CN201069782Y - LED lead frame and LED with this frame - Google Patents
LED lead frame and LED with this frame Download PDFInfo
- Publication number
- CN201069782Y CN201069782Y CNU2007201515585U CN200720151558U CN201069782Y CN 201069782 Y CN201069782 Y CN 201069782Y CN U2007201515585 U CNU2007201515585 U CN U2007201515585U CN 200720151558 U CN200720151558 U CN 200720151558U CN 201069782 Y CN201069782 Y CN 201069782Y
- Authority
- CN
- China
- Prior art keywords
- heat
- emitting diode
- contact site
- light
- dissipation element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a lead bracket for a light emitting diode and a light emitting diode having the lead bracket for the light emitting diode. The lead bracket for the light emitting diode, which includes a fixing seat, a thermoconductive substrate and a thermoconductive elastic sheet, can movably contact a heat dissipating element. The thermoconductive substrate is arranged in the fixing seat. The thermoconductive elastic sheet includes a connection part and a contact part, the connection part is connected with the contact part and the thermoconductive substrate, and the contact part can movably and elastically contact the heat dissipating element. With the thermoconductive elastic sheet in properly designed size, the contact part can contact the heat dissipating element plane so as to improve heat-dissipating efficiency.
Description
Technical field
The utility model is about a kind of light emitting diode construction, and especially, the utility model is about a kind of LED conducting wire frame and have the light-emitting diode of this LED conducting wire frame.
Background technology
Because the lcd technology maturation, manufacturing cost significantly reduces, and most display has adopted LCD.And because liquid crystal panel inactive mode element, therefore need module backlight so that even lamp source to be provided, and then make the Presentation Function of liquid crystal panel be achieved.
Traditional backlight module still many with cold cathode fluorescent lamp as light source, cold cathode fluorescent lamp is except volume is big, luminous efficiency is also inexcellent.Early stage lumination of light emitting diode efficient is limited, yet the light-emitting diode of existing higher-wattage is asked the city at present, and technology is ripe.The heat that the high-power light-emitting diode of thought is produced in running is also considerable, and this heat will make the surface temperature that connects of light-emitting diode remain high, and then influence luminous efficiency and reduction of service life if not dissipation is gone out.
At foregoing problems, it is exactly that heat-conducting part with light-emitting diode directly is labelled to a heat dissipation element that a solution is arranged at present.This heat dissipation element is generally a metallic plate.Because the size of television set is done bigger and bigger, therefore the light-emitting diode that uses is also just more and more, and this metallic plate is also just increasing.This metallic plate is big more, and its flatness also just is not easy control more.Especially in when assembling, this metallic plate may produce warpage, or the fixing circuit board of these light-emitting diodes also may produce warpage, cause these light-emitting diodes heat-conducting part and can't as expectedly fully and this metallic plate be close to.In addition, after using a period of time, may cause aforesaid problem also can take place because this metallic plate or this circuit board are influenced by heat and produce warpage.
See also Figure 1A and B, Figure 1A illustrates the light-emitting diode 12 of prior art and the schematic diagram of the applying of metallic plate 14, and Figure 1B illustrates the schematic diagram of the inefficacy applying of light-emitting diode 12 and metallic plate 14.Supplementary notes, Figure 1B illustrates turgidly to highlight the situation that expression was lost efficacy and fitted.
Each light-emitting diode 12 comprises a heat-conducting part 122, protrude in usually light-emitting diode 12 outside, and each light-emitting diode 12 all is fixed on the circuit board 16.Under the situation of expection, the heat-conducting part 122 of light-emitting diode 12 is all smooth in metallic plate 14, shown in Figure 1A.Yet, as previously mentioned, may cause some heat-conducting part 122 can't be smooth because of various reasons in metallic plate 14, shown in Figure 1B.This kind can't the smooth situation comprise disengaging (as starting at second light-emitting diode 12 by the left side among Figure 1B) fully and only surplus part contact (as starting at the 3rd and the 4th light-emitting diode 12 by the left side among Figure 1B).Therefore, no doubt heat transfer efficiency is not good not touch the light-emitting diode 12 of metallic plate 14, but only light-emitting diode 12 its thermal conductive properties of part contacting metal plate 14 are not good yet.
Therefore, be necessary to design a kind of new LED conducting wire frame to address the above problem.
Summary of the invention
The light-emitting diode that the utility model purpose is to provide a kind of LED conducting wire frame and has LED conducting wire frame, to overcome the defective of above-mentioned traditional structure, after making the assembling back or using a period of time, even the distance between this heat dissipation element and this light-emitting diode changes to some extent, this heat conduction shell fragment still can remain with this heat dissipation element and contact, and makes the unlikely inefficacy of heat conduction function of this heat conduction shell fragment.
