CN201312310Y - Erbium-doped fiber amplifier - Google Patents

Erbium-doped fiber amplifier Download PDF

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Publication number
CN201312310Y
CN201312310Y CNU2008202293153U CN200820229315U CN201312310Y CN 201312310 Y CN201312310 Y CN 201312310Y CN U2008202293153 U CNU2008202293153 U CN U2008202293153U CN 200820229315 U CN200820229315 U CN 200820229315U CN 201312310 Y CN201312310 Y CN 201312310Y
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CN
China
Prior art keywords
erbium
doped fiber
housing
cover plate
fiber amplifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008202293153U
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Chinese (zh)
Inventor
汤吓雄
谢凯波
张党卫
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Photop Technologies Inc
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Photop Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photop Technologies Inc filed Critical Photop Technologies Inc
Priority to CNU2008202293153U priority Critical patent/CN201312310Y/en
Application granted granted Critical
Publication of CN201312310Y publication Critical patent/CN201312310Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a fiber communication field, in particular to an erbium-doped fiber amplifier structure, comprising integrated thermal fans, a casing and a circuit board, and is characterized in that the circuit board is welded with an electronic element, a pumping laser and a photo-detector, the casing is made of copper product materials, the casing is not in the complete enclosed type, and ventilation holes are arranged at the lateral side of the casing and a cover board. The integrated EDFA achieves the radiation function by employing to internally arrange one or a plurality of integrated fans on each lateral side of the casing including the cover board, and a monolithic device on the circuit board is used to control the rotary speed and the operation of the fan. The erbium-doped fiber amplifier overcomes the shortcoming that EDFA requires to work under high-temperature environment on the industrial grade, and is provided with characteristics of good radiation performance, small bulk, adapting to high temperature working, strong practicality, high reliability, being extensively applicable to fiber communication, CATV (community television) and other fields.

Description

A kind of erbium-doped fiber amplifier
Technical field
The utility model relates to fiber optic communication field, relates in particular to a kind of erbium-doped fiber amplifier structure.
Background technology
The development of fiber optic communication field has been quickened in the appearance of fiber amplifier, particularly erbium-doped fiber amplifier.The advantage of EDFA self: power output is big, noise is little, directly to light signal amplify, need not to convert to the signal of telecommunication, operating wavelength range is wide, reliability is high, these advantages make EDFA be used widely in optical fiber communication.Some external condition harshness very in the use of EDFA is as hot environment.The ceiling temperature of other application requirements of technical grade EDFA work is 75 ℃, and this requirement has exceeded the working limit of common EDFA.
For traditional EDFA, working limit temperature range on the general technology is at 60-70 ℃, and when ambient temperature reaches 70 ℃, because internal circuit heater element and pump laser outwards dispel the heat, and because housing seals, make the air of housing the inside not form convection current with outside air, can make the enclosure interior temperature rise to more than 85 ℃, this just causes enclosure interior to accumulate very high heat, owing to be limited to 85 ℃ on the working temperature of a lot of devices on the circuit board, when ambient temperature reached 70 ℃, the device on the EDFA circuit board had limited EDFA use at high temperature with regard to cisco unity malfunction.
Development along with global information industry, extensiveization of optical fiber communication application, operational environment to the EDFA product requires more and more harsher, it is 75 ℃ that the industry level applications generally requires the ceiling temperature of EDFA work, and the requirement to EDFA integrated level, volume and power consumption is also very strict, this makes necessary improvement with regard to requiring to traditional EDFA, thereby satisfies new demand.
The utility model content
In order to satisfy the demand that EDFA works under hot conditions, the utility model proposes a kind of perfect heat-dissipating, EDFA that integrated level is high, have that volume is little, integrated level is high, characteristic such as low in energy consumption, practical and reliability height, significant in the fiber amplifier field.It has overcome existing EDFA can not satisfy the shortcoming of working under the industrial hot conditions.
Erbium-doped fiber amplifier of the present utility model (EDFA) is to realize like this.It comprises housing, cover plate, circuit board etc., and described circuit board is arranged in the described housing, and described housing side has the housing ventilation hole, and the cover plate ventilation hole is arranged on the described cover plate, and the correspondence position of cover plate ventilation hole has radiator fan.
Further, also be provided with port on the described housing, port comprises power port and PORT COM; And be provided with the optical fiber optical fiber hole.
Further, described housing is copper housing, and described cover plate is copper cover plate.
Further, described circuit board comprises temperature detecting module, single chip control module, pump laser, Er-doped fiber, two photo-detectors, input optical fibre, output optical fibre and passive optical devices.
Further, described passive optical device comprises optical isolator, optical branching device etc.
Further, the motor of described radiator fan is electrically connected at described single chip control module by driver module.
Further, described two photo-detectors are connected to described input optical fibre and output optical fibre.
Further, the housing ventilation hole quantity of described housing side be 2 or more than; Cover plate ventilation hole on the described cover plate and corresponding radiator fan be 1 or more than.
EDFA of the present utility model adopts said structure, compares with structure in the past to have following advantage: proposed a kind of EDFA that works under 75 ℃ of conditions of high temperature that satisfies.The utility model EDFA adopts the material of copper to design housing, be because the thermal conductivity ratio of copper is higher, and cover plate and side at housing are offered ventilation hole, make the air of housing the inside to form convection current with outside air faster, next is the radiator fan that adopts built-in one or several integrated forms on the side of housing or cover plate, has increased the convection current of air.Make that like this whole system is simple in structure, have characteristics such as compact conformation, miniaturization, perfect heat-dissipating and reliability height, and practical, and be widely used in optical fiber communication, CATV fields such as (cable TVs) under the technical grade environment.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The figure number explanation:
1---cover plate 2---screw
3---cover plate ventilation hole 4---fan
5---housing side ventilation hole 6---pump laser
7---optical fiber optical fiber hole 8---power supply communication interface
9---control circuit board 10---housing
Embodiment
Existing accompanying drawings and embodiment further specify the utility model.
See also shown in Figure 1, the technical scheme that EDFA of the present utility model adopted is: the location hole of offering fan on cover plate 1, fan 4 is fixed on the cover plate 1 of housing by screw 2, and offer ventilation hole 3 in the relevant position of placing fan, control the rotating speed and the operation of fan 4 by the single-chip microcomputer on the EDFA circuit board 9, this example is to open ventilation hole at the cover plate 1 of housing and housing 10 sides 5, and placement fan 4 increases convection current on cover plate 1, can certainly open ventilation hole 5 at the side of housing 10 and place fan, adopting copper product to design housing simultaneously increases thermal conductivity.Also be provided with port 8 on the described housing 10, port 8 comprises power port and PORT COM; And be provided with optical fiber optical fiber hole 7.
When ambient temperature rises to 70 ℃, because the effect of radiator fan 4 and ventilation hole 3,5, housing 1 temperature inside also can not rise to the ceiling temperature of electronic device work on the EDFA circuit board, so just can not influence the stability of EDFA work, simultaneously can adopt temperature sensor to survey housing 1 temperature inside, can be so that fan just brings into operation when housing 1 internal temperature reaches a certain numerical value, and also can be by the rotating speed of Single-chip Controlling fan, so the user can control fan flexibly according to the situation of reality.This control circuit board 9 also is used to control pump laser 6, and drive current and refrigeration are provided.By the input and output optical detection, the power output of control EDFA.
In sum, adopt design philosophy of the present utility model and method, can propose a kind of industrial EDFA of working under the hot conditions of requiring that satisfies on the basis of traditional E DFA, have good prospect and using value widely.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; in the spirit and scope of the present utility model that do not break away from appended claims and limited; can make various variations to the utility model in the form and details, be protection range of the present utility model.

