CN201097107Y - Vertical micro-adjustment and gravity compensation machine - Google Patents

Abstract

The utility model relates to a vertical vernier adjustment and gravity compensation mechanism. The vertical vernier adjustment and gravity compensation mechanism of the utility model comprises a gravity compensator used for supporting the static weight of an object, and a driving device positioned on the gravity compensator, wherein the driving device performs vertical vernier adjustment and gravity compensation to the supported object. Through adopting the vertical vernier adjustment and gravity compensation mechanism of the utility model, accurate position control can be achieved, and the vernier adjustment and the positioning of the direction of the vertical three degree of freedom can be realized simultaneously.

Description

Vertically delicate adjusting and gravity compensation mechanism

Technical field

The utility model relates to vertically delicate adjusting and gravity compensation mechanism, particularly uses this mechanism to carry out balance mass and inching location in the litho machine.

Background technology

In semiconductor fabrication, photoetching is wherein very important one processing procedure, and it is the technological process that the graphics chip on a series of masks is transferred to successively the complexity on the silicon chip equivalent layer by exposure system.Whole photoetching process approximately consumes 60% of the preceding road of chip manufacturing time, and nearly 40% the cost that occupies that entire chip makes.And these a series of complexity, costliness, photo-etching technological process consuming time concentrate on and finish on the group for photo etching machine of pipeline production line correspondence before the chip, so the lithographic accuracy of litho machine and productive rate height directly affect the integrated level and the manufacturing cost of chip.

Compare with the silicon chip of diameter 200mm, effective photoetching area of diameter 300mm silicon chip surface generally improves 1.2---1.7 doubly, this will make the manufacturing cost of chip descend about 30%, and it is ripe that the manufacturing process of diameter 300mm silicon chip has been tending towards, based on these factors, the silicon chip that present lithographic diameters is 300mm has become the mainstream technology of preceding road field of lithography.Pipeline production line serve as mainly to equip with litho machine that can photoetching 300mm diameter silicon chip (and backward compatible) all before the newly-built chip.Compare etching system in the past, no matter the work stage of carrying diameter 300mm silicon chip increases with all having qualitatively significantly in size in the new system, how under the prerequisite that does not influence the silicon wafer exposure quality, the productive rate that improves silicon chip has become the difficult problem of pendulum in face of each main litho machine manufacturer.

In the main flow photoetching technique of diameter 200mm silicon chip, disclosed a kind of photoetching technique as U.S. Pat 5953105, the motion counter-force that it produces during with work stage mask platform system acceleration and deceleration motion leads in the external frame, to alleviate and to eliminate the influence of motion counter-force to system alignment location and exposure accuracy.U.S. Pat 6271640 has disclosed another kind of photoetching technique, and it is that the motion counter-force of work stage is guided to one outward independently on the reaction frame, and carries out the passive damping weakening between reaction frame and basic framework, avoids vibration is imported in the etching system once more.U.S. Pat 6396566 has disclosed another photoetching technique, it leads to the motion counter-force of mask platform in the external frame, the motion counter-force that work stage produces acts on external frame by the damping system of marble bottom and side direction, and the vibration that causes with alleviation motion counter-force is to the influence of etching system.

Technology from above three pieces of United States Patent (USP)s announcement at the employing of diameter 200mm silicon chip, although form difference, but all be to adopt the motion counter-force to lead to this technological thought of external frame, the motion counter-force that produces when avoiding photoetching is to the influence of silicon wafer exposure quality.But, become the mainstream technology of field of lithography already along with diameter 300mm silicon chip, the frame system of traditional lithographic diameters 200mm silicon chip and local vibration damping layout can not satisfy the requirement that improves systematic yield and exposure quality, its main cause is: first, even work stage and mask platform high acceleration play the motion counter-force of stopping time generation and lead to external frame, as not handled, very big to the influence of etching system; The second, work stage and mask platform cause that when high-speed motion the frequent variations of system's center of gravity brings the unordered vibration of etching system.Work stage at the photoetching large-diameter silicon wafer, in order to improve the productive rate of silicon chip, require the litho machine sweep velocity constantly to promote, this certainly will will improve constantly the acceleration of scanning motion, the frequent variations of motion counter-force that is produced and work stage system center of gravity, caused unordered vibration problem must worsen the exposure quality as not solving, and obtains the result who runs counter to desire.

