CN201218482Y - Angle-fixing high-brightness polycrystal packaging LED heat radiating device - Google Patents
Angle-fixing high-brightness polycrystal packaging LED heat radiating device Download PDFInfo
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- CN201218482Y CN201218482Y CNU2008200095919U CN200820009591U CN201218482Y CN 201218482 Y CN201218482 Y CN 201218482Y CN U2008200095919 U CNU2008200095919 U CN U2008200095919U CN 200820009591 U CN200820009591 U CN 200820009591U CN 201218482 Y CN201218482 Y CN 201218482Y
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Abstract
The utility model relates to a fixed-angle and high-brightness polycrystal encapsulation LED heat abstractor which comprises a heat-conducting plate, a plurality of baseplates, a plurality of polycrystal encapsulation LED modules and a plurality of radiating modules, wherein the surface of the lower layer of the heat-conducting plate is provided with a plurality of rabbet joint parts; the baseplates are arranged at the bottoms of the rabbet joint parts, and the bottoms of the rabbet joint parts form included angles ranging from 0 degree to 180 degrees with two directional axes of the joint faces of the baseplates and a plane; and the plurality of polycrystal encapsulation LED modules are encapsulated on the plurality of baseplates. The utility model has the advantages of simple structure, easy assembly, high practicability, and the like, and prevents overhigh quantity of heat from influencing the actual operation and the service life of an LED.
Description
Technical field
The utility model relates to a kind of polycrystalline encapsulation LED heat abstractor, what be particularly related to is that a kind of polycrystalline encapsulation LED (LED) that utilizes is as light source, and utilize radiating module and radiating tube that the heat energy of polycrystalline packaged LED is led the external world, reach the polycrystalline encapsulation LED heat abstractor of radiating effect.
Background technology
Light emitting diode (Light Emitting Diode; LED) be utilize in the semi-conducting material electronics electricity hole in conjunction with the time rank, energy band (Energy Gap) position change, with its energy that is discharged of luminous demonstration, specifically amass advantages such as little, that the life-span is long, driving voltage is low, power consumption is low, reaction rate is fast, vibration strength is good, be assembly common in the various application apparatus in the daily life.Along with the continuous evolution of LED material and encapsulation technology, impel the brightness of LED product to improve constantly, by early stage power supply indicator function, advance to have power saving, the life-span is long, the monocrystalline LED illumination and the light source product of visual advantages of higher in the thick fog.The LED product is used and to be contained general illumination, automobile-used illumination and quite popular street lighting etc., and market scale and growth power are considerable, are the 3,000,000 industries that government will actively promote future.
But follow the development of high brightness high power monocrystalline LED, its heat dissipation problem also faces more and more acid test as the development of CPU, as do not solve the life-span and the luminous intensity that will influence LED in good time.
Existing radiating module only will be provided with mostly offers several open-works in order to heat radiation, the following drawback of this kind mode tool after actual embodiment in the metal system housing of monocrystalline LED lamp:
1, existing monocrystalline LED lamp is when start, and the heat of its generation is not to be only soluble in order to dispel the heat with offering several open-works on the described metal system shell.
2, existing monocrystalline LED lamp is because of putting in metal system housing, so if the LED lamp can't dispel the heat or radiating effect is not good, can make whole metal system case temperature rising, even meeting damage other assembly in the metal system housing because of the temperature of metal system housing is too high.
3, LED is the monocrystalline method for packing at present, and the method for packing of monocrystalline mainly can influence heat radiation performance and the weight of LED.
4, Zheng Ti monocrystalline packaged LED adds that the weight of radiating module can be overweight, the problem that can cause carrying and assembling to use.
This shows that above-mentioned existing article still have many defectives, real non-one kindhearted design, and demand urgently being improved.
Every shortcoming that this case utility model designer derives in view of above-mentioned existing light fixture is urgently thought improve innovation, and after concentrating on studies through taking great pains to attain one's goal for many years, successfully researches and develops finally and finish this part fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor.
Summary of the invention
The original text of polycrystalline is English: Multi-Chip Module, be called for short: MCM.Polycrystalline is the word at electronics, semiconductor applications, is packing, the encapsulation technology (Package) of a kind of naked crystalline substance, chip, IC, and this kind encapsulation technology can be received two or more naked crystalline substances an encapsulated content.
