CN201178095Y - Surface adhesive type radiating construction of LED - Google Patents
Surface adhesive type radiating construction of LED Download PDFInfo
- Publication number
- CN201178095Y CN201178095Y CNU2008200067270U CN200820006727U CN201178095Y CN 201178095 Y CN201178095 Y CN 201178095Y CN U2008200067270 U CNU2008200067270 U CN U2008200067270U CN 200820006727 U CN200820006727 U CN 200820006727U CN 201178095 Y CN201178095 Y CN 201178095Y
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- copper foil
- heat
- layer
- circuit board
- mounting led
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Abstract
The utility model relates to a surface adhesion type light emitting diode (LED) heat dissipation structure for conducting and dissipating the heat energy generated from a surface adhesion type LED arranged on a circuit board. The circuit board comprises a base material layer, and a first circuit copper foil layer and a second circuit copper foil layer that are arranged on the base material layer, a metal pin of the surface adhesion type LED is soldered on the first circuit copper foil layer via a tin solder, at least a heat-conducting copper foil through-hole is arranged on the circuit board, and a heat dissipation element with a heat-conducting plate is combined on the second circuit copper foil layer via a bonding layer. The heat energy generated from the surface adhesion type LED is conducted to the heat-conducting plate via the metal pin, the tin solder, the first circuit copper foil layer, the heat-conducting copper foil through-hole, the second circuit copper foil layer and the bonding layer, and then dissipated by the heat dissipation element.
Description
Technical field
The utility model is the design about a kind of heat abstractor of light-emitting diode, particularly about a kind of radiator structure of surface-mounting LED.
Background technology
Press, modal light source includes traditional osram lamp, quartz bulb, fluorescent bulb and mercury vapor lamp or the like in the daily life, and light-emitting diode (LED) because have that power consumption is low, life-span length, high power, volume are little, environmental protection and chemiluminescence or the like characteristic, so except that often being applied to various information electronic devices or display unit, now replacing traditional osram lamp etc. gradually and become the light source body of many electric appliance components, electrical home appliances.
But now with light-emitting diode as illuminating light fixture, because of the problem of conversion efficiency, light-emitting diode all can produce high heat during use, the Gao Reyi that continues causes damage to the electronic building brick in the light fixture, so there are many radiating modes to be developed out.Radiating mode commonly used is as on the electronic building brick that heat sink material is covered on heating or utilize fan to strengthen the convection current of air so that heat dissipation.For example in the novel patent of TaiWan, China M321141 patent, disclose a kind of high-powered LED lamp radiator structure, mainly be combined with a plurality of high-power LED lamps, wherein in circuit control device; Lampshade has the hollow tank, be provided with by a plurality of fresh air inlets in the lampshade periphery, can be combined with circuit control device and fan in this hollow tank, the space that is positioned at hollow tank rear can be for being provided with fan, the lampshade rear is for being provided with back shroud, and this back shroud is provided with a plurality of air outlets; By the start of fan, can cold air be brought into circuit control device and the cooling of LED lamp via fresh air inlet by the fresh air inlet of lampshade periphery, hot-air is taken out of, to reach the purpose of circulation heat radiation by the air outlet of back shroud.
Yet therefore most complex structure of known various heat abstractors and assembling inconvenience waste many manufacturing costs, technology and man-hour in rain.
The utility model content
The purpose of this utility model is to provide a kind of radiator structure of surface-mounting LED, saves cost and ease of assembly with simple structural design.
For achieving the above object, the radiator structure of the surface-mounting LED that the utility model provides, be arranged at the heat energy that surface-mounting LED produced of a circuit board in order to conduction and dissipation, this circuit board includes the first circuit copper foil layer and the second circuit copper foil layer that a substrate layer, is arranged on this substrate layer, and wherein the metal pin of this surface-mounting LED is to be welded on this first circuit copper foil layer with scolding tin; This circuit board offers at least one heat conduction Copper Foil cover through hole, and in this heat conduction Copper Foil cover through hole, has the Copper Foil cover, one heat sink with a heat-conducting plate is incorporated into this second circuit copper foil layer via a cementing layer, this cementing layer is as the second circuit copper foil layer of this circuit board and heat conduction and the insulation material layer between this heat sink, the heat energy that this surface-mounting LED produced is via the metal pin of this surface-mounting LED, scolding tin, the first circuit copper foil layer, the Copper Foil cover of this heat conduction Copper Foil cover through hole, the second circuit copper foil layer, cementing layer conducts to the heat-conducting plate of this heat sink, by this heat sink dissipation.