The utility model content

The purpose of this utility model is to provide a kind of vertically delicate adjusting and gravity compensation mechanism, said mechanism can reach accurate position control with the inching locator meams, adopts the balance mass mode to reduce and to eliminate the adverse effect that the frequent changes of motion counter-force and system's center of gravity causes to etching system simultaneously.

In order to reach described purpose, the utility model provides a kind of vertically delicate adjusting and gravity compensation mechanism, wherein, comprising: the gravity compensator that is used for the static weight of supporting object, be positioned at the drive unit on the gravity compensator, supported objects is carried out vertically delicate adjusting and gravity compensation.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, has a support disk support drive device on the described gravity compensator.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, described gravity compensator also comprises outer wall, push rod in the outer wall, flexible hinge part and top air supporting retaining head in the middle of the push rod that is connected with supported objects, keep off the air supporting between the head at push rod and outer wall, top air supporting, and the constant voltage chamber of push rod bottom.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, the friction force that push rod moves up and down is eliminated in described air supporting.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, described air supporting gap is 10～16 μ m.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, described constant voltage chamber is connected by the gas circuit of constant voltage compensation gas port and air feed source of the gas.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, the gas circuit of described air feed source of the gas and pneumatically supported air intake opening are connected.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, comprise that also variable valve, gas container chamber, flow controller are linked in sequence between described air feed source of the gas and the constant voltage compensation gas port.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, the valve body of described variable valve for controlling automatically and regulate.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, described drive unit is a voice coil motor.

In above-mentioned vertically delicate adjusting and gravity compensation mechanism, described voice coil motor is made up of stationary part, mover part, flexible support.

A kind of litho machine, comprise a basic framework, be positioned at illuminator, mask platform system, projection objective and alignment measurement systems, work stage system on the basic framework, mask platform system and work stage system comprise carrying micropositioner and long stroke pedestal, its substantive distinguishing features is, the carrying micropositioner comprises foregoing vertically delicate adjusting and gravity-compensated device with corresponding long stroke pedestal, reaches installation one balance mass body on the described long stroke pedestal.

In above-mentioned litho machine, described vertically delicate adjusting and gravity compensation mechanism are three groups, become equilateral triangle to distribute.

In above-mentioned litho machine, described vertically delicate adjusting and gravity compensation mechanism are three groups, become isosceles triangle to distribute, and leg-of-mutton geometric center is positioned on the center of gravity of carrying micropositioner.

In above-mentioned litho machine, described work stage system comprises that the stator of workpiece director stroke motor is installed on the balance mass body of workpiece director stroke pedestal.

In above-mentioned litho machine, workpiece director stroke pedestal is installed on the balance mass body by air supporting.

In above-mentioned litho machine, described work stage system comprises the voice coil motor that is installed in carrying micropositioner one side by its mover, and the stator of voice coil motor is installed on the micropositioner bearing frame.

In above-mentioned litho machine, described voice coil motor is three, is divided into two groups and is installed on the carrying micropositioner both sides.

In above-mentioned litho machine, described mask platform system comprises that the stator of mask director stroke motor is installed on the balance mass body of mask director stroke pedestal.

In above-mentioned litho machine, described mask platform system comprises the voice coil motor that is installed in carrying micropositioner one side by its mover, and the stator of voice coil motor is installed on the micropositioner bearing frame.

In above-mentioned litho machine, described voice coil motor is three, is divided into two groups and is installed on the carrying micropositioner both sides.

In above-mentioned litho machine, also comprise the vibration damping and vibration isolation system that is installed on the basic framework, the active damping supporter between projection objective and the main substrate.

In above-mentioned litho machine, described mask platform system, projection objective and alignment measurement systems, work stage system are three independently modules.

In above-mentioned litho machine, the position relation is to project on the projection objective and the laser beam of reflected back is that benchmark is set up between carrying micropositioner, the carrying micropositioner in the work stage system and projection objective in the described mask platform system, by projecting the measuring beam of object lens top and bottom, in conjunction with the reference beam on the main substrate, set up the coordinate contact between the three.

The utility model makes it compared with prior art owing to adopted above-mentioned technical scheme, has following advantage and good effect:

1. micropositioner all adopts independent vertical vibration damping, and forms the independently inner world, in conjunction with level to three groups of voice coil motors, can realize X, Y, Z, Rx, R y,, the inching positioning function of Rz six direction degree of freedom, in order to accurate position control.

2. the motion counter-force that has produced when having eliminated big stroke motion pedestal acceleration and deceleration motion, system's center of gravity remains unchanged in whole exposure process.

3. mask carrying micropositioner and silicon chip carrying micropositioner form the internal module of independent vibration isolation, and can realize nano level high-accuracy pose adjustment and location.

Description of drawings

Vertically delicate adjusting of the present utility model and gravity compensation mechanism are provided by following embodiment and accompanying drawing.

Fig. 1 is a high precision litho machine one-piece construction synoptic diagram of the present utility model;

Fig. 2 (a) and 2 (b) are the structural representation of the utility model work stage system;

Fig. 3 is the structural representation of the utility model mask platform system;

Fig. 4 is the three-dimensional cross section view of vertically delicate adjusting of the present utility model and gravity compensation mechanism;

Fig. 5 is vertically delicate adjusting and gravity compensation mechanism air feed loop synoptic diagram.

Embodiment

Below in conjunction with drawings and Examples vertically delicate adjusting of the present utility model and gravity compensation mechanism and micropositioner, litho machine are described in further detail.

Fig. 1 is high precision litho machine one-piece construction figure of the present utility model, this litho machine belongs to high precision step-scan formula litho machine, mainly comprise illuminator, mask platform system, projection objective and alignment measurement systems, work stage system, what they were all direct or indirect is installed on the basic framework 1.Wherein, illuminator 2, mask platform system and work stage system are directly installed on the basic framework 1.The mask platform system mainly comprises mask 3, long stroke pedestal 4, mask director stroke motor 5, balance mass body 20 and is positioned at mask platform carrying micropositioner 21 on the balance mass body 20.Projection objective and alignment measurement systems comprise: the active damping supporter 18 on pivot flange 7, alignment measurement systems 9, projection objective 19, main substrate 17 and the main substrate 17, laser interferometer 8.The work stage system comprises carrying micropositioner 10, workpiece director stroke motor 12, balance mass body 13, workpiece director stroke pedestal 14 and silicon chip 15.Wherein the silicon chip carrying micropositioner 10 in the carrying of the mask in projection objective and alignment measurement systems, mask platform system micropositioner 21, the work stage system forms three independently internal modules respectively.The main substrate 17 that object lens 19, alignment measurement systems 9 and laser interferometer 8 are installed passes through three active damping vibrating isolation systems 16, and (an active damping vibrating isolation system is at the back side of Fig. 1, not shown) be installed on the basic framework 1, wherein these three active damping vibrating isolation systems 16 carry out active damping and vibration isolation, import mask carrying micropositioner 21 to avoid other disturbance into by base station, make the integrally formed internal module independently of projection objective and alignment measurement systems, basic framework 1 directly is fixed on the factory foundation 11 of rigidity.What the high precision litho machine complete machine that the utility model relates to aimed at is the high precision photoetching that characteristic line breadth is lower than 100nm, the photoetching bearing medium is the silicon chip of diameter 300mm, therefore the dynamics to projection objective 19 has stricter requirement: require the work stage system, be no more than 2nm comprising mask platform with respect to the positioning error of projection objective.This just need carry out high-accuracy active damping controls and inching function to object lens 19, therefore, at the pivot flange 7 and 17 of the main substrates of object lens 19 active damping supporter 18 is installed also. Balance mass body 13,20 is respectively as the balance mass piece of workpiece director stroke pedestal 14, mask director stroke pedestal 4, to reduce and to eliminate work stage and mask platform high acceleration and play the influence to exposure system of motion counter-force that the stopping time produces and center of gravity frequent variations.The stator of workpiece director stroke motor 12 and mover are installed in respectively on work-piece platform balancing mass 13 and the workpiece director stroke pedestal 14, the stator of mask director stroke motor 5 and mover are installed in respectively on mask platform balance mass body 20 and the mask director stroke pedestal 4, this structure makes that the motor-driven masterpiece is that the internal force of system is offset, in the whole step-scan motion process, the center of gravity of system remains unchanged simultaneously.

