CN201081693Y - Weld head position tester - Google Patents
Weld head position tester Download PDFInfo
- Publication number
- CN201081693Y CN201081693Y CNU2007201219276U CN200720121927U CN201081693Y CN 201081693 Y CN201081693 Y CN 201081693Y CN U2007201219276 U CNU2007201219276 U CN U2007201219276U CN 200720121927 U CN200720121927 U CN 200720121927U CN 201081693 Y CN201081693 Y CN 201081693Y
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- China
- Prior art keywords
- linear array
- soldering tip
- welding head
- optical sensor
- transmitting set
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a welding head position detection device which can be used to detect the displacement of the welding head on a supersonic bonding machine, wherein, the welding head is arranged on a fixed bolster. The detection device comprises an optical transmitter and a linear array optical sensor which outputs position digital signals according to the ray displacement sent by the optical transmitter. The optical transmitter and the linear array optical sensor are respectively arranged on the welding head and the fixed bolster. The light transmitted by the optical transmitter irradiates on the linear array optical sensor; when the welding head moves, the optical transmitter moves with the welding head, the position of a light spot which irradiates on the linear array optical sensor also moves with the welding head; the position of the welding head can be indirectly detected by detecting the position of the light spot which irradiates on the linear array optical sensor. Compared with using a vortex sensor to detect the position of the welding head in the prior art of the supersonic bonding machine, the welding head position detection device of the utility model has the advantages that: the detection device has a simple structure and high accuracy, and the output signals can be directly used by digital signal processors for processing and so on.
Description
Technical field
The utility model relates to a kind of position detecting device, is specifically related to a kind of pick-up unit that is used for the soldering tip position probing of welder.
Background technology
Along with the continuous development of semiconductor industry, the use of welder, particularly ultrasonic brazing unit (for example ultrasound wave gold wire bonding machine) more and more widely.The chopper 2 that the soldering tip of these welders generally includes luffing bar 1 and is installed in the front end of luffing bar 1.The device such as grade is rotating is installed on the fixed support 4 and luffing bar 1 is usually by rotating shaft 6.During welding, control luffing bar 16 rotates around the shaft, and makes chopper 2 produce upper and lower displacement.In order to control the displacement of chopper 2 accurately, as shown in Figure 1, prior art is by away from the end of chopper 2 sensor block 3 (for example magnet steel etc.), the corresponding eddy current sensor 5 of installing being set at luffing bar 1 on fixed support 4.Around the shaft 6 when rotating, the distance between sensor block 3 and the eddy current sensor 5 changes at luffing bar 1, and then detects the position of luffing bar 1 by eddy current sensor 5, and the output simulating signal is controlled luffing bar 1 by control device and moved to control device.Adopt eddy current sensor 5 to have following defective at least: because control device is to adopt digital signal to carry out computing and processing, therefore the simulating signal of eddy current sensor 5 outputs need be passed through analog to digital conversion, convert digital signal to and be input to control device again, handled by control device, it handles complicated; And the precision that exists of simulating signal is hanged down shortcoming.In addition, the cost of eddy current sensor 5 is higher, and needing increases extra analog to digital converter, has increased cost.
The utility model content
Technical problem to be solved in the utility model is, detects the low defective of precision of soldering tip position at the employing eddy current sensor of above-mentioned prior art, and a kind of simple in structure, soldering tip position detecting device that precision is high is provided.
The technical scheme that its technical matters that solves the utility model adopts is: a kind of soldering tip position detecting device, and described soldering tip is installed on the fixed support; Described pick-up unit comprises optical transmitting set and the linear array optical sensor of the ray displacement outgoing position digital signal sent according to described optical transmitting set; Described optical transmitting set and described linear array optical sensor are installed separately on described soldering tip and fixed support.
In soldering tip position detecting device of the present utility model, described optical transmitting set is fixedly mounted on the described soldering tip, and described linear array optical sensor is fixedly mounted on the described fixed support; Perhaps, described optical transmitting set is fixedly mounted on the described fixed support, and described linear array optical sensor is fixedly mounted on the described soldering tip.
In soldering tip position detecting device of the present utility model, described linear array optical sensor comprises the photosensitive window of strip; The rayed of described optical transmitting set emission is on described photosensitive window.
In soldering tip position detecting device of the present utility model, described optical transmitting set is semiconductor laser power valve or semiconductor light-emitting-diode.
In soldering tip position detecting device of the present utility model, described linear array optical sensor is line array CCD sensor or linear array cmos sensor.
Implement soldering tip position detecting device of the present utility model, at least have following beneficial effect: optical transmitting set is along with soldering tip moves together, the position that is radiated at the hot spot on the linear array optical sensor is also along with soldering tip moves together, and the facula position that is radiated on the linear array optical sensor by detection just can indirect detection arrive the soldering tip position.Compare as can be known with using eddy current sensor detection soldering tip position in the supersonic bonding machine prior art, the utility model soldering tip position detecting device has simple in structure, the degree of accuracy height, and output signal can be directly for advantages such as digital signal processor processes.
Description of drawings
Fig. 1 is the synoptic diagram of existing soldering tip position detecting device;
Fig. 2 is the synoptic diagram of first embodiment of soldering tip position detecting device of the present utility model;
Fig. 3 is the synoptic diagram of the linear array optical sensor of soldering tip position detecting device of the present utility model;
Fig. 4 is the synoptic diagram of second embodiment of soldering tip position detecting device of the present utility model.
