CN201223233Y - Thermal insulation board for dishes - Google Patents
Thermal insulation board for dishes Download PDFInfo
- Publication number
- CN201223233Y CN201223233Y CNU2008200452780U CN200820045278U CN201223233Y CN 201223233 Y CN201223233 Y CN 201223233Y CN U2008200452780 U CNU2008200452780 U CN U2008200452780U CN 200820045278 U CN200820045278 U CN 200820045278U CN 201223233 Y CN201223233 Y CN 201223233Y
- Authority
- CN
- China
- Prior art keywords
- thick film
- film circuit
- circuit module
- panel
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- 238000010792 warming Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000010425 asbestos Substances 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000005337 ground glass Substances 0.000 claims description 3
- 239000013081 microcrystal Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229910052895 riebeckite Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 235000012054 meals Nutrition 0.000 abstract description 2
- 238000010411 cooking Methods 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- 235000013305 food Nutrition 0.000 description 5
- 238000009835 boiling Methods 0.000 description 2
- 208000018522 Gastrointestinal disease Diseases 0.000 description 1
- 235000021210 cold soups Nutrition 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 208000010643 digestive system disease Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 208000018685 gastrointestinal system disease Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000009418 renovation Methods 0.000 description 1
Images
Landscapes
- Surface Heating Bodies (AREA)
Abstract
The utility model is a dish heat-insulation board which is used in catering and can keep the dish at a proper temperature in the eating process. The circuit board comprises a panel (1), a heating element (3), a heat insulation plate (4) and a shell (9), wherein the heat insulation plate (4) is arranged at the bottom of a hollow cavity of the shell (9), and the heating element (3) is a thick film circuit module and is directly sintered on the lower surface of the panel (1). The utility model discloses a thick film circuit module all integrates relevant component on the panel, adopts unified encapsulation form in its outside, so thick film circuit module's insulating properties, resistance precision are all better, and reduce outside temperature, humidity to its influence, so have stronger external environment adaptability, its dependable performance can ensure permanent use. Additionally, the utility model discloses a high-power main heating thick film circuit module can realize functions such as frying, cooking, chafing dish, and the meal that the miniwatt heat preservation thick film circuit module can make above the panel keeps being fit for edible temperature.
Description
Technical field:
The utility model is that a kind of family or restaurant of being used for uses when the food and drink for the user, makes dish can keep the dish warming plate of preference temperature in edible process, belongs to the renovation technique of dish insulation electric heating appliance.
Background technology:
Have now and be used to hold cooked food vessel, as: basin, dish, bowl etc. are not owing to all be provided with heating and heat-insulating device, therefore, Hot dishes, hot meal that culinary art has been got well are contained out to be placed on and are easy on the desk turn cold, and especially in the season in winter of the northern area of China, temperature is low, food can coldly get faster, edible cold dish, cold soup not only mouthfeel can be had a greatly reduced quality, and cause gastrointestinal disease easily, healthy unfavorable to old man, child.
At this problem, the insider has applied for a kind of patent of dish warming plate, it can keep the preference temperature of dish in edible process, but because its heater element is a kind of heating pottery of positive temperature coefficient, be independent parts be installed in panel below.The service life of the warming plate of this structure and heat insulation effect depend on its heating pottery fully, because the heating pottery does not adopt the form of encapsulation, be subjected to the influence of external temperature, humidity easily to it, so that directly influence the reliability of its serviceability, in case the heating pottery lost efficacy, must change, not only bother, and can increase use cost.
The utility model content:
The purpose of this utility model is to consider the problems referred to above and a kind of dependable performance is provided, and can guarantee the dish warming plate of permanent use.The utility model is simple in structure, easy to manufacture and volume is small and exquisite, conveniently move, switching on gets final product continuous firing.
The technical solution of the utility model is: include panel, heater element, thermal insulation board, make the housing of hollow cavity, wherein thermal insulation board is installed in the bottom of the hollow cavity of housing, wherein heater element is the thick film circuit module, its direct sintering is at the lower surface of panel, and the thick film circuit module is provided with the binding post that can be connected with power line.
The binding post of above-mentioned heater element is connected with the power-line plug that can connect with civil power.
Above-mentioned heater element is the thick film circuit module of positive temperature coefficient.