A kind of LED conducting wire frame with heat conduction shell fragment described in the utility model is characterized in that, comprises:
One holder;
One heat-conducting substrate, this heat-conducting substrate are arranged in this holder; And
One heat conduction shell fragment, this heat conduction shell fragment comprises an a junction and a contact site, and this connecting portion connects this heat-conducting substrate and this contact site, and this contact site and this heat dissipation element be Elastic Contact movably.
Wherein, this contact site and this heat dissipation element plane contact.
Wherein, this connecting portion is connected with this contact site is vertical.
Wherein, has a both sides off plumb angle between this connecting portion and this contact site.
Wherein, this contact site comprises a rounded portions, and this rounded portions contacts with this heat dissipation element.
According to a kind of light-emitting diode of the utility model with LED conducting wire frame, it is characterized in that, comprise:
One holder;
One heat-conducting substrate, this heat-conducting substrate are arranged in this holder;
One luminescent wafer, this luminescent wafer are arranged on this heat-conducting substrate; And
One heat conduction shell fragment, this heat conduction shell fragment comprises an a junction and a contact site, and this connecting portion connects this heat-conducting substrate and this contact site, and this contact site and this heat dissipation element be Elastic Contact movably.
Wherein, this contact site and this heat dissipation element plane contact.
Wherein, this connecting portion is connected with this contact site is vertical.
Wherein, this contact site comprises a rounded portions, and this rounded portions contacts with this heat dissipation element.
Wherein, this luminescent wafer comprises an electrode, and this electrode is connected with this heat-conducting substrate conduction.
The utility model beneficial effect: by said structure, the heat that this luminescent wafer produces in running will again through this heat conduction shell fragment, be gone out by this heat dissipation element dissipation at last via this heat-conducting substrate.In addition and since this heat conduction shell fragment have elasticity and with this heat dissipation element Elastic Contact movably, contact so this heat conduction shell fragment can remain with this heat dissipation element, cause heat to be gone out by this heat dissipation element dissipation sustainably.Even if after the assembling or after using a period of time, distance between this heat dissipation element and this light-emitting diode changes to some extent, this heat conduction shell fragment still can remain with this heat dissipation element and contact, and makes the unlikely inefficacy of heat conduction function of this heat conduction shell fragment to have solved the problem that prior art heat conduction was lost efficacy.
Can describe in detail and appended graphic being further understood by following creation about advantage of the present utility model and spirit.
Description of drawings
Figure 1A illustrates the light-emitting diode of prior art and the schematic diagram that metallic plate is fitted.
Figure 1B illustrates the light-emitting diode of prior art and the schematic diagram that metallic plate lost efficacy and fits.
Fig. 2 A is the schematic diagram that illustrates according to a preferred embodiment light-emitting diode of the present utility model.
Fig. 2 B illustrates the profile of light-emitting diode along X-X line among Fig. 2 A.
Fig. 2 C is the schematic diagram that illustrates the assembling application of light-emitting diode.
Fig. 2 D illustrates when heat dissipation element has distortion, the combination schematic diagram of light-emitting diode and heat dissipation element
Fig. 2 E illustrates the schematic diagram that the contact site of light-emitting diode has rounded portions.
Fig. 3 A is the schematic diagram that illustrates another geometrical relationship of the contact site of light-emitting diode and connecting portion.
Fig. 3 B is the schematic diagram that illustrates another geometrical relationship of the contact site of light-emitting diode and connecting portion.
Fig. 3 C is the schematic diagram that illustrates another geometrical relationship of the contact site of light-emitting diode and connecting portion.
Fig. 3 D is the schematic diagram that illustrates another geometrical relationship of the contact site of light-emitting diode and heat dissipation element.
Embodiment
See also Fig. 2 A and B, Fig. 2 A is the schematic diagram that illustrates according to the light-emitting diode 3 of a preferred embodiment of the present utility model.Fig. 2 B illustrates the profile of light-emitting diode 3 along X-X line among Fig. 2 A.
Light-emitting diode 3 comprises a holder 32, heat-conducting substrate 34, two heat conduction shell fragments 36, six pins 38, six electrode contacts 40 and three luminescent wafers 42.Heat-conducting substrate 34 is arranged in the holder 32.Luminescent wafer 42 is arranged on the heat-conducting substrate 34, and the heat that produced can be via heat-conducting substrate 34 conduction to avoid luminescent wafer 42 working temperatures too high in running for luminescent wafer 42 by this.In addition, the electrode of luminescent wafer 42 is connected with electrode contact 40 conductions with metal wire (not being illustrated among the figure).Each electrode contact 40 is connected to a pin 38, and is connected with external circuit (not being illustrated among the figure) conduction by the pin 38 that connects.Heat conduction shell fragment 36 comprises connecting portion 362 and contact site 364.Connecting portion 362 connects heat-conducting substrate 34 and contact site 364.Connecting portion 362 forms an angle α with contact site 364.In addition, shown in Fig. 2 B, holder 32 forms a depression 322, and light-emitting diode 3 further comprises encapsulating material (not being shown among the figure) and is arranged in the depression 322 to cover fixedly luminescent wafer 42.
