CN201352551Y - Silver paste spraying device in semiconductor packaging engineering - Google Patents
Silver paste spraying device in semiconductor packaging engineering Download PDFInfo
- Publication number
- CN201352551Y CN201352551Y CNU2009200367091U CN200920036709U CN201352551Y CN 201352551 Y CN201352551 Y CN 201352551Y CN U2009200367091 U CNU2009200367091 U CN U2009200367091U CN 200920036709 U CN200920036709 U CN 200920036709U CN 201352551 Y CN201352551 Y CN 201352551Y
- Authority
- CN
- China
- Prior art keywords
- silver
- slurry
- hole
- spray
- thick liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 76
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 76
- 239000004332 silver Substances 0.000 title claims abstract description 76
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000005507 spraying Methods 0.000 title abstract 2
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000002347 injection Methods 0.000 claims abstract description 26
- 239000007924 injection Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 230000005855 radiation Effects 0.000 claims abstract description 6
- 239000002002 slurry Substances 0.000 claims description 79
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract 8
- 230000010354 integration Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000006255 coating slurry Substances 0.000 description 3
- 238000007581 slurry coating method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009955 starching Methods 0.000 description 1
Images
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- Nozzles (AREA)
Abstract
The utility model relates to a silver thick liquid injection apparatus in semiconductor package engineering, install silver thick liquid injection apparatus (100) of silver thick liquid sprayer (120) of spraying silver thick liquid downwards on silver thick liquid pipe (110) that are equipped with the silver thick liquid and the support that links to each other with the silver thick liquid pipe, silver thick liquid sprayer lower part has at least one integration outstanding nozzle (120) that forms, the nozzle is by corresponding with the injection area that needs, the jet orifice (DH) of suitable length and width forms, the terminal surface of jet orifice (DH) is triangle-shaped, quadrangle, rhombus, ellipse, circular, a style of calligraphy or any form in cross and the radiation shape; the silver paste is coated on the substrate at one time through the spray hole. The silver paste is simply, quickly and stably coated on the semiconductor equipment, so that the productivity of the semiconductor equipment is improved, and the production efficiency is improved.
Description
Technical field
The utility model is about semiconductor packages engineering silver slurry injection apparatus, more detail is for silver coating slurry promptly easily on semiconductor substrate, improved the silver slurry injection apparatus of nozzle structure, help chip epoxycoverage (the silver slurry overflows around the chip) management, improve the quality of silver slurry coating.
Background technology
Usually in order to paste semiconductor chip (Semiconductor Chip), chip attach on substrate zone coating in advance has the aqueous silver slurry of adhibit quality, and the equipment of the silver coating slurry being pasted semiconductor chip is called Die Attach equipment (Die Attach Equipment patch device).
That is, spray (Dispensing) silver slurry with Die Attach equipment to substrate, 1 property is finished the engineering of pasting semiconductor chip in the above.
Semiconductor Die Attach equipment, is supplied the silver of aqueous resin and is starched injection apparatus to Bond workbench supply board device by the Bond workbench that carries out Die bond operation to the Pad of substrate, the Die bond of Bond Chip constitutes on substrate.
Fig. 2 is the simple concept map of silver slurry injection apparatus of original semiconductor packages engineering, and original silver slurry injection apparatus comprises that roughly silver is starched pipe and silver-colored slurry ejector is formed.
Aqueous silver-colored slurry is equipped with in the inside of silver slurry pipe. and silver-colored slurry ejector bottom comprises 1 syringe needle shape nozzle, links with silver slurry pipe and passes through nozzle ejected silver slurry downwards.
The silver slurry that sprays from such 1 nozzle is usually in the Writing mode, and coating forms silver slurry layer as the picture of picture The Small Well apperance on substrate.
But, when starching with Writing mode silver coating by original silver-colored slurry ejector, thus owing to the bigger silver-colored slurry of contact area can be deviate from, need be mobile as drawing, so just caused silver-colored slurry coating project speed problem slowly.
Summary of the invention
Technical problem: the purpose of this utility model is that the injection apparatus of the silver slurry in a kind of semiconductor packages engineering is provided in order to address the above problem, and this device is implemented in the simple and easy slurry of silver coating promptly on the semiconductor equipment.
