CN201248198Y - Routing structure for circuit board of secondary encapsulation quartz oscillator - Google Patents
Routing structure for circuit board of secondary encapsulation quartz oscillator Download PDFInfo
- Publication number
- CN201248198Y CN201248198Y CNU200820163216XU CN200820163216U CN201248198Y CN 201248198 Y CN201248198 Y CN 201248198Y CN U200820163216X U CNU200820163216X U CN U200820163216XU CN 200820163216 U CN200820163216 U CN 200820163216U CN 201248198 Y CN201248198 Y CN 201248198Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pad
- oscillator
- quartz oscillator
- bonding pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a circuit board wiring structure for a secondary-encapsulation quartz oscillator, comprising the quartz oscillator, lines and a plurality of bonding pads. The left half part of a circuit board is provided with four bonding pads, and the ordinal link of the four bonding pads is in a rectangle; four pins of the quartz oscillator are respectively welded to the four bonding pads; and one bonding pad at the left upper corner is connected with a welding spot used for welding a filter capacitor through the lines. By adopting the structure, the utility model has the advantages that the distribution of the circuit board is reasonable and compact; the bonding pads welded to the pins are arranged at four peaks of the rectangle so as to reduce the lines, thereby the work of the circuit board is more stable; in addition, the filter capacitor is welded to one bonding pad, so the work of the circuit board is more stable.
Description
Technical field
The utility model relates to a kind of circuit board wiring structure of secondary encapsulation quartz (controlled) oscillator.
Background technology
In recent years, more and more higher along with developing rapidly of communications electronics field to the requirement of electronic equipment, especially to as this basic components such as oscillator require all the more so.The oscillator product more and more requires gently, thin, short, little, more and more require low cost, high-performance, production in enormous quantities.Application development along with surface mounting technology, SMD type quartz (controlled) oscillator is also day by day ripe, specification and output are also more and more abundanter, but encapsulate the not enough of development for traditional pin via hole, traditional circuit-board laying-out is reasonable inadequately, cabling is various, therefore when frequency is higher, to the highly significant that influences of circuit performance.In addition, traditional quartz oscillator circuit plate power work is stable inadequately sometimes, has also influenced circuit performance.
Summary of the invention
The utility model is at the deficiencies in the prior art, and a kind of simple in structure, rationally distributed, circuit board wiring structure of having reduced cabling, working stability is provided.
The utility model is solved by following technical proposals:
The circuit board wiring structure of secondary encapsulation quartz (controlled) oscillator, include quartz (controlled) oscillator, cabling and several pads, right-hand part at circuit board is provided with 4 rectangular pads of line successively, 4 pins of described quartz (controlled) oscillator respectively with above-mentioned 4 pads welding, the pad in the upper left corner in the wherein above-mentioned pad is connected with a solder joint that is used to weld filter capacitor by cabling.
Adopted the beneficial effects of the utility model of said structure to be: circuit-board laying-out is rationally compact, the pad of welding pin has been arranged on the place, four summits of rectangle, thereby has reduced cabling, thereby made the circuit board more stable work; In addition, on pad, be welded with a filter capacitor, make the circuit board more stable work.
Figure of description
Fig. 1 is circuit theory diagrams of the present utility model;
Fig. 2 is the circuit board wiring structure chart of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is described in further detail:
Embodiment:
Figure 1 shows that the circuit theory diagrams of the utility model secondary encapsulation quartz (controlled) oscillator, comprise quartzy clock oscillator SMD OSC.Wherein the PIN 1 of SMD OSC is OE (a ternary control pin), and PIN 2 is GND (grounding leg), and PIN 3 is OUTPUT (a frequency output pin), PIN4 is Vdd (a power supply introducing pin), in order to guarantee the stationarity of power supply power supply, the PIN4 pin also is connected with a filter capacitor C1, the other end ground connection of C1.
Figure 2 shows that the circuit board wiring figure of Fig. 1, mainly be printed on the ceramic wafer of one 17.8 (mm) * 10.2 (mm), four edges at circuit board are provided with the pad 1 that presets, pad 2, pad 3, pad 4 is so that install identical with existing DIP base, the SMDOSC layout is in the upper right corner of circuit board, as far as possible near pad 4 frequency output points.