High precision step-scan formula litho machine groundwork principle is: light source sends the light of specific wavelength through illuminator 2, become range of exposures size and the controlled exposing light beam of make-and-break time, controlled exposing light beam illuminating is to the zone of mask 3 correspondences, the light beam that sees through mask 3 is carrying the pattern-information of mask 3 corresponding regions, through behind the projection objective 19, mask 3 epigraphs clearly are imaged on by a certain percentage on the respective regions of the silicon chip 15 that scribbles photoresist, being synchronized with the movement of step-scan by mask platform and work stage, illuminating bundle will carry out finishing until the photoetching of whole silicon wafer by the image exposure on the field scan mask 3 in the corresponding scanning area of silicon chip repeatedly.In the photoetching process, the foundation of mask platform carrying micropositioner 21, silicon chip carrying micropositioner 10 and 19 positions relations of projection objective is to project on the projection objective 19 and the laser beam 6 of reflected back is that benchmark is set up with laser interferometer 8, by projecting the measuring beam of object lens 19 tops and bottom, in conjunction with the reference beam on the main substrate 17 6, set up the coordinate relation between the three, and the mutual position relation of real-Time Compensation and adjustment mask carrying micropositioner 21 coordinate systems and silicon chip carrying micropositioner 10 coordinate systems.The silicon chip 15 of silicon chip carrying micropositioner 10 carryings is in exposure process, desirable position of focal plane according to projection objective 19, need real-time inching silicon chip carrying micropositioner 10, so that the exposure area of silicon chip 15 correspondences just in time is positioned on the focal plane of object lens 19 promptly so-called leveling and focusing.The horizontal level of silicon chip carrying micropositioner 10 is sent and is projected that the position measurement light beam 6 of silicon chip carrying micropositioner 10 and reflection accurately measures by laser interferometer 8, silicon chip carries that the accurate measurement of micropositioner 10 vertical height and positions finished in conjunction with the vertical laser beam that projects object lens 19 bottoms by alignment measurement systems 9.Data message with silicon chip 15 surface measurements, the co-ordinate position information that records in real time in conjunction with mask carrying micropositioner 21, silicon chip carrying micropositioner 10 and projection objective 19, the leveling and focusing of silicon chip carrying micropositioner 10 when the surface information of the silicon chip 15 after handling is used for silicon chip 15 exposures.When exposing at last, the leveling and focusing process basically identical of the inching process of mask carrying micropositioner 21 and silicon chip carrying micropositioner 10, different is that the accurate inching in mask corresponding region that illuminating bundle need be passed through is to the object plane of object lens 19.

Fig. 2 (a) and 2 (b) adopt this topology layout for the structural representation of the utility model silicon chip carrying micropositioner at the work stage system that uses balance mass 13.Three groups of vertically delicate adjustings and the 23a of gravity compensation mechanism, 23b, 23c are arranged between workpiece director stroke pedestal 14 and the silicon chip carrying micropositioner 10, and these three groups of vertically delicate adjustings and the 23a of gravity compensation mechanism, 23b, 23c become equilateral triangle to distribute, in order to support silicon chip carrying micropositioner 10 most static weights, and having the inching function of Z, Rx, Ry three direction degree of freedom concurrently, concrete principle is as described in Figure 4.Shown in Fig. 2 (a), the inching of X, Y, Rz direction Three Degree Of Freedom in the horizontal direction of silicon chip carrying micropositioner 10 is finished to the voice coil motor 25 of finely tuning to voice coil motor 26a, the 26b of fine setting and Y jointly by two X being arranged in surface level.Concrete fine setting principle is as follows: if Y moves to the voice coil motor 25 of fine setting, then silicon chip carrying micropositioner 10 is finely tuned along the translation of Y direction; If wherein two X are synchronized with the movement to voice coil motor 26a, the 26b of fine setting, then silicon chip carrying micropositioner 10 is toward directions X translation fine setting; If wherein two X are to voice coil motor 26a, the 26b asynchronous movement of finely tuning, then carry micropositioner 10 around the rotation of Z direction, carry out the fine setting of Rz direction degree of freedom.The mover of voice coil motor 25,26 is bound up on silicon chip carrying micropositioner 10 1 sides by the spring reed, and the stator of three groups of voice coil motors 25,26a, 26b is installed on the work stage micropositioner bearing frame 22.Shown in Fig. 2 (b), work stage micropositioner bearing frame 22 connects with workpiece director stroke pedestal 14, and workpiece director stroke pedestal 14 is supported on the work-piece platform balancing mass 13 by air supporting 24.By this kind distribution form, can obtain the silicon chip carrying micropositioner 10 independent internal modules that form, and have the inching ability of 6DOF concurrently.

