CN201233434Y - Full automatic wafer testing platform device - Google Patents
Full automatic wafer testing platform device Download PDFInfo
- Publication number
- CN201233434Y CN201233434Y CN 200820035165 CN200820035165U CN201233434Y CN 201233434 Y CN201233434 Y CN 201233434Y CN 200820035165 CN200820035165 CN 200820035165 CN 200820035165 U CN200820035165 U CN 200820035165U CN 201233434 Y CN201233434 Y CN 201233434Y
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- CN
- China
- Prior art keywords
- negative pressure
- thimble
- plate
- wafer
- pressure sucker
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- Expired - Lifetime
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to an automatic wafer test platform device that is used for testing the function and the performance index of the semi-conductor wafer. An under-frame is provided with a transverse straight-line guide rail; the transverse straight-line guide rail is provided with the soleplate that is connected with the transverse straight-line guide rail in a sliding way; the under-frame is provided with a sliding drive device of the soleplate; the under-frame is provided with a longitudinal straight-line guide rail that is vertical to the transverse straight-line guide rail; the longitudinal straight-line guide rail is provided with a supporting plate and a sliding drive device of the supporting plate; the supporting plate is provided with a wafer absorption and disassembling device; a probe frame is hinged with the wafer absorption and disassembling device; one side, which is opposite to the wafer absorption and disassembling device, of the stander is provided with an installation groove of an optics positioning identification device. The device has high automation, compact structure, stable work, good vibration resistance and high movement and positioning precision, and effectively improves the test automation degree and the test speed of the wafer.
Description
Technical field
The utility model relates to a kind of full-automatic wafer test platform device that the function and the performance index of semiconductor crystal wafer are tested.
Background technology
The ultimate challenge that future, IC testing apparatus manufacturer faced is how to reduce testing cost.And improve test speed and test intellectuality is the necessary ways that reduce the cost.Test machine and the method for testing that generally adopts is manual test or semi-automatic test at present.Manual test is artificial each wafer of placing, with manual test behind each tube core of optics microscope alignment.Semi-automatic test is manually wafer to be placed on the test board, again by optical microscope scanning, the angle of manual adjustment wafer and the position of first tube core.Each tube core on the test wafer successively again after adjusting.Manually wafer is put back in the wafer film magazine after testing each wafer, taken out next wafer again and repeat above-mentioned test process.So manually-operated has increased the time of wafer sort greatly, and must manual adjustment to the probe of new installation after changing different kinds of chips, again by parameter manually is set.The accuracy that test process is got ready also can't be judged.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of full-automatic wafer test platform device is provided, and to improve the quality of products, shortens the production cycle.
The technical scheme that provides according to the utility model, horizontal line slideway is set on underframe, laterally line slideway is provided with the base plate that is slidingly connected with it, on underframe, be provided with the sliding driving device of base plate, on base plate, be provided with and the horizontal vertical vertical line slideway of line slideway, vertically slidely connect support plate and sliding driving device thereof on the line slideway, support plate is provided with wafer absorption and lowering device, above wafer absorption and lowering device, be hinged with probe carriage, on the frame of wafer absorption and lowering device one side, be provided with the mounting groove of optical alignment recognition device.
Described wafer absorption and lowering device comprise the wafer suction disc device of the interior cover of the tubulose top setting that the longitudinal direction of frame is provided with, cover links to each other with whirligig with jacking gear in described, this wafer suction disc device is included in the well heater that is provided with between negative pressure sucker and the thermal insulating disc, be provided with some negative pressure air drains at the negative pressure sucker upper surface, in negative pressure sucker, be provided with the negative pressure pore that is communicated with the negative pressure air drain, on negative pressure sucker, be provided with the negative pressure gas-tpe fitting, described negative pressure gas-tpe fitting is communicated with the negative pressure pore, on negative pressure sucker, be provided with and run through negative pressure sucker, the dumping pit of well heater and thermal insulating disc is provided with thimble and thimble apparatus for controlling of lifting in the dumping pit.
The concentric circles cell body that described negative pressure air drain is offered for the negative pressure sucker upper surface is provided with hot buffer disc between negative pressure sucker and well heater.Place, interior cover bottom outer wall is provided with ball sliding bush, and the ball sliding bush outer wall is with chuck, and described chuck is located in the overcoat that fixedly installs and with overcoat and is rotationally connected, and overlaps the bottom in longitudinal leadscrew withstands on and links to each other with its drive unit.In put and be provided with the rocking bar that crosses out, the other end of rocking bar links to each other with whirligig.