The radiator structure of described surface-mounting LED, wherein this heat sink also includes at least one heat radiation fin keel.
The radiator structure of described surface-mounting LED, wherein this circuit board is soft circuit board.
The radiator structure of described surface-mounting LED, wherein this circuit board is the hard circuit board.
The radiator structure of described surface-mounting LED, wherein this heat sink is the metal shell of electronic installation.
The utility model also provides a kind of radiator structure of surface-mounting LED, be arranged at the heat energy that surface-mounting LED produced of a circuit board in order to conduction and dissipation, this circuit board includes the circuit copper foil layer that a substrate layer, is arranged on this substrate layer, and wherein the metal pin of this surface-mounting LED is welded on this circuit copper foil layer with scolding tin; One heat sink with a heat-conducting plate is incorporated into this circuit copper foil layer via a cementing layer, this cementing layer is as the circuit copper foil layer of this circuit board and heat conduction and the insulation material layer between this heat sink, the heat energy that this surface-mounting LED produced conducts to the heat-conducting plate of this heat sink via metal pin, scolding tin, circuit copper foil layer, the cementing layer of this surface-mounting LED, by this heat sink dissipation.
The radiator structure of described surface-mounting LED, wherein this heat sink also includes at least one heat radiation fin keel.
The radiator structure of described surface-mounting LED, wherein this circuit board is soft circuit board.
The radiator structure of described surface-mounting LED, wherein this circuit board is the hard circuit board.
The radiator structure of described surface-mounting LED, wherein this heat sink is the metal shell of electronic installation.
The utility model contrast effect that known technology had:
Via the technological means that the utility model adopted, the purpose that only needs the first circuit copper foil layer laid by a cementing layer, a heat sink, at circuit board and second circuit copper foil layer and can reach LED heat radiating at least one heat conduction Copper Foil cover through hole that circuit board is offered, not only be convenient to assemble and save time, and can save manufacturing cost, technology and man-hour.
Description of drawings
Fig. 1 is the cross-sectional schematic of first embodiment of the radiator structure of the utility model surface-mounting LED;
Fig. 2 is the enlarged diagram at A position among Fig. 1;
Fig. 3 is the cross-sectional schematic of second embodiment of the radiator structure of the utility model surface-mounting LED;
Fig. 4 is the cross-sectional schematic of the 3rd embodiment of the radiator structure of the utility model surface-mounting LED;
Fig. 5 is the cross-sectional schematic of the 4th embodiment of the radiator structure of the utility model surface-mounting LED;
Fig. 6 is the schematic perspective view of the 5th embodiment of the radiator structure of the utility model surface-mounting LED;
Fig. 7 is the cross-sectional schematic of the 6th embodiment of the radiator structure of the utility model surface-mounting LED;
Fig. 8 is the cross-sectional schematic of the 7th embodiment of the radiator structure of the utility model surface-mounting LED.
