CN201259683Y - Passive porcelain based type electronic label special for automobile - Google Patents
Passive porcelain based type electronic label special for automobile Download PDFInfo
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- CN201259683Y CN201259683Y CNU200820207993XU CN200820207993U CN201259683Y CN 201259683 Y CN201259683 Y CN 201259683Y CN U200820207993X U CNU200820207993X U CN U200820207993XU CN 200820207993 U CN200820207993 U CN 200820207993U CN 201259683 Y CN201259683 Y CN 201259683Y
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- ceramic substrate
- electronic label
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- label
- based electronic
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Abstract
The utility model discloses a passive ceramic substrate-based vehicle-specific electronic label, which comprises a ceramic substrate and a printed circuit; the ceramic substrate is provided with a printed circuit etching surface and a label pasting surface, wherein, at least one surface is provided with grid-like groove lines for breaking the memory function; and the printed circuit is attached to the printed circuit etching surface of the ceramic substrate. With such a technology, the passive ceramic substrate-based vehicle-specific electronic label can effectively prevent the non-designated holder removing and reusing the label to ensure the unique correspondence between the vehicle and the electronic label. In addition, the electronic label can be equivalently broken together with the windshield in the case of vehicle accidents and can not cause secondary injury to the drivers and the passengers.
Description
Technical field
The utility model relates to radio frequency identification, relates in particular to a kind of passive ceramic substrate-based electronic label special for automobile.
Background technology
Along with the popularization and the development of RFID application technology, all types of electronic tags that work in uhf band more and more are used to the trap for automobile field of traffic.Solve electronic tag and moved electronic tag in reusability and the use by unique correspondence, tamper between the marker application demands such as guarantee of personal safety are grown with each passing day.
In vehicle management is used, electronic tag moves multiplexing with the unique correspondence and the tamper that are identified vehicle, and vehicle when being in accident condition the electronic tag relic can not cause problems such as secondary injury to the driver and conductor, progressively become the major issue that the RFID technology is faced in the vehicle management application process.
At present, the all types of electronic tags widespread use of adopting ceramic substrate to design and develop, existing technology provides a kind of ceramic substrate-based electronic tag, this ceramic substrate-based electronic tag simultaneously is the chip that is etched in the silver paste P.e.c. on the ceramic substrate and adopts brilliant unit level mode to encapsulate, and another side is to be used for the stickup face that connects firmly with shield glass.
In use, this electronic tag is secured at shield glass.But there is potential safety hazard in this in actual application, and its reason is:
1, lacks tamper and move multiplexing structural measure.Electronic tag very likely can be moved by complete tearing open and divert on other vehicles, and label is difficult to be protected with the unique correspondence that is identified vehicle, can cause the supervision leak of vehicle.
2, ceramic substrate can form the sharp relic of irregular after fragmentation under certain external force effect.Therefore, when vehicle had an accident, the ceramic label that is installed on the shield glass very likely can threaten because of the personal safety of fragmentation to the driver and conductor.
Therefore, be necessary to design and a kind ofly can thoroughly prevent to tear open the method for moving electronic tag multiplexing and safe in utilization and making this label.
The utility model content
At the defective of prior art, the purpose of this utility model provides and a kind ofly can provide unique corresponding sign and safer electronic tag.
The utility model proposes a kind of electronic tag, affiliated label comprises: ceramic substrate, described ceramic substrate have the P.e.c. etched surface and label is pasted face, has the latticed ditch line that can produce broken memory function on the one side at least therein; P.e.c. is on the P.e.c. etched surface of described P.e.c. attached to ceramic substrate.
Preferably, on the P.e.c. etched surface of described ceramic substrate and label stickup face, all has the latticed ditch line that can produce broken memory function.
Preferably, the size of mesh opening of described latticed ditch line is in the scope of 10mm * 13.5mm to 13.5mm * 14mm
Preferably, the degree of depth of latticed ditch line is 0.05-0.2mm.