See also Fig. 2 C, Fig. 2 C is the schematic diagram that illustrates the assembling application of light-emitting diode 3.What remark additionally is that Fig. 2 C is to draw with the end view of Fig. 2 B equidirectional.The heat conduction shell fragment 36 of light-emitting diode 3 and heat dissipation element 5 be Elastic Contact movably, and light-emitting diode 3 itself then is fixed on the circuit board 7 by pin 38.Circuit board 7 comprises hole (not being illustrated among the figure) can freely contact heat dissipation element 5 for the heat conduction shell fragment 36 of light-emitting diode 3.Heat dissipation element 5 can be a metallic plate or a temperature-uniforming plate.Shown in Fig. 2 C, the contact site 364 of heat conduction shell fragment 36 and 362 vertical connections of connecting portion, that is angle α is 90 degree.And and heat dissipation element 5 plane contact are to reduce the contact heat resistance between contact site 364 and the heat dissipation element 5.
See also Fig. 2 D, Fig. 2 D illustrates when heat dissipation element 5 has distortion, the combination schematic diagram of light-emitting diode 3 and heat dissipation element 5, and wherein dotted line is represented the position before heat dissipation element 5 is not out of shape.When there was warpage on the heat dissipation element 5 former surfaces that provide, the distance between light-emitting diode 3 and the heat dissipation element 5 changed.According to prior art, this kind situation causes light-emitting diode 3 to dispel the heat by heat dissipation element 5 more most probably, and then eventually to losing efficacy.On the contrary, the heat conduction shell fragment 36 of light-emitting diode 3 of the present utility model is and heat dissipation element 5 Elastic Contact, therefore in such cases, heat conduction shell fragment 36 still can keep by the elasticity of itself contacting with heat dissipation element 5 and not cause luminescent wafer 42 working temperatures too high and lost efficacy.In addition, by the design of choosing suitable material or contact site 364 sizes, the contact site 364 of heat conduction shell fragment 36 still can keep suitable contact area with heat dissipation element 5 under above-mentioned situation.In addition, this contact site 364 can comprise a rounded portions 3642, shown in Fig. 2 E.When rounded portions 3642 can make light-emitting diode 3 with heat dissipation element 5 assemblings, contact site 364 can be smooth-goingly and heat dissipation element 3 Elastic Contact.And when the distance between light-emitting diode 3 and heat dissipation element 5 has dynamic change (for example in the carrying), rounded portions 3642 can make contact site 364 more smooth-going ground and dynamically keep in touch with heat dissipation element 5.
What deserves to be mentioned is that heat conduction shell fragment 36 is not limit above stated specification with the geometrical relationship of heat dissipation element 5 combinations.Contact site 364 can be under holder 32, and is to be connected with connecting portion 362 towards the other places, as shown in Figure 3A.And contact site 364 does not exceed with vertical the connection with connecting portion 362, shown in Fig. 3 B and C.In addition, contact site 364 does not exceed with complete plane contact with heat dissipation element 5, shown in Fig. 3 D.What remark additionally is though heat-conducting substrate 34 its major functions are heat conduction, also can use electrode contact as.In a specific embodiment, an electrode of luminescent wafer 42 can conduct electricity and be connected to heat-conducting substrate 34.
In sum, the heat of luminescent wafer 42 generation in running will again through heat conduction shell fragment 36, be gone out by heat dissipation element 5 dissipations at last via heat-conducting substrate 34.In addition and since heat conduction shell fragment 36 have elasticity and with heat dissipation element 5 Elastic Contact movably, contact so heat conduction shell fragment 36 can remain with heat dissipation element 5, cause heat to be gone out by heat dissipation element 5 dissipations sustainably.Even if after the assembling or after using a period of time, distance between heat dissipation element 5 and the light-emitting diode 3 changes to some extent, heat conduction shell fragment 36 still can remain with heat dissipation element 5 and contact, and makes the unlikely inefficacy of heat conduction function of heat conduction shell fragment 36 to have solved the problem that prior art heat conduction was lost efficacy.
By the above detailed description of preferred embodiments, be that hope can be known description feature of the present utility model and spirit more, and be not to come category of the present utility model is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of the claim that is arranged in the desire application of the utility model institute of various changes and tool equality.Therefore, the category of the claim that the utility model is applied for should be done the broadest explanation according to above-mentioned explanation, contains the arrangement of all possible change and tool equality to cause it.