Below wafer suction disc device, be provided with tie-plate, be set with thimble upper plate and thimble lower plate below the tie-plate, plate in the thimble is slidingly connected between thimble upper plate and the thimble lower plate, in thimble plate on Plane Installation be fixed with ejector retainner plate, plate is by the thimble leading screw in the thimble, and this thimble leading screw links to each other with its drive unit.The thimble upper plate is provided with the thimble installing plate, is fixed with the thimble that inserts in the dumping pit on the thimble installing plate, is socketed with back-moving spring outside the thimble between thimble installing plate and negative pressure sucker.
Between well heater and thermal insulating disc, be provided with cover plate, wafer suction disc device is provided with the lower convex ring that stretches out to thermal insulating disc at the lower surface of negative pressure sucker, correspondingly the thermal insulating disc upper surface be provided with to negative pressure sucker stretch out on bulge loop, the lower surface of lower convex ring contacts with last bulge loop upper surface and hot heater, buffer disc and cover plate is contained in it.Place, bottom at underframe is provided with cushion blocking.
The utility model automaticity height, the apparatus structure compactness, stable working, resistance to shock is good, has higher motion and bearing accuracy, has improved the automaticity and the test speed of wafer sort effectively.
Description of drawings
Fig. 1 is an one-piece construction synoptic diagram of the present utility model.
Fig. 2 is the wafer absorption in the utility model and the structural representation of lowering device.
Fig. 3 is the structural representation of the wafer suction disc device in the utility model.
Embodiment
The utility model is described in further detail below in conjunction with concrete drawings and Examples.
As shown in the figure: horizontal line slideway 5 is set on underframe 4, place, bottom at underframe 4 is provided with cushion blocking 10 and vibration absorber 8, laterally line slideway 5 is provided with the base plate 9 that is slidingly connected with it, on underframe 4, be provided with the sliding driving device of base plate 9, this sliding driving device comprises the horizontal ball screw 6 that is spirally connected with base plate 9, laterally ball screw 6 one ends are rotatably connected on the underframe 4, the other end joins with the output shaft that is fixedly installed on the drive motor 16 on the underframe 4, base plate 9 is provided with the vertical line slideway 12 vertical with horizontal line slideway 5, vertically slidely connect support plate 14 and sliding driving device thereof on the line slideway 12, this sliding driving device comprises the vertical ball screw 13 that is spirally connected with support plate 14, vertically an end of ball screw 13 be rotationally connected, the other end joins with the output shaft that is fixedly installed on the drive motor 15 on vertical line slideway 12, vertical line slideway 12, support plate 14 is provided with wafer absorption and lowering device 2, above wafer absorption and lowering device 2, be hinged with probe carriage 1, on the frame 4 of wafer absorption and lowering device 2 one sides, be provided with the mounting groove 3 of optical alignment recognition device.
Do horizontal rectilinear motion for realizing base plate 9 with respect to horizontal line slideway 5, a pair of horizontal line slideway 5 and horizontal ball screw 6 are installed on frame 4, driving horizontal ball screw 6 by drive motor 16 gives base plate 9 motion-promotion forces, and by horizontal line slideway 5 guiding, this kind of drive can realize the straight-line stationarity of Y-axis preferably, and controlled motion precision preferably.
Described wafer absorption and lowering device 2 comprise the wafer suction disc device 229 of the interior cover of the tubulose 201 tops setting that the longitudinal direction of frame is provided with, cover 201 links to each other with whirligig with jacking gear in described, this wafer suction disc device 229 is included in the well heater 237 that is provided with between negative pressure sucker 235 and the thermal insulating disc 236, be provided with some negative pressure air drains 238 at negative pressure sucker 235 upper surfaces, in negative pressure sucker 235, be provided with the negative pressure pore 239 that is communicated with negative pressure air drain 238, on negative pressure sucker 235, be provided with negative pressure gas-tpe fitting 240, described negative pressure gas-tpe fitting 240 is communicated with negative pressure pore 239, on negative pressure sucker 235, be provided with and run through negative pressure sucker 235, the dumping pit 241 of well heater 237 and thermal insulating disc 236 is provided with thimble 230 and thimble apparatus for controlling of lifting in the dumping pit 241.