Preferably, have viscose glue on the described ceramic substrate and connect firmly groove.
Preferably, described P.e.c. comprises silver paste layer printed circuit board, microstrip antenna and passive radio frequency identification chip.
Use electronic tag of the present utility model, when human desires is uncovered mounted electronic tag, the latticed ditch line that label inside can produce broken memory function can make this label split into a lot of small unit, like this, other people can't be with already used electronic tag from intactly being uncovered on the sign vehicle, just can to prevent effectively also that non-appointment holder from tearing open move multiplexing described electronic tag, guaranteed the unique corresponding of automobile and electronic tag.
And, label can be broken with windshield when vehicle is in accident condition, because the fine and closely woven degree of the grid of latticed ditch line is high, and ceramic small unit broken under the effect of presetting internal stress will can not form sharp ceramics, can only form similar small particle, broken with the windshield equivalence, thereby can not cause the secondary injury to the driver and conductor.
Use this pottery label to meet the use standard and the safety standard of automobile in-vehicle apparatus fully, can not influence the normal use of automobile, and can not bring potential safety hazard to the user because of this label is installed.
Description of drawings
Fig. 1 is the manufacture method process flow diagram of the utility model electronic tag;
Fig. 2 is the structural representation that adopts a kind of electronic tag of the present utility model;
Fig. 3 is the cut-open view of the described electronic tag of Fig. 2.
Description of reference numerals:
10---ceramic substrate; 11---latticed ditch line; 12---microstrip antenna; 13---passive radio frequency identification chip; 14---sizing connects firmly groove; 15---silver paste P.e.c. etching face; 16---ceramic label is pasted face; 17---P.e.c..
Embodiment
As shown in Figure 1, in a kind of embodiment of the present utility model, the production technology of electronic tag may further comprise the steps:
At first, in step 101, when ceramic substrate is in soft blank, by substrate blank is carried out physical treatment, for example by the accurate mode of suppressing of particular manufacturing craft, the non-homogeneous five equilibrium of mint-mark size on this soft blank, the latticed ditch line of position asymmetric arrangement.This processing has changed the internal stress NATURAL DISTRIBUTION situation of substrate, make substrate have the internal stress that presets by the designing requirement distribution, to the substrate broken memory line that also just has been equivalent to " implantation ", can only paste the latticed ditch line of face mint-mark at label, promptly, paste the broken memory of face direction single face " implantation " line from label, also can all implant broken memory line at P.e.c. etching face and ceramic label stickup face.
The sizing grid of described latticed ditch line 11 need reach certain requirement, so that make label fragmentation up hill and dale under certain condition.Preferably, in a preferred embodiment, the size of each grid is in 10mm * 13.5mm-13.5mm * 14mm scope, and the area of whole latticed ditch line is: 53.57 * 84.57mm
2To 54.43 * 85.43mm
2The degree of depth of latticed ditch line also can have influence on the internal stress of generation, and in a preferred embodiment, the degree of depth of latticed ditch line is 0.05-0.2mm.
Preferably, the viscose glue that keeps original twice symmetry in the time of the latticed ditch line of mint-mark connects firmly groove, and it can be the groove that twice connect substrate that described viscose glue connects firmly groove, and sizing is full of viscose glue and connects firmly groove during stickup, makes that the stickup of label is more firm.
Next, in step 102, there is the soft blank of latticed ditch line carry out low temperature presintering system to mint-mark.For example, in the pre-burned process of present embodiment, temperature rises to 150 ℃ equably from 30 ℃, makes that blank absorbs, normal temperature dries.Because of the stress that is produced in the preceding road suppression process, thereby keep base material flatness and base substrate integrity.
In step 103, the blank after the pre-burned is carried out high-temperature firing, can adopt suitable standard ceramic burning process, base substrate is fired crystalline forming, make it to become the ceramic substrate that can be used for carrying out follow-up electric manufacturing procedure.In the present embodiment, the baking temperature range of high-temperature firing is 1565 ℃-1575 ℃.
