CN201142273Y - Lamination porcelain capacitor with resin sheet metal - Google Patents
Lamination porcelain capacitor with resin sheet metal Download PDFInfo
- Publication number
- CN201142273Y CN201142273Y CNU2007203059178U CN200720305917U CN201142273Y CN 201142273 Y CN201142273 Y CN 201142273Y CN U2007203059178 U CNU2007203059178 U CN U2007203059178U CN 200720305917 U CN200720305917 U CN 200720305917U CN 201142273 Y CN201142273 Y CN 201142273Y
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- ceramic capacitor
- monolithic ceramic
- electrode layer
- layer
- composite material
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Abstract
The utility model relates to a multilayer ceramic capacitor with a resin metal layer. The multilayer ceramic capacitor comprises a storage body and outer end electrode layers arranged at the both ends of the storage body. The storage body is formed by stacking at least three dielectric layers and at least two inner electrode layers alternately, adjacent inner electrode layers are respectively exposed at both ends of the storage body, the outer end electrode layers comprise electrode layers, protective layers and conducting layers, the electrode layers are coated at the both ends of the storage body, and are in contact with the inner electrode layers, the protective layers are coated on the other sides of the electrode layers corresponding to the storage body, the conducting layers are coated on the other sides of the protective layers corresponding to the electrode layers in a welding manner, and a resin metal layer is arranged between the electrode layer and the protective layer. The multilayer ceramic capacitor has the advantages of low production cost and good tractility, thereby effectively resisting the damage of the external stress to the multilayer ceramic capacitor.
Description
Technical field
This creation is a kind of monolithic ceramic capacitor of tool resin metallic layer, and especially a kind of monolithic ceramic capacitor that can allow bears external stress, and more meets the monolithic ceramic capacitor of the tool resin metallic layer of economic benefit.
Background technology
Please referring to shown in Figure 2; general monolithic ceramic capacitor (20) is arranged on the circuit board; this monolithic ceramic capacitor (20) is to comprise a storehouse body (21) and an external electrode layer; this storehouse body (21) is made of the mutual storehouse of plural ceramic layer (212) and plural inner electrode layer (211); each adjacent inner electrode layer (211) is to be exposed to storehouse body (21) two ends respectively; and this external electrode layer is to comprise silver electrode layer (22); nickel coat of metal (23) and tin metal conductive layer (24); this silver electrode layer (22) is to be coated on storehouse body (21) two ends; to contact with inner electrode layer (211); and then formation circuit in parallel; this nickel coat of metal (23) is to be coated on the in addition side of silver electrode layer (22) with respect to storehouse body (21); with avoid silver electrode layer (22) after weld and melted erosion in the process of tin metal conductive layer (24); and this tin metal conductive layer (24) is to be coated on the in addition side of this nickel coat of metal (23) with respect to silver electrode layer (22) in the mode of welding, and it is to electrically connect with other electronic building brick on the circuit board.
In the manufacture process of circuit board, be earlier this monolithic ceramic capacitor (20) to be installed on the circuit board, again other electronic building brick is installed on the circuit board, yet, in the process that other electronic building brick is installed, can produce and to make the diastrophic external stress of circuit board, therefore this monolithic ceramic capacitor (20) is subjected to the influence of this external stress easily and destroys this inner electrode layer (211), even allow ceramic layer (212) damage of breaking, so that the capacitance of this monolithic ceramic capacitor (20) descends and the voltage-resistent characteristic decay, and cause life of product to shorten.
For fear of producing the problems referred to above, and make this monolithic ceramic capacitor can bear higher external stress, then this external electrode must have the ductility and the elasticity of height, the external stress that in installation process, is produced with effective distributed circuit plate, significantly reducing the damage of tin metal conductive layer and ceramic body, and increase useful life of product.
Such as " monolithic ceramic capacitor of tool mechanical damping floor " of the novel patent announcement of TaiWan, China number No. 532548 exposure; it is that one deck mechanical damping layer is set between silver electrode layer and nickel coat of metal again; this mechanical damping layer is with the composite material made metallic conductor of silver with organic sticker; its thickness range is at 50 μ m to 500 μ m; and ductility about 1% to 3%; yet; the made mechanical damping layer of this material is only applicable to by the made inner electrode layer of the metal material of silver-colored palladium class; and the composite material cost height of this mechanical damping layer; the space that ductility and elasticity also also make progress, with more effective opposing external stress to infringement that this monolithic ceramic capacitor was caused.
The utility model content
This creator is because public monolithic ceramic capacitor has the high mechanical damping layer of cost, and it is silver that its scope of application only has by silver-colored palladium class material made inner electrode layer and electrode layer, the mechanical damping layer is formed by silver, therefore through constantly attempting and effort, create the monolithic ceramic capacitor of this tool resin metallic layer finally.
The purpose of this creation is to be the inner electrode layer that a kind of low cost is provided, is applicable to multiple kind, and the monolithic ceramic capacitor of the tool resin metallic layer that its ductility and elasticity all can more effective opposing external stresses.