Claims (10)
1. a LED conducting wire frame is characterized in that, comprises:
One holder;
One heat-conducting substrate, this heat-conducting substrate are arranged in this holder; And
One heat conduction shell fragment, this heat conduction shell fragment comprises an a junction and a contact site, and this connecting portion connects this heat-conducting substrate and this contact site, and this contact site and this heat dissipation element be Elastic Contact movably.
2. LED conducting wire frame as claimed in claim 1 is characterized in that, this contact site and this heat dissipation element plane contact.
3. LED conducting wire frame as claimed in claim 1 is characterized in that, this connecting portion is connected with this contact site is vertical.
4. LED conducting wire frame as claimed in claim 1 is characterized in that, has a both sides off plumb angle between this connecting portion and this contact site.
5. LED conducting wire frame as claimed in claim 1 is characterized in that this contact site comprises a rounded portions, and this rounded portions contacts with this heat dissipation element.
6. the light-emitting diode with LED conducting wire frame is characterized in that, comprises:
One holder;
One heat-conducting substrate, this heat-conducting substrate are arranged in this holder;
One luminescent wafer, this luminescent wafer are arranged on this heat-conducting substrate; And
One heat conduction shell fragment, this heat conduction shell fragment comprises an a junction and a contact site, and this connecting portion connects this heat-conducting substrate and this contact site, and this contact site and this heat dissipation element be Elastic Contact movably.
7. the light-emitting diode with LED conducting wire frame as claimed in claim 6 is characterized in that, this contact site and this heat dissipation element plane contact.
8. the light-emitting diode with LED conducting wire frame as claimed in claim 6 is characterized in that, this connecting portion is connected with this contact site is vertical.
9. the light-emitting diode with LED conducting wire frame as claimed in claim 6 is characterized in that this contact site comprises a rounded portions, and this rounded portions contacts with this heat dissipation element.
10. the light-emitting diode with LED conducting wire frame as claimed in claim 6 is characterized in that this luminescent wafer comprises an electrode, and this electrode is connected with this heat-conducting substrate conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201515585U CN201069782Y (en) | 2007-06-12 | 2007-06-12 | LED lead frame and LED with this frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201515585U CN201069782Y (en) | 2007-06-12 | 2007-06-12 | LED lead frame and LED with this frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201069782Y true CN201069782Y (en) | 2008-06-04 |
Family
ID=39491171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201515585U Expired - Fee Related CN201069782Y (en) | 2007-06-12 | 2007-06-12 | LED lead frame and LED with this frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201069782Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076171A (en) * | 2010-12-22 | 2011-05-25 | 广东大普通信技术有限公司 | Printed circuit board packaging method and crystal oscillator |
-
2007
- 2007-06-12 CN CNU2007201515585U patent/CN201069782Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076171A (en) * | 2010-12-22 | 2011-05-25 | 广东大普通信技术有限公司 | Printed circuit board packaging method and crystal oscillator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI255377B (en) | Backlight module | |
| CN102588841B (en) | Temperature self-adaptation high-brightness LED directly-down liquid crystal backlight module | |
| US20080117601A1 (en) | Combination assembly of LED and liquid-vapor thermally dissipating device | |
| JP3173051U (en) | Light source device, backlight module, liquid crystal display | |
| CN102102863B (en) | Luminous source radiating structure and backlight module | |
| CN101943356B (en) | Backlight module and luminous source encapsulation structure thereof | |
| TW200837309A (en) | Light modules | |
| US20090002946A1 (en) | Heat-dissipation module of light-emitting device | |
| JP2007042552A (en) | Light source for illumination | |
| CN101294661B (en) | LED lighting lamp | |
| CN101975376B (en) | Luminous source heat-dissipation structure of backlight module | |
| CN201069782Y (en) | LED lead frame and LED with this frame | |
| TW200846776A (en) | Side emitting type lighting module | |
| CN101294660B (en) | LED lighting lamp | |
| CN208418279U (en) | For display and the side entering type LED light source of lamp box | |
| TWI559053B (en) | Light source device adapted to a direct-type backlight module and display device | |
| JP2011146225A (en) | Light source device and backlight device equipped therewith | |
| WO2016078052A1 (en) | Led support and led light emitting unit | |
| WO2016078051A1 (en) | Led support and led light emitting unit | |
| US8288782B2 (en) | Backlight module and light-emitting source package structure thereof | |
| TWI339294B (en) | Bottom lighting type backlight module | |
| TWM311119U (en) | Heat-dissipating module for LED | |
| JP2006343541A (en) | Display device | |
| CN211427761U (en) | Outdoor high bright liquid crystal advertisement all-in-one of little heat pipe heat dissipation | |
| CN208596674U (en) | Light-emitting diode encapsulation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080604 Termination date: 20160612 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |