CN201159867Y - Extension type internal memory guard sheet - Google Patents
Extension type internal memory guard sheet Download PDFInfo
- Publication number
- CN201159867Y CN201159867Y CNU2007201875684U CN200720187568U CN201159867Y CN 201159867 Y CN201159867 Y CN 201159867Y CN U2007201875684 U CNU2007201875684 U CN U2007201875684U CN 200720187568 U CN200720187568 U CN 200720187568U CN 201159867 Y CN201159867 Y CN 201159867Y
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- CN
- China
- Prior art keywords
- bluff piece
- internal memory
- radiating module
- type internal
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Disclosed is an expandable memory guard strip, which is composed of a first guard strip, a second guard strip and a thermal module, an expansion slot formed on the first guard strip and a lug relative to the expansion slot and formed on the thermal module are utilized to assemble the thermal module and the first guard strip into one body mutually, when in use, the first guard strip and the second guard strip are clamped on two faces of the memory, then the high-efficiency heat dissipation effect of the thermal module can be utilized to rapidly dissipate the heat produced by the memory.
Description
Technical field
The utility model relates to a kind of internal memory bluff piece in order to the protection memory chip, especially, relates to a kind of expansible type internal memory bluff piece.
Background technology
Along with the computer operating frequency is more and more faster; except central processing unit; related other spare part of inside that makes; as: internal memory; the speed of display card and hard disk all speeds relatively; the heat that it produced is also more and more higher; with regard to internal memory; because the space of plant internal memory is come narrowly than general spare part; and memory chip presents exposed state usually; cause damage easily when dismounting, radiating effect is not good yet, thereby at the internal memory bluff piece that has occurred on the market utilizing the good metal material of heat-conducting effect to be made into; it is attached at the memory chip surface, can increase protectiveness and radiating effect.
Fig. 1 is the organigram of prior art heat radiation bluff piece, as shown in FIG., its heat radiation bluff piece is by a plurality of anchor clamps 10, two heat radiation bluff pieces 20 are located in the two sides of an internal memory 30, and to coat the main pyrotoxin-chip 301 of internal memory 30, heat radiation bluff piece 20 is to make with transcalent metal material, lead the heat that mode is produced internal memory 30 chips 301 and utilize to conduct heat, conduct to the bigger heat radiation bluff piece 20 of area, and utilize the advantage of area of dissipation increasing, disperse the heat of chip 301 fast; But this radiating mode can be subject to the space of 30 of adjacent two internal memories, when heat evenly is transmitted to heat radiation bluff piece 20 surfaces, might form focus because radiating airflow is not flowed through, so can't smoothly heat be dispersed.
Summary of the invention
Because the radiating efficiency of prior art heat radiation bluff piece is not good, the utility model people is by studying intensively, and long-pending individual is engaged in fansink designs experience for many years, and designs a kind of brand-new expansion type internal memory bluff piece.
Fundamental purpose of the present utility model aims to provide a kind of expansion type internal memory bluff piece, can combine with various radiating modules fast, and take into account protectiveness and thermal diffusivity.
For reaching above-mentioned purpose; expansion type internal memory bluff piece of the present utility model; mainly be by one first bluff piece; one second bluff piece and a radiating module are formed; its first bluff piece, one ora terminalis is to form an expansion slot; and radiating module forms a projection; projection can be inserted in the expansion slot and also be locked; the radiating module and first bluff piece are combined into one fast; when its expansion type internal memory bluff piece uses; be that first bluff piece and second bluff piece are located in an internal memory two sides respectively; utilize the solid mode of spiral shell again; first bluff piece and second bluff piece firmly are located on the internal memory; by the specially designed integrated structure of the utility model; must with as: water-cooled; radiating modules such as air-cooled type or heat radiation tubular type carry out combination and expand; and then utilize the high-effect radiating effect of radiating module; the heat that disperses memory chip rapidly and produced; it is quite convenient when its bluff piece removes and installs; and can effectively promote its protectiveness; and can be by integrated structure mutual between bluff piece and radiating module; and expand various difference in functionality modules by the user; especially be example with water-cooled or thermal conductance tubular type radiating module, then can significantly promote radiating effect of the present utility model.
Description of drawings
Below in conjunction with accompanying drawing the utility model content is described further, in the accompanying drawing:
Fig. 1 is the organigram of prior art heat radiation bluff piece;
Fig. 2 is the stereo appearance figure of the utility model preferred embodiment;
Fig. 3 is the three-dimensional exploded view of the utility model preferred embodiment;
Fig. 4 is the assembled sectional view of the utility model preferred embodiment;
Fig. 5 is the stereo appearance figure of another preferred embodiment of the utility model;
Fig. 6 is the utility model stereo appearance figure of a preferred embodiment again.
