CN201078685Y - Light emitting diode light source and light fitting using the same - Google Patents
Light emitting diode light source and light fitting using the same Download PDFInfo
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- CN201078685Y CN201078685Y CNU2007201721084U CN200720172108U CN201078685Y CN 201078685 Y CN201078685 Y CN 201078685Y CN U2007201721084 U CNU2007201721084 U CN U2007201721084U CN 200720172108 U CN200720172108 U CN 200720172108U CN 201078685 Y CN201078685 Y CN 201078685Y
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Abstract
A LED light source is provided, which comprises a circuit board. The lower surface of the circuit board is provided with a radiating layer fixedly connected with the circuit board; the LED also comprises a unsealed LED wafer; the radiating layer is provided with a groove for containing the LED wafer and the groove passes through the circuit board; the LED wafer is fixedly connected with the radiating layer and the circuit board in binding way. The utility model effectively solves the radiating problem of the LED light source, which makes the production size of the LED light source can be more smaller, the circuit board can be more densely provided with the LED wafter, and cancels the sealing, adding-in and welding reprocessing procedures of the LED light source, saves cost and improve efficiency, and prolongs service life. Besides, the utility model provides a light fitting of LED light source.
Description
Technical field
The utility model relates to a kind of LED source and light fixture, relates in particular to a kind of good LED source of LED wafer, thermal diffusivity and light fixture of LED source of using.
Background technology
Semiconductor light-emitting-diode (light-emitting diode, LED) be a kind of light source device that can directly electric energy be converted into visible light, have that operating voltage is low, power consumption is little, luminous efficiency is high, the response time is short, stable and reliable for performance, nontoxic, harmless, advantage such as volume is little and be used as light source, be widely used in various occasions, for example: operating room, sports tournament field, concert etc.Yet the performance of light emitting diode, life-span and its operating ambient temperature have close ties: when the electric current increase of flowing through LED wafer, the junction temperature of LED wafer increases; And the rising of temperature causes the increase by the LED wafer electric current, the decay of the aging and luminous flux of excessive electric current accelerated luminescence diode wafer; If LED wafer is worked under the environment of higher temperature always, will reduce its effective utilization, make the LED source product the dead lamp of light emitting diode, the fast situation of light decay in application, can occur.
Application number " CN200520122050.3 " name is called " a kind of cooling LED light source module and light fixture thereof " and discloses a kind of cooling LED light source module and light fixture thereof in China's utility application prospectus, and this cooling LED light source module comprises light emitting diode and printed circuit board (PCB).This printed circuit board (PCB) is provided with by the formed array light emitting diode of several light emitting diodes, be provided with the heat-conducting medium layer of high heat-conducting medium between light emitting diode and the printed circuit board (PCB), and this printed circuit board (PCB) is provided with the hole that at least one runs through in the light emitting diode placement, be formed with heat-conducting layer on the sidewall of hole, in the metal blocks that is connected with this heat-conducting layer in addition between position and the heat-conducting medium layer that is provided with of light emitting diode.Therefore, the heat that light emitting diode produced can be transmitted to printed circuit board (PCB) by heat-conducting medium layer, metal blocks, heat-conducting layer, and reach the purpose of heat radiation.Yet, this cooling LED light source module structure complexity, and, since printed circuit board (PCB) normally by materials such as glasses as base material, its conductibility is lower, still can't be effectively with heat directly guiding come out.
Summary of the invention
The technical problem that the utility model solves provides a kind of simple in structure, LED source that thermal diffusivity is good.
In addition, can provide also that heat conduction, thermal diffusivity are good, the life-span light fixture of long LED source.
A kind of LED source, comprise circuit board, the lower surface of described circuit board is provided with the heat dissipating layer affixed with circuit board, described LED source also comprises the LED wafer of un-encapsulated, described heat dissipating layer is provided with the groove that is used for ccontaining described LED wafer, and described groove passes described circuit board, and described LED wafer is affixed with the fixed mode of nation and described heat dissipating layer and circuit board.
Above-mentioned LED source, wherein: described LED wafer be placed on the sealant that the outer surface of circuit board is provided with printing opacity.
Above-mentioned LED source, wherein: the upper surface of described circuit board is provided with the pad layer that is connected with described LED wafer by metal wire.