After the burning process moulding, the latticed ditch line of suppressing on substrate is in advance solidified, the fragmentation memory line of being implanted has changed original ceramic substrate inside internal stress relatively low, uncontrollable, that form naturally in fact, the monoblock substrate has been produced by what designing requirement distributed preset internal stress, so promptly have can be by the performance of expecting the form fragmentation in advance when reaching predetermined condition for ceramic substrate.Meet external force do the time spent (as external force prize, during external impacts), this substrate can be by fragmentation memory line institute's restricted portion and the direction implanted, internal stress is preset in release, thereby realizes that substrate is cracked by the scope and the direction of design in advance, reaches the crushing effect that memory is arranged.
Simultaneously, electronic tag because of with windshield be that attaching type connects firmly, the internal stress that windshield is discharged when meeting the cracked or distortion of external force (as car accident), be delivered to electronic tag by connecting firmly device, promptly be to latter's externally applied forces, electronic tag also can be cracked in a manner described, and electronic tag will be broken with the windshield equivalence like this.
In step 104, on the P.e.c. etched surface on the ceramic substrate, lay corresponding circuit and electronic devices and components, to finish the production of whole electronic tag.For example, in electronic tag manufacturing process of the present utility model, need printing and circuit devcies such as microstrip antenna, passive radio frequency identification chip are set.It should be appreciated by those skilled in the art that and to take various suitable existing technology P.e.c. on ceramic substrate.
Shown in Fig. 2,3, electronic tag of the present utility model comprises ceramic substrate 10 and attached to the P.e.c. on the ceramic substrate 10 17.Described ceramic substrate 10 has P.e.c. etched surface and label and pastes face, has the latticed ditch line with broken memory function therein at least on the one side; On the P.e.c. etched surface of described P.e.c. 17 attached to ceramic substrate.
Described P.e.c. 17 comprises silver slurry layer printed circuit board, microstrip antenna 12 and passive radio frequency identification chip 13, and the trickle hole on the ceramic substrate 10 can guarantee that the circuit infiltration of microstrip antenna 12 and passive radio frequency identification chip 13 is attached at P.e.c. etching face 15.The silver-colored slurry penetrates in the inner pore of pottery, be integral thereby silver is starched and ceramic substrate 10 is combined closely, so this class pottery tag circuit radio-frequency (RF) impedance is highly stable, thereby guaranteed the electronic tag stability of the electric index of microwave in use.
In the electronic tag of utility model, latticed ditch line 11 was laid in before ceramic substrate 10 is fired in the blank of substrate, and for example the mode mint-mark by mould compacting is at the soft blank that is used to make ceramic substrate.In the electronic tag of present embodiment, the area of whole latticed ditch line 11 is 53.57 * 84.57mm
2To 54.43 * 85.43mm
2, the mesh-density of described latticed ditch line 11 need reach certain requirement, so that make label fragmentation up hill and dale under certain condition, preferably, in this preferred implementation, each grid is of a size of: 10mm * 13.5mm to 13.5mm * 14mm.
The degree of depth of latticed ditch line also can have influence on the internal stress size of generation, and in the present embodiment, the degree of depth of latticed ditch line is preferably 0.05-0.2mm.In an embodiment of the present utility model, only paste mint-mark on the face 16 at label.In more preferably embodiment, can paste the equal latticed ditch line 11 of mint-mark on the face 16 at silver paste P.e.c. etching face 15 and ceramic label, like this, easier fragmentation of external force effect subtegulum and the bad land of taking label in attempt off are more thorough, thereby have further increased the anti-dismounting of electronic tag.
