CN201272743Y - Quartz wafer etching machine - Google Patents
Quartz wafer etching machine Download PDFInfo
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- CN201272743Y CN201272743Y CNU2008200940905U CN200820094090U CN201272743Y CN 201272743 Y CN201272743 Y CN 201272743Y CN U2008200940905 U CNU2008200940905 U CN U2008200940905U CN 200820094090 U CN200820094090 U CN 200820094090U CN 201272743 Y CN201272743 Y CN 201272743Y
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Abstract
The utility model discloses a quartz chip etcher comprising a control system, a plurality of driving systems, an etching system and a cleaning system, wherein each driving system corresponds to an etching tank and a cleaning tank in the etching system and the cleaning system, each driving system comprises a swing mechanism equipped with a manipulator, a mechanical arm and a secondary mechanical arm and a sliding mechanism equipped with parallel sliding tracks and a sliding plate, through engagement of the two mechanisms, an etching basket of a hook of the driving system can realize vertical reciprocation, and positive and negative rotation, and then microchips in the etching basket can be immersed sufficiently in etching liquid, thereby increasing working efficiency of the quartz chip etcher while reducing cost of etching the quartz chips.
Description
Technical field
The utility model relates to quartz wafer corrosion field, relates in particular to a kind of quartz wafer etching machine.
Background technology
In the research, development and production activity of quartz crystal, need a corrosion process to the process for processing of wafer.The etching process of prior art is to hang the corrosion frame on the mechanical arm of wafer etching machine, this corrosion frame has some cellular spaces, load a wafer that is corroded in each space, the space of loaded with wafers should make corrosive fluid fully enter, can not allow wafer drop out again, therefore this corrosion shelf structure more complicated.The mechanical arm of wafer etching machine drive corrosion frame pumped in corrosive fluid after suspension finished, and wafer surface is corroded operation.Need after etching the wafer in the corrosion frame is cleaned up together with the corrosion frame, will corrode frame again and take apart, wafer is taken out.
Therefore, a large amount of production practice show that existing quartz wafer etching machine has following shortcoming:
1, production has high input, the cost height, and it is higher mainly to show as human cost, especially for scale operation, needs to arrange a large amount of employees, pack into wafer and combination, loading and unloading corrosion frame.
2, labor strength is big, and production efficiency is low, the dependence workman manual operation that the existing processes process is too much, and level of automation is low.
3, frangible easily the splitting of wafer causes in loading and unloading corrosion frame process, and the wafer loss is big, and product cost increases.
In summary, the quartz wafer etching machine of described prior art obviously exists inconvenience and defective on reality is used, so be necessary to be improved.
The utility model content
At above-mentioned defective, the purpose of this utility model is to provide a kind of quartz wafer etching machine, to improve quartz wafer corrosive working efficiency, reduces operator's labour intensity and production cost.
To achieve these goals, the utility model provides a kind of quartz wafer etching machine, comprise Controlling System, some groups of drive systems, etching system and cleaning systems, wherein, a pair of etching tank and rinse bath in corresponding described etching system of each group drive system and the cleaning system, described each group drive system comprises:
Tilting mechanism has
Mechanical manipulator, its upper end is provided with follower gear, and the lower end is provided with hook, and this hook hook one corrosion basket is installed in some quartz wafers to be corroded arbitrarily in this corrosion basket; The middle part of this mechanical manipulator is provided with connecting rod, is connected with the lower end of mechanical arm by this connecting rod;
Mechanical arm, its upper end is provided with rotary cylinder, and its lower end is connected with described mechanical manipulator by described connecting rod;
Secondary mechanical arm, its upper end is connected with the reducing motor output shaft by a crank and rocker mechanism; Its lower end is provided with driving toothed gear, when described corrosion basket places described etching tank to corrode, and this driving toothed gear and the engagement of described follower gear;
Slide mechanism has
Parallel slideway, this parallel slideway is assembled by two groups of linear bearingss, two groups of linear axis and shaft holder;
Sliding panel, this sliding panel is installed on the described parallel slideway, and described tilting mechanism is installed on this sliding panel;
Two-way cylinder, this two-way cylinder is installed on the described slide mechanism, and its point of application is corresponding to described sliding panel, and on this two-way cylinder some magnetic switch is set, and pumps to control described sliding panel.
