CN201267086Y - Composite heat radiation body of electric line - Google Patents
Composite heat radiation body of electric line Download PDFInfo
- Publication number
- CN201267086Y CN201267086Y CNU2008201456257U CN200820145625U CN201267086Y CN 201267086 Y CN201267086 Y CN 201267086Y CN U2008201456257 U CNU2008201456257 U CN U2008201456257U CN 200820145625 U CN200820145625 U CN 200820145625U CN 201267086 Y CN201267086 Y CN 201267086Y
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- Prior art keywords
- electric wiring
- radiator
- insulating layer
- conductive insulating
- powder
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Abstract
The utility model discloses a composite radiating body for an electric circuit, comprising a radiator which can remove heat energy effectively, a heat conducting insulation layer, an electric circuit layer and an insulating paint layer for decreasing the thermal resistance coefficient, wherein, the heat conducting insulation layer is applied on one lateral surface of the radiator and comprises heat conducting powder through surface treatment and sintered and dispersed liquid material which is combined with the heat conducting powder so as to lead the heat conducting powder to be easily applied on the radiator; the electric circuit layer comprises evenly distributed rubber material and low-impedance electric conducting powder and is combined on the other lateral surface of the heat conducting insulation layer corresponding to the radiator and surface treatment by chemical deposition of nickel is carried out; connection points are arranged on the electric circuit layer and electrically connected with corresponding pins of electronic components; and the insulating paint layer is combined on the other lateral surfaces of the heat conducting insulation layer corresponding to the radiator and the electric circuit layer corresponding to the heat conducting insulation layer. By adopting the structure, the heat energy of the electric circuit can be removed comprehensively, directly and quickly, and the thermal resistance coefficient is significantly decreased, and therefore, the efficiency and the service life of an electrical and electronic component are effectively ensured.
Description
Technical field
The utility model relates to a kind of electric wiring composite radiating body, be meant especially a kind of can be with the heat energy that electric circuit produced, carry out comprehensive direct diffusion and heat radiation rapidly, reduce thermal resistivity significantly, effectively guarantee the electric wiring composite radiating body in electric electronic element usefulness and useful life.
Background technology
Lighting apparatus includes kinds such as street lighting, advertising lighting, room lighting and machinery equipment illumination at present, the lighting source of general lighting equipment adopts kinds such as incandescent lamp bulb, fluorescent tube, mercury vapor lamp mostly, except mercury vapour causes environmental pollution, illumination efficiency is poor, outside power consumption increases relatively, and damages easily, its useful life is short simultaneously, so that need frequent maintain and replace, waste of manpower, material resources and time, therefore improvement to be strengthened is arranged.
The lighting source of lighting apparatus such as indoor and outdoor machine, advertisement has considered to adopt the solid state light emitter light-emitting diode now, to improve illumination efficiency, and saving electric power, this type of lighting source must be on circuit substrate a plurality of light-emitting diodes of arranged, but along be provided with quantity and the power output of light-emitting diode increases, in the transfer process of electricity → light → heat, produce the high-temperature heat relatively, therefore must conduct to radiator by the insulating barrier of circuit substrate and fin dispels the heat.
The circuit substrate of LED light-emitting diode must be fitted in spreader surface by viscose, so that can't comprehensive firm driving fit, influence heat conduction efficiency, and easily aging and obscission take place, cause that radiating efficiency is poor, radiating rate is slow, when therefore light-emitting diode uses for a long time, cause temperature too high easily, have a strong impact on the illumination usefulness of light-emitting diode, and then cause light decay, reduce useful life, therefore be necessary further to create improvement.
In order to overcome the problems referred to above, circuit board material kind and the structure with heat radiation commonly used at present are as follows:
First kind: the printed circuit board (PCB) of FR4 base material, its sheet material does not have the function of heat conduction and heat radiation;
Second kind: metal-core printed circuit board Metal Core PCB (MCPCB), its structure is by Copper Foil (circuit) layer, insulation (dielectric) layer and three kinds of stacking formation of unlike material of aluminium base (metallic core) layer;
The third: ceramic substrate, this structure are to see through circuit directly conductive silver paste to be applied surface at substrate.
In order to strengthen the heat radiation of LED, first kind FR4 printed circuit board (PCB) has been not enough to the heat radiation function that reaches required, therefore the printed circuit board (PCB) (MCPCB) of second kind interior tool metallic core has been proposed, utilization is arranged on the preferable metals of heat conductivity such as the aluminium of circuit board bottom or copper and quickens heat radiation, though second kind (MCPCB) can reach the effect of heat radiation, yet also make its heat conduction be subjected to some restrictions because of the characteristic of insulating barrier; Ceramic substrate structure in the third also is only applicable on small size, high operating temperature and the easy to handle high-power components.
This shows that above-mentioned article still have many defectives, be not a kind of good article, thereby demand urgently being improved.
The inventor is in view of above-mentioned every shortcoming of commonly using article, and actively thinking improve innovation, and after concentrating on studies through taking great pains to attain one's goal for many years, successfully researches and develops the electric wiring composite radiating body of finishing in this case finally.
The utility model content
The purpose of this utility model is to provide a kind of electric wiring composite radiating body, and it can carry out comprehensive direct diffusion and heat radiation rapidly with the heat energy that electric circuit produced, and reduces thermal resistivity significantly, effectively guarantees electric electronic element usefulness and useful life.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of electric wiring composite radiating body comprises radiator, heat conductive insulating layer, electric wiring layer that heat energy that electric electronic element is produced is effectively discharged and the insulation enamelled coating that reduces thermal resistivity; The heat conductive insulating layer is applied to a side surface of radiator, comprises equally distributed, surface treated heat conduction powder, and combines with heat conduction powder particulate and make the fluent material of the sintering dispersion of its side surface that is easy to be applied to radiator; The electric wiring layer contains equally distributed glue material and Low ESR electrically conducts powder, and is combined on the side surface in addition of the relative radiator of heat conductive insulating layer, and carries out the chemical deposited nickel surface treatment; Also be provided with contact on the electric wiring layer, electrically connect with the relative pin of electronic component; The insulation enamelled coating is combined on the side surface in addition of the in addition side surface of the relative radiator of heat conductive insulating layer and the relative heat conductive insulating layer of electric wiring layer.
Above-mentioned heat conduction powder body material is ball-type or irregular crystalline particle.
The granularity of above-mentioned heat conduction powder body material is between 0.01～100 μ m.
The thickness that above-mentioned heat conductive insulating layer is coated on spreader surface is 0.01～15mm.
The particle mean size that above-mentioned Low ESR electrically conducts powder is 0.01～400 μ m.
The thickness that above-mentioned electric wiring layer is combined in the heat conductive insulating layer is 0.005～0.2mm.
After adopting said structure, the utility model at first is provided with a radiator, and heat radiation materials such as several radiating fins or metallic plate, ceramic wafer are set in a side of this radiator, and the heat conductive insulating layer is set at opposite side, this heat conductive insulating layer contains equally distributed heat conduction powder, also be provided with an electric wiring layer on the heat conductive insulating layer, this electric wiring layer contains equally distributed glue material and Low ESR electrically conducts powder; Heat conductive insulating layer and electric wiring layer also are provided with an insulation enamelled coating outward, as anti-soldering effect, the element or the IC that have thermal source on the circuit can be dispelled the heat rapidly in comprehensive direct diffusion, reduce thermal resistivity significantly, guarantee the usefulness and the useful life of electric electronic element.
Description of drawings
Fig. 1 is the radiator and the heat conductive insulating layer structural representation of the utility model electric wiring composite radiating body;
Fig. 2 is the electric wiring layer integrated structure schematic diagram of the utility model electric wiring composite radiating body;
Fig. 3 is the insulation enamelled coating integrated structure schematic diagram of the utility model electric wiring composite radiating body;
Fig. 4 is the electric electronic element integrated structure schematic diagram of the utility model electric wiring composite radiating body;
Fig. 5 is the radiator perspective view of the utility model electric wiring composite radiating body;
Fig. 6 is the radiator reverse side angle perspective view of the utility model electric wiring composite radiating body;
Fig. 7 is that the solid of the utility model electric wiring composite radiating body is implemented structural representation.
The main element symbol description
10 radiators 11 are side surface 12 radiating fins in addition
20 heat conductive insulating layers 21 are side surface 30 electric wiring layers in addition
31 contacts 32 are side surface 40 insulation enamelled coatings in addition
50 electronic components, 51 pins
Embodiment
Below in conjunction with accompanying drawing the utility model is elaborated.
Referring to figs. 1 to shown in Figure 7, be planar structure, the stereochemical structure of the utility model electric wiring composite radiating body and the schematic diagram of implementing to move, it comprises a radiator 10, a heat conductive insulating layer 20, an electric wiring layer 30 and an insulation enamelled coating 40.
Heat conductive insulating layer 20 combines with the side surface 11 in addition of radiator 10 for containing equally distributed heat conduction powder; Heat conductive insulating layer 20 includes the heat conduction powder and is used for the dispersing liquid of heat conduction powder particulate combination therewith, and utilizes mixing processing procedure that the heat conduction powder is evenly distributed in the dispersing liquid.The heat conduction powder can be selected high electrical resistance powders such as aluminium oxide, aluminium nitride, boron nitride, carborundum for use herein, is made by a kind of or at least two kinds of material mixing in the previous materials, makes heat conductive insulating layer 20 have the electrical impedance 10 of high insulation
6～10
19Ω cm.And the heat conduction powder body material can be ball-type or irregular crystalline particle, and suitable particle mean size is about 0.01～100 μ m.