So-called polycrystalline encapsulation is defined as a plural number semiconductor light-emitting-diode (LED), and its every is more than 1 watt or 1 watt, is encapsulated into an illuminator.Be different from conventional art, the purpose of this utility model promptly is to provide a kind of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor, it is characterized in that utilizing illuminator that the polycrystalline packaged LED becomes as light source, and utilize radiating tube that the heat energy guiding of polycrystalline packaged LED is conducted heat to extraneous.
Other purpose is disclosed for reaching, the utility model provides a kind of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor, it includes: a heat-conducting plate, and its upper surface is provided with a plurality of junction surfaces, and the following laminar surface of heat-conducting plate is provided with a plurality of interlocking portion; A plurality of substrates, its device are in interlocking portion bottom, and the joint face of described interlocking portion bottom and substrate and two axis of orientations of horizontal plane form one 0 to 180 degree angles; A plurality of polycrystalline encapsulation LED modules, it is encapsulated in respectively on a plurality of substrates, and; A plurality of radiating modules, it installs on a plurality of junction surfaces.Can be on the radiating module in addition and install the heat pipe radiating module additional or use the aluminium extruded type radiating module to strengthen radiating effect.
The beneficial effects of the utility model are compared with the prior art, can prevent that heat is too high, improve the running and the life-span of LED reality, lead the external world by selecting suitable radiating module with the used heat that LED is produced of appropriateness.It has polycrystalline packaged LED heat radiation assembling simple in structure, as to assemble plurality of advantages such as easy and high practicability.
Description of drawings
Fig. 1 is the structure chart of high brightness polycrystalline encapsulation LED substrate;
Fig. 2 A is the example structure figure of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 2 B is the embodiment three-dimensional view of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 3 is another embodiment three-dimensional view of interlocking portion of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 4 A is another example structure figure of interlocking portion of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 4 B is another embodiment three-dimensional view of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 5 A is the circular embodiment three-dimensional view of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 5 B is the circular embodiment upward view of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 6 A is the permutation and combination of two groups of interlocking portions of described fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor to Fig. 6 F;
Fig. 7 is the permutation and combination upward view of two groups of interlocking portions of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Fig. 8 A is the permutation and combination of three groups of interlocking portions of described fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor to Fig. 8 L;
Fig. 9 is the permutation and combination upward view of three groups of interlocking portions of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor;
Figure 10 is the permutation and combination upward view of the ring-like interlocking portion of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor.
Description of reference numerals: 15a, 15b, 15c, 15d, the naked crystalline substance of 15e-light emitting diode; 11,11a, 11b, 11c-encapsulation; 12,12a, 12b, 12c-substrate; The 21-heat-conducting plate; 22a, 22b, 22c...22n-junction surface; 11a, 11b, 11c...11n-polycrystalline encapsulation LED module; 24a, 24b, 24c...24n, 25a, 25b, 25c...25n-fin; The 31--radiating module; The 32-heat sink; 19,20-heat pipe; A1, a2-first direction axle clamp angle; A3, a4-second direction axle clamp angle; 14,15,16,17-perforation; 41-first direction axle; 42-second direction axle; 23a, 23b, 23c...23n-interlocking portion.
The specific embodiment
Below in conjunction with accompanying drawing, to this novel above-mentionedly is described in more detail with other technical characterictic and advantage.
Maximum of the present utility model is characterised in that utilizes the polycrystalline packaged LED as light source, and utilizes the heat radiation module to add that heat pipe or aluminium extruded type radiating module lead outside radiator structure with the heat energy of polycrystalline packaged LED.So-called polycrystalline encapsulation is defined as a plural number semiconductor light-emitting-diode (LED), and its every is more than 1 watt or 1 watt, is encapsulated into an illuminator.
Seeing also Fig. 1 is described a kind of high brightness polycrystalline encapsulation LED substrate; the naked crystalline substance of two or more light emitting diodes (15a, 15b, 15c, 15d, 15e) is encapsulated (11) on substrate (12); the effect of LED encapsulation is that outer lead is connected on the electrode of led chip; not only can protect the LED wafer, and play effect and the dispersion angle that improves luminous efficiency.So the output signal of telecommunication is not only just finished in the LED encapsulation, the more important thing is protection tube core operate as normal, the function of output visible light.The naked crystalline substance of two or more light emitting diodes (15a, 15b, 15c, 15d, 15e) encapsulation is according to different application scenarios, different appearance and size, heat sink conception and illumination effect.Utilize so-called polycrystalline encapsulation, it is defined as a plural number semiconductor light-emitting-diode (LED), and its every is more than 1 watt or 1 watt, is encapsulated into an illuminator.