According to quartz wafer etching machine of the present utility model, described secondary mechanical arm upper end is provided with second rocking arm, and this second rocking arm is connected to first rocking arm that is uneven in length with described second rocking arm that is provided with on the described reducing motor output shaft by a fork; Wherein, described reducing motor rotates and drives described first rocking arm do turnover motion, does positive and negative to-and-fro movement by described second rocking arm of the drive of fork, drives described secondary mechanical arm by this second rocking arm and makes positive and negative crankmotion;
Described mechanical manipulator passes through the engagement of the follower gear and the driving toothed gear that described secondary mechanical arm lower end is provided with of its upper end setting, makes positive and negative crankmotion;
The upper, middle and lower portion of described two-way cylinder is provided with a magnetic switch respectively, and the magnet ring signal of the middle part by described two-way cylinder and two magnetic switch induction bidirectional cylinder pistons of bottom pumps to control described sliding panel; And
The magnetic switch on described two-way cylinder top is responded to the magnet ring signal of this two-way cylinder piston, control described sliding panel and upwards slide into the level attitude height of the corrosion basket of described mechanical manipulator hook, be higher than the height of the cell wall between described etching tank and the rinse bath along described parallel slideway; And the rotary cylinder rotation of described mechanical arm upper end drives the mechanical manipulator that is connected with described mechanical arm and rotates, to control the station that described mechanical manipulator is transformed in etching tank and rinse bath.
According to according to quartz wafer etching machine of the present utility model, the two ends of described two-way cylinder are provided with restrictor, and this restrictor is regulated the frequency that sliding panel pumps; And/or
Described rotary cylinder is provided with two magnetic switch, controls described rotary cylinder by described two magnetic switch and a magnetic valve group and rotates the positive and negative crankmotion of the described mechanical arm of drive.
According to quartz wafer etching machine of the present utility model, the stroke that described sliding panel pumps is by the distance decision of two magnetic switch of the middle part of described two-way cylinder and bottom;
The level attitude height of the corrosion basket of described mechanical manipulator hook when conversion etching tank and rinse bath station is by the upper magnetic on-off control of described two-way cylinder.
According to quartz wafer etching machine of the present utility model, described secondary mechanical arm drives described mechanical manipulator, and to make the rotation radian of positive and negative crankmotion in etching tank be 90～115 radians;
Described mechanical arm drive described mechanical manipulator in etching tank or rinse bath, work with the conversion station the rotation radian be 180 radians.
According to quartz wafer etching machine of the present utility model, described mechanical manipulator comprises axle, bearing housing, bearing, hook receiver, hook, fixed block and follower gear; Described axle is installed on the described bearing, and described bearing housing is loaded on described axle and bearing housing in it; The upper end of described axle is connected with described follower gear, and the lower end of described axle is connected with described hook receiver; Described hook receiver lower end is provided with a fixed block, and this fixed block is connected with described hook by a securing gear;
The upper end of described mechanical arm is connected with a rotary cylinder, and this rotary cylinder is connected with the shaft adapter of described mechanical arm by a shaft coupling;
The axle of described secondary mechanical arm is installed in the bearing housing.
According to quartz wafer etching machine of the present utility model, the number of teeth of described driving toothed gear and modulus equate with the number of teeth and the modulus of described follower gear; And/or,
Described driving toothed gear and follower gear are nylon gear.
According to quartz wafer etching machine of the present utility model, the two ends of described fork are connected with second rocking arm with described first rocking arm by an oscillating bearing respectively.
According to quartz wafer etching machine of the present utility model, described etching system comprises corrosion case, the corrosion protection pump that is linked in sequence successively by anti-corrosion pipeline, and etching tank, overflow groove;
Described cleaning system comprises: a rinse bath and a magnetic valve that is installed in water-in; When scavenging solution enters rinse bath, by the described rinse bath of weir divider discharge.
According to quartz wafer etching machine of the present utility model, the corrosion heating tube is installed in the described rinse bath; And/or,
The temperature of the scavenging solution in the described quartz wafer etching machine is by temperature regulator and temperature sensor control; And/or,
Described Controlling System is a programmable logic controller.
By the quartz wafer etching machine that uses the utility model to provide, can make and place the quartz wafer of corrosion basket to pump simultaneously and positive and negative rotatablely moving, microwafer crevice corrosion fully liquid like this, and in etching tank and rinse bath light conversion station; This makes the operator needn't re-use the carrier of baroque corrosion frame as quartz wafer, has reduced the cost of manufacture of corrosion frame and the damage quantity of the wafer in the cargo handling process, improves the corrosion yield rate of quartz wafer, reduces production costs.On the other hand, because the utility model can be provided with many group drive systems, every group of drive system difference independent control improved quartz wafer etching machine level of automation of the present utility model and production efficiency, alleviate working strength of workers, and saved cost of human resources.
