CN201180950Y - Light source module of LED - Google Patents
Light source module of LED Download PDFInfo
- Publication number
- CN201180950Y CN201180950Y CNU2008200840894U CN200820084089U CN201180950Y CN 201180950 Y CN201180950 Y CN 201180950Y CN U2008200840894 U CNU2008200840894 U CN U2008200840894U CN 200820084089 U CN200820084089 U CN 200820084089U CN 201180950 Y CN201180950 Y CN 201180950Y
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- CN
- China
- Prior art keywords
- led
- chip
- source module
- substrate
- base plate
- Prior art date
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Abstract
A lighting diode light source module comprises at least an LED chip, a secondary optical component and a base plate. The LED chip is formed by the frameless packaging of a single crystal grain or a plurality of crystal grains. The base plate is a circuit board. A single LED chip or a plurality of LED chips can be implanted on the base plate; a single LED chip or a plurality of LED chips with mixed color of red, green and blue (RGB) can be also implanted on the base plate; power supply connection points are arranged on the base plate; a copper net and a circuit are implanted in the base plate; more than one LED chip is implanted on the base plate; the circuits among the chips are connected in parallel; the LED chip is a single chip with three crystal grains and the crystal grains are connected in parallel, or the LED is a single chip with six crystal grains and every two crystal grains are connected in series; and the serially connected crystal grain pairs are in parallel connection. The lighting diode light source module has the advantages of simple structure, convenient and reliable use, high lighting efficiency, small volume, light weight, miniaturization, easy assembly, etc.
Description
Technical field
The utility model relates to a kind of light source module that utilizes light emitting diode to carry out electrified light emitting, belong to a kind of semiconductor light-emitting apparatus.
Background technology
The efficient of light emitting diode electrified light emitting is very high, thereby more and more causes the attention of national departments concerned as a kind of energy-saving electric product.It is as a kind of electron emitting structure, mainly by light emitting diode (LED) chip, secondary optics parts and circuit substrate are formed, practical at present led light source, major part be with one or more LED die package in a shallow an official document or note type, have the base plate for packaging of both positive and negative polarity, this substrate adopts heat-conducting aluminium, and the thermal resistance of substrate is about 17-21C.The heat that LED source produced that this structure is formed, be to dispel the heat to all directions in the mode of heat point source, the sectional area of its heat dissipation direction is little, can't reach fast and conduct heat in large area to heat abstractor, as aluminium block or loose type aluminium flake, be easy to be accumulated in led chip inside, cause chip temperature to be higher than its maximum operating temperature, cause light decay or damage; Each encapsulation unit of the light-emitting diode chip for backlight unit of said structure must weld 2 both positive and negative polarity contacts, and its solder joint is many, processed complex, and quality management and control difficulty is big, is difficult for volume production; Described chip must be set about from chip exterior if will form high efficiency and low-risk parallel circuit, causes wiring many, processed complex; Prior art is because base plate line only has simple positive and negative electrode circuit, so do not possess the colorful control ability of RGB (RGB) mixed light simultaneously; On packing forms, have frame, thereby the light that has reduced LED crystal grain appears rate.
Summary of the invention
The purpose of this utility model is to overcome the deficiency of above-mentioned existence; and provide that a kind of luminous efficiency height, volume are frivolous, miniaturization and the LED light-source module of assembling easily; this module is made up of at least one led chip, secondary optics parts and substrate; it is characterized in that described led chip is that single crystal grain or polycrystalline grain become through no frame package group; described substrate is a circuit substrate, and implanting on it has single or a plurality of led chips.
Implant on the described substrate single and a plurality of RGB mixed light led chips are arranged.
Described substrate is provided with power supply contact, has been implanted into copper mesh and circuit at substrate.
Implanting on the described substrate has an above led chip, and each chip chamber circuit is that parallel circuit connects.
Described led chip is the one chip of three crystal grain, and each intergranule is for being connected in parallel; Or be the one chip of six crystal grain, per two crystal grain are series connection, and every pair of intergranule of series connection is for being connected in parallel.
Described substrate length is 140-420mm, and substrate width is 25-50mm, and thickness is 0.6-1.4mm, and the inter-chip pitch on substrate is 35-70mm.
Described secondary optics parts are 60 degree or 90 degree or 120 degree taper reflectors, single or compound lens, or diffusion barrier constitutes.
The utility model compared with prior art, have simple in structure, easy to use and reliable, the luminous efficiency height, volume is frivolous, can realize miniaturization and easy characteristics such as assembling.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is that the A of Fig. 1 is to structural representation.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in detail: shown in the accompanying drawing 1,2, the utility model is made up of at least one led chip 1, secondary optics parts 2 and substrate 3, and described led chip 1 is that single crystal grain or polycrystalline grain constitute through no frame encapsulation; Adopt polycrystalline grain packaged type, can improve the power and the luminous flux of spot light, can lower the scattering ratio of light by medium (air), the power of spot light can reach 1.0-12.0W; Led chip adopts no frame packaged type, and the light that can improve crystal grain appears rate and luminous efficiency.Described substrate 3 is a circuit substrate, and implanting on it has single or a plurality of led chips 1, and the general power scope is 4.0-48.0W; Also implantable on the described substrate have single and a plurality of RGB mixed light led chips, makes the use variation of light source, and the general power scope is 12.0-48.0W.