The concentric circles cell body that described negative pressure air drain 238 is offered for negative pressure sucker 235 upper surfaces is provided with hot buffer disc 242 between negative pressure sucker 235 and well heater 237.Place, interior cover 201 bottoms outer wall is provided with ball sliding bush 215, ball sliding bush 215 outer walls are with chuck 209, described chuck 209 is located in the overcoat 210 that fixedly installs and with overcoat 210 and is rotationally connected, and cover 201 bottoms linked to each other with its drive unit in longitudinal leadscrew 217 withstood on.Interior cover 201 is provided with the rocking bar 221 that crosses out, and the other end of rocking bar 221 links to each other with whirligig.
Below wafer suction disc device 229, be provided with tie-plate 228, be set with thimble upper plate 203 and thimble lower plate 207 below the tie-plate 228, plate 204 in the thimble is slidingly connected between thimble upper plate 203 and the thimble lower plate 207, in thimble plate 204 on Plane Installation be fixed with ejector retainner plate 227, plate 204 is by thimble leading screw 205 in the thimble, and this thimble leading screw 205 links to each other with its drive unit.Thimble upper plate 203 is provided with thimble installing plate 232, is fixed with the thimble 230 that inserts in the dumping pit 241 on thimble installing plate 232, is socketed with back-moving spring 231 outside the thimble 230 between thimble installing plate 232 and negative pressure sucker 235.
Between well heater 237 and thermal insulating disc 236, be provided with cover plate 245, wafer suction disc device 229 is provided with the lower convex ring 243 that stretches out to thermal insulating disc 236 at the lower surface of negative pressure sucker 235, correspondingly thermal insulating disc 236 upper surfaces be provided with to negative pressure sucker 235 stretch out on bulge loop 244, the lower surface of lower convex ring 243 contacts with last bulge loop 244 upper surfaces and hot heater 237, buffer disc 242 and cover plate 245 is contained in it.
Arranged a tube-in-tube structure of overcoat 210, chuck 209, interior cover 201 three-layer types longitudinally above the support plate 14 in surface level, overcoat 210 maintains static as shoring of foundation, chuck 209 plays the middle transition effect, chuck 209 is connected by deep groove ball bearing 208 with overcoat 210, and chuck 209 can only rotate with respect to overcoat 210; Chuck 209 is connected by ball sliding bush 215 transition with interior cover 201, simultaneously chuck 209 and vertical diametrically three groups of guide rods, 24 linear bearings 23 that are evenly equipped with of interior cover 201 so just make and interiorly overlap 201 and can only be relative Z when can rotate together with chuck 209 and slide up and down.Sliding up and down of interior cover 201 is to drive 217 transmissions of Z axial filament thick sticks with 213 by Z spindle motor 11 synchronously by the Z axle to realize that Z axial filament thick stick 217 is fixed on the chuck 209 by vertical by Z axial filament thick stick seat, deep groove ball bearing 218 and hexagonal nut 219.The rectilinear motion that utilizes lead screw transmission to produce has stationarity and accuracy preferably, and this helps the wafer sort demand.This transmission utilizes ball sliding bush 215 and three groups of guide rod 224 linear bearings 223 as guiding, has improved the stationarity and the accuracy of motion widely, has also dwindled parts overall dimensions diametrically simultaneously effectively.
Test bench wafer suction disc device 229 is a disc, assemble by multilayer, this device is overlapped 201 upper surface in being fixed on together by tie-plate 228 transition, tie-plate 228 adopts aluminium oxide ceramics to make, and its material properties can separate the temperature that test bench wafer suction disc device 229 produces effectively with other parts.Below tie-plate 228, be mounted with plate 204 and thimble lower plate 207 in thimble upper plate 203, the thimble, thimble upper plate 203 and thimble lower plate 207 maintain static with respect to tie-plate 228, the last Plane Installation of plate 204 is fixed with ejector retainner plate 227 in the thimble, and plate 204 is done oscilaltion by the driving drive ejector retainner plate 227 of thimble leading screw 205 together in the thimble between thimble upper plate 203 and thimble lower plate 207.Top on can be with guide rod 233 when ejector retainner plate 227 rises is because thimble 230, thimble installing plate 232 and guide rod 233 threes are mounted to one, so thimble 230 is also upwards ejected; When ejector retainner plate 227 descended, thimble 230 descended under the effect of back-moving spring 31.
In sum, test bench wafer suction disc device 229 and thimble parts are done cover 201 upper surfaces in as a whole being installed in, and so just can realize vertical lifting of wafer by longitudinal leadscrew 217 transmissions.Realize the correction of horizontal direction drift angle and the compensation of wafer by rocking bar control gear 222 control rocking bars 221.Push pin device can be with longitudinal axis lifting and energy relatively independent ground execution.