Above-mentioned LED source, wherein: the lower surface of described circuit board is provided with the heat-conducting medium layer that the lower surface with described heat dissipating layer covers; Adopt the heat-conducting medium layer can assist heat dissipating layer more rapidly heat to be conducted.
Above-mentioned LED source, wherein: described heat dissipating layer is a metal level.
Above-mentioned LED source, wherein: described recess sidewall is provided with metal film; Adopt the conduction that metal film can supplemental heat.
A kind of light fixture of LED source, comprise metal base and with the lampshade of described metal base fluid-tight engagement, wherein, the light fixture of described LED source also comprises the above-mentioned LED source that is contained in described metal base.
LED source of the present utility model, because the LED wafer of un-encapsulated directly is arranged in the groove of heat dissipating layer, make the heat that LED wafer produced conduct fast by heat dissipating layer, heat-conducting medium layer, efficiently solve the heat dissipation problem of LED source, make that the production dimensions of LED source can be more tiny.In addition, adopt the utility model illuminator that light emitting diode is set of crypto set more on the LED source circuit board, and saved LED package, plug-in unit, welding rework process, save cost, raise the efficiency, prolong the service life of LED source simultaneously.
Description of drawings
Below in conjunction with the specific embodiment and accompanying drawing the utility model is described in further detail.
Fig. 1 is the vertical direction cross section view of the utility model LED source.
Fig. 2 is the half-finished three-dimensional exploded view of the utility model LED source.
Fig. 3 is the three-dimensional decomposition texture schematic diagram that adopts the light fixture of the utility model LED source.
The specific embodiment
Figure 1 shows that the vertical direction cross section view of the utility model LED source 10.LED source 10 comprises the LED wafer 102 of circuit board 101 and un-encapsulated.Wherein, the lower surface of circuit board 101 is provided with and affixed heat dissipating layer 103 of circuit board 101 and the heat-conducting medium layer 104 that covers with the lower surface of heat dissipating layer 103.Heat dissipating layer 103 is provided with the groove 105 that is used for ccontaining LED wafer 102, and groove 105 passes circuit board 101, and LED wafer 102 is affixed with the mode of nation fixed (bonding) and heat dissipating layer 103 and circuit board 101.
Nation is the mode of a kind of routing in the chip production technology surely.Be generally used for before the encapsulation chip internal circuit being connected with package pins with metal wire.General nation back (being that circuit is connected the back with pin) surely encapsulates chip with colloid; adopt advanced outer package technology----chip on board encapsulation (Chip On Board simultaneously; COB); the flow process of this technology is that good after tested wafer is implanted on the special circuit board; with metal wire wafer circuit is connected on the circuit board then, has the special protection materials with function and cover the later stage encapsulation of finishing chip on the wafer.
In the present embodiment, heat dissipating layer 103 can enlarge area of dissipation and radiating rate, and it is metal level, for example copper foil layer.Because LED wafer 102 is directly to decide in the groove 105 that mode is arranged on heat dissipating layer 103 with nation, therefore, the heat that LED Chips for Communication 102 is produced can conduct rapidly, saves manufacturing cost simultaneously.This heat-conducting medium layer 104 is the auxiliary heat dissipation layer, can assist heat dissipating layer 103 more rapidly heat to be conducted.
In other embodiment of the utility model, also be provided with the metal film (not shown) on groove 105 sidewalls, with the conduction of supplemental heat.
Again, the upper surface of circuit board 101 is provided with the pad layer 108 that is connected with LED wafer 102 by metal wire 107.And, LED wafer 102 be placed on the sealant 109 that the outer surfaces of circuit board 101 are provided with printing opacity, can reduce the loss of light.In the present embodiment, sealant 109 is the sealants that adopt high transmission rate.
When LED source 10 work, the heat that LED wafer 102 is produced conducts by heat dissipating layer 103, heat-conducting medium layer 104 fast.Because LED wafer 102 is to be directly connected in and heat dissipating layer 103, therefore, the area and the radiating rate of the heat radiation of LED source 10 have been increased, avoided the rising of the working junction temperature of LED wafer 102, the operating current of the feasible LED wafer 102 of flowing through maintains normal operating conditions, prolongs the service life of LED source 10.