Fig. 3 is the utility model mask carrying micropositioner structural representation.The distribution form of the similar silicon chip carrying of the inner structure layout micropositioner 10 of mask carrying micropositioner 21.Three groups of vertically delicate adjustings and the 27a of gravity compensation mechanism, 27b, 27c are arranged between mask director stroke pedestal 4 and the mask carrying micropositioner 21, these three groups of vertically delicate adjustings and the 27a of gravity compensation mechanism, 27b, 27c become isosceles triangle to distribute and its center overlaps with the center of gravity of mask carrying micropositioner 21, in order to support the whole static weight of mask carrying micropositioner 21, and having the inching ability of z, Rx, Ry Three Degree Of Freedom concurrently, concrete principle is as described in Figure 4.X, the Y of mask carrying micropositioner 21 horizontal directions, the inching of Rz Three Degree Of Freedom are finished by three inching voice coil motors 29,32a, 32b that are arranged in surface level.Concrete fine setting principle is as follows: if Y moves to the voice coil motor 29 of fine setting, then silicon chip carrying micropositioner 21 is finely tuned along the translation of Y direction; If wherein two X are synchronized with the movement to voice coil motor 32a, the 32b of fine setting, then silicon chip carrying micropositioner 21 is toward directions X translation fine setting; If wherein two X are to voice coil motor 32a, the 32b asynchronous movement of finely tuning, then carry micropositioner 21 around the rotation of Z direction, carry out the fine setting of Rz direction degree of freedom.The mover of inching voice coil motor 29,32 is bound up on mask carrying micropositioner 21 1 sides by the spring reed, the stator of three inching voice coil motors 29,32 is installed on the support frame 28 of mask carrying micropositioner 21, mask micropositioner bearing frame 28 outsides are equipped with mover 30a, the 30b of mask director stroke drive motor 5 along the y direction, and stator 31a, the 31b of mask director stroke drive motor 5 are installed on the balance mass body 20.