Above-mentioned heater element includes the different thick film circuit module of several heating powers, wherein the central area of panel is provided with at least one high-power main heating thick film circuit module, and the periphery of high-power main heating thick film circuit module is provided with some small-power insulation thick film circuit modules.
The heating power of above-mentioned some high-power main heating thick film circuit modules is identical or inequality; The heating power of some small-power insulation thick film circuit modules is identical or inequality.
Above-mentioned housing includes link and base plate, and thermal insulation board is installed on the base plate, and link is fixedlyed connected with base plate, and panel is fixedly connected on the top of link.
Above-mentioned panel cements in the top of link by adhesive.
The size of above-mentioned thermal insulation board is consistent with the floor space size of hollow cavity in the housing; Thermal insulation board is an asbestos board, or rubber slab, or plastic plate.
Above-mentioned panel is a microcrystal glass plate, or ceramic wafer, or the ground glass plate, or corrosion resistant plate or aluminium sheet.
Above-mentioned link is connected with base plate riveted joint or screw, or connects by adhesive.
Heater element of the present utility model is owing to adopt the structure of thick film circuit module, the thick film circuit module is owing to all be integrated in relevant element on the panel, at the unified packing forms of its outside employing, so insulating properties, the resistance accuracy of thick film circuit module are all better, and reduced the influence of external temperature, humidity to it, so the thick film circuit module has stronger external environment condition conformability, its dependable performance, can guarantee permanent use, realize that the dish of putting on the counter plate carries out heat tracing.The a plurality of thick film heater elements of the utility model sintering below panel, wherein the central area of panel is provided with at least one high-power main heating thick film circuit module, the temperature height, thereby realize functions such as frying, boiling, chafing dish, the periphery of high-power main heating thick film circuit module is provided with some small-power insulation thick film circuit modules, temperature is lower, makes that the food above the panel keeps edible temperature.The utility model parts are few, and cumulative volume is little, and are not only attractive in appearance but also practical, are applicable to that general family and dining room use when having dinner cold season for the user, are that a kind of design is ingenious, function admirable, convenient and practical dish warming plate.
Description of drawings:
Fig. 1 is a stereogram of the present utility model;
Fig. 2 is STRUCTURE DECOMPOSITION figure of the present utility model;
Fig. 3 is the layout of heater element on panel in the utility model.
The specific embodiment:
Embodiment:
Structural representation of the present utility model as shown in Figure 1, 2, include panel 1, heater element 3, thermal insulation board 4, make the housing 9 of hollow cavity, wherein thermal insulation board 4 is installed in the bottom of the hollow cavity of housing 9, wherein heater element 3 is the thick film circuit module, its direct sintering is at the lower surface of panel 1, and the thick film circuit module is provided with the binding post that can be connected with power line.For guaranteeing that the heat that heater element 3 is sent can not pass to base plate 5 downwards, the floor space of hollow cavities is big or small consistent in the size of above-mentioned thermal insulation board 4 and the housing 9, and thermal insulation board 4 is asbestos boards, or rubber slab, or the relatively poor material of conductivity of heat such as plastic plate is made.The binding post of above-mentioned heater element 3 is connected with the power-line plug 6 that can connect with civil power, and power-line plug 6 is installed on the base plate 5, during use, is communicated with civil power.
In the present embodiment, above-mentioned heater element 3 is the thick film circuit module of positive temperature coefficient.
In addition, for satisfying the use needs of different user, above-mentioned heater element 3 includes the different thick film circuit module of several heating powers, wherein the central area of panel 1 is provided with at least one high-power main heating thick film circuit module 7, and the periphery of high-power main heating thick film circuit module 7 is provided with some small-power insulation thick film circuit modules 8.Temperature height when high-power main heating thick film circuit module is worked, thus realize functions such as frying, boiling, chafing dish, and temperature is lower during the work of small-power insulation thick film circuit module, makes that the food above the panel keeps edible temperature.
The heating power of above-mentioned some high-power main heating thick film circuit modules 7 is identical or inequality; The heating power of some small-power insulation thick film circuit modules 8 is identical or inequality.High-power main heating thick film circuit module 7 all can be made different sizes, size and power according to requirement of client with small-power insulation thick film circuit module 8.
