CN201150149Y - Tin-thieving soldering disk - Google Patents
Tin-thieving soldering disk Download PDFInfo
- Publication number
- CN201150149Y CN201150149Y CNU2007201724769U CN200720172476U CN201150149Y CN 201150149 Y CN201150149 Y CN 201150149Y CN U2007201724769 U CNU2007201724769 U CN U2007201724769U CN 200720172476 U CN200720172476 U CN 200720172476U CN 201150149 Y CN201150149 Y CN 201150149Y
- Authority
- CN
- China
- Prior art keywords
- solder
- soldering
- stealing
- pcb
- soldering dish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model relates to a solder thieves pad, which comprises a PCB used for installing the multi-pin inserting device. The inserting device is vertically arranged on the PCB, the solder thieves pad is designed on the rear face of the PCB, the direction of the solder thieves is parallel to the direction of the PCB over wave soldering, and the directions of solder thieves of the adjacent soldering pads are in reverse. As misplaced solder thieves pad is adopted between adjacent pins, so the solder tin can not be centralized between the pins, but the solder tin is drawn away mutually according to the distance between the solder thieves pads, thus preventing the problem of bridge connection of the solder tin between the adjacent pins. Therefore the cost is reduced, the production straight through rate and the production efficiency are improved, and the hidden danger of reduction of device property caused by solder point mending is decreased.
Description
Technical field
The utility model relates to the dress connection of electronics, is specifically related to a kind of soldering dish of stealing.
Background technology
When many pins device is vertical with mistake wave-soldering direction in the past, in order to reduce the bridge joint short circuit between the pin, increase the spacing between the pin when constantly adopting scaling powder preferably, scolding tin and design, so not only can increase manufacturing cost, but also the hidden danger that meeting brings weld strength to reduce because of the pad that dwindles pin.
The utility model content
The technical problems to be solved in the utility model is, and is little at the prior art weld strength, easily causes the shortcoming of bridge joint short circuit, and a kind of soldering dish of stealing is provided.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of soldering dish of stealing, comprise the PCB that is used to install many pins plug-in mounting device, the plug-in mounting device is vertically mounted on the described PCB, the back side design of described PCB has soldering dish steathily, describedly steal tin direction and described PCB to cross peak weldering direction parallel, it is opposite that adjacent pad is stolen the tin direction.
Steal in the soldering dish described in the utility model, the described soldering dish of stealing can be for circular, oval and other are special-shaped.
Steal in the soldering dish described in the utility model, described size of stealing the soldering dish can be determined according to concrete arrangement space and the described plug-in mounting device pin size of described PCB.
Steal in the soldering dish described in the utility model, the described soldering dish of stealing links to each other with the original pad of described plug-in mounting device.
Steal in the soldering dish described in the utility model, described plug-in mounting device can be single in-line packages.
Steal in the soldering dish described in the utility model, described plug-in mounting device can be dual in-line package.
The beneficial effects of the utility model are, adopt dislocation to steal the soldering dish between the adjacent leads, and scolding tin is not concentrated between the pin when making welding, but draws back mutually according to the distance of stealing the soldering dish, so avoided the bridge joint of scolding tin between adjacent leads.Thereby reduce manufacturing cost, improve and produce first-pass yield and production efficiency, reduce because of repairing the hidden danger that device performance that solder joint causes reduces; Stealing the soldering dish links to each other with original pad and improves weld strength simultaneously.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the schematic diagram that the utility model is stolen a kind of preferred embodiment of soldering dish.
Embodiment
A kind of soldering dish of stealing comprises the PCB that is used to install many pins plug-in mounting device, the plug-in mounting device is vertically mounted on the described PCB, the back side design of described PCB has soldering dish steathily, describedly steal tin direction and described PCB to cross the wave-soldering direction parallel, it is opposite that adjacent pad is stolen the tin direction, the described soldering dish of stealing can be for circular, oval and other are special-shaped, and described size of stealing the soldering dish can be determined according to concrete arrangement space and the described plug-in mounting device pin size of described PCB.The described soldering dish of stealing links to each other with the original pad of described plug-in mounting device.
Wherein the plug-in mounting device can be single in-line packages (SIP).The plug-in mounting device can also be dual in-line package (DIP).
Illustrate that below in conjunction with Fig. 1 the utility model steals a preferred embodiment of soldering dish, be illustrated in figure 1 as a SIP4 encapsulation, the direction of arrow was the wave-soldering direction, and the device installation direction is vertical PCB direction, and the wave-soldering direction of PCB is for from left to right; Each pin design of SIP4 has soldering dish steathily, steals the soldering dish and links to each other with original SIP pad, steals the soldering dish and adopts semi-circular shape, steals soldering dish diameter less than the SIP pad diameter is arranged.The soldering dish steathily of SIP first pin and the 3rd pin is on original pad right side, and the soldering dish steathily of SIP second pin and the 4th pin is in original pad left side.