Description of drawings
Fig. 1 is the driving system structure synoptic diagram of the quartz wafer etching machine that provides of the utility model;
Fig. 2 is the vertical view of the drive system of the quartz wafer etching machine that the utility model provides among Fig. 1;
Fig. 3 is the structural representation of secondary mechanical arm in the drive system of the utility model quartz wafer etching machine among Fig. 1;
Fig. 4 is the sectional view of partial component of the drive system of the quartz wafer etching machine that the utility model provides among Fig. 1;
Fig. 5 is the motion synoptic diagram of the crank and rocker mechanism in the drive system of the present utility model;
Fig. 6 is the mechanical manipulator in the drive system of the present utility model and the structural representation of mechanical arm;
Fig. 7 is the synoptic diagram of the mechanical manipulator of quartz wafer etching machine of the present utility model at corrosion station and washing station;
Fig. 8 is the etching system structural representation of the quartz wafer etching machine that provides of the utility model;
Fig. 9 is the control panel layout of the programmable logic controller of the quartz wafer etching machine that provides of the utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Basic thought of the present utility model is: the drive system of improving the quartz wafer etching machine, this drive system comprises tilting mechanism and slide mechanism, cooperation by two mechanisms, the corrosion basket of realizing the drive system hook pumps and positive and negative rotatablely moving simultaneously, make the microwafer in the corrosion basket fully be immersed in the corrosive fluid, improve the working efficiency of quartz wafer etching machine, reduced quartz wafer corrosive cost.
Fig. 1 is the driving system structure synoptic diagram of the quartz wafer etching machine that provides of the utility model, is described below:
Quartz wafer etching machine in the utility model, comprise Controlling System, some groups of drive systems, etching system and cleaning systems, wherein, a pair of etching tank 100 and rinse bath 200 in corresponding described etching system of each group drive system and the cleaning system, each group drive system 1 comprises: tilting mechanism, have: mechanical manipulator 11, its upper end is provided with follower gear 111, the lower end is provided with hook 112, this links up with 112 hooks, one corrosion basket (not shown), is installed in some quartz wafers to be corroded in this corrosion basket arbitrarily; The middle part of this mechanical manipulator 11 is provided with connecting rod 20, is connected with the lower end of mechanical arm 12 by this connecting rod 20; Mechanical arm 12, its upper end is provided with rotary cylinder 13, and its lower end is connected with mechanical manipulator 11 by connecting rod 20; Fig. 2 is the vertical view of the drive system of the quartz wafer etching machine that the utility model provides among Fig. 1, and Fig. 3 is the structural representation of secondary mechanical arm in the drive system of the utility model quartz wafer etching machine; Wherein, secondary mechanical arm 14, its upper end is connected with reducing motor 15 output shafts by a crank and rocker mechanism; Its lower end is provided with driving toothed gear 144, when the corrosion basket places etching tank 100 to corrode, and this driving toothed gear 144 and follower gear engagement 111; Slide mechanism referring to Fig. 1, has: parallel slideway 16, and this parallel slideway 16 is assembled by two groups of linear bearingss 161, two groups of linear axis 162 and shaft holder 163; Sliding panel 17, this sliding panel 17 is installed on the parallel slideway 16, and tilting mechanism is installed on this sliding panel 17; Two-way cylinder 18, this two-way cylinder 18 is installed on the slide mechanism, and its point of application is corresponding to sliding panel 17, and on this two-way cylinder 18 some magnetic switch 18a～18c is set, and pumps with control sliding panel 17.In the utility model, the main body of mechanical manipulator 11, mechanical arm 12 and secondary mechanical arm 14 all is the cylinder bodily form.
The corrosion frame of quartz wafer etching machine has some cellular spaces in the prior art, loads a wafer that is corroded in each space, and it so is provided with is in order to allow every wafer can both be subjected to the immersion of corrosive liquid fully.And in the utility model, because drive system 1 is improved, driving the corrosion basket by drive system 1 pumps and positive and negative rotatablely moving, make the wafer in the corrosion basket also can obtain same movement effects, promptly corroding basket carries out in vertical the pumping in corrosive fluid, also carrying out with the central axis of basket is the forward and reverse crankmotion or the positive and negative oscillating motion in the center of circle, reaches desirable corrosive effect.And the corrosion basket does not need to be made into special shape.Therefore, can simultaneously some quartz wafers be put into the corrosion basket, its put order and aspects such as orientation without any requirement.And quartz wafer no order ground in corrosion process drifts about in corrosive fluid, and every bauerite wafer all has the identical time fully to contact with corrosive fluid with probability, thereby reaches the ideal corrosive effect.