For reaching above-mentioned purpose; the monolithic ceramic capacitor of this creation tool resin metallic layer is to comprise the storehouse body and the external electrode layer that is arranged on these storehouse body two ends; this storehouse body is made of at least three dielectric layers and the mutual storehouse of two inner electrode layers at least; and each adjacent inner electrode layer is to be exposed to storehouse body two ends respectively; and this external electrode layer is to comprise electrode layer; protective layer and conductive layer; this electrode layer is to be coated on storehouse body two ends; and contact with this inner electrode layer; this protective layer is to be coated on the in addition side of electrode layer with respect to the storehouse body; and this conductive layer is to be coated on the in addition side of this protective layer with respect to electrode layer in the mode of welding, and it is characterized in that:
Still be provided with a resin metallic layer between this electrode layer and this protective layer, it is the side in addition of jacketed electrode layer with respect to the storehouse body.
The ductility of this resin metallic layer is 0.001% to 60%.
Because the cost of manufacture of this resin metallic layer is low, and can be applicable to by metal or made inner electrode layers such as its alloy, compound or organic composite material such as nickel, silver, copper, palladiums, therefore range of application is wider, and the ductility scope of this resin metallic layer is to expand 0.001% to 60% to, therefore more is highly resistant to the injury of external stress to this monolithic ceramic capacitor.
Description of drawings
Fig. 1 is the side sectional view of this creation.
Fig. 2 is the side sectional view of public monolithic ceramic capacitor.
Symbol description
(10) (20) monolithic ceramic capacitor
(11) (21) storehouse body
(111) (211) inner electrode layer
(112) dielectric layer (12) electrode layer
(13) resin metallic layer (14) protective layer
(15) conductive layer (212) ceramic layer
(22) silver electrode layer (23) nickel coat of metal
(24) tin metal conductive layer
Embodiment
Please referring to shown in Figure 1, the monolithic ceramic capacitor (10) of this creation tool resin metallic layer is arranged on the circuit board, and it is to comprise storehouse body (11) and the external electrode layer that is arranged on these storehouse body (11) two ends;
This storehouse body (11) is made of the mutual storehouse of at least three dielectric layers (112) and two inner electrode layers (111) at least, this dielectric layer (112) is a ceramic layer, and each adjacent inner electrode layer (111) is to be exposed to storehouse body (11) two ends respectively, this inner electrode layer (111) can be selected from nickel, nickeliferous alloy, nickel compound containing and nickeliferous organic composite material or be selected from silver, the alloy of argentiferous, the organic composite material of Ag-containing compound and argentiferous, or be selected from copper, the alloy of cupric, the organic composite material of copper-containing compound and cupric, or be selected from palladium, the alloy that contains palladium, contain palladium compound and contain the organic composite material of palladium;
This external electrode layer is to comprise electrode layer (12); protective layer (14) and conductive layer (15); this electrode layer (12) is to be coated on storehouse body (11) two ends; and contact with inner electrode layer (111); and then formation circuit in parallel; this electrode layer (12) can be selected from copper; the alloy of cupric; the organic composite material of copper-containing compound and cupric; or be selected from gold; the alloy that contains gold; gold-containing compound and contain the gold organic composite material; or be selected from silver; the alloy of argentiferous; the organic composite material of Ag-containing compound and argentiferous; or be selected from nickel; nickeliferous alloy; nickel compound containing and nickeliferous organic composite material; or be selected from palladium; the alloy that contains palladium; contain palladium compound and contain the organic composite material of palladium; this protective layer (14) is to be coated on the in addition side of this electrode layer (12) with respect to storehouse body (11); with avoid this electrode layer (12) after weld in the process of conductive layer (15) by corrode; this protective layer (14) is the nickel coat of metal; and this conductive layer (15) to be mode with welding be coated on this protective layer (14) with respect to the in addition side of electrode layer (12) with circuit board on other electronic building brick electrically connect; this conductive layer (15) is the tin metal conductive layer, it is characterized in that:
Still be provided with a resin metallic layer (13) between this electrode layer (12) and this protective layer (14); it has good electrical conductivity; it is the in addition side of jacketed electrode layer (12) with respect to storehouse body (11); this resin metallic layer (13) is made with the composite material of thermosetting resin and metal; thermosetting resin can be materials such as epoxy resin or resinox; and the ratio of this metal is the 30wt% to 70wt% that accounts for whole resin metal level (13); this metal can be selected from gold; the alloy that contains gold; gold-containing compound and contain the gold organic composite material; or be selected from silver; the alloy of argentiferous; the organic composite material of Ag-containing compound and argentiferous; or be selected from nickel; nickeliferous alloy; nickel compound containing and nickeliferous organic composite material; or be selected from palladium; the alloy that contains palladium; contain palladium compound and contain the organic composite material of palladium; or be selected from copper; the alloy of cupric; the organic composite material of copper-containing compound and cupric; the thickness of this resin metallic layer (13) is 0.1 μ m to 800 μ m; and its ductility is 0.001% to 60%, so have the favorable mechanical resiliency.