For ease of processing and installation, above-mentioned housing 9 includes link 2 and base plate 5, and thermal insulation board 4 is installed on the base plate 5, and link 2 is fixedlyed connected with base plate 5, and panel 1 is fixedly connected on the top of link 2.Above-mentioned link 2 is connected with base plate 5 riveted joints or screw, or connects by adhesive.In the present embodiment, link 2 and base plate 5 are connected by adhesive, and above-mentioned panel 1 cements in the top of link 2 by adhesive.Above-mentioned panel 1 is a microcrystal glass plate, or ceramic wafer, or the ground glass plate, or corrosion resistant plate or aluminium sheet.
The utility model is when design, and whole warming plate can be made the different all size of size according to client's needs.The utility model is inserted in plug 6 in the supply socket in use, then heater element 3 heatings, and all dish of putting on the heat counter plate 1 that utilizes it to send all can carry out heat tracing.
Claims (10)
1, a kind of dish warming plate, include panel (1), heater element (3), thermal insulation board (4), make the housing (9) of hollow cavity, wherein thermal insulation board (4) is installed in the bottom of the hollow cavity of housing (9), it is characterized in that heater element (3) is the thick film circuit module, its direct sintering is at the lower surface of panel (1), and the thick film circuit module is provided with the binding post that can be connected with power line.
2, dish warming plate according to claim 1, the binding post that it is characterized in that above-mentioned heater element (3) are connected with the power-line plug (6) that can connect with civil power.
3, dish warming plate according to claim 1 is characterized in that above-mentioned heater element (3) is the thick film circuit module of positive temperature coefficient.
4, dish warming plate according to claim 1, it is characterized in that above-mentioned heater element (3) includes the different thick film circuit module of several heating powers, wherein the central area of panel (1) is provided with at least one high-power main heating thick film circuit module (7), and the periphery of high-power main heating thick film circuit module (7) is provided with some small-power insulation thick film circuit modules (8).
5, dish warming plate according to claim 4 is characterized in that the heating power of above-mentioned some high-power main heating thick film circuit modules (7) is identical or inequality; The heating power of some small-power insulation thick film circuit modules (8) is identical or inequality.
6, according to each described dish warming plate of claim 1 to 5, it is characterized in that above-mentioned housing (9) includes link (2) and base plate (5), thermal insulation board (4) is installed on the base plate (5), link (2) is fixedlyed connected with base plate (5), and panel (1) is fixedly connected on the top of link (2).
7, dish warming plate according to claim 6 is characterized in that above-mentioned panel (1) cements in the top of link (2) by adhesive.
8, dish warming plate according to claim 7 is characterized in that the size of above-mentioned thermal insulation board (4) is consistent with the floor space size of the interior hollow cavity of housing (9); Thermal insulation board (4) is an asbestos board, or rubber slab, or plastic plate.
9, dish warming plate according to claim 7 is characterized in that above-mentioned panel (1) is a microcrystal glass plate, or ceramic wafer, or the ground glass plate, or corrosion resistant plate or aluminium sheet.
10, dish warming plate according to claim 7 is characterized in that above-mentioned link (2) is connected with base plate (5) riveted joint or screw, or connects by adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200452780U CN201223233Y (en) | 2008-03-24 | 2008-03-24 | Thermal insulation board for dishes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200452780U CN201223233Y (en) | 2008-03-24 | 2008-03-24 | Thermal insulation board for dishes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201223233Y true CN201223233Y (en) | 2009-04-22 |
Family
ID=40596111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200452780U Expired - Lifetime CN201223233Y (en) | 2008-03-24 | 2008-03-24 | Thermal insulation board for dishes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201223233Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105795811A (en) * | 2014-12-30 | 2016-07-27 | 无锡汉思特电器科技有限公司 | Heat-insulation pan structure |
-
2008
- 2008-03-24 CN CNU2008200452780U patent/CN201223233Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105795811A (en) * | 2014-12-30 | 2016-07-27 | 无锡汉思特电器科技有限公司 | Heat-insulation pan structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: MIDEA GROUP CO., LTD. Free format text: FORMER NAME: MEIDI GROUP CO. LTD. |
|
| CP03 | Change of name, title or address |
Address after: 528311 Guangdong, Foshan, Beijiao, the United States, the United States and the United States on the avenue of the United States, the headquarters of the United States building B floor, District, 26-28 Patentee after: MIDEA GROUP Co.,Ltd. Address before: 528311 Penglai Road, Beijiao Town, Foshan District, Guangdong, China, Patentee before: Midea Group |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090422 |