Description of reference numerals: 10-anchor clamps; The 20-bluff piece that dispels the heat; The 30-internal memory; The 301-chip; The 40-internal memory; The 401-button hole; The 50-motherboard; The 501-memory bank; The 502-fastener; 60-expansion type internal memory heat radiation bluff piece; 601-first bluff piece; The 6011-expansion slot; The 6012-fixed part; The 6013-fixed orifice; 602-second bluff piece; 6021-relative fixed portion; The 6022-fixed screw; The 603-radiating module; The 6031-projection; 60311-relative fixed hole; The 6032-water channel; The 60321-water intake end; The 60322-water side; The 6033-pumping; The 6034-tank; The 6035-fixed screw; The 6036-radiating fin; The 6037-radiator shutter; The 6038-heat pipe.
Embodiment
Fig. 2 is the stereo appearance figure of the utility model preferred embodiment, as shown in FIG., when internal memory 40 uses usually, be to be fixed in the memory bank 501 (Socket) of a motherboard 50 (Mainboard) in the plant mode, and memory bank 501 mostly is design side by side greatly, and memory bank 501 two ends are respectively equipped with a fastener 502, be used for buckling the button hole 401 on the internal memory 40, with the position of fixed memory 40 in memory bank 501, and expansion type internal memory bluff piece 60 of the present utility model, it mainly comprises one first bluff piece 601, one second bluff piece 602 and a radiating module 603, when it uses, at first, first bluff piece 601 is assembled into one mutually with radiating module 603, then, the mode that second bluff piece 602 is established with folder again, be divided into the two sides of internal memory 40, utilizing fixed screw that first bluff piece 601 and second bluff piece 602 are incorporated on the internal memory 40, after internal memory 40 is inserted in memory bank 501, the radiating module 603 that utilization is positioned at first bluff piece, 601 tops quickens heat radiation, and its radiating module 603 can be general common water-cooled, air-cooled type and thermal conductance tubular type, present embodiment is to be example with the water-cooled radiating module, again, first bluff piece 601 and second bluff piece 602, be to make with coefficient of heat conductivity good metal material, therefore, the heat that internal memory 40 is produced, can see through first bluff piece 601 and second bluff piece 602, conduct on the radiating module 603, because water-cooled radiating module 603 has good heat dissipation characteristics, the heat that can rapidly internal memory 40 be produced disperses; And, owing to the plant Fixed Design of the utility model expansion type internal memory bluff piece 60, can simplify the assembly working of 601 of the radiating module 603 and first bluff pieces, for the user, it can have more functional and economy with the individual demand dissimilar radiating module 603 that changes the outfit fast.
Fig. 3 is the three-dimensional exploded view of the utility model preferred embodiment, as shown in FIG., aforementioned expansion type internal memory bluff piece 60 mainly comprises: one first bluff piece 601, it is that upper limb at first bluff piece 601 forms an expansion slot 6011, and the side of first bluff piece 601 is the plurality of fixed portions 6012 that form, in the outside of first bluff piece, be to form plurality of fixed hole 6013 with respect to expansion slot 6011 again; One second bluff piece 602, it is to be used for being assembled in first bluff piece, 601 1 sides, and second bluff piece, 602 correspondences form a plurality of relative fixed portion 6021, by plurality of fixed screw 6022, fixed part 6012 can be assembled mutually with relative fixed portion 6021, so that first bluff piece 601 and second bluff piece 602 form the state that is located in aforementioned internal memory 40 two sides; An and water-cooled radiating module 603, it utilizes a projection 6031 of bottom surface institute moulding to be assembled on first bluff piece 601, and be to form a water channel 6032 on the water-cooled radiating module 603, and water channel 6032 two ends form a water intake end 60321 and a water side 60322 respectively, and with the water intake end 60321 and the water side 60322 of water channel 6032, be connected to a pumping 6033 and a tank 6034 respectively, after heat conducts to water-cooled radiating module 603 by first bluff piece 601 and second bluff piece 602, can utilize pumping 6033 water that specific heat is high, force to charge in the water channel 6032 by water intake end 60321, therefore, its heat can be absorbed by the higher water of specific heat, send back in the tank 6034 by water side 60322 again and dispel the heat, to reach the purpose that increases radiating efficiency, can be combined into one fast with the expansion slot 6011 of first bluff piece 601 by its projection 6031, its dismounting is all quite convenient, again, on the position of its projection 6031 with respect to the fixed orifice 6013 of expansion slot 6011, be to form a plurality of relative fixed hole 60311, and can utilize several fixed screws 6035 fixedly radiating module 603 on first bluff piece 601.
Fig. 4 is the assembled sectional view of the utility model preferred embodiment, as shown in Figure 4, when its radiating module 603 is assembled on first bluff piece 601, be that projection 6031 by radiating module 603 is inserted in the expansion slot 6011 of first bluff piece 601, so that the fixed orifice 6013 of first bluff piece 601 aligns with the relative fixed hole 60311 on the projection 6031, locked by fixed screw 6035 again, radiating module 603 closely is fixed on first bluff piece 601, and first bluff piece 601 and second bluff piece 602, the fixed part 6012 that then utilizes fixed screw 6022 to wear to fix first bluff piece 601 and the relative fixed portion 6021 of second bluff piece 602, and be folded in two of internal memory 40.
