CN201264202Y - Device for surface cleaning and polishing semiconductor chip and suction disc - Google Patents

Abstract

The utility model relates to a device for cleaning and grinding surfaces of a semiconductor wafer and a sucking disc. The device has compact structure, less components and simple motion control and effectively improves the machining precision and the surface quality of the semiconductor wafer. The device comprises a case body, a wafer brush, a sucking disk brush and an oilstone disk, wherein the case body includes an upper case body and a lower case body, and the wafer brush, the sucking disk brush and the oilstone disk are all arranged in the lower case body through respective support. The device is characterized by also comprising an air cylinder with a guide bar, an index driving system and a rotation driving system; the air cylinder with a guide bar is fixed on a grinding machine by a bracket; the upper case body is connected with the lower case body through the index driving system; a piston rod of the air cylinder is connected with the upper case body; and the index driving system, the rotating driving system and the air cylinder with a guide bar can be electrically connected.

Description

Semiconductor wafer and chuck surface are cleaned sanding apparatus

(1) technical field

The utility model relates to semiconductor wafer surface grinding field of components, is specially a kind of semiconductor wafer and chuck surface and cleans sanding apparatus.

(2) background technology

In the production of semiconductor wafer, more and more harsher to the machining accuracy and the surface quality requirement of semiconductor wafer.After the grinding of semiconductor wafer process, its surface can retain the particulates such as particle that abrasive dust and emery wheel come off, only the method that dries up by deionized water rinsing and dry air can't all be removed, and this will rerun a movie in road, back polishing process in the formation of particulate place, badly influences wafer surface quality.In the grinding wafer process, the porous ceramics sucker utilizes the vacuum suction wafer, and its upper surface is as the wafer orientation face, and surface configuration directly has influence on the shape behind the grinding wafer.If there is particle in the porous ceramics chuck surface, under the sucker suction function, the wafer at particle place meeting warpage or cracked has a strong impact on the wafer surface grinding quality; If particle stops up the micropore on the porous ceramics sucker, will make the porous ceramics sucker lose the vacuum suction effect.Therefore in the wafer grinding machine, can take manually cleaning or automatic cleaning mode to remove the wafer surface particulate, remove porous ceramics chuck surface particle and polishing chuck surface,, improve the wafer surface grinding quality to guarantee porous ceramics sucker face type and good gas permeability.

Manual mode is generally only used the deionized water rinsing wafer surface, and dries up with dry air, does not use wafer to brush the clean wafers surface particle in the cleaning process.When manual mode is cleaned the porous ceramics sucker, when sucker feeds high pressure aqueous vapor mixture, use brush to clean sucker, use oilstone polishing chuck surface then.This manual mode cleaning efficiency is low, and inconvenience is used in the automation grinding process, and the quality of cleaning is also stable inadequately.Also have on the wafer grinding machine at present and adopt automatic flushing device, promptly automatically finish the cleaning of grinding wafer face, the cleaning and the polishing of oilstone dish of porous ceramics sucker absorption locating surface, but the brush of the wafer in this automatic flushing device, sucker brush and three parts of oilstone dish adopt separate driving, i.e. wafer brush, the relative separately realization rotation with the oilstone dish of sucker brush, horizontal and vertical feed motion.Structurally, this cleaning device structural compactness difference and complexity, in control, because movement parts and actuator are more, the realization of control is also complicated.

(3) summary of the invention

At the problems referred to above, the utility model provides a kind of semiconductor wafer and chuck surface to clean the polishing structure, and its compact conformation, member is few, motion control is simple, effectively improves the machining accuracy and the surface quality of semiconductor wafer.

Its technical scheme is such: it comprises casing, the wafer brush, the sucker brush, the oilstone dish, described casing comprises upper box and lower box, described wafer brush, the sucker brush, the oilstone dish is installed on lower box by support separately respectively, it is characterized in that: it also comprises the band guide rod cylinder, calibration drive system and rotary drive system, described band guide rod cylinder is fixed on the grinding machine by carriage, connect by described calibration drive system between described upper box and the lower box, the piston rod of described cylinder is connected with upper box, and described calibration drive system and described rotary drive system and described band guide rod cylinder electricly connect;

It is further characterized in that:

Described calibration drive system comprises micromachine, decelerator, gear train assembly and signal transduction system, described gear train assembly comprises driven partial gear and active partial gear, described driven partial gear is set in the rotating shaft in the centre bearing hole of described lower box, described active partial gear is set in the rotating shaft in the described upper box dead eye, and with above-mentioned driven partial gear engagement, rotating shaft in the described upper box dead eye is connected by shaft coupling with the output of decelerator, described decelerator input is connected with described micromachine, described signal transduction system comprises metal derby and near switch, described metal derby is fixed on initiatively on the partial gear, describedly is installed on the described upper box near switch;