Above-mentioned heat conduction powder is carried out technical finesse, concrete grammar is alcohols fluorine compounds such as (as ethanol, isopropyl alcohol etc.) dissolving or organosilicon etc. are hydrolyzed (as soaking), add a kind of or at least two kinds of materials in the aforementioned hot conduction powder again, after the mixing, under about 60 ℃～150 ℃ low temperature, toast, the air and the hydrone on surface are removed totally, obtained dry thermal conductive ceramic powder.Through after the above-mentioned surface treatment, except obtaining good dispersiveness, its surface also is coated with one deck fluorine compounds or organosilicon etc. fully with the heat conduction powder, helps the dispersion and the sintering crystallization of powder and divides the crosslinked of component.
And the configuration of heat conduction powder surface sintering fluent material can be adopted following method:
This solution liquid is alcohols and methyl ethane and ketone (butanone), ether equal solvent, with corresponding order dissolving organosilicon phenolic aldehyde (phenol aldehyde modified organic silicon monomer) or organosilicon (epoxy-phenolic aldehyde-modified organic silicons such as polyester) and fourth is fine or elastic gels such as neoprene or poly-sulphur, add colloidal sol (A10H+H again
2O+ ethanol) a little filler is promptly finished the configuration of this heat conduction powder surface sintering fluent material to dissolving each other fully.
Moreover, heat conductive insulating layer 20 can use above-mentioned surperficial sintering fluent material to mix with the part by weight of heat conduction powder, to obtain required high thermal conductivity and flexible, temperature tolerance, shearing strength, ageing-resistant, peel strength, material property such as wear-resistant, shock-resistant.
Generally speaking, heat conductive insulating layer 20 is selected the heat conduction powder collocation between the surperficial sintering fluent material and 97%～85% between 3%～15% weight ratio usually for use, so that obtain the thermal conductive material layer of about 3W/mk～150W/mk heat biography coefficient.
Above-mentioned heat conduction powder and surperficial sintering liquid via mixing processing procedure after, repeating repeatedly stacking mode with coating or spraying or screen painting etc. is molding mode, make the heat conductive insulating layer 20 of 0.01～15mm thickness at the in addition side surface 11 of radiator 10, be able to the close and firm combination by the molecular structure of surperficial sintering fluent material.
Above-mentioned electric wiring layer 30 is combined on the surface of heat conductive insulating glue-line 20, and carry out surface treatment, this Surface Treatment Engineering is the chemical sinking nickel engineering, the characteristic of this engineering can satisfy RoHs (the Restriction of the use of certain Hazardoussubstances in electrical and electronic equipment of electronic industry, " electric, some harmful substance instruction is used in restriction in the electronic equipment "), WEEE (Waste Electrical andElectronic Equipment, " the discarded instruction of electronic and electrical equipment ") etc. regulations, also can strengthen its hardness, resistance to wear and reduce the resistance coefficient of above-mentioned electric wiring layer 30, satisfying the parameter value of appliance circuit design, this chemical sinking nickel engineering optionally only is applied to and contains equally distributed glue material and Low ESR electrically conducts on the electric wiring layer 30 of powder; This surface treatment program is:
(1) takes off the grease that ester is removed spreader surface remnants;
(2) surface of activator activation electric wiring layer 30;
(3) not having the heavy nickel of electricity applies: not having the long-pending plating bath nickelous sulfate in the heavy nickel Shen of electricity is the complexing agent of host;
(4) use hot water to clean.
Generally speaking, electric wiring layer 30 preferably selects for use the Low ESR between the glue material and 95%～30% between 5%～70% electrically to conduct the powder collocation, this Low ESR electrically conducts powder can select irregular type particle collocation such as silver powder, silver-bearing copper powder, silver-colored aluminium powder, silver-colored nickel powder and copper powder for use, and optimal average particle size is about 0.01～400 μ m; And the glue material can select for use as epoxy resin, phenolic resins, acrylic resin, polyvinyl acetate resin (PVAC), silicon element (Silicon) resin or synthetic rubber etc., and this glue material can form by one of previous materials or by material mixing more than two kinds.
In the actual fabrication program, Low ESR electrically conduct powder and glue material via mixing processing procedure after, with coating or spraying or screen painting mode, implement to make the electric wiring layer 30 of 0.005～0.2mm thickness at the side surface in addition 21 of heat conductive insulating layer 20, and utilize the molecular structure of glue material to realize the close and firm combination, and reach the copper foil layer function of general printed circuit board (PCB).