Because the cost of manufacture of this resin metallic layer (13) is low, and can be applicable to by metal or made inner electrode layers (111) such as its alloy, compound or organic composite material such as nickel, silver, copper, palladiums, therefore range of application is wider, and the ductility scope of this resin metallic layer (13) is to expand 0.001% to 60% to, therefore more is highly resistant to the injury of external stress to this monolithic ceramic capacitor (10).
Claims (22)
1. the monolithic ceramic capacitor of a tool resin metallic layer; it comprises storehouse body and the external electrode layer that is arranged on these storehouse body two ends; this storehouse body is made of at least three dielectric layers and the mutual storehouse of two inner electrode layers at least; and each adjacent inner electrode layer is to be exposed to storehouse body two ends respectively; and this external electrode layer is to comprise electrode layer; protective layer and conductive layer; this electrode layer is to be coated on storehouse body two ends; and contact with this inner electrode layer; this protective layer is to be coated on the in addition side of electrode layer with respect to the storehouse body; and this conductive layer is to be coated on the in addition side of this protective layer with respect to electrode layer in the mode of welding, and it is characterized in that:
Still be provided with a resin metallic layer between this electrode layer and this protective layer, it is the side in addition of jacketed electrode layer with respect to the storehouse body.
2. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this dielectric layer is a ceramic layer.
3. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this inner electrode layer is nickel or nickeliferous alloy or nickel compound containing or nickeliferous organic composite material.
4. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this inner electrode layer is silver or the alloy of argentiferous or the organic composite material of Ag-containing compound or argentiferous.
5. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this inner electrode layer is the alloy of copper or cupric or the organic composite material of copper-containing compound or cupric.
6. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this inner electrode layer is palladium or the alloy that contains palladium or contains palladium compound or contain the organic composite material of palladium.
7. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this electrode layer is the alloy of copper or cupric or the organic composite material of copper-containing compound or cupric.
8. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this electrode layer is gold or contains the alloy or the gold-containing compound of gold or contain golden organic composite material.
9. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this electrode layer is silver or the alloy of argentiferous or the organic composite material of Ag-containing compound or argentiferous.
10. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this electrode layer is nickel or nickeliferous alloy or nickel compound containing or nickeliferous organic composite material.
11. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this electrode layer is palladium or the alloy that contains palladium or contains palladium compound or contain the organic composite material of palladium.
12. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this protective layer is the nickel coat of metal.
13. monolithic ceramic capacitor as claimed in claim 1 is characterized in that: this conductive layer is the tin metal conductive layer.
14. as each described monolithic ceramic capacitor of claim 1 to 13, it is characterized in that: this resin metallic layer is made with the composite material of thermosetting resin and metal.
15. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: the thickness of this resin metallic layer is 0.1 μ m to 800 μ m.
16. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: the ductility of this resin metallic layer is 0.001% to 60%.。
17. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: the ratio of this metal is the 30wt% to 70wt% that accounts for whole resin metal level.
18. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: this metal is gold or contains the alloy or the gold-containing compound of gold or contain golden organic composite material.
19. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: this metal is silver or the alloy of argentiferous or the organic composite material of Ag-containing compound or argentiferous.
20. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: this metal is nickel or nickeliferous alloy or nickel compound containing or nickeliferous organic composite material.
21. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: this metal is palladium or the alloy that contains palladium or contains palladium compound or contain the organic composite material of palladium.
22. monolithic ceramic capacitor as claimed in claim 14 is characterized in that: this metal is the alloy of copper or cupric or the organic composite material of copper-containing compound or cupric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007203059178U CN201142273Y (en) | 2007-02-14 | 2007-12-27 | Lamination porcelain capacitor with resin sheet metal |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200720000766 | 2007-02-14 | ||
| CN200720000766.5 | 2007-02-14 | ||
| CNU2007203059178U CN201142273Y (en) | 2007-02-14 | 2007-12-27 | Lamination porcelain capacitor with resin sheet metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201142273Y true CN201142273Y (en) | 2008-10-29 |
Family
ID=40069983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007203059178U Expired - Fee Related CN201142273Y (en) | 2007-02-14 | 2007-12-27 | Lamination porcelain capacitor with resin sheet metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201142273Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103971930A (en) * | 2013-01-24 | 2014-08-06 | 三星电机株式会社 | Multilayer Ceramic Capacitor And Method Of Manufacturing The Same |
| CN104103421A (en) * | 2013-04-12 | 2014-10-15 | 华新科技股份有限公司 | Multilayer ceramic capacitor with buffer layer |
| CN109119246A (en) * | 2017-06-22 | 2019-01-01 | 太阳诱电株式会社 | Multilayer ceramic capacitor |
-
2007
- 2007-12-27 CN CNU2007203059178U patent/CN201142273Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103971930A (en) * | 2013-01-24 | 2014-08-06 | 三星电机株式会社 | Multilayer Ceramic Capacitor And Method Of Manufacturing The Same |
| CN104103421A (en) * | 2013-04-12 | 2014-10-15 | 华新科技股份有限公司 | Multilayer ceramic capacitor with buffer layer |
| CN109119246A (en) * | 2017-06-22 | 2019-01-01 | 太阳诱电株式会社 | Multilayer ceramic capacitor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081029 Termination date: 20111227 |