Technical scheme: the structure of silver in the semiconductor packages engineering of the present utility model slurry injection apparatus is: be equipped with on the support that is connected at the silver slurry pipe that the silver slurry is housed with silver slurry pipe in the silver slurry injection apparatus of the silver-colored slurry ejector of ejected silver slurry downwards, silver slurry ejector bottom has the nozzle of an integrated outstanding formation at least, nozzle is by with the projected area correspondence of needs, the spray-hole of appropriate length and width forms, and the end face of spray-hole is any form in triangle, quadrangle, rhombus, ellipse, circle, yi word pattern or cross and the radiation; By spray-hole is disposable the silver slurry is applied on the substrate.When above-mentioned spray-hole formed with even number, each spray-hole disposed at intervals.When above-mentioned spray-hole formed with even number, each spray-hole connected the through-hole form that links and have integral body mutually.
The end face of spray-hole can form triangle, quadrangle, rhombus, circle, ellipse, in-line, any shape in cross and the radiation.
Beneficial effect: as above-mentioned be bottom according to the silver in the utility model semiconductor packages engineering slurry injection apparatus at silver slurry injection apparatus.On semiconductor equipment, realize simple and easy, at a high speed, silver coating slurry stably, thereby improve the semiconductor equipment production capacity, enhance productivity.
Description of drawings
Fig. 1 is the concept map of the silver slurry injection apparatus of the demonstration of summary semiconductor packages engineering of the present invention.
Fig. 2 is the simple concept map of the silver slurry injection apparatus of original semiconductor packages engineering.
Fig. 3 is the plane oblique view of silver-colored slurry ejector, and Fig. 4 is the bottom surface oblique view of silver-colored slurry ejector.
Fig. 5 to 12 is the plane graph that has shown the multiple structure of the silver-colored slurry ejector nozzle that applies to the invention process example.
Figure 13 to 20 is the plane graph that has shown the different examples of multiple structure of the silver-colored slurry ejector nozzle that applies to the invention process example.
Wherein have: silver slurry injection apparatus 100, silver slurry pipe 110, silver-colored slurry ejector 120, nozzle 125, spray-hole DH.
Embodiment
Be equipped with on the support that is connected at the silver slurry pipe 110 that silver slurry is housed with silver slurry pipe in the silver slurry injection apparatus 100 of the silver-colored slurry ejector 120 of ejected silver slurry downwards, silver slurry ejector bottom has the nozzle 120 of an integrated outstanding formation at least, nozzle is by with the projected area correspondence of needs, the spray-hole DH of appropriate length and width forms, and the end face of spray-hole DH is any form in triangle, quadrangle, rhombus, ellipse, circle, yi word pattern or cross and the radiation; By spray-hole is disposable the silver slurry is applied on the substrate, reaches the silver slurry injection apparatus that the semiconductor packages engineering is provided.
When spray-hole formed with even number, each spray-hole was configured at regular intervals mutually.
When spray-hole formed with even number, each spray-hole connected mutually and links, and it is good forming whole spray-hole.
Describe embodiments of the invention in detail below with reference to additional drawing.But, below shown in the invention process example may be changed to multiple other form, scope of the present invention not merely is limited to described example.To be had more complete elaboration the present invention of people of the common knowledge of the industry in order giving, and embodiments of the invention to be provided.
Fig. 1 is the notion that has shown the semiconductor silver slurry injection apparatus in the invention process example briefly,
Fig. 3 is an oblique view of looking the plane of silver-colored slurry ejector from Fig. 1, and Fig. 4 is the oblique view of bottom surface.
With reference to figure 3 and Fig. 4, the silver slurry injection apparatus 100 in the invention process example roughly comprises silver slurry pipe 110 and silver-colored slurry ejector 120 compositions.Aqueous silver slurry is equipped with in the inside of silver slurry pipe 110, and the silver slurry is given silver-colored slurry ejector 120 downwards along the air pressure that is added in the silver slurry pipe 110.
Also have, silver-colored slurry ejector 120 links with silver slurry pipe 110 downsides, and silver-colored slurry ejector 120 bottoms possess a nozzle 125 at least.