Seeing also Fig. 2 A and Fig. 2 B is described a kind of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor the utility model one embodiment, it includes: a heat-conducting plate (21), its upper surface is provided with a plurality of junction surfaces (22a, 22b), and the following laminar surface of heat-conducting plate (21) can be provided with a plurality of interlocking portions (23a, 23b); A plurality of polycrystalline encapsulation LED modules (11a, 11b), it is encapsulated in respectively on a plurality of substrates (12a, 12b), and interlocking portion (23a, 23b) bottom forms one 0 to 180 degree first direction axle clamp angles (a1, a2) with the joint face of substrate (12a, 12b) and the first direction axle (41) of horizontal plane.And a plurality of radiating modules (13), can be provided with a plurality of junction surfaces (22a, 22b) on the heat-conducting plate (21), a plurality of radiating modules (13) but framework on a plurality of junction surfaces (22a, 22b).
Radiating module can be aluminium extruded type radiating module (13).Described junction surface (22a, 22b), interlocking portion (23a, 23b) and heat-conducting plate (21) can be the one-body molded conductive structure of ejection formation or independent structures separately, and junction surface (22a, 22b), interlocking portion (23a, 23b), radiating module (31) and heat-conducting plate (21) conductive structure that also can be formed in one helps integral heat sink efficient in addition.
Seeing also Fig. 3 A and Fig. 3 B is described a kind of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor the utility model one embodiment of interlocking portion.Can respectively do for oneself independent protuberance of interlocking portion (23a, 23b, 23c, 23d) connects substrate (21), first direction axle clamp angle (a1) and second direction axle clamp angle (a3) that the joint face of interlocking portion (23a) bottom and substrate (12a, 12b) and the first direction axle (41) of horizontal plane and second direction axle (42) form, the second direction axle azimuth axis (42) at second direction axle clamp angle (a3) is the first direction axle (41) at the first direction axle clamp angle (a1) that does not coexist.Can form the joint face of a universal interlocking portion (23a, 23b, 23c, 23d) bottom and substrate (12a, 12b) by control angle (a3, a1), device during the design phase according to the needed polycrystalline encapsulation LED of designer module (11a, 11b) lighting angle, irradiated area and adjust different azimuth axis (41,42) angle, and then generation free from glare, irradiated area is wide, brightness is even, good visual effect.Really having accomplished luminous softly, steady, continuous, near natural daylight, is real perfect light source.
Seeing also Fig. 4 A and Fig. 4 B is described a kind of another embodiment of fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor the utility model, the radiating module (31) of device on junction surface (22a, 22b) can be the radiating module (31) that a plurality of fin (24a, 25a) and heat sink (32) are combined into, a plurality of heat pipes (19,20) can be set on the fin (24a, 25a), it passes a plurality of fin (13), is beneficial to the fin heat radiation.Interlocking portion (23a, 23b) bottom forms one 0 to 180 degree angles (a1, a2) with the joint face and the horizontal plane (41) of substrate (12a, 12b).Its heat-conducting plate mentioned (21) or substrate (12a, 12b) can be metal or ceramic substrate and heat-conducting plate, for example copper base or aluminium base.
Heat energy is delivered to heat-conducting plate (21) via substrate (12a) by interlocking portion (23a, 23b).Heat-conducting plate (21) passes to radiating module (13) with heat energy by junction surface (22a, 22b).Can be provided with perforation (14,15) on the fin (24a, 25a), can pass fin (24a) and can utilize perforation (14,15) to set up heat pipe (19), flow in order to heat energy.Heat pipe (19) is pressed close to heat sink (32), and the thermal energy transfer that helps in that junction surface (22a, 22b) received arrives on the fin (24a, 25a).Heat pipe (19,20) is to utilize the phase change of working fluid to produce (fire end), makes heat transfer to the other end (colling end) immediately, relends by capillary structure, is retracted fire end and is reached by colling end and carry out the heat conveying continuously.Because the polycrystalline packaged LED can be the naked crystalline substance of the light emitting diode of different power, and produces different heat energy, so a plurality of heat pipe (19,20) can install on fin (24a, 25a).Perforation on the fin (24a, 25a) can be air vent (18) and flows in order to hot gas in addition, reaches radiating effect.The combination of many in addition group heat pipes and fin (25a, 25b, 25c...25n) can be installed on junction surface (22a, 22b), to strengthen radiating rate.