Insulation enamelled coating 40 is combined on other side surface 32 of the in addition side surface 21 of heat conductive insulating layer 20 relative radiator 10 and electric wiring layer 30 relative heat conductive insulating layer 20, setting by insulation enamelled coating 40, as anti-soldering effect, make the element or IC (the Integrated Circuit of the thermal source on the general circuit, integrated circuit), be able to comprehensive direct diffusion and dispel the heat rapidly, reduce thermal resistivity significantly, guarantee the usefulness and the useful life of electric electronic element 50; Above-mentioned electronic component 50 can be selected light-emitting diode for use.
The structural design of the utility model electric wiring composite radiating body, mainly by radiator 10 directly in conjunction with heat conductive insulating layer 20 and electric wiring layer 30 and insulation enamelled coating 40, can reach the effect of electric and electronic circuit composite radiating, dispel the heat rapidly to carry out comprehensive direct diffusion, significantly reduce thermal resistivity, guarantee usefulness and useful life electric, electronic component 50.
Previous embodiment only is the utility model illustration, can not limit protection range of the present utility model with this, and is every according to the technological thought that the utility model proposes, and any change of being done on the technical scheme basis all falls within the utility model protection range.
Claims (6)
1, a kind of electric wiring composite radiating body is characterized in that: the insulation enamelled coating that comprises the effective radiator of discharging of the heat energy that electric electronic element is produced, heat conductive insulating layer, electric wiring layer and reduction thermal resistivity;
The heat conductive insulating layer is applied to a side surface of radiator, comprises equally distributed, surface treated heat conduction powder, and combines with heat conduction powder particulate and make the fluent material of the sintering dispersion of its side surface that is easy to be applied to radiator;
The electric wiring layer contains equally distributed glue material and Low ESR electrically conducts powder, and is combined on the side surface in addition of the relative radiator of heat conductive insulating layer, and carries out the chemical deposited nickel surface treatment; Also be provided with contact on the electric wiring layer, electrically connect with the relative pin of electronic component;
The insulation enamelled coating is combined on the side surface in addition of the in addition side surface of the relative radiator of heat conductive insulating layer and the relative heat conductive insulating layer of electric wiring layer.
2, electric wiring composite radiating body as claimed in claim 1 is characterized in that: described heat conduction powder body material is ball-type or irregular crystalline particle.
3, electric wiring composite radiating body as claimed in claim 1, it is characterized in that: the granularity of described heat conduction powder body material is between 0.01～100 μ m.
4, electric wiring composite radiating body as claimed in claim 1 is characterized in that: the thickness that described heat conductive insulating layer is coated on spreader surface is 0.01～15mm.
5, electric wiring composite radiating body as claimed in claim 1 is characterized in that: the particle mean size that described Low ESR electrically conducts powder is 0.01～400 μ m.
6, electric wiring composite radiating body as claimed in claim 1 is characterized in that: the thickness that described electric wiring layer is combined in the heat conductive insulating layer is 0.005～0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201456257U CN201267086Y (en) | 2008-09-18 | 2008-09-18 | Composite heat radiation body of electric line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201456257U CN201267086Y (en) | 2008-09-18 | 2008-09-18 | Composite heat radiation body of electric line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201267086Y true CN201267086Y (en) | 2009-07-01 |
Family
ID=40833457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201456257U Expired - Lifetime CN201267086Y (en) | 2008-09-18 | 2008-09-18 | Composite heat radiation body of electric line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201267086Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447643A (en) * | 2018-05-30 | 2018-08-24 | 上海安费诺永亿通讯电子有限公司 | A kind of magnetic shield piece |
-
2008
- 2008-09-18 CN CNU2008201456257U patent/CN201267086Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447643A (en) * | 2018-05-30 | 2018-08-24 | 上海安费诺永亿通讯电子有限公司 | A kind of magnetic shield piece |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: XULI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHENXIANG TECHNOLOGY INDUSTRIAL CO., LTD. Effective date: 20111111 Free format text: FORMER OWNER: XULI TECHNOLOGY CO., LTD. JINGSHENG TECHNOLOGY CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111111 Address after: Taoyuan 543, Zhongshan Road, China, No. 11, Taiwan Patentee after: Jingcheng Technology Co., Ltd., Taiwan Address before: Taoyuan 543, Zhongshan Road, China, No. 11, Taiwan Co-patentee before: Jingcheng Technology Co., Ltd., Taiwan Patentee before: Solvetek Technology Corp. Co-patentee before: Xuli Technology Co., Ltd., Taiwan |
|
| CX01 | Expiry of patent term |
Granted publication date: 20090701 |
|
| CX01 | Expiry of patent term |