For preferably laminar wafer being fixed, consider fixing firmly and factor such as even, the utility model is taked the mode of vacuum suction, be about to go out for example ten concentric circular negative pressure air drains 238 in order to negative pressure sucker 235 surface working of absorption wafer, each negative pressure air drain 238 all has a negative pressure pore 239, also can be divided into three groups to these ten negative pressure air drains 238 in addition, every group has independent gas circuit air feed, connect negative pressure pore 239 by negative pressure gas-tpe fitting 240 and connect, so just formed vacuum suction system by three gas circuit controls with outside tracheae.Firm and the uniform and stable of this system's absorption in test process, can be carried out the gentle pressure-controlled of switch respectively to these three gas circuits according to the difference of wafer specification.Location for ease of test is shaped on identification marking at the center of negative pressure sucker 235.Based on the needs of wafer, on negative pressure sucker 235, be processed with dumping pit 241 last and the thimble lifting of when unloading.
Temperature requirement when satisfying wafer sort, the utility model is taked electrically heated mode, this heating action is finished by well heater 237, on the extension line of well heater, temperature detect switch (TDS) is installed, and the temperature sensor of packing in negative pressure sucker 235 is monitored temperature, be able to switch control to be implemented in when too high or too low for temperature, make wafer sort in the temperature environment of expection, to finish.
Well heater cover plate 245 can be fixed on well heater 237 glands on the negative pressure sucker 235, has ground wire to draw on the well heater cover plate 245, the security when guaranteeing to test.Consider the requirement of wafer sort simultaneously to the stability of temperature, hot buffer disc 242 and thermal insulating disc 236 have been involved in the device of the present utility model, hot buffer disc 242 and thermal insulating disc 236 are to be made by a kind of thermosetting plastics DMC, it absorbs heat slow and the slow material properties of heat release has the function that preferably temperature is stored, and has also played heat-blocking action preferably simultaneously when installing with outside parts.
Claims (9)
1, a kind of full-automatic wafer test platform device, comprise the horizontal line slideway (5) that is arranged on the underframe (4), it is characterized in that: laterally line slideway (5) is provided with the base plate (9) that is slidingly connected with it, on underframe (4), be provided with the sliding driving device of base plate (9), on base plate (9), be provided with and the horizontal vertical vertical line slideway (12) of line slideway (5), vertically slidely connect support plate (14) and sliding driving device thereof on the line slideway (12), support plate (14) is provided with wafer absorption and lowering device (2), top at wafer absorption and lowering device (2) is hinged with probe carriage (1), is provided with the mounting groove (3) of optical alignment recognition device on the frame (4) of wafer absorption and lowering device (2) one sides.
2, full-automatic wafer test platform device as claimed in claim 1, it is characterized in that: described wafer absorption and lowering device (2) comprise the wafer suction disc device (229) of the interior cover of tubulose (201) top setting that the longitudinal direction of frame is provided with, cover (201) links to each other with whirligig with jacking gear in described, this wafer suction disc device (229) is included in the well heater (237) that is provided with between negative pressure sucker (235) and the thermal insulating disc (236), be provided with some negative pressure air drains (238) at negative pressure sucker (235) upper surface, in negative pressure sucker (235), be provided with the negative pressure pore (239) that is communicated with negative pressure air drain (238), on negative pressure sucker (235), be provided with negative pressure gas-tpe fitting (240), described negative pressure gas-tpe fitting (240) is communicated with negative pressure pore (239), on negative pressure sucker (235), be provided with and run through negative pressure sucker (35), the dumping pit (241) of well heater (237) and thermal insulating disc (236) is provided with thimble (30) and thimble apparatus for controlling of lifting in the dumping pit (241).
3, full-automatic wafer test platform device as claimed in claim 2, it is characterized in that: the concentric circles cell body that described negative pressure air drain (238) is offered for negative pressure sucker (235) upper surface is provided with hot buffer disc (242) between negative pressure sucker (235) and well heater (237).
4, full-automatic wafer test platform device as claimed in claim 2, it is characterized in that: place, interior cover (201) bottom outer wall is provided with ball sliding bush (215), ball sliding bush (215) outer wall is with chuck (209), described chuck (209) is located in the overcoat (210) that fixedly installs and with overcoat (210) and is rotationally connected, and longitudinal leadscrew (217) withstands on interior cover (201) bottom and links to each other with its drive unit.