Seeing also Fig. 5 A and Fig. 5 B is the circular embodiment of described fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor.Fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor integral body can be circle or ellipse, and being beneficial to technical specific (special) requirements mainly is to design the shadow surface territory in conjunction with LED brightness and lighting angle, and can insert in the space limited in the light fixture.Radiating module (31) can be and is arranged in the radiating module (31) that ring-like a plurality of fin (24a, 24b, 24c...24n) and circular heat sink (32) are combined into.Interlocking portion (23) under the substrate (21) can be ring-like, and a plurality of substrates (12a, 12b...12n) that are packaged with polycrystalline encapsulation LED module (11a, 11b...11n) can be arranged according to ring-like interlocking portion (23).Substrate (21) can be provided with a plurality of ring-like interlocking portions (23) in order to designing the shadow surface territory in conjunction with LED brightness and lighting angle down.
Seeing also Fig. 6 A is the permutation and combination and the upward view of the polycrystalline encapsulation LED module of described fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor to 6C and Fig. 7, a plurality of interlocking portions (23a, 23b) can be arranged in different graphic in conjunction with a plurality of polycrystalline encapsulation LED modules (11a, 11b), for example about, up and down or the diagonal angle symmetric figure.The arrangement mode of LED can be influential to its brightness and exothermicity, position that therefore must a balance of acquisition, when the configuration of LED tight more, brightness is also good more, but its thermal diffusivity problem is just comparatively serious, but if LED arranges comparatively sparse, will reduce brightness, but the thermal diffusivity problem will be preferable.The arrangement mode of different LED has the temperature of different brightness and LED integral body, and team is joined in its combination that influences heat pipe and radiating module, to reach effective heat radiation.
Seeing also Fig. 6 D is the no junction surface permutation and combination and the upward view of described fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor to Fig. 6 F and Fig. 7, heat-conducting plate (21) only is provided with interlocking portion (23a, 23b), and the received heat energy of heat-conducting plate (21) is directly transferred to radiating module.
Seeing also Fig. 8 A is the embodiment of the many interlockings portion front view and the upward view of described fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor to Fig. 8 F and Fig. 9, present embodiment is formed by a plurality of interlocking portions (23a, 23b, 23c) and a plurality of junction surface (22a, 22b, 22c), by forming the light source more than the both direction.Adjust interlocking portion (23a, 23b, 23c) bottom and the joint face of substrate (12a, 12b, 12c) and the angle of horizontal plane two axis of orientations formation, with illumination that forms effective wide regional coverage or illumination with special directionality.
Seeing also Fig. 8 G is the embodiment of the many interlockings portion front view and the upward view of described fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor to Fig. 8 L and Fig. 9, and present embodiment is formed by a plurality of interlocking portions (23a, 23b, 23c).Heat-conducting plate (21) only is provided with interlocking portion (23a, 23b), and the received heat energy of heat-conducting plate (21) is directly transferred to radiating module.
See also Figure 10 in addition, the interlocking portion that heat-conducting plate (21) is provided with can be circle or ellipse, and being beneficial to technical specific (special) requirements mainly is to design the shadow surface territory in conjunction with LED brightness and lighting angle, and can insert in the space limited in the light fixture.Interlocking portion (23) under the substrate (21) can be ring-like, and a plurality of substrates (12a, 12b...12n) that are packaged with polycrystalline encapsulation LED module (11a, 11b...11n) can be arranged according to ring-like interlocking portion (23).Substrate (21) can be provided with a plurality of ring-like interlocking portions (23) in order to designing the shadow surface territory in conjunction with LED brightness and lighting angle down.