Fig. 4 is the three-dimensional diagrammatic cross-section of vertically delicate adjusting and gravity compensation mechanism, this mechanism is formed in parallel by two assemblies with standalone feature, and (voice coil motor 49 is as a functional module independently, the remainder of mechanism is that gravity compensator is formed another independently functional module), adopt gravity compensator to add the mode of voice coil loudspeaker voice coil motor.Be example with silicon chip carrying micropositioner 10 below, the principle of work of vertically delicate adjusting and gravity compensation mechanism is described.Be positioned at the work stage internal system, three groups of vertically delicate adjustings and the 23a of gravity compensation mechanism, 23b, 23c is the center with the geometric center of silicon chip carrying micromotion platform 10, be equilateral triangle, just 120 ° of equal angles are distributed on the workpiece director stroke pedestal 14, gravity compensator is used to support the static weight of silicon chip carrying micropositioner 10 and realize vibration damping and vibration isolation, voice coil motor 49 as Z to the fine motion compensator, in order to realize that silicon chip carries the z of micropositioner 10 to little compensation, three groups of vertically delicate adjustings and 23 associatings of gravity compensation mechanism are supported together and are acted on the silicon chip carrying micropositioner 10, by being positioned at the synergy of the voice coil motor 49 on the voice coil motor support disk 46, realize silicon chip carrying micropositioner 10 at Z, Rx, fine setting on the Ry three degree of freedom direction.Concrete fine setting principle is as follows: if the voice coil motor 49 on three groups of vertically delicate adjustings and the 23a of gravity compensation mechanism, 23b, the 23c is synchronized with the movement, then silicon chip carrying micropositioner 10 moves at the Z directional trim; If have only vertically delicate adjusting and the 23a of gravity compensation mechanism motion or vertically delicate adjusting and the 23b of gravity compensation mechanism, 23c to be synchronized with the movement, then carry micropositioner 10 and rotate around directions X, carry out the fine setting of Rx direction degree of freedom; If have only vertically delicate adjusting and the 23b of gravity compensation mechanism or 23c motion, then carry micropositioner 10 around the rotation of Y direction, carry out the fine setting of Ry direction degree of freedom.And the self-adaptation of the flexible support 50 by voice coil motor 49 tops adjusts function, avoided the influence of mechanical redundant degree of freedom to the micropositioner inching.Wherein the function of vertically delicate adjusting in vertically delicate adjusting in the work stage system and gravity compensation mechanism 23 and the mask platform system and gravity compensation mechanism 27 is consistent, its specific constructive form is consistent with Fig. 4, be size and structural behaviour parameter difference, therefore, here be that example describes with the work stage system only, the mask platform system similarly.

Gravity compensator in vertically delicate adjusting and the gravity compensation mechanism mainly is made of outer wall 42 and 44, voice coil motor 49, push rod 36, push rod top air supporting retaining 34, the air supporting 43 of push rod outer wall, the air supporting 35 at top, the constant voltage chamber 40 of push rod bottom, and its air supporting 43,35 gaps are about 10～16 μ m.Outer wall the 42, the 44th, the main body cover of whole gravity compensator and support mounting portion.Push rod top air supporting retaining 34 and middle flexible hinge part 33 directly connect with silicon chip carrying micropositioner 10 bottoms.A constant compression force is kept in constant voltage chamber 40, carrying micropositioner 10 most weight, because of pressure constant all the time, the 40 pairs of micropositioners 10 in this constant voltage chamber are almost nil because of the rigidity of factor generation weight change such as vibration, dither can be filtered into low-frequency vibration, significantly eliminate the influence of inside and outside vibration micropositioner 10.Constant voltage chamber outer wall 42 directly is fixedly mounted on the workpiece director stroke pedestal 14, and the pressure of constant voltage chamber 40 is by push rod 36, and push rod top air supporting retaining 34 is supporting micropositioner 10.Because of piston push rod 36 and outer wall 44 and push rod 36 tops and air supporting retaining 34 all have air supporting 43,35 to distribute, so the friction force that push rod 36 moves up and down can be eliminated.This gravity compensator also comprises pass elements such as gas passage 37, gas outlet 38, air intake opening 39, constant voltage compensation gas port 41, and wherein constant voltage compensation gas port 41 keeps the constant controlled source of the gas of constant voltage chamber 40 pressure stabilitys in order to connect.The permanent magnet stationary part 47 of voice coil motor 49 is installed on the support disk 46 of gravity compensator, its mover part 48 connects with silicon chip carrying micropositioner 10 direct mechanical by the flexible support 50 at top, and plane, top and gravity compensator air supporting retaining 34 a top plan coplane of guaranteeing flexible support 50 after adjusting are installed.Voice coil motor stator 47 and mover 48 require precise combination to be mounted to one and form a straight line fine motion motor 49, its critical function is according to vibration signal, real-time little compensation silicon chip carrying micropositioner 10 Z to the position, and can moment support the total weight that silicon chip carries micropositioner 10, it mainly acts on and is equivalent to a magnetomechanical damping device and little compensator.Magnetomechanical damping is in order to eliminate the influence of vibration to micromotion platform 10, and little compensator is also realized accurately location in order to the Z that adjusts micromotion platform 10 to height.