5, full-automatic wafer test platform device as claimed in claim 4 is characterized in that: interior cover (201) is provided with the rocking bar (221) that crosses out, and the other end of rocking bar (221) links to each other with whirligig.
6, full-automatic wafer test platform device as claimed in claim 2, it is characterized in that: be provided with tie-plate (228) in wafer suction disc device (229) below, be set with thimble upper plate (203) and thimble lower plate (207) below the tie-plate (228), plate (204) in the thimble is slidingly connected between thimble upper plate (203) and the thimble lower plate (207), the last Plane Installation of plate in thimble (204) is fixed with ejector retainner plate (227), plate in the thimble (204) is by thimble leading screw (205), and this thimble leading screw (205) links to each other with its drive unit.
7, full-automatic wafer test platform device as claimed in claim 6, it is characterized in that: thimble upper plate (203) is provided with thimble installing plate (232), on thimble installing plate (232), be fixed with the thimble (230) that inserts in the dumping pit (241), be socketed with back-moving spring (231) outside the thimble (230) between thimble installing plate (232) and negative pressure sucker (235).
8, full-automatic wafer test platform device as claimed in claim 2, it is characterized in that: between well heater (237) and thermal insulating disc (236), be provided with cover plate (245), wafer suction disc device (229) is provided with the lower convex ring (243) that stretches out to thermal insulating disc (236) at the lower surface of negative pressure sucker (235), correspondingly be provided with the last bulge loop (244) that stretches out to negative pressure sucker (235) at thermal insulating disc (236) upper surface, the lower surface of lower convex ring (243) contacts with last bulge loop (244) upper surface and hot heater (237), buffer disc (242) is contained in it with cover plate (245).
9, full-automatic wafer test platform device as claimed in claim 1 is characterized in that: the place, bottom at underframe (4) is provided with cushion blocking (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820035165 CN201233434Y (en) | 2008-04-14 | 2008-04-14 | Full automatic wafer testing platform device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820035165 CN201233434Y (en) | 2008-04-14 | 2008-04-14 | Full automatic wafer testing platform device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201233434Y true CN201233434Y (en) | 2009-05-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200820035165 Expired - Lifetime CN201233434Y (en) | 2008-04-14 | 2008-04-14 | Full automatic wafer testing platform device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201233434Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102183716A (en) * | 2009-12-18 | 2011-09-14 | 株式会社爱德万测试 | Carrier assembly apparatus |
| CN102279290A (en) * | 2010-06-13 | 2011-12-14 | 北大方正集团有限公司 | Sucking disc for tester table |
| CN102483437A (en) * | 2009-09-03 | 2012-05-30 | 应用材料公司 | Testing apparatus and relative method |
| CN103901334A (en) * | 2012-12-28 | 2014-07-02 | 深圳市劲升迪龙科技发展有限公司 | Micro-adjustable wafer test machine |
| TWI452298B (en) * | 2011-11-24 | 2014-09-11 | Hon Hai Prec Ind Co Ltd | Testing mounting device for expansion card |
-
2008
- 2008-04-14 CN CN 200820035165 patent/CN201233434Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102483437A (en) * | 2009-09-03 | 2012-05-30 | 应用材料公司 | Testing apparatus and relative method |
| CN102483437B (en) * | 2009-09-03 | 2015-06-17 | 应用材料公司 | Testing apparatus and relative method |
| US9412898B2 (en) | 2009-09-03 | 2016-08-09 | Applied Materials, Inc. | Apparatus and method of testing a substrate using a supporting nest and testing probes |
| CN102183716A (en) * | 2009-12-18 | 2011-09-14 | 株式会社爱德万测试 | Carrier assembly apparatus |
| CN102279290A (en) * | 2010-06-13 | 2011-12-14 | 北大方正集团有限公司 | Sucking disc for tester table |
| CN102279290B (en) * | 2010-06-13 | 2013-04-17 | 北大方正集团有限公司 | Sucking disc for tester table |
| TWI452298B (en) * | 2011-11-24 | 2014-09-11 | Hon Hai Prec Ind Co Ltd | Testing mounting device for expansion card |
| CN103901334A (en) * | 2012-12-28 | 2014-07-02 | 深圳市劲升迪龙科技发展有限公司 | Micro-adjustable wafer test machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20090506 Effective date of abandoning: 20080414 |