Fig. 4 is the sectional view of partial component of the drive system of the quartz wafer etching machine that the utility model provides among Fig. 1; The side sectional view of representing the secondary mechanical arm 14 of the parallel slideway 16 of slide mechanism and tilting mechanism by Fig. 4.Simultaneously referring to Fig. 3, in an embodiment of the present utility model, crank and rocker mechanism comprises that secondary mechanical arm 14 upper ends are provided with second rocking arm 141, and this second rocking arm 141 is connected to first rocking arm 143 that is uneven in length with second rocking arm 141 that is provided with on reducing motor 15 output shafts by a fork 142; Wherein, reducing motor 15 rotates and drives the 143 do turnover motions of first rocking arm, does positive and negative to-and-fro movement by drive second rocking arm 141 of fork 142, drives secondary mechanical arm 14 by this second rocking arm 141 and makes positive and negative crankmotion.Wherein, doing positive and negative rotatablely moving is reducing motor 15 by having reduction box, and its model is 60YYNCY-06-60, is that 1250 rev/mins moment of rotation drives reduction box and rotates by motor speed, and speed ratio is 10:1; The output shaft of reduction box obtains an ideal torque and rotating speed, and this rotating speed decision mechanical manipulator 11 is made the positive and negative speed that rotatablely moves.Second rocking arm 141 that is loaded on the reduction gearbox output shaft is done 360 degree rotations with identical rotating speed, this motion is passed to secondary mechanical arm 14 through fork 142 again.
Fig. 5 is the motion synoptic diagram of the crank and rocker mechanism in the drive system of the present utility model; A, B are respectively the movement locus of first rocking arm 143, second Swing Arm 141, be all circle, L3 is the circle center line connecting of two locus circles, L1, L2 be respectively two locus circles the center of circle and with the vertical axis of circle center line connecting L3, A1, A2, A3, A4 be on first Swing Arm 143 in four exemplary position of kinestate, corresponding with these 44 are respectively B1, B2, B3, B4 on second Swing Arm 141.Can understand clearly from figure, first Swing Arm 143 is being done the turnover motion always, and second Swing Arm 141 is being done oscillating motion always.By the drive of first rocking arm 143, secondary mechanical arm 14 is made positive and negative crankmotion.In addition, the two ends of fork 142 are connected with second rocking arm 141 with first rocking arm 143 by an oscillating bearing 147 respectively.
Fig. 6 is the mechanical manipulator in the drive system of the present utility model and the structural representation of mechanical arm; Mechanical manipulator 11 is made positive and negative crankmotion by the engagement of follower gear 111 with the driving toothed gear 144 of secondary mechanical arm 14 lower ends setting of its upper end setting.
Referring to Fig. 1, the upper, middle and lower portion of two-way cylinder 18 is provided with a magnetic switch 18a～18c respectively, by the middle part of two-way cylinder 18 and two magnetic switch 18b of bottom, the magnet ring signal of 18c induction bidirectional cylinder 18, with 17 to-and-fro movements of control sliding panel; Mechanical arm 12 pump by 18 controls of two-way cylinder, promptly sliding panel 17 pump by two-way cylinder 18 controls, in an embodiment of the present utility model, the model of this two-way cylinder 18 is SMCCDM2C25-200AJC73-3.In the outside part upper, middle and lower of this cylinder a magnetic switch is installed respectively, the model of this magnetic switch can be SMCDC73L, and when magnetic switch 18a or 18b sense the signal of two-way cylinder piston magnet ring, two-way cylinder piston promptly carries out reversing motion.And the stroke that sliding panel 17 pumps is by the distance decision of two magnetic switch 18b～18c of the middle part of two-way cylinder 18 and bottom.
On the other hand, Fig. 7 is the synoptic diagram of the mechanical manipulator of quartz wafer etching machine of the present utility model at corrosion station and washing station; F, Q are respectively the state of the utility model at corrosion station and washing station among the figure; Wherein, the magnetic switch 18a of two-way cylinder 18～18c responds to these two-way cylinder 18 magnet ring signals, control sliding panel 17 upwards slides into the level attitude height of the corrosion basket of mechanical manipulator 11 hooks along parallel slideway 16, makes it to be higher than the height of the cell wall 300 between etching tank 100 and the rinse bath 200; And rotary cylinder 13 rotations of mechanical arm 12 upper ends drive the mechanical manipulator 11 that is connected with mechanical arm 12 and rotate, and are transformed between etching tank 100 and 200 liang of stations of rinse bath with control mechanical manipulator 11.In the utility model, the corrosion basket of mechanical manipulator 12 hooks is by the upper magnetic switch 18a control of two-way cylinder 18 when the level attitude height of conversion etching tank 100 during with rinse bath 200 stations.
In an embodiment of the present utility model, the two ends of two-way cylinder 18 are provided with restrictor 19a～19b, and this restrictor 19a, 19b regulate the frequency that sliding panel 17 pumps; And/or, rotary cylinder 13 is provided with two magnetic switch 18d～18e, corrode cleaning by two magnetic switch 18d～18e and the moving mechanical arm 12 of a magnetic valve group controls revolution cylinder 13 rotating bands and exchange the position, the magnetic valve group comprises two restrictor 19c, 19d that are arranged on the rotary cylinder 13, and the model of two magnetic switch 18d～18e can be respectively SMLD-R731 and MLD-R732.The frequency that sliding panel 17 pumps is controlled respectively by the restrictor 19a～19b at two-way cylinder 18 two ends.The model of restrictor 19a～19d is SMCAC2201F-01-06S.