Embodiment
As Fig. 2, shown in Figure 3, be first embodiment of soldering tip position detecting device of the present utility model.In the present embodiment, be that example describes with the soldering tip of ultrasound wave gold wire bonding machine, understandable, this soldering tip position detecting device also can be applied on the soldering tip of other welders.This soldering tip comprises luffing bar 11 and chopper 12.Chopper 12 is installed in an end of luffing bar 11, is used to carry out the bonding to workpiece.Luffing bar 11 is installed on the fixed support 14 by rotating shaft 16, thereby luffing bar 11 can 16 rotate around the shaft, moves up and down and drive chopper 12.
This pick-up unit comprises optical transmitting set 13 and the linear array optical sensor 15 that is installed separately on soldering tip and fixed support 14.In the present embodiment, optical transmitting set 13 is fixedly mounted on the end that luffing bar 11 is not installed chopper 12, move along with the rotation of luffing bar 11, thereby the light that optical transmitting set 13 emits also moves along with the rotation of luffing bar 11.This optical transmitting set 13 can be selected semiconductor laser power valve, semiconductor light-emitting-diode or other light sources for use.Understandable, optical transmitting set 13 also can be installed in other appropriate locations of luffing bar 11 except being installed in the end of luffing bar 11, can successfully penetrate as long as guarantee the light of optical transmitting set 13, and the rotation that does not hinder luffing bar 11 gets final product.
Linear array optical sensor 15 is fixedly mounted on the fixed support 14, and is corresponding with the position of optical transmitting set 13, is used to receive the light from optical transmitting set 13, according to the displacement generation position digital signal output of light.Linear array optical sensor 15 can be selected line array CCD sensor, linear array cmos sensor or other line array sensor for use, and it comprises the photosensitive window 151 of strip, as shown in Figure 3.The hot spot that the light that optical transmitting set 13 sends forms is radiated on this photosensitive window 151, and the diverse location that is radiated at photosensitive window 151 according to hot spot obtains the correspondence position of luffing bar 11, and produces corresponding position digital signal output.
Its course of action is: optical transmitting set 13 is along with luffing bar 11 (soldering tip) moves together, the position that is radiated at the hot spot on the photosensitive window 151 of linear array optical sensor 15 is also along with soldering tip moves together, linear array optical sensor 15 just can indirect detection arrive the soldering tip position by the facula position that detection is radiated on the linear array optical sensor 15, and the generation position digital signal output corresponding with the soldering tip position.Because output is digital signal, can avoid analog-to-digital process directly for the processor use of welder, have degree of accuracy height, signal stabilization advantages of higher.
As shown in Figure 4, be second embodiment of soldering tip position detecting device of the present utility model, the difference of itself and first embodiment is, linear array optical sensor 15 is fixedly mounted on the luffing bar 11, and optical transmitting set 13 is fixedly mounted on the fixed support 14.Other structures and first embodiment of present embodiment are basic identical, hold and do not give unnecessary details.
Claims (5)
1. soldering tip position detecting device, described soldering tip is installed on the fixed support; It is characterized in that: described pick-up unit comprises optical transmitting set and the linear array optical sensor of the ray displacement outgoing position digital signal sent according to described optical transmitting set; Described optical transmitting set and described linear array optical sensor are installed separately on described soldering tip and fixed support.
2. soldering tip position detecting device as claimed in claim 1 is characterized in that: described optical transmitting set is fixedly mounted on the described soldering tip, and described linear array optical sensor is fixedly mounted on the described fixed support; Perhaps, described optical transmitting set is fixedly mounted on the described fixed support, and described linear array optical sensor is fixedly mounted on the described soldering tip.
3. soldering tip position detecting device as claimed in claim 1 or 2 is characterized in that described linear array optical sensor comprises the photosensitive window of strip; The rayed of described optical transmitting set emission is on described photosensitive window.
4. soldering tip position detecting device as claimed in claim 1 or 2 is characterized in that: described optical transmitting set is semiconductor laser power valve or semiconductor light-emitting-diode.
5. soldering tip position detecting device as claimed in claim 1 or 2 is characterized in that: described linear array optical sensor is line array CCD sensor or linear array cmos sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201219276U CN201081693Y (en) | 2007-07-31 | 2007-07-31 | Weld head position tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201219276U CN201081693Y (en) | 2007-07-31 | 2007-07-31 | Weld head position tester |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201081693Y true CN201081693Y (en) | 2008-07-02 |
Family
ID=39615362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201219276U Expired - Fee Related CN201081693Y (en) | 2007-07-31 | 2007-07-31 | Weld head position tester |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201081693Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110702003A (en) * | 2019-09-10 | 2020-01-17 | 山东科技大学 | Space point coordinate detection device |
| CN113681146A (en) * | 2021-10-25 | 2021-11-23 | 宁波尚进自动化科技有限公司 | BTO intelligent correction device and method of full-automatic lead bonding machine |
-
2007
- 2007-07-31 CN CNU2007201219276U patent/CN201081693Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110702003A (en) * | 2019-09-10 | 2020-01-17 | 山东科技大学 | Space point coordinate detection device |
| CN113681146A (en) * | 2021-10-25 | 2021-11-23 | 宁波尚进自动化科技有限公司 | BTO intelligent correction device and method of full-automatic lead bonding machine |
| CN113681146B (en) * | 2021-10-25 | 2022-02-08 | 宁波尚进自动化科技有限公司 | BTO intelligent correction device and method of full-automatic lead bonding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080702 Termination date: 20100731 |