Therefore, LED source of the present utility model efficiently solves its heat conduction, heat dissipation problem, makes that the production dimensions of LED source can be more tiny.In addition, adopt the utility model on the LED source circuit board more crypto set the lumination of light emitting diode body is set, and saved LED package, plug-in unit, welding rework process, save cost, raise the efficiency, prolong the service life of LED source simultaneously.
Figure 2 shows that the half-finished three-dimensional exploded view of the utility model LED source.Usually during fabrication, at first metallic radiating layer 103 and circuit board 101 are pressed together; At last in the above by the milling method from circuit board 101 to metallic radiating layer 103, produce groove 105; Again LED wafer 102 is fixed on the groove 105, by the pad layer of metal wire connecting circuit plate 101 upper surfaces.Because LED wafer 102 directly contacts with metallic radiating layer 103, therefore can directly the heat that produces on the LED wafer 102 effectively directly be derived rapidly.
Figure 3 shows that the three-dimensional decomposition texture schematic diagram of the light fixture that adopts the utility model LED source 10.The light fixture of LED source comprises LED source 10, lampshade 20 and metal base 30.Wherein, LED source 10 is contained in the metal base 30, lampshade 20 and metal base 30 fluid-tight engagement.In the present embodiment, lampshade 20 is made for transparent or semitransparent material, and metal base 30 is made by thermal conductivity good metal material.
The light fixture of LED source 10 of the present utility model, since the heat that produced of LED wafer 102 by heat dissipating layer, heat-conducting medium layer, metal base 30 fast towards periphery air disperse, therefore, avoided LED source 10 to make the decay of LED wafer 102 luminosity because of the rising of temperature, and improve radiating effect and can avoid high temperature to damage LED wafer 102, and then prolonged the service life of the light fixture of LED source 10.
The utility model LED source according to actual needs, alternative useful common LED source, be applied to backlight, LED desk lamp, fields such as lamp decoration, be not limited to the mentioned mode of embodiment, and can be so that above-mentioned light emitting source is more light and handy, safety and improve service efficiency.
Claims (7)
1. LED source, comprise circuit board, the lower surface of described circuit board is provided with the heat dissipating layer affixed with circuit board, it is characterized in that: described LED source also comprises the LED wafer of un-encapsulated, described heat dissipating layer is provided with the groove that is used for ccontaining described LED wafer, and described groove passes described circuit board, and described LED wafer is affixed with the fixed mode of nation and described heat dissipating layer and circuit board.
2. LED source according to claim 1 is characterized in that: described LED wafer be placed on the sealant that the outer surface of circuit board is provided with printing opacity.
3. according to any described LED source of claim 1, it is characterized in that: the upper surface of described circuit board is provided with the pad layer that is connected with described LED wafer by metal wire.
4. LED source according to claim 1 is characterized in that: the lower surface of described circuit board is provided with the heat-conducting medium layer that the lower surface with described heat dissipating layer covers.
5. according to claim 1,2,3 or 4 described LED sources, it is characterized in that: described heat dissipating layer is a metal level.
6. LED source according to claim 5 is characterized in that: described recess sidewall is provided with metal film.
7. the light fixture of a LED source, comprise metal base and with the lampshade of described metal base fluid-tight engagement, it is characterized in that: the light fixture of described LED source also comprise be contained in described metal base according to claim 1 to 6 any described LED source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201721084U CN201078685Y (en) | 2007-09-25 | 2007-09-25 | Light emitting diode light source and light fitting using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201721084U CN201078685Y (en) | 2007-09-25 | 2007-09-25 | Light emitting diode light source and light fitting using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201078685Y true CN201078685Y (en) | 2008-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201721084U Expired - Fee Related CN201078685Y (en) | 2007-09-25 | 2007-09-25 | Light emitting diode light source and light fitting using the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201078685Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102147074A (en) * | 2010-02-10 | 2011-08-10 | 深圳帝光电子有限公司 | Direct type ultrathin LED backlight module |
-
2007
- 2007-09-25 CN CNU2007201721084U patent/CN201078685Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102147074A (en) * | 2010-02-10 | 2011-08-10 | 深圳帝光电子有限公司 | Direct type ultrathin LED backlight module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080625 Termination date: 20100925 |