Corrosion basket in the utility model when the quartz wafer etching machine is worked, its movement locus comprises and up and down reciprocatingly reaches positive and negative rotatablely moving, quartz wafer no order ground in corrosion process is drifted about in corrosive fluid, every bauerite wafer all has the identical time fully to contact with corrosive fluid with probability, thereby reaches the ideal corrosive effect.And, all should reach the certain numerical value scope on the speed of this corrosion basket and frequency, angle and the stroke in order to reach this effect, through testing its preferred value such as following table repeatedly:
Therefore, in an embodiment of the present utility model, secondary mechanical arm 14 drive mechanical manipulators 11 are made positive and negative crankmotion in etching tank 100 rotation radian is 90～115 radians; And/or it is 180 radians at etching tank 100 and rinse bath 200 with the rotation radian of changing station that mechanical arm 12 drives mechanical manipulator 11.In Fig. 7, F represents to corrode station, and Q represents washing station, when mechanical manipulator 11 is changed stations to rinse bath 200 from etching tank 100, need turn over 180 radians and just can change station to rinse bath 200; 100 need the same angle of conversion equally from rinse bath 200 to etching tank.
In an embodiment of the present utility model, as shown in Figure 6, mechanical manipulator 11 comprises axle 112, bearing housing 113, bearing 114, hook receiver 115, hook 116, fixed block 117 and follower gear 111; Axle 112 is installed on the bearing 114, and bearing housing 113 is set in axle 112 and bearing 114 in it; The upper end of axle 112 is connected with follower gear 111, and the lower end of axle 112 is connected with hook receiver 115; Hook receiver 115 lower ends are provided with a fixed block 117, and this fixed block 117 is connected with hook by a securing gear, and this securing gear can be a screw; The upper end of mechanical arm 12 is connected 13 with a rotary cylinder, and rotary cylinder 13 is connected with the shaft adapter 122 of mechanical arm 12 by a shaft coupling 121; Being installed in the bearing housing 146 of the axle 145 of secondary mechanical arm.And the number of teeth of driving toothed gear 114 and modulus equate with the number of teeth and the modulus of moving gear 111; The nylon gear that can select for use nylon to be made for driving toothed gear 114 and follower gear 111.
The utility model is for satisfy producing needs, and above-mentioned drive system 1 can be set up in parallel many groups, as 5 groups of drive systems 1 are set, and every group of drive system 1 independently controlled and worked alone.And corrosive fluid employing of the present utility model is circulating, Fig. 8 is the etching system of the quartz wafer etching machine that provides of the utility model, etching system comprises corrosion case 102, the corrosion protection pump 103 that is linked in sequence successively by anti-corrosion pipeline 101, and etching tank 100, overflow groove 104.
Because it is circulating that corrosive fluid of the present utility model adopts, thereby disposed corrosion case 102, corrosion protection pump 103 and the etching tank 100 that the overflow effect is arranged.The three connects with anti-corrosion pipeline 101, a corrosion heating tube is housed in the corrosion case 102, adopt temperature sensor and intelligent temperature controller that the corrosive fluid in the corrosion case 102 is carried out temperature and add temperature control, the working cycle of corrosive fluid is: corrosion case 102---corrosion protection pump 103---etching tank 100---overflow groove 104.Arranged side by side with etching tank 100, the utility model has disposed a rinse bath 200 that relief function is arranged, a magnetic valve is equipped with in the cleaning liquid inlet of rinse bath 200, when magnetic valve is subjected to (the Programmable Logic Controller from PLC, programmable logic controller) instruction is promptly opened, scavenging solution enters rinse bath 200, discharges through overflow plate after rinse bath 200 is expired.An anticorrosion heating tube has been installed in rinse bath 200, has been used the control of temperature controller and temperature sensor realization rinse liquid temperature.Therefore, the temperature of the scavenging solution in the quartz wafer etching machine is by temperature regulator and temperature sensor control; And Controlling System of the present utility model is a programmable logic controller (PLC).