The PIN 1 of SMD OSC, PIN 2, and PIN 3, and PIN 4 is welded on pad 5 respectively, pad 6, pad 7 is above the pad 8.Whether effectively the PIN1 pin of pad 5 by being used to determine SMD OSC solder joint 9 link to each other with pad 1.Pad 6 directly links to each other with pad 2.The shortest cabling of pad 7 usefulness links to each other with pad 3.Pad 8 bifurcation cablings, wherein the cabling by top links to each other with pad 4, and another links to each other with pad 2 by the solder joint 10 that is used to weld filter capacitor.
Claims (1)
1. secondary encapsulates the circuit board wiring structure of quartz (controlled) oscillator, include quartz (controlled) oscillator, cabling and several pads, it is characterized in that: the right-hand part at circuit board is provided with 4 rectangular pads of line successively, 4 pins of described quartz (controlled) oscillator respectively with above-mentioned 4 pads welding, the pad in the upper left corner in the wherein above-mentioned pad is connected with a solder joint that is used to weld filter capacitor by cabling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820163216XU CN201248198Y (en) | 2008-08-22 | 2008-08-22 | Routing structure for circuit board of secondary encapsulation quartz oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820163216XU CN201248198Y (en) | 2008-08-22 | 2008-08-22 | Routing structure for circuit board of secondary encapsulation quartz oscillator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201248198Y true CN201248198Y (en) | 2009-05-27 |
Family
ID=40732025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU200820163216XU Expired - Lifetime CN201248198Y (en) | 2008-08-22 | 2008-08-22 | Routing structure for circuit board of secondary encapsulation quartz oscillator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201248198Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011026277A1 (en) * | 2009-09-02 | 2011-03-10 | 广东大普通信技术有限公司 | Surface-mounted constant-temperature crystal oscillator |
-
2008
- 2008-08-22 CN CNU200820163216XU patent/CN201248198Y/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011026277A1 (en) * | 2009-09-02 | 2011-03-10 | 广东大普通信技术有限公司 | Surface-mounted constant-temperature crystal oscillator |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100616384B1 (en) | Electronic assembly with vertically connected capacitors and manufacturing method | |
US9717163B2 (en) | Electronic component mounting structure, manufacturing method and electronic component product | |
EP3826053A1 (en) | Chip power supply system, chip, pcb, and computer device | |
JP2003124383A5 (en) | ||
CN109244045B (en) | Miniaturized metal tube shell packaging structure of thick film substrate | |
WO2013107305A1 (en) | Integrated module, integrated system board and electronic device | |
US6636416B2 (en) | Electronic assembly with laterally connected capacitors and manufacturing method | |
KR100341077B1 (en) | Structure of multi-layered module in pcb | |
CN100490604C (en) | Printing circuit board | |
JPH09223861A (en) | Semiconductor integrated circuit and printed wiring board | |
CN201248198Y (en) | Routing structure for circuit board of secondary encapsulation quartz oscillator | |
US20230300985A1 (en) | Electronic component and electronic device | |
CN1972561A (en) | Pcb | |
CN202587598U (en) | Pad structure and printed circuit board (PCB) | |
TWI523186B (en) | Module ic package structure with electrical shielding function and method of making the same | |
CN203368919U (en) | Printed circuit board (PCB) pad and ball grid array (BGA) packaging PCB | |
CN211698062U (en) | Test board for camera module | |
CN202374566U (en) | Multi-module printed circuit board (PCB) package and communication terminal | |
CN221127116U (en) | Power module, chip power supply assembly and electronic equipment | |
US20050073050A1 (en) | BGA package and printed circuit board for supporting the package | |
CN216772296U (en) | Novel RTC clock module | |
CN110534494B (en) | BGA chip pin secondary arrangement packaging method and packaging structure | |
CN201248200Y (en) | Routing architecture for circuit board of base pin type quartz oscillator | |
CN220272479U (en) | Power supply device with integrated packaging structure | |
CN210381639U (en) | Layout structure of printed circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20090527 |
|
CX01 | Expiry of patent term |