When running into extraneous stress, this pottery label can can't continue to use along the damage of rupturing up hill and dale of latticed ditch line 11, thereby has guaranteed the unique corresponding of automobile and electronic tag.And because the fine and closely woven mesh shape of latticed ditch line, ceramic label can equivalence be broken in pelletized form because the preset stress effect that broken memory line produces is together with the vehicle front windshield, can not cause the secondary injury to the driver and conductor.
Although the utility model is to be described by above-mentioned preferred implementation, its way of realization is not limited to above-mentioned embodiment.Should be realized that under the situation that does not break away from the utility model purport those skilled in the art can make different variations and modification to the utility model.
Claims (7)
1, a kind of passive ceramic substrate-based electronic label special for automobile is characterized in that, comprising:
Ceramic substrate, described ceramic substrate have the P.e.c. etched surface and label is pasted face, and one side is provided with the latticed ditch line that possesses broken memory function at least therein;
P.e.c. is on the P.e.c. etched surface of described P.e.c. attached to ceramic substrate.
2, passive ceramic substrate-based electronic label special for automobile according to claim 1 is characterized in that, is equipped with the latticed ditch line that possesses broken memory function on the P.e.c. etched surface of described ceramic substrate and label stickup face.
3, passive ceramic substrate-based electronic label special for automobile according to claim 1 and 2 is characterized in that, described latticed ditch line is non-homogeneous five equilibrium, asymmetric arrangement.
4, passive ceramic substrate-based electronic label special for automobile according to claim 1 and 2 is characterized in that, the size of mesh opening of described latticed ditch line is in 10mm * 13.5mm to 13.5mm * 14mm scope.
5, passive ceramic substrate-based electronic label special for automobile according to claim 4 is characterized in that, the degree of depth of latticed ditch line is 0.05-0.2mm.
6, passive ceramic substrate-based electronic label special for automobile according to claim 4 is characterized in that, has viscose glue on the described ceramic substrate and connects firmly groove.
7, passive ceramic substrate-based electronic label special for automobile according to claim 4 is characterized in that, described P.e.c. comprises silver paste layer printed circuit board, microstrip antenna and passive radio frequency identification chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNU200820207993XU CN201259683Y (en) | 2008-08-26 | 2008-08-26 | Passive porcelain based type electronic label special for automobile |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNU200820207993XU CN201259683Y (en) | 2008-08-26 | 2008-08-26 | Passive porcelain based type electronic label special for automobile |
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CN201259683Y true CN201259683Y (en) | 2009-06-17 |
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CNU200820207993XU Expired - Lifetime CN201259683Y (en) | 2008-08-26 | 2008-08-26 | Passive porcelain based type electronic label special for automobile |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102555523A (en) * | 2010-12-20 | 2012-07-11 | 甘肃金盾信息安全技术有限公司 | Printing device of ceramic-substrate card tag |
CN101661568B (en) * | 2008-08-26 | 2012-07-18 | 北京标准信源科技有限公司 | Passive ceramic substrate-based electronic label special for automobile and manufacturing method thereof |
-
2008
- 2008-08-26 CN CNU200820207993XU patent/CN201259683Y/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101661568B (en) * | 2008-08-26 | 2012-07-18 | 北京标准信源科技有限公司 | Passive ceramic substrate-based electronic label special for automobile and manufacturing method thereof |
CN102555523A (en) * | 2010-12-20 | 2012-07-11 | 甘肃金盾信息安全技术有限公司 | Printing device of ceramic-substrate card tag |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171206 Address after: No. 38, block B, No. 38, No. 1, Zhongguancun Avenue, Haidian District, Beijing City, No. 077, No. 077 Patentee after: Beijing material union datum Technology Co., Ltd. Address before: 100102, room ten, room 9, building B, Wangjing central building, No. 6101, South Central Road, Chaoyang District, Beijing, Wangjing Patentee before: Beijing Biaozhunxinyuan Technology Co., Ltd. |
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CX01 | Expiry of patent term |
Granted publication date: 20090617 |
|
CX01 | Expiry of patent term |