The PLC control panel layout of the quartz wafer etching machine that the utility model provides as shown in Figure 9, this control panel is provided with a plurality of buttons and pilot lamp, comprising:
PLC 80 input control programs are provided with and control working hour of mechanical arm immediately.Start button 81, be used for the start-up control program, joint institution's follow procedure instruction is worked in order.Suddenly stop button 82, can occur making the program stop operation by this button unusually, decommission after the mechanical arm 12 of drive system 1 returns original state at equipment.Hummer 83, when these hummer 83 light flash and send " too " sound, represent that this corresponding mechanical arm 12 is worked to finish, send cue to the operator.Hummer 84, when these hummer 84 light flash and send " too " sound, expression corrosion case 102 liquid levels are lower than requirement, send cue to the operator.Temperature controller 85 is intelligent temperature controllers, can implement temperature control to the corrosive fluid in the corrosion case 102.Temperature controller 86 also is an intelligent temperature controller, can carry out temperature test to the corrosive fluid in the etching tank 100, and show its temperature value.Temperature controller 87 is medium-sized temperature controllers, can carry out temperature control to the scavenging solution of rinse bath 200.Pilot lamp 88 is power supply indications, when the on of the bright indication equipment power supply of its lamp.Pilot lamp 89 is the indications of heating of corrosion case 102 internal corrosion liquid, and the bright expression corrosive fluid of lamp is heated.Pilot lamp 90, the rinse bath 200 cleaning liquid insides pilot lamp 90 bright expression scavenging solutions of heating are heated.Pilot lamp 91 is that corrosion protection pump is indicated, and the bright expression corrosion protection pump of lamp moves.When the utility model corroded work normally, following condition should be up to standard: at first, and the value and constant that meets the requirements of corrosive fluid its temperature in working cycle in the corrosion case 102.Secondly, the rinse liquid temperature in the rinse bath 200 meets the requirements.At last, all moving indexs comprise that speed, frequency, stroke meet the requirements.
Work of the present utility model (wafer corrosion) process is controlled by PLC, and its zero position is the most significant digit of mechanical manipulator at washing station.Before starting working, the operator need carry out and finish 3 preparation works: calculate the erosion rate of corrosive fluid to wafer; According to erosion rate, calculate etching time, and on PLC, be provided with; The corrosion basket that the wafer that is corroded is housed is suspended on the hook, makes fixed block push down the handle of corrosion basket, screw is tightened.
In embodiment of the utility model, the workflow of quartz wafer etching machine is as follows:
(1) operator presses start button 81;
(2) driving toothed gear 144 of secondary mechanical arm 14 lower ends carries out the positive and negative reciprocal rotation of 100 ± 5 degree, and mechanical manipulator 11 raises 20 centimeters, and mechanical arm 12 carries out the rotations of 180 degree, and mechanical manipulator forwards corrosion station F to by washing station Q.At this moment, driving toothed gear 144 engagements of the follower gear 111 of mechanical manipulator 11 and secondary mechanical arm 14 lower ends make the corrosion basket carry out the positive and negative reciprocal rotation of 100 ± 5 degree.
(3) mechanical arm 12 descends, drive the corrosion basket in corrosive fluid, carry out 6 centimeters of strokes, speed 60 times/minute about (lifting) to-and-fro movement.When corroding basket in a high position, liquid level is at 1/4 place of basket, and when corroding basket at lower, liquid level is at 3/4 place of basket.
(4) uninterruptedly carry out continuously in PLC (2) in the set time, (3) action.
(5) the set time arrives, and mechanical arm 12 rises to most significant digit, and the Rotate 180 degree is finished mechanical manipulator 11 by the conversion of corrosion station F to washing station Q, decline then.
(6) mechanical arm 12 carries out (3) described action, and its time is that a fixed value 20 seconds is carried out corruption back pre-washing to wafer.
(7) time drops down onto low level to mechanical arm 12, the corrosion basket be immersed in the scavenging solution, this moment hummer 83 send " too " sound, light flash, these mechanical arm 12 end-of-jobs.
(8) operator is by starting 81 buttons, and 12 rise to most significant digit on the mechanical arm, take off the corrosion basket, and wafer is poured out, and clean again.At this moment, mechanical manipulator 11 has been got back to start bit.
Need to prove a plurality of devices in the utility model in addition, as reducing motor etc., cited model just realize more of the present utility model for example, can also adopt the device of other model to realize identical functions.
In sum, by the quartz wafer etching machine that uses the utility model to provide, can make to place the quartz wafer of corrosion basket to pump simultaneously and positive and negative rotatablely moving, quartz wafer crevice corrosion fully liquid like this, and in etching tank and rinse bath the light station of changing; This makes the operator needn't re-use the carrier of baroque corrosion frame as quartz wafer, has reduced the cost of manufacture of corrosion frame and the damage quantity of loading and unloading wafer, improves the corrosion yield rate of quartz wafer, reduces production costs.On the other hand, because the utility model can be provided with many group drive systems, every group of drive system difference independent control improved quartz wafer etching machine level of automation of the present utility model and production efficiency, alleviate working strength of workers, and saved cost of human resources.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.
