CN201054827Y

CN201054827Y - High lighting rate light source encapsulation structure

Info

Publication number: CN201054827Y
Application number: CNU200720147272XU
Authority: CN
Inventors: 许继元
Original assignee: ILED OPTOTEK Inc
Current assignee: iLEDm Photoelectronics Inc
Priority date: 2007-05-29
Filing date: 2007-05-29
Publication date: 2008-04-30
Anticipated expiration: 2017-05-29

Abstract

The utility model relates to a light source packaging structure with high luminance. The structure comprises a circuit substrate, at least one luminous light source and a resin coating covered on the luminous light source. The packaging structure is characterized in that a ray refracting layer is produced on the surface of the circuit substrate corresponding to the luminous light source. The ray refracting layer can not only refract the ineffective rays from the luminous light source into effective rays but also limit the layout range of the resin coating, so the utility model can fully apply the rays from the luminous light source with any direction, and is a light source packaging structure with high luminance indeed.

Description

The illuminating source packaging structure of high luminous efficiency

Technical field

The utility model relates to a kind of illuminating source packaging structure, is meant a kind of illuminating source packaging structure of high luminous efficiency especially, and it fills part each angle light that the utilization illuminating source sends.

Background technology

Still there are many problems in the traditional lighting light fixture now, though as incandescent lamp bulb shortcomings such as low, the high power consumption of luminous efficiency, life-span be short, frangible are arranged cheaply.Though and very power saving of fluorescent lamp, its discarded object has mercury pollution, problem such as frangible.

Comparatively speaking, the products such as LED, cold light light source that meet various countries' energy-conserving and environment-protective safety standard just produce relative advantage, and its characteristic and advantage are: life-span length, low power consumption, pure, the high shock resistance of light color, safety is non-friable, pollution-free and miniaturization can encapsulate or the like;

Though have aforementioned multiple advantage, but be subjected to the influence of restrictions such as light source light-emitting efficiency, luminance directions such as LED, cold light light source, this kind light source product still is not enough to be applied among the human lives fully, see also the existing example of Fig. 1, this kind utilization led chip is as the product problem of illuminating source:

One, occur product in the market and mostly be on a circuit substrate 10, to install most illuminating source chips 11, and be laid with conductive layer 12 on the circuit substrate 10, and each illuminating source chip 11 emits beam towards different directions and angle, because the light that illuminating source chip 11 sends towards circuit substrate 10 directions to no effect, therefore the problem of luminance low excessively (effective ratio emits beam) all can appear in general existing LED, cold light light source; Though this kind design still can be combined into illumination such as similar conventional bulb luminosity, energy waste but is the problem that can't ignore of making us; Therefore relevant manufacturer of global light source and the continuous active research of research unit are made every effort to seek and can be filled part design of all light ray energy of performance light source.

They are two years old; can use resin cladding 13 location, protection illuminating source chip 11 on the available circuit substrate 10; again with lens 14 refracted rays; and these circuit substrate 10 surfaces are not if having when making groove or system coating restriction barrier resin coating separately; then the laying scope of this resin cladding 13 is not easy control, and the consumption that this system groove or system coating step produce cost equally.

In order effectively to solve aforementioned relevant issues, this new design people is based on the technology and the experience of past research and development relevant source lighting apparatus and illuminating source system, improve under the target of foregoing problems research and development design and experiment, developing the illuminating source packaging structure that a kind of brand-new high luminous efficiency finally.

The utility model content

This novel primary and foremost purpose provides a kind of part illuminating source packaging structure of the high luminous efficiency of utilization illuminating source light that fills;

For reaching above-mentioned purpose, this novel in circuit substrate mutually should illuminating source the surface make a light refraction layer, utilize this light refraction layer that the invalid light refraction of illuminating source is effective sunlight; Thus, this new structure can fill part each angle light that this illuminating source of utilization sends, an a kind of illuminating source packaging structure of high luminous efficiency really.