Described rotary drive system comprises micromachine, decelerator, gear train assembly and signal transduction system, described gear train assembly comprises driving gear and brushes with described wafer respectively, three driven gears of sucker brush and oilstone dish correspondence, described three driven gears are installed in respectively on the lower box corresponding with it, and described three driven gears are brushed with corresponding wafer respectively, the sucker brush is connected with the support of oilstone dish, described three driven gears all can mesh with described driving gear when working position, described driving gear is installed in the rotating shaft in the dead eye of described upper box, described rotating shaft is connected by shaft coupling with the output of decelerator, described signal transduction system comprises metal derby and near switch, described metal derby is provided with three and is separately fixed on described three driven gears, describedly is installed on the described upper box near switch.

The semiconductor wafer and the chuck surface of utilization the utility model structure are cleaned sanding apparatus, and its beneficial effect is: compact conformation, and member is few, and motion control is simple, can effectively improve the machining accuracy and the surface quality of semiconductor wafer.

(4) description of drawings

Fig. 1 is the overall structure schematic diagram of the wafer grinding machine of installation wafer of the present utility model and sucker cleaning device;

Fig. 2 is construction profile figure of the present utility model;

Fig. 3 is the structural representation of wafer of the present utility model and sucker cleaning device;

The transmission principle vertical view of Fig. 4 wafer and sucker cleaning device;

Fig. 5 is wafer brush (sucker brush and oilstone dish) calibration drive system cutaway view;

Fig. 6 is wafer and sucker cleaning device rotary drive system.

(5) specific embodiment

See Fig. 1, Fig. 2, Fig. 3, Fig. 4, the utility model comprises casing, wafer brush 45, sucker brush 46, oilstone dish 47, casing comprises upper box 34 and lower box 35, wafer brush 45, sucker brush 46, oilstone dish 47 passes through support 41 separately respectively, 42,43 are installed on lower box 35, the utility model also comprises band guide rod cylinder 33, calibration drive system and rotary drive system, band guide rod cylinder 33 is fixed on the grinding machine by carriage 32, connect by the calibration drive system between upper box 34 and the lower box 35, the piston rod of cylinder 33 is connected with upper box 34, and calibration drive system and rotary drive system and band guide rod cylinder 33 electricly connect.

See Fig. 5, calibration drive system 37 comprises micromachine 52, decelerator 54, gear train assembly and signal transduction system, gear train assembly comprises driven partial gear 58 and active partial gear 57, driven partial gear 58 is sleeved in the rotating shaft 59 in the centre bearing hole of lower box 35, initiatively partial gear 57 is connected by shaft coupling 56 with the output of decelerator 54, this moment is partial gear 57 and driven partial gear 58 engagements initiatively, decelerator 37 inputs are connected with micromachine 52, signal transduction system comprises metal derby 61 and near switch 63, metal derby 61 is fixed on the active partial gear 57, is installed on the upper box 34 near switch 63.

See Fig. 4, Fig. 6, rotary drive system 36 comprises micromachine 51, decelerator 53, gear train assembly and signal transduction system, gear train assembly comprises driving gear 48 and brushes 45 with wafer respectively, three driven gears 49 of sucker brush 46 and oilstone dish 47 correspondences, 50,18, three driven gear shafts are installed in respectively in the dead eye of the lower box corresponding with it 35, wafer brush 45, the mounting bracket 41 of sucker brush 46 and oilstone dish 47,42,43 are set with in the gear shaft of three driven gears and (see Fig. 3, Fig. 6), three driven gears all can mesh with driving gear 48 when working position, driving gear 48 is sleeved in the rotating shaft in the dead eye of 35 lower boxes, signal transduction system comprises metal derby 60a respectively and near switch 62, totally 3 of metal derby 60a, be separately fixed on three driven gears, be installed on the upper box 34 near switch 62;