Claims (8)

1, a kind of erbium-doped fiber amplifier, it is characterized in that: comprise housing (10), cover plate (1), circuit board (9) etc., described circuit board (9) is arranged in the described housing (10), described housing (10) side has housing ventilation hole (5), cover plate ventilation hole (3) is arranged on the described cover plate (1), and the correspondence position of cover plate ventilation hole (3) has radiator fan (4).
2, erbium-doped fiber amplifier according to claim 1 is characterized in that: also be provided with port (8) on the described housing (10), port (8) comprises power port and PORT COM; And be provided with optical fiber optical fiber hole (7).
3, erbium-doped fiber amplifier according to claim 1 is characterized in that: described housing (10) is copper housing, and described cover plate (1) is copper cover plate.
4, erbium-doped fiber amplifier according to claim 1 is characterized in that: described circuit board (9) comprises temperature detecting module, single chip control module, pump laser (6), Er-doped fiber, two photo-detectors, input optical fibre, output optical fibre and passive optical devices.
5, erbium-doped fiber amplifier according to claim 4 is characterized in that: described passive optical device comprises optical isolator, optical branching device etc.
6, according to claim 1 or 4 described erbium-doped fiber amplifiers, it is characterized in that: the motor of described radiator fan (4) is electrically connected at described single chip control module by driver module.
7, erbium-doped fiber amplifier according to claim 4 is characterized in that: described two photo-detectors are connected to described input optical fibre and output optical fibre.
8, erbium-doped fiber amplifier according to claim 1 is characterized in that: housing ventilation hole (5) quantity of described housing (10) side be 2 or more than; Cover plate ventilation hole (3) on the described cover plate (1) and corresponding radiator fan (4) be 1 or more than.
CNU2008202293153U 2008-12-03 2008-12-03 Erbium-doped fiber amplifier Expired - Lifetime CN201312310Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008202293153U CN201312310Y (en) 2008-12-03 2008-12-03 Erbium-doped fiber amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008202293153U CN201312310Y (en) 2008-12-03 2008-12-03 Erbium-doped fiber amplifier

Publications (1)

Publication Number Publication Date
CN201312310Y true CN201312310Y (en) 2009-09-16

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CNU2008202293153U Expired - Lifetime CN201312310Y (en) 2008-12-03 2008-12-03 Erbium-doped fiber amplifier

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CN (1) CN201312310Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103022868A (en) * 2012-12-25 2013-04-03 中国电子科技集团公司第十一研究所 Pulse optical fiber laser
CN106329298A (en) * 2016-10-25 2017-01-11 无锡市德科立光电子技术有限公司 Array optical fiber amplifier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103022868A (en) * 2012-12-25 2013-04-03 中国电子科技集团公司第十一研究所 Pulse optical fiber laser
CN106329298A (en) * 2016-10-25 2017-01-11 无锡市德科立光电子技术有限公司 Array optical fiber amplifier

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CX01 Expiry of patent term

Granted publication date: 20090916

CX01 Expiry of patent term