Primary clustering symbol description in the accompanying drawing:
1, the radiator structure of 1a, 1b, 1c, 1d, 1e, 1f surface-mounting LED
11,11a, 11b, 11c cementing layer
12,12a, 12b, 12c, 12d, 12e, 12f heat sink
121,121a, 121c heat-conducting plate
122,122a, 122c, 122d, the 122e fin keel that dispels the heat
123 perforates
2,2a, 2b, 2c circuit board
21,21b substrate layer
22, the 22b first circuit copper foil layer
22 ' circuit copper foil layer
221 insulating spaces
23,23b second circuit copper foil layer
231 insulating spaces
24, the anti-welding insulating varnish of 24b
25, the anti-welding insulating varnish of 25b
26 heat conduction Copper Foils cover through hole
261 Copper Foil covers
3 surface-mounting LEDs
31 metal pins
4 scolding tin
Embodiment
The utility model is for solving the technological means that problem adopted of known technology, provide a kind of radiator structure of surface-mounting LED, be arranged at the heat energy that surface-mounting LED produced of a circuit board in order to conduction and dissipation, circuit board includes a substrate layer, one is arranged on the first circuit copper foil layer and the second circuit copper foil layer of substrate layer, wherein the metal pin of surface-mounting LED is to be welded on the first circuit copper foil layer with scolding tin, circuit board offers at least one heat conduction Copper Foil cover through hole, and in heat conduction Copper Foil cover through hole, has the Copper Foil cover, one heat sink with a heat-conducting plate is incorporated into the second circuit copper foil layer via a cementing layer, cementing layer is as the second circuit copper foil layer of circuit board and heat conduction and the insulation material layer between heat sink, the heat energy that surface-mounting LED produced is via the metal pin of surface-mounting LED, scolding tin, the first circuit copper foil layer, the Copper Foil cover of heat conduction Copper Foil cover through hole, the second circuit copper foil layer, cementing layer conducts to the heat-conducting plate of heat sink, by heat sink dissipation.
The specific embodiment that the utility model adopted will and attachedly be graphic and be further described by following embodiment.
Consult illustrated in figures 1 and 2ly, it shows that the radiator structure 1 of first embodiment the utility model surface-mounting LED of the radiator structure of the utility model surface-mounting LED is to be arranged at the heat energy that the plural surface adhering type LED 3 of a circuit board 2 is produced in order to conduction and dissipation.
The radiator structure 1 of surface-mounting LED is to offer a plurality of heat conduction Copper Foil cover through holes 26 at circuit board 2, and in heat conduction Copper Foil cover through hole 26, has Copper Foil cover 261, the Copper Foil cover of heat conduction Copper Foil cover through hole 26 is connected in the first circuit copper foil layer 22 and second circuit copper foil layer 23, one heat sink 12 with a heat-conducting plate 121 via a cementing layer 11 be incorporated into second circuit copper foil layer 23 (because of anti-welding insulating varnish 25 as thin as a wafer), and cementing layer 11 is as the heat conduction and the insulation material layer of 12 of the second circuit copper foil layer 23 of circuit board 2 and heat sinks, the mode of its combination can be heat fused, gluing closes, ultrasonic waves fusion or with mechanical packing method in conjunction with (as using screw, rivet or anchor clamps etc.), cementing layer 11 can be silicon cream, silica gel or silica gel sheet, it glues together the function of being close to and insulating except having, and good heat-conducting effect is also arranged.One surface of the heat-conducting plate 121 of heat sink 12 is protruded and is formed with a plurality of heat radiation fin keels 122, and to increase radiating efficiency, heat sink 12 can be made by the good metal of thermal conductivity.
When surface-mounting LED 3 electrified light emittings, the heat energy that surface-mounting LED 3 is produced conducts to heat-conducting plate 121 via Copper Foil cover 261, second circuit copper foil layer 23, the cementing layer 11 of the metal pin 31 of surface-mounting LED 3, scolding tin 4, the first circuit copper foil layer 22, heat conduction Copper Foil cover through hole 26, conduct to heat radiation fin keel 122 again, by heat sink 12 dissipations.Therefore, second circuit copper foil layer 23 has a predetermined area, and this predetermined area is the bigger the better, and the number of the heat conduction Copper Foil of being offered at circuit board 2 cover through hole 26 is The more the better, in order to the conduction of heat energy.
Consult shown in Figure 3ly, it shows the cross-sectional schematic of second embodiment of the radiator structure of the utility model surface-mounting LED.The structural design of the radiator structure 1a of the utility model surface-mounting LED and aforesaid first embodiment are roughly the same, so identical member indicates with identical assembly numbering, as a means of correspondence.Its difference is that the circuit board 2a among second embodiment only includes substrate layer 21, circuit copper foil layer 22 ' and anti-welding insulating varnish 24, and a heat sink 12a via a cementing layer 11a be incorporated into circuit board 2a circuit copper foil layer 22 ' (because of anti-welding insulating varnish 24 as thin as a wafer), and heat sink 12a offers two perforates 123, the position of perforate 123 is just corresponding to surface-mounting LED 3, so that the heat-conducting plate 121a of heat sink 12a can be close to the circuit copper foil layer 22 ' of circuit board 2a via cementing layer 11a gummed, cementing layer 11a is as the circuit copper foil layer 22 ' of circuit board 2a and heat conduction and the insulation material layer between heat sink 12a.The heat energy that surface-mounting LED 3 is produced conducts to heat-conducting plate 121a via metal pin 31, scolding tin 4, circuit copper foil layer 22 ', the cementing layer 11a of surface-mounting LED 3, conducts to heat radiation fin keel 122a again, by heat sink 12a dissipation.
And the height of the heat radiation fin keel 122a of heat sink 12a is no more than the end face (light-emitting area) of surface-mounting LED 3, in order to avoid cover the light that surface-mounting LED 3 is sent.And circuit copper foil layer 22 ' has a predetermined area, and this predetermined area is the bigger the better, in order to the conduction of heat energy.
Consult shown in Figure 4ly, it shows the cross-sectional schematic of the 3rd embodiment of the radiator structure of the utility model surface-mounting LED.The structural design of the radiator structure 1b of the utility model surface-mounting LED and aforesaid first embodiment are roughly the same, so identical member indicates with identical assembly numbering, as a means of correspondence.Its difference is to be incorporated into via cementing layer 11 the second circuit copper foil layer 23 of circuit board 2 except heat sink 12, also has heat sink 12a to be incorporated into the first circuit copper foil layer 22 of circuit board 2 via cementing layer 11a, to increase radiating effect.
Consult shown in Figure 5ly, it shows the cross-sectional schematic of the 4th embodiment of the radiator structure of the utility model surface-mounting LED.Heat sink 12c among the radiator structure 1c of the utility model surface-mounting LED is hollow tubular and made by metal material, includes a heat-conducting plate 121c and a plurality of heat radiation fin keel 122c.One soft circuit board 2b is close to the outer ring surface of heat sink 12c via cementing layer 11c gummed.Circuit board 2b comprises a substrate layer 21b, one first circuit copper foil layer 22b, one second circuit copper foil layer 23b, an one anti-welding insulating varnish 24b and an anti-welding insulating varnish 25b, and offer a plurality of heat conduction Copper Foil cover through holes 26 equally, each heat conduction Copper Foil cover through hole 26 has Copper Foil cover (not shown) respectively, the first circuit copper foil layer 22b leaves an insulating space 221 equally respectively between the metal pin 31 of each surface-mounting LED 3, second circuit copper foil layer 23b leaves an insulating space 231 equally respectively between the correspondence position of the metal pin 31 of each surface-mounting LED 3.
The heat energy that surface-mounting LED 3 produced conducts to Copper Foil cover, second circuit copper foil layer 23b, cementing layer 11c and the heat sink 12c of scolding tin 4, the first circuit copper foil layer 22b, heat conduction Copper Foil cover through hole 26 in regular turn via its metal pin 31 and dissipates in the air.
Consult shown in Figure 6ly, it is the schematic perspective view of the 5th embodiment that shows the radiator structure of the utility model surface-mounting LED.As shown in the figure, the radiator structure 1d of the utility model surface-mounting LED is included in a plurality of heat conduction Copper Foil cover through hole (not shown) that circuit board 2c is offered, the two-tier circuit copper foil layer (not shown) of being laid at circuit board 2c, one cementing layer (not shown), an and heat sink 12d, heat sink 12d is the concave mirror in the general lighting light fixture, be made by metal material, and circuit board 2c is similarly soft circuit board, so can cooperate the shape of heat sink 12d to fit via cementing layer is arranged on the heat sink 12d (concave mirror), in present embodiment, the outer surface of heat sink 12d (concave mirror) protrudes and is formed with a plurality of heat radiation fin keel 122d, to increase radiating effect; Perhaps, the radiating effect of being reached as heat sink 12d (concave mirror) itself has been enough when (or the radiating effect of reaching in conjunction with other metal shell as heat sink 12d is enough), and then the outer surface of heat sink 12d (concave mirror) can not need protrude and forms heat radiation fin keel 122d.
Consult shown in Figure 7ly, it is the cross-sectional schematic of the 6th embodiment of the radiator structure of the utility model surface-mounting LED.The structural design of the radiator structure 1e of the utility model surface-mounting LED and aforesaid first embodiment are roughly the same, so identical member indicates with identical assembly numbering, as a means of correspondence.Its difference is that the heat sink 12e among the 6th embodiment is the metal shell of an electronic installation (for example desk lamp, car light, flashlight etc.), the circuit board 2 that also is about among Fig. 1 is arranged at heat sink 12e (metal shell of electronic installation) via cementing layer 11 applyings, so that the heat energy that surface-mounting LED 3 is produced dissipates in the air via heat sink 12e (metal shell of electronic installation), and in present embodiment, the bottom surface of heat sink 12e (metal shell) is protruded and is formed with a plurality of heat radiation fin keel 122e, to increase radiating effect.
Consult shown in Figure 8ly, be the cross-sectional schematic of the 7th embodiment of the radiator structure of the utility model surface-mounting LED.The structural design of the radiator structure 1f of the utility model surface-mounting LED and aforesaid the 6th embodiment are roughly the same, so identical member indicates with identical assembly numbering, as a means of correspondence.Its difference is that the bottom surface of heat sink 12f of the radiator structure 1f of surface-mounting LED there is no to protrude and forms the heat radiation fin keel that this is because the radiating effect that heat sink 12f (metal shell) itself is reached is enough.
Those skilled in the art all can learn easily, heat sink in the utility model can be various electronic installations (as desk lamp, car light, flashlight, or display etc.) metal shell, and circuit board 2,2b, 2c is flexible soft circuit board, be arranged on the heat sink of different shape so can fit, for example foregoing circuit plate 2b can fit via cementing layer 11c and be arranged at the heat sink 12c of hollow tubular, certainly also can fit and be arranged at other and be square, triangle, polygon, on the metal heat sink of taper or the like, so can make the surface-mounting LED of the metal shell that is applied to various electronic installations that good hot channel is arranged, and prolong the useful life of electronic installation.In addition, in the time need too much passive component being set on the circuit board, also can use multilayer circuit board, promptly be laid with circuit copper foil layer more than two-layer in circuit board system; Maybe can use the heap layer circuit board, also be about to the circuit board combination more than two.
Only, above narration only is preferred embodiment explanation of the present utility model, and those skilled in the art work as can do other all improvement according to above-mentioned explanation, in the scope that these changes of thought still belong to creation spirit and claim of the present utility model to be defined.
Claims (10)
1, a kind of radiator structure of surface-mounting LED, be arranged at the heat energy that surface-mounting LED produced of a circuit board in order to conduction and dissipation, this circuit board includes a substrate layer, one is arranged on the first circuit copper foil layer and the second circuit copper foil layer of this substrate layer, wherein the metal pin of this surface-mounting LED is welded on this first circuit copper foil layer, it is characterized in that: this circuit board offers at least one heat conduction Copper Foil cover through hole, and in this heat conduction Copper Foil cover through hole, has the Copper Foil cover, one heat sink with a heat-conducting plate is incorporated into this second circuit copper foil layer via a cementing layer, this cementing layer is as the second circuit copper foil layer of this circuit board and heat conduction and the insulation material layer between this heat sink, the heat energy that this surface-mounting LED produced is via the metal pin of this surface-mounting LED, scolding tin, the first circuit copper foil layer, the Copper Foil cover of this heat conduction Copper Foil cover through hole, the second circuit copper foil layer, cementing layer conducts to the heat-conducting plate of this heat sink, by this heat sink dissipation.
2, the radiator structure of surface-mounting LED as claimed in claim 1 is characterized in that: wherein this heat sink includes at least one heat radiation fin keel.
3, the radiator structure of surface-mounting LED as claimed in claim 1 is characterized in that: wherein this circuit board is soft circuit board.
4, the radiator structure of surface-mounting LED as claimed in claim 1 is characterized in that: wherein this circuit board is the hard circuit board.
5, the radiator structure of surface-mounting LED as claimed in claim 1 is characterized in that: wherein this heat sink is the metal shell of electronic installation.