Fig. 5 is the stereo appearance figure of another preferred embodiment of the utility model, as shown in FIG., for effectively increasing its radiating effect, and reduction manufacturing cost, the expansion slot 6011 of aforementioned first bluff piece, 601 upper limbs institute moulding, can be used to assemble an air-cooled type radiating module 603, its radiating module 603 bottom surfaces are to form a projection 6031, and radiating module 603 end faces are to form a radiating fin 6036, so that aforementioned internal memory 40 heatings are conducted to radiating fin 6036, by radiating fin 6036 area of dissipation is strengthened, and increase the efficient of heat radiation.
Fig. 6 is the utility model stereo appearance figure of a preferred embodiment again, as shown in FIG., for increasing the radiating effect of aforementioned expansion type internal memory bluff piece 60, can assemble the radiating module 603 of a thermal conductance tubular type, it is to be assembled on first bluff piece 601, in radiating module 603 bottom surfaces is to form a projection, radiating module 603 end faces then are assembled with a plurality of radiator shutters 6037 and a heat pipe 6038, its radiator shutter 6037 is equidistantly to be arranged on the heat pipe 6038, the heat that utilizes heat pipe 6038 that first bluff piece 601 is conducted, conduct to rapidly on the radiator shutter 6037, so that heat is dispersed rapidly, equally also can utilize projection 6031, be combined into one fast with the expansion slot 6011 of first bluff piece 601.
As mentioned above, when the utility model is implemented, at first, be to utilize the projection of radiating module both to be carried out quick the combination with the expansion slot of first bluff piece, then, again first bluff piece and second bluff piece are located in the two sides of an internal memory respectively, thereby a kind of expansion type internal memory bluff piece is provided, and reach easy accessibility, and can effectively increase the purpose of radiating effect.
Being noted that the above only is preferred embodiment of the present utility model, is not in order to limit the scope that the utility model is implemented; Any those skilled in the art not breaking away from equivalent variations and the modification of being done under spirit of the present utility model and the scope, all should be covered by in the claim of the present utility model.
Claims (7)
1. an expansion type internal memory bluff piece in order to be assembled in the two sides of an internal memory, can have the effect of protection and heat radiation concurrently, it is characterized in that described expansion type internal memory bluff piece comprises:
One first bluff piece, it forms an expansion slot and plurality of fixed portion, and the outside of the described relatively expansion slot of described first bluff piece forms the plurality of fixed hole;
One second bluff piece, be assembled in described first bluff piece, one side, the described second bluff piece correspondence forms a plurality of relative fixed portion, be by the plurality of fixed screw, described fixed part and described relative fixed portion are assembled mutually, so that described first bluff piece and described second bluff piece are located in described internal memory two sides; And
One radiating module is assembled on described first bluff piece, forms a projection on the described radiating module, on the described projection and form a plurality of relative fixed hole, by the plurality of fixed screw, the described projection that is inserted in described expansion slot is fixed.
2. expansion type internal memory bluff piece according to claim 1 is characterized in that described radiating module is to be water-cooled.
3. expansion type internal memory bluff piece according to claim 2, it is characterized in that, described radiating module simultaneously is to form a projection, described radiating module inside is to form a water channel, described water channel two ends form a water intake end and a water side respectively, described water intake end also is connected with a pumping, and described water side also is connected with a tank.
4. expansion type internal memory bluff piece according to claim 1 is characterized in that described radiating module is to be air-cooled type.
5. expansion type internal memory bluff piece according to claim 4 is characterized in that, described radiating module simultaneously is to form a projection, and another side then forms a plurality of radiating fins.
6. expansion type internal memory bluff piece according to claim 1 is characterized in that, described radiating module is to be the thermal conductance tubular type.
7, expansion type internal memory bluff piece according to claim 6 is characterized in that, described radiating module simultaneously is to form a projection, and another side then is assembled with a plurality of radiator shutters and a heat pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201875684U CN201159867Y (en) | 2007-12-21 | 2007-12-21 | Extension type internal memory guard sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201875684U CN201159867Y (en) | 2007-12-21 | 2007-12-21 | Extension type internal memory guard sheet |
Publications (1)
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CN201159867Y true CN201159867Y (en) | 2008-12-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNU2007201875684U Expired - Fee Related CN201159867Y (en) | 2007-12-21 | 2007-12-21 | Extension type internal memory guard sheet |
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CN (1) | CN201159867Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104252212A (en) * | 2013-06-29 | 2014-12-31 | 华为技术有限公司 | Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment |
WO2023125670A1 (en) * | 2021-12-31 | 2023-07-06 | 中兴通讯股份有限公司 | Rack-mounted electronic apparatus and cabinet |
-
2007
- 2007-12-21 CN CNU2007201875684U patent/CN201159867Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104252212A (en) * | 2013-06-29 | 2014-12-31 | 华为技术有限公司 | Liquid cooling heat dissipation device and liquid cooling heat dissipation equipment |
CN104252212B (en) * | 2013-06-29 | 2017-12-15 | 华为技术有限公司 | Liquid-cooling heat radiator and equipment |
WO2023125670A1 (en) * | 2021-12-31 | 2023-07-06 | 中兴通讯股份有限公司 | Rack-mounted electronic apparatus and cabinet |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081203 Termination date: 20131221 |