During system works, see Fig. 5 and Fig. 6, before wafer is placed on the selected porous ceramics sucker, the work of calibration drive system, micromachine 52 drives decelerator 54 and active partial gear 57 is rotated counterclockwise, driven partial gear 58 turns clockwise under active partial gear 57 drives, lower box 35 is around main axis rotation, when metal derby 61 goes near switch 63 belows, near switch 63 output signals, the calibration drive system stops to drive, and this moment, the sucker brush went to working position.Meanwhile, when metal derby 60a goes near switch 62 belows, near switch 62 output signals, rotary drive system is started working, see Fig. 4, Fig. 6, micromachine 51 slows down through decelerator 53, driving driving gear 48 is rotated counterclockwise continuously, driving gear 48 is with 50 engagements of sucker brush driven gear and along turning clockwise, thereby driving sucker brush 46 rotates counterclockwise around self axle continuously with default speed (20～60 rev/mins), the bristle end of being with guide rod cylinder driving cleaning part vertically to drop to sucker brush 46 touches the absorption surface of porous ceramics sucker, scrub the porous ceramics sucker, the porous ceramics sucker rotates with default speed and sucker brush 46 in the same way with its workbench simultaneously, simultaneously outside water nozzle water spray.The porous ceramics sucker sprays big flow gas-vapor mix body at upper surface and washes away the chuck surface particulate.After cleaning finished, band guide rod cylinder drives the vertical rising of cleaning part made the bristle end of sucker brush 46 leave the absorption surface of porous ceramics sucker, and rotary drive system quits work, and has so far finished the cleaning to the porous ceramics sucker; Go near switch 62 belows when brushing 45 corresponding metal derby 60a with oilstone dish 47, wafer, near switch 62 output signals, 47 pairs of porous ceramics sucker polishings of oilstone dish, 45 pairs of wafers after polishing of wafer brush clean, and are identical with the cleaning process of 46 pairs of porous ceramics suckers of above-mentioned sucker brush.Among Fig. 1,1 is the wafer grinding machine, 2 is lathe bed, 3 is manipulator, 4 is positioning table, 5 is rinsing table, 6 for soaking into platform, 7 is the material loading arm, 8 are the blanking arm, 9 is the sucker cleaning device, 10,13,14 is front console, 11,12 is film magazine, 15,16,17 is rotary table, 19 is the porous ceramics sucker, 20 are the corase grind unit, 21 are the correct grinding unit, 22 is column, 23 is line slideway, 24 is servo drive unit, 25 is slide plate, 26 is spindle drum, 27 is electric main shaft, 28 is emery wheel, 29 is finishing wheel, 30 is coarse-grained stone, 31 are correct grinding stone, 38 is the case support, 39 are fixing case, 40 are the swing case, 44 is spring leaf, 55 shaft couplings.

Claims (3)

1, semiconductor wafer and chuck surface are cleaned sanding apparatus, it comprises casing, the wafer brush, the sucker brush, the oilstone dish, described casing comprises upper box and lower box, described wafer brush, the sucker brush, the oilstone dish is installed on lower box by support separately respectively, it is characterized in that: it also comprises the band guide rod cylinder, calibration drive system and rotary drive system, described band guide rod cylinder is fixed on the grinding machine by carriage, connect by described calibration drive system between described upper box and the lower box, the piston rod of described cylinder is connected with upper box, and described calibration drive system and described rotary drive system and described band guide rod cylinder electricly connect.

2, clean sanding apparatus according to described semiconductor wafer of claim 1 and chuck surface, it is characterized in that: described calibration drive system comprises micromachine, decelerator, gear train assembly and signal transduction system, described gear train assembly comprises driven partial gear and active partial gear, described driven partial gear is set in the rotating shaft in the centre bearing hole of described lower box, described active partial gear is set in the rotating shaft in the described upper box dead eye, and with above-mentioned driven partial gear engagement, rotating shaft in the described upper box dead eye is connected by shaft coupling with the output of decelerator, described decelerator input is connected with described micromachine, described signal transduction system comprises metal derby and near switch, described metal derby is fixed on initiatively on the partial gear, describedly is installed on the described upper box near switch.

3, clean sanding apparatus according to described semiconductor wafer of claim 2 and chuck surface, it is characterized in that: described rotary drive system comprises micromachine, decelerator, gear train assembly and signal transduction system, described gear train assembly comprises driving gear and brushes with described wafer respectively, three driven gears of sucker brush and oilstone dish correspondence, described three driven gears are installed in respectively on the lower box corresponding with it, and described three driven gears are brushed with corresponding wafer respectively, the sucker brush is connected with the support of oilstone dish, described three driven gears all can mesh with described driving gear when working position, described driving gear is installed in the rotating shaft in the dead eye of described upper box, described rotating shaft is connected by shaft coupling with the output of decelerator, described signal transduction system comprises metal derby and near switch, described metal derby is provided with three and is separately fixed on described three driven gears, describedly is installed on the described upper box near switch.

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