Described substrate 3 is provided with power supply contact, can be welding and pegs graft, and can have an anti-riot function; Be implanted into copper mesh and circuit at substrate 3, its thin thickness, thermal resistance is low; Described circuit also has antistatic, anti-lightning strike, anti-electromagnetic interference and anti-overheat protector function.
Implanting on the substrate 3 described in the utility model has an above led chip 1, and 1 circuit of each chip is that parallel circuit connects.Described led chip 1 is the one chip of three crystal grain, and each intergranule is for being connected in parallel; Or be the one chip 1 of six crystal grain, per two crystal grain are series connection, and every pair of intergranule of series connection is for being connected in parallel.The advantage of above-mentioned connected mode is: except power supply contact is few, be easy to processing, QC, in a large number produce and the power-efficient height beyond, more help the management and control of failure risk.Each crystal grain fault of the one chip of three crystal grain does not influence the function of other crystal grain; Each crystal grain fault of the one chip of six crystal grain only influences the crystal grain of series connection, and does not influence the function of all the other crystal grain; Each encapsulation unit fault does not influence the function of use of other encapsulation unit.
Described substrate length is 140-420mm, and substrate width is 25-50mm, and thickness is 0.6-1.4mm, and the inter-chip pitch on substrate is 35-70mm.Described substrate is faced face shaping, can be various forms such as rectangle, square, hexagon, circle and ellipse.
Described secondary optics parts are 60 degree or 90 degree or 120 degree taper reflectors, or the reflector of other shape, single or compound lens, or diffusion barrier constitutes.
Substrate described in the utility model is because of using the encapsulation of polycrystalline grain and implanting many encapsulation units, so light source is concentrated, make things convenient for secondary optics to handle, but elasticity is used the minute surface of various optic angles or reflector, Lamp cup lens, light source outer cover lens glass and the diffusion barrier etc. that cloudy surface is handled, to be applicable to the luminous intensity distribution demand of different purposes.The utility model helps the assembling and a large amount of production of lighting, helps quality management and control and assembly cost saving that lighting is produced.
Claims (7)
1, a kind of LED light-source module; this module is made up of at least one led chip, secondary optics parts and substrate; it is characterized in that described led chip is that single crystal grain or polycrystalline grain become through no frame package group; described substrate is a circuit substrate, and implanting on it has single or a plurality of led chips.
2, LED light-source module according to claim 1 is characterized in that implantation has single or a plurality of RGB mixed light led chips on the described substrate.
3, LED light-source module according to claim 1 and 2 is characterized in that described substrate is provided with power supply contact, has been implanted into copper mesh and circuit at substrate.
4, LED light-source module according to claim 3 is characterized in that implantation has an above led chip on the described substrate, and each chip chamber circuit is that parallel circuit connects.
5, LED light-source module according to claim 4 is characterized in that described led chip is the one chip of three crystal grain, and each intergranule is for being connected in parallel; Or be the one chip of six crystal grain, per two crystal grain are series connection, and every pair of intergranule of series connection is for being connected in parallel.
6, LED light-source module according to claim 4 is characterized in that described substrate length is 140-420mm, and substrate width is 25-50mm, and thickness is 0.6-1.4mm, and the inter-chip pitch on substrate is 35-70mm.
7, LED light-source module according to claim 1, the secondary optics parts under it is characterized in that are 60 degree or 90 degree or 120 degree taper reflectors, single or compound lens, or diffusion barrier constitutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200840894U CN201180950Y (en) | 2008-03-14 | 2008-03-14 | Light source module of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200840894U CN201180950Y (en) | 2008-03-14 | 2008-03-14 | Light source module of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201180950Y true CN201180950Y (en) | 2009-01-14 |
Family
ID=40250451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200840894U Expired - Fee Related CN201180950Y (en) | 2008-03-14 | 2008-03-14 | Light source module of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201180950Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101963315A (en) * | 2010-10-14 | 2011-02-02 | 友达光电股份有限公司 | Light source module and liquid crystal display |
-
2008
- 2008-03-14 CN CNU2008200840894U patent/CN201180950Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101963315A (en) * | 2010-10-14 | 2011-02-02 | 友达光电股份有限公司 | Light source module and liquid crystal display |
| CN101963315B (en) * | 2010-10-14 | 2016-01-20 | 友达光电股份有限公司 | Light source module and liquid crystal display |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 Termination date: 20140314 |