More than explanation is novel just illustrative for this; and it is nonrestrictive; those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited; can make many modifications; change, or equivalence, but all will fall in the protection domain of the present utility model.
Claims (16)
1. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor, it is characterized in that: it includes:
One heat-conducting plate, its down laminar surface be provided with a plurality of interlocking portion;
A plurality of substrates, its device are in described interlocking portion bottom, and described interlocking portion bottom forms one 0 degree to 180 degree angles with the joint face of substrate and two axis of orientations of horizontal plane;
A plurality of polycrystalline encapsulation LED modules, it is encapsulated in respectively on a plurality of substrates, and;
A plurality of radiating modules, it installs on described heat-conducting plate.
2. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 1, it is characterized in that: described heat-conducting plate upper surface is provided with a plurality of junction surfaces, and a plurality of described radiating modules are arranged on a plurality of junction surfaces.
3.. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 1 and 2, it is characterized in that: described a plurality of radiating module settings comprise: a plurality of fin and heat sink.
4. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 3, it is characterized in that: described fin is provided with a plurality of perforation.
5. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 4, it is characterized in that: described a plurality of fin are provided with a plurality of heat pipes, and the perforation that it passes a plurality of fin is beneficial to the radiating module heat radiation.
6. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 4, it is characterized in that: described perforation is an air vent.
7. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 1 and 2, it is characterized in that: described radiating module is the aluminium extruded type radiating module.
8. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 2 is characterized in that: described junction surface, interlocking portion and the heat-conducting plate conductive structure that is formed in one.
9 fixed angle formula high brightness polycrystalline encapsulation LED heat abstractors according to claim 2 is characterized in that: described junction surface, interlocking portion, radiating module and the heat-conducting plate conductive structure that is formed in one.
10. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 1 and 2, it is characterized in that: described a plurality of substrates are arranged in different graphic in interlocking portion in conjunction with a plurality of polycrystalline encapsulation LED modules.
11. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 10 is characterized in that: described spread geometry is arranged for the strip type.
12. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 1 and 2 is characterized in that: described polycrystalline encapsulation LED module is for encapsulating a plural number semiconductor light-emitting-diode on described substrate.
13. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 12, it is characterized in that: the power of described semiconductor light-emitting-diode is more than 1 watt or 1 watt.
14. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 1 and 2, it is characterized in that: described substrate is a ceramic substrate.
15. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 1 and 2, it is characterized in that: described substrate is a metal substrate.
16. fixed angle formula high brightness polycrystalline encapsulation LED heat abstractor according to claim 15, it is characterized in that: described metal substrate is copper or aluminium base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200095919U CN201218482Y (en) | 2008-05-26 | 2008-05-26 | Angle-fixing high-brightness polycrystal packaging LED heat radiating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200095919U CN201218482Y (en) | 2008-05-26 | 2008-05-26 | Angle-fixing high-brightness polycrystal packaging LED heat radiating device |
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| CN201218482Y true CN201218482Y (en) | 2009-04-08 |
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| CNU2008200095919U Expired - Fee Related CN201218482Y (en) | 2008-05-26 | 2008-05-26 | Angle-fixing high-brightness polycrystal packaging LED heat radiating device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102207271A (en) * | 2010-03-29 | 2011-10-05 | 东芝照明技术株式会社 | Optical unit and lighting apparatus |
| CN104930368A (en) * | 2014-03-18 | 2015-09-23 | 璨圆光电股份有限公司 | Lighting device |
| US9353927B2 (en) | 2010-03-29 | 2016-05-31 | Toshiba Lighting & Technology Corporation | Lighting apparatus |
-
2008
- 2008-05-26 CN CNU2008200095919U patent/CN201218482Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102207271A (en) * | 2010-03-29 | 2011-10-05 | 东芝照明技术株式会社 | Optical unit and lighting apparatus |
| US8511862B2 (en) | 2010-03-29 | 2013-08-20 | Toshiba Lighting & Technology Corporation | Optical unit and lighting apparatus |
| US9353927B2 (en) | 2010-03-29 | 2016-05-31 | Toshiba Lighting & Technology Corporation | Lighting apparatus |
| CN104930368A (en) * | 2014-03-18 | 2015-09-23 | 璨圆光电股份有限公司 | Lighting device |
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Granted publication date: 20090408 Termination date: 20140526 |