6, a kind of radiator structure of surface-mounting LED, be arranged at the heat energy that surface-mounting LED produced of a circuit board in order to conduction and dissipation, this circuit board includes a substrate layer, one is arranged on the circuit copper foil layer of this substrate layer, wherein the metal pin of this surface-mounting LED is welded on this circuit copper foil layer, it is characterized in that: a heat sink with a heat-conducting plate is incorporated into this circuit copper foil layer via a cementing layer, this cementing layer is as the circuit copper foil layer of this circuit board and heat conduction and the insulation material layer between this heat sink, the heat energy that this surface-mounting LED produced is via the metal pin of this surface-mounting LED, scolding tin, the circuit copper foil layer, cementing layer conducts to the heat-conducting plate of this heat sink, by this heat sink dissipation.
7, the radiator structure of surface-mounting LED as claimed in claim 6 is characterized in that: wherein this heat sink includes at least one heat radiation fin keel.
8, the radiator structure of surface-mounting LED as claimed in claim 6 is characterized in that: wherein this circuit board is soft circuit board.
9, the radiator structure of surface-mounting LED as claimed in claim 6 is characterized in that: wherein this circuit board is the hard circuit board.
10, the radiator structure of surface-mounting LED as claimed in claim 6 is characterized in that: wherein this heat sink is the metal shell of electronic installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200067270U CN201178095Y (en) | 2008-02-18 | 2008-02-18 | Surface adhesive type radiating construction of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200067270U CN201178095Y (en) | 2008-02-18 | 2008-02-18 | Surface adhesive type radiating construction of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201178095Y true CN201178095Y (en) | 2009-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200067270U Expired - Fee Related CN201178095Y (en) | 2008-02-18 | 2008-02-18 | Surface adhesive type radiating construction of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201178095Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814574A (en) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | Light emitting diode base plate heat radiation structure and manufacture method thereof |
| WO2012162863A1 (en) * | 2011-06-03 | 2012-12-06 | 新高电子材料（中山）有限公司 | Highly-efficient heat radiating led lamp and method for manufacturing same |
| CN103176309A (en) * | 2011-12-26 | 2013-06-26 | 康佳集团股份有限公司 | Liquid crystal module using high-power light-emitting diode (LED) lamps |
| CN108306442A (en) * | 2017-12-12 | 2018-07-20 | 安徽德科电气科技有限公司 | A kind of system's high-voltage generator peculiar to vessel |
| CN113289873A (en) * | 2021-05-12 | 2021-08-24 | 和能人居科技(天津)集团股份有限公司 | Cooling mechanism for curing machine, curing machine and curing production line |
| CN117156662A (en) * | 2023-11-01 | 2023-12-01 | 北京睿塔智能科技有限公司 | Metal substrate, preparation method and heat dissipation circuit board |
-
2008
- 2008-02-18 CN CNU2008200067270U patent/CN201178095Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814574A (en) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | Light emitting diode base plate heat radiation structure and manufacture method thereof |
| WO2012162863A1 (en) * | 2011-06-03 | 2012-12-06 | 新高电子材料（中山）有限公司 | Highly-efficient heat radiating led lamp and method for manufacturing same |
| CN103176309A (en) * | 2011-12-26 | 2013-06-26 | 康佳集团股份有限公司 | Liquid crystal module using high-power light-emitting diode (LED) lamps |
| CN108306442A (en) * | 2017-12-12 | 2018-07-20 | 安徽德科电气科技有限公司 | A kind of system's high-voltage generator peculiar to vessel |
| CN113289873A (en) * | 2021-05-12 | 2021-08-24 | 和能人居科技(天津)集团股份有限公司 | Cooling mechanism for curing machine, curing machine and curing production line |
| CN117156662A (en) * | 2023-11-01 | 2023-12-01 | 北京睿塔智能科技有限公司 | Metal substrate, preparation method and heat dissipation circuit board |
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Effective date of registration: 20100629 Address after: The United States Delaware Patentee after: Gce Clean Energy Technology LLC. U.S.A. Address before: P.O. Box 1511, walnut 91784, California, USA Co-patentee before: Chen Shoushan Patentee before: Yang Liangzhi |
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Owner name: AA WIND + SOLAR ENERGY DEVELOPMENT GROUP LLC Free format text: FORMER OWNER: GCE CLEAN ENERGY TECHNOLOGY LLC Effective date: 20121113 |
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