01-21 | 电子设备及其散热基板 |
Publications (1)
Publication Number | Publication Date |
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CN201355893Y true CN201355893Y (zh) | 2009-12-02 |
Family
ID=41412233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2009201297503U Expired - Fee Related CN201355893Y (zh) | 2009-01-21 | 2009-01-21 | 电子设备及其散热基板 |
Country Status (1)
Country | Link |
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CN (1) | CN201355893Y (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106255313A (zh) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | 一种电路板用散热冷板的制备和粘接方法 |
-
2009
- 2009-01-21 CN CNU2009201297503U patent/CN201355893Y/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106255313A (zh) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | 一种电路板用散热冷板的制备和粘接方法 |
CN106255313B (zh) * | 2016-08-30 | 2018-10-02 | 无锡市同步电子制造有限公司 | 一种电路板用散热冷板的制备和粘接方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: Shenzhen Shennan Circuits Co., Ltd. Address before: 518000 overseas Chinese city, Guangdong, Shenzhen southern Shahe Industrial Zone Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091202 Termination date: 20160121 |
|
EXPY | Termination of patent right or utility model |