Claims (10)
1, a kind of quartz wafer etching machine, comprise Controlling System, some groups of drive systems, etching system and cleaning systems, wherein, a pair of etching tank and rinse bath in corresponding described etching system of each group drive system and the cleaning system, it is characterized in that described each group drive system comprises:
Tilting mechanism has
Mechanical manipulator, its upper end is provided with follower gear, and the lower end is provided with hook, and this hook hook one corrosion basket is installed in some quartz wafers to be corroded arbitrarily in this corrosion basket; The middle part of this mechanical manipulator is provided with connecting rod, is connected with the lower end of mechanical arm by this connecting rod;
Mechanical arm, its upper end is provided with rotary cylinder, and its lower end is connected with described mechanical manipulator by described connecting rod;
Secondary mechanical arm, its upper end is connected with the reducing motor output shaft by a crank and rocker mechanism; Its lower end is provided with driving toothed gear, when described corrosion basket places described etching tank to corrode, and this driving toothed gear and the engagement of described follower gear;
Slide mechanism has
Parallel slideway, this parallel slideway is assembled by two groups of linear bearingss, two groups of linear axis and shaft holder;
Sliding panel, this sliding panel is installed on the described parallel slideway, and described tilting mechanism is installed on this sliding panel;
Two-way cylinder, this two-way cylinder is installed on the described slide mechanism, and its point of application is corresponding to described sliding panel, and on this two-way cylinder some magnetic switch is set, and pumps to control described sliding panel.
2, quartz wafer etching machine according to claim 1, it is characterized in that, described secondary mechanical arm upper end is provided with second rocking arm, and this second rocking arm is connected to first rocking arm that is uneven in length with described second rocking arm that is provided with on the described reducing motor output shaft by a fork; Wherein, described reducing motor rotates and drives described first rocking arm do turnover motion, does positive and negative to-and-fro movement by described second rocking arm of the drive of fork, drives described secondary mechanical arm by this second rocking arm and makes positive and negative crankmotion;
Described mechanical manipulator passes through the engagement of the follower gear and the driving toothed gear that described secondary mechanical arm lower end is provided with of its upper end setting, makes positive and negative crankmotion;
The upper, middle and lower portion of described two-way cylinder is provided with a magnetic switch respectively, and the magnet ring signal of the middle part by described two-way cylinder and two magnetic switch induction bidirectional cylinder pistons of bottom pumps to control described sliding panel; And
The magnetic switch on described two-way cylinder top is responded to the magnet ring signal of this two-way cylinder piston, control described sliding panel and upwards slide into the level attitude height of the corrosion basket of described mechanical manipulator hook, be higher than the height of the cell wall between described etching tank and the rinse bath along described parallel slideway; And the rotary cylinder rotation of described mechanical arm upper end drives the mechanical manipulator that is connected with described mechanical arm and rotates, to control the station that described mechanical manipulator is transformed in etching tank and rinse bath.
3, quartz wafer etching machine according to claim 2 is characterized in that, the two ends of described two-way cylinder are provided with restrictor, and this restrictor is regulated the frequency that sliding panel pumps; And/or
Described rotary cylinder is provided with two magnetic switch, controls described rotary cylinder by described two magnetic switch and a magnetic valve group and rotates the positive and negative crankmotion of the described mechanical arm of drive.
4, quartz wafer etching machine according to claim 3 is characterized in that, the stroke that described sliding panel pumps is by the distance decision of two magnetic switch of the middle part of described two-way cylinder and bottom;
The level attitude height of the corrosion basket of described mechanical manipulator hook when conversion etching tank and rinse bath station is by the upper magnetic on-off control of described two-way cylinder.
According to claim 2 or 3 described quartz wafer etching machines, it is characterized in that 5, described secondary mechanical arm drives described mechanical manipulator, and to make the rotation radian of positive and negative crankmotion in etching tank be 90～115 radians;
Described mechanical arm drive described mechanical manipulator in etching tank or rinse bath, work with the conversion station the rotation radian be 180 radians.
6, quartz wafer etching machine according to claim 2 is characterized in that, described mechanical manipulator comprises axle, bearing housing, bearing, hook receiver, hook, fixed block and follower gear; Described axle is installed on the described bearing, and described bearing housing is loaded on described axle and bearing housing in it; The upper end of described axle is connected with described follower gear, and the lower end of described axle is connected with described hook receiver; Described hook receiver lower end is provided with a fixed block, and this fixed block is connected with described hook by a securing gear;
The upper end of described mechanical arm is connected with a rotary cylinder, and this rotary cylinder is connected with the shaft adapter of described mechanical arm by a shaft coupling;
The axle of described secondary mechanical arm is installed in the bearing housing.