Fig. 5 is a gravity compensator mechanism air feed loop synoptic diagram.In this gravity compensator mechanism, keeping the constant voltage chamber 40 of gravity compensator and the supply source of the gas 52 of outer wall air supporting 43 and top air supporting 35 is the containers with big volume, in order to avoid the moving influence that work causes to gravity compensator of source of the gas transfer pump bulk wave.Variable valve 53 is the valve bodies that can control automatically and regulate, in order to keep the stable of supply bleed pressure, reduces to cause because of gas flow the fluctuation of pressure as far as possible.In order further to control air pressure, make it stable, at variable valve more atmospheric vessel 54 of a volume is installed for 53 times, to keep the stable of supply gravity compensator pressure.Gas circuit 56 is directly connected the air intake opening 39 of the circumferential air supporting 43 of outer wall, and connects constant voltage chamber compensation gas port 41 by flow controller 55.When gas flow was arranged, flow controller 55 can provide a pressure to fall, and when there not being air communication out-of-date, its pressure reduces to zero.Therefore, when push rod 36 carries micropositioner 10 acceleration differences because of silicon chip, motion up and down takes place, there is gas to flow in the constant voltage chamber 40 or outflow, this can cause on flow controller 55 that all a pressure falls, and gas-static will be less than the gaseous tension in the pressure stabilizing chamber 54 in leading to the gas circuit 56 of constant voltage chamber 40.When voice coil motor 49 is stable adjust to the control position after, the pressure in the constant voltage chamber 40 can return to constant voltage originally gradually, and sustainable stable and remain on the work of adaptive stabilizing under this constant voltage.

That more than introduces only is based on preferred embodiment of the present utility model, can not limit scope of the present utility model with this.Any method of the present utility model is done replacement, the combination, discrete of step well know in the art, and the utility model implementation step is done well know in the art being equal to change or replace and all do not exceed exposure of the present utility model and protection domain.

Claims (11)

1, a kind of vertically delicate adjusting and gravity compensation mechanism is characterized in that, comprising:

Gravity compensator is used for the static weight of supporting object;

Be positioned at the drive unit on the gravity compensator, supported objects is carried out vertically delicate adjusting and gravity compensation.

2, vertically delicate adjusting as claimed in claim 1 and gravity compensation mechanism is characterized in that: have a support disk support drive device on the described gravity compensator.

3, vertically delicate adjusting as claimed in claim 2 and gravity compensation mechanism, it is characterized in that: described gravity compensator also comprises outer wall, push rod in the outer wall, flexible hinge part and top air supporting retaining head in the middle of the push rod that is connected with supported objects, keep off the air supporting between the head at push rod and outer wall, top air supporting, and the constant voltage chamber of push rod bottom.

4, vertically delicate adjusting as claimed in claim 3 and gravity compensation mechanism is characterized in that: the friction force that push rod moves up and down is eliminated in described air supporting.

5, as claim 3 or 4 described vertically delicate adjustings and gravity compensation mechanism, it is characterized in that: described air supporting gap is 10-16 μ m.

6, vertically delicate adjusting as claimed in claim 3 and gravity compensation mechanism is characterized in that: described constant voltage chamber is connected by the gas circuit of constant voltage compensation gas port and air feed source of the gas.

7, vertically delicate adjusting as claimed in claim 6 and gravity compensation mechanism is characterized in that: the gas circuit of described air feed source of the gas and pneumatically supported air intake opening are connected.

8, vertically delicate adjusting as claimed in claim 6 and gravity compensation mechanism is characterized in that: comprise that also variable valve, gas container chamber, flow controller are linked in sequence between described air feed source of the gas and the constant voltage compensation gas port.

9, vertically delicate adjusting as claimed in claim 8 and gravity compensation mechanism is characterized in that: the valve body of described variable valve for controlling automatically and regulate.

10, vertically delicate adjusting as claimed in claim 1 or 2 and gravity compensation mechanism is characterized in that: described drive unit is a voice coil motor.

11, vertically delicate adjusting as claimed in claim 10 and gravity compensation mechanism is characterized in that: described voice coil motor is made up of stationary part, mover part, flexible support.

Images