In addition, the end face that applies to the spray-hole DH of example of the present invention forms the radiation that communicates, but, be not limited thereto, such as, triangle, quadrangle, rhombus, equilateral polygon, ellipse, circular, yi word pattern or cross etc., as long as and the corresponding form of projected area that needs, any form all may.
Describe the multiple structure that applies to the nozzle 125 in the silver-colored slurry ejector 120 of the present invention below in detail.
Fig. 5 to Figure 12 is the plane graph that applies to the multiple structure of the nozzle 125 that possesses in the silver-colored slurry ejector of the invention process example, and each spray-hole DH configured separate at regular intervals demonstrated multiple structure when spray-hole DH was even number.
That is, Fig. 5 to Figure 12 shows that each even number spray-hole DH is separated from each other the triangle of demonstration, quadrangle, rhombus, ellipse, circle, yi word pattern or cross and actiniform form.
Figure 13 to Figure 20 is the plane graph of the different examples of the multiple structure of the nozzle 125 in the silver-colored slurry ejector that uses in the demonstration the invention process example, when spray-hole forms with even number, show that each spray-hole connects mutually and links, have whole spray-hole (DH) and the variety pattern that forms.
That is, Figure 13 to Figure 20 shows that each even number spray-hole connects mutually and links, and shows whole spray-hole DH with triangle, quadrangle, rhombus, ellipse, circle, yi word pattern or cross and actiniform form.
Although the suitable examples of implementation to the slurry of the silver in above-mentioned the utility model semiconductor manufacturing engineering injection apparatus are illustrated, but the present invention is not limited only to this, reach in the additional drawing scope in patent claim and detailed description of the invention, can implement by various deformation, and belong to the utility model.
Claims (3)
1. the slurry of the silver in semiconductor packages engineering injection apparatus, it is characterized in that, be equipped with on the support that is connected at the silver slurry pipe (110) that silver slurry is housed with silver slurry pipe in the silver slurry injection apparatus (100) of the silver-colored slurry ejector (120) of ejected silver slurry downwards, silver slurry ejector bottom has the nozzle (120) of an integrated outstanding formation at least, nozzle is by with the projected area correspondence of needs, the spray-hole of appropriate length and width (DH) forms, and the end face of spray-hole (DH) is a triangle, quadrangle, rhombus, oval, circular, any form in yi word pattern or cross and the radiation; By spray-hole is disposable the silver slurry is applied on the substrate.
2. the silver slurry injection apparatus in the semiconductor packages engineering according to claim 1 is characterized in that when above-mentioned spray-hole (DH) formed with even number, each spray-hole DH disposed at intervals.
3. the silver slurry injection apparatus in the semiconductor packages engineering according to claim 1 is characterized in that when above-mentioned spray-hole (DH) formed with even number, each spray-hole (DH) connected the through-hole form that links and have integral body mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200367091U CN201352551Y (en) | 2009-02-23 | 2009-02-23 | Silver paste spraying device in semiconductor packaging engineering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009200367091U CN201352551Y (en) | 2009-02-23 | 2009-02-23 | Silver paste spraying device in semiconductor packaging engineering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201352551Y true CN201352551Y (en) | 2009-11-25 |
Family
ID=41375937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009200367091U Expired - Fee Related CN201352551Y (en) | 2009-02-23 | 2009-02-23 | Silver paste spraying device in semiconductor packaging engineering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201352551Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660699A (en) * | 2018-06-28 | 2020-01-07 | 台湾积体电路制造股份有限公司 | Apparatus for dispensing fluid, apparatus for semiconductor manufacturing, and dispensing method |
-
2009
- 2009-02-23 CN CNU2009200367091U patent/CN201352551Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660699A (en) * | 2018-06-28 | 2020-01-07 | 台湾积体电路制造股份有限公司 | Apparatus for dispensing fluid, apparatus for semiconductor manufacturing, and dispensing method |
| CN110660699B (en) * | 2018-06-28 | 2022-06-14 | 台湾积体电路制造股份有限公司 | Apparatus for dispensing fluid, apparatus for semiconductor manufacturing, and dispensing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091125 Termination date: 20130223 |