7, quartz wafer etching machine according to claim 6 is characterized in that, the number of teeth of described driving toothed gear and modulus equate with the number of teeth and the modulus of described follower gear; And/or,
Described driving toothed gear and follower gear are nylon gear.
8, quartz wafer etching machine according to claim 1 and 2 is characterized in that, the two ends of described fork are connected with second rocking arm with described first rocking arm by an oscillating bearing respectively.
9, quartz wafer etching machine according to claim 2 is characterized in that, described etching system comprises corrosion case, the corrosion protection pump that is linked in sequence successively by anti-corrosion pipeline, and etching tank, overflow groove;
Described cleaning system comprises: a rinse bath and a magnetic valve that is installed in water-in; When scavenging solution enters rinse bath, by the described rinse bath of weir divider discharge.
10, quartz wafer etching machine according to claim 9 is characterized in that, the corrosion heating tube is installed in the described rinse bath; And/or,
The temperature of the scavenging solution in the described quartz wafer etching machine is by temperature regulator and temperature sensor control; And/or,
Described Controlling System is a programmable logic controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200940905U CN201272743Y (en) | 2008-05-28 | 2008-05-28 | Quartz wafer etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200940905U CN201272743Y (en) | 2008-05-28 | 2008-05-28 | Quartz wafer etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201272743Y true CN201272743Y (en) | 2009-07-15 |
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ID=40883091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200940905U Expired - Fee Related CN201272743Y (en) | 2008-05-28 | 2008-05-28 | Quartz wafer etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201272743Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886263A (en) * | 2010-07-15 | 2010-11-17 | 菲特晶(南京)电子有限公司 | Blowing corrosion machine and method for corrosion and cleaning |
| CN102910830A (en) * | 2012-11-15 | 2013-02-06 | 徐培炎 | Quartz crystal wafer corrosion machine |
| CN105551952A (en) * | 2015-12-21 | 2016-05-04 | 上海提牛机电设备有限公司 | Chip deep groove corrosion device |
| CN106746699A (en) * | 2016-12-28 | 2017-05-31 | 重庆晶宇光电科技有限公司 | Quartz wafer corrosion device |
| CN109887866A (en) * | 2019-03-08 | 2019-06-14 | 重庆市洲金电子科技有限公司 | A kind of semiconductor crystal wafer cleaning device |
| CN110002764A (en) * | 2019-04-01 | 2019-07-12 | 江西沃格光电股份有限公司 | Hook |
| CN115159855A (en) * | 2022-07-22 | 2022-10-11 | 重庆华渝电气集团有限公司 | Full-automatic swing piece corrosion equipment |
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2008
- 2008-05-28 CN CNU2008200940905U patent/CN201272743Y/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886263A (en) * | 2010-07-15 | 2010-11-17 | 菲特晶(南京)电子有限公司 | Blowing corrosion machine and method for corrosion and cleaning |
| CN101886263B (en) * | 2010-07-15 | 2012-07-04 | 菲特晶(南京)电子有限公司 | Blowing corrosion machine and method for corrosion and cleaning |
| CN102910830A (en) * | 2012-11-15 | 2013-02-06 | 徐培炎 | Quartz crystal wafer corrosion machine |
| CN102910830B (en) * | 2012-11-15 | 2016-01-06 | 徐培炎 | Quartz crystal wafer corrosion machine |
| CN105551952B (en) * | 2015-12-21 | 2018-10-19 | 上海提牛机电设备有限公司 | Chip deep seated stain device |
| CN105551952A (en) * | 2015-12-21 | 2016-05-04 | 上海提牛机电设备有限公司 | Chip deep groove corrosion device |
| CN106746699A (en) * | 2016-12-28 | 2017-05-31 | 重庆晶宇光电科技有限公司 | Quartz wafer corrosion device |
| CN109887866A (en) * | 2019-03-08 | 2019-06-14 | 重庆市洲金电子科技有限公司 | A kind of semiconductor crystal wafer cleaning device |
| CN109887866B (en) * | 2019-03-08 | 2020-01-07 | 重庆市洲金电子科技有限公司 | Semiconductor wafer cleaning device |
| CN110002764A (en) * | 2019-04-01 | 2019-07-12 | 江西沃格光电股份有限公司 | Hook |
| CN110002764B (en) * | 2019-04-01 | 2022-03-29 | 江西沃格光电股份有限公司 | Hook for hanging articles |
| CN115159855A (en) * | 2022-07-22 | 2022-10-11 | 重庆华渝电气集团有限公司 | Full-automatic swing piece corrosion equipment |
| CN115159855B (en) * | 2022-07-22 | 2023-10-27 | 重庆华渝电气集团有限公司 | Full-automatic swing piece corrosion equipment |
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