Claims (6)
1, a kind of soldering dish of stealing comprises the PCB that is used to install many pins plug-in mounting device, and the plug-in mounting device is installed on the described PCB, it is characterized in that, the back side of described PCB is provided with steathily soldering dish, describedly steals tin direction and described PCB to cross the wave-soldering direction parallel, and it is opposite that adjacent pad is stolen the tin direction.
2, the soldering dish of stealing according to claim 1 is characterized in that, the described soldering dish of stealing can be for circular, semicircle, oval.
3, the soldering dish of stealing according to claim 1 is characterized in that, described size of stealing the soldering dish can be determined according to concrete arrangement space and the described plug-in mounting device pin size of described PCB.
4, the soldering dish of stealing according to claim 1 is characterized in that, the described soldering dish of stealing links to each other with the original pad of described plug-in mounting device.
5, the soldering dish of stealing according to claim 1 is characterized in that described plug-in mounting device can be single in-line packages (SIP).
6, the soldering dish of stealing according to claim 1 is characterized in that described plug-in mounting device can be dual in-line package (DIP).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201724769U CN201150149Y (en) | 2007-10-19 | 2007-10-19 | Tin-thieving soldering disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201724769U CN201150149Y (en) | 2007-10-19 | 2007-10-19 | Tin-thieving soldering disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201150149Y true CN201150149Y (en) | 2008-11-12 |
Family
ID=40117920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201724769U Expired - Fee Related CN201150149Y (en) | 2007-10-19 | 2007-10-19 | Tin-thieving soldering disk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201150149Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093268A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | PCB structure capable of preventing tin connection of adjacent pads |
| CN104394644A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化***有限公司 | Four-pin 3528 LED lamp welding pad |
| CN105682349A (en) * | 2016-03-30 | 2016-06-15 | 广东欧珀移动通信有限公司 | Pad structure, circuit board using same and mobile terminal |
| CN106102316A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
| CN109068502A (en) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | A kind of PCB |
-
2007
- 2007-10-19 CN CNU2007201724769U patent/CN201150149Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093268A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | PCB structure capable of preventing tin connection of adjacent pads |
| CN104394644A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化***有限公司 | Four-pin 3528 LED lamp welding pad |
| CN105682349A (en) * | 2016-03-30 | 2016-06-15 | 广东欧珀移动通信有限公司 | Pad structure, circuit board using same and mobile terminal |
| CN106102316A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
| CN109068502A (en) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | A kind of PCB |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201150149Y (en) | Tin-thieving soldering disk | |
| CN204088624U (en) | Binding post and connecting terminal components | |
| CN101868123B (en) | Printed circuit board and design method thereof | |
| CN207637785U (en) | Novel high-frequency microwave high power limiter welding assembly structure | |
| CN205004327U (en) | 62mmIGBT module | |
| CN203722928U (en) | Integrated circuit chip packaging structure of printed circuit board | |
| CN203788342U (en) | Structure for installing infrared sensing module of mobile terminal | |
| CN202695864U (en) | Ground loop structure of wire cable connecting piece | |
| CN104363698B (en) | The row leaded package and encapsulation design method and wiring board of wiring board | |
| CN202393306U (en) | Bridge wire welding assembly of digital electronic detonator | |
| CN206072785U (en) | Automobile-used aluminium base bending structure | |
| CN203368926U (en) | PCB board | |
| CN207427575U (en) | A kind of mounting structure of integrated circuit plate | |
| CN201084830Y (en) | An anti-fall-off false-welding connection applicable to switches | |
| CN104684250A (en) | Package structure of integrated circuit chip of printed circuit board and package design method | |
| CN204632578U (en) | SMD installation forming LED dedicated capacitor | |
| CN102764924A (en) | Wire clamp | |
| CN203277366U (en) | J-shaped surface-mounted pin circuit module | |
| CN205939041U (en) | Circuit backboard face connects line knot to construct | |
| CN203356806U (en) | Tin carrier and welding machine | |
| CN201750663U (en) | Soldering leg for heat sinks and soldering structure thereof | |
| CN202772289U (en) | Wire clamp | |
| CN204090289U (en) | The row leaded package of wiring board and wiring board | |
| CN215003252U (en) | Novel electronic detonator control module structure | |
| CN202352654U (en) | Electronic element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081112 Termination date: 20161019 |