This novel time purpose provides the illuminating source packaging structure of the high luminous efficiency of a kind of high refraction, high heat conduction;

For reaching above-mentioned purpose, the illuminating source packaging structure of the high luminous efficiency that this is novel includes the resin cladding that a circuit substrate, at least one illuminating source and cover cover this illuminating source, this circuit substrate is with porous ceramic making, can bring into play the effect of high heat conduction, the light refraction layer of this circuit substrate possesses metallic mirror surface in addition, utilizes the smooth metal minute surface of this light refraction layer can strengthen refraction effect.

This novel purpose again provides a kind of illuminating source packaging structure that can limit the high luminous efficiency of resin cladding laying scope synchronously;

For reaching aforementioned purpose, this novel light refraction layer is the protrusion thin metal layer that adopts the metal sputtering technology to make on this circuit substrate surface, the protrusion light refraction layer that utilizes this light refraction layer metal sputtering to go out can directly be made the stopper that the restriction resin cladding is laid scope, effectively reduces the complexity and the cost of manufacturing process.

Be noted that at this, the light refraction layer of the circuit substrate that this is novel is to adopt metal sputtering, plating or surface diposition to be made, make it possess the smooth metal minute surface, and the corresponding illuminating source of light refraction layer can be made leaded light inclined-plane or leaded light cambered surface, promotes this novel luminance once again.

The beneficial effects of the utility model are: this novel in circuit substrate mutually should illuminating source the surface make a light refraction layer, utilize this light refraction layer that the invalid light refraction of illuminating source is effective sunlight; Fill part each angle light that this illuminating source of utilization sends thus, improve luminance; This novel circuit substrate is with porous ceramic making, can bring into play the effect of high heat conduction, and the light refraction layer of this circuit substrate possesses metallic mirror surface in addition, utilizes the smooth metal minute surface of this light refraction layer can strengthen refraction effect; This novel light refraction layer can be made the stopper that the restriction resin cladding is laid scope synchronously, effectively reduces the complexity and the cost of manufacturing process.

Description of drawings

Fig. 1 is the structural representation of existing design.

Fig. 2 is the schematic perspective view of this new-type circuit substrate and illuminating source.

Fig. 3 is the three-dimensional assembled sectional view of this new embodiment.

Fig. 4 is this novel refractive status schematic diagram.

Fig. 5 is another configuration schematic diagram of this new type lens.

Fig. 6 is the form schematic diagram that this novel utilization diffusion layer replaces lens.

Circuit substrate 10 illuminating source chips 11

Conductive layer 12 resin claddings 13

Lens 14

Circuit substrate 20 layer printed circuit boards 21

Electrode pad 211

Light refraction layer 30 metallic mirror surface 31

Stopper 32 leaded light inclined-planes 33

Illuminating source 40 bonding wires 41

Resin cladding 50

Lens 60

Diffusion layer 70

Embodiment

See also Fig. 2, this new embodiment of 3 and 4, according to this novel above-mentioned purpose, the illuminating source packaging structure that it provides a kind of high luminous efficiency includes resin cladding 50 and lens 60 that a circuit substrate 20, light refraction layer 30, at least one illuminating source 40 and cover cover this illuminating source, wherein;

This circuit substrate 20 is provided with a layer printed circuit board 21 with electrode pad 211 on it;

This light refraction layer 30, be the thin metal layer that adopts the metal sputtering technology to make on these circuit substrate 20 surfaces, the surface of this light refraction layer 30 is a metallic mirror surface 31, and protrusion light refraction layer that sputter goes out 30 mutually should circuit substrate 20 electrode pad 211 laying scopes convex with stopper 32, these stopper 32 respective electrode weld pads 211 directions are manufactured with leaded light inclined-plane 33;

This illuminating source 40, it is a luminescence chip assembly, illuminating source 40 is positioned on this light refraction layer 30, and this illuminating source 40 mutually should circuit substrate 20 electrode pad 211 location, and illuminating source 40 is electrically connected to the electrode pad 211 on the layer printed circuit board 21 of this circuit substrate 20 with bonding wire 41;

This resin cladding 50 is filled out and is overlayed on outside this illuminating source 40 and the bonding wire 41, and resin cladding 50 is limited in the stopper 32 that this light refraction layer 30 is convexly equipped with; And

These lens 60 are located on this resin cladding 50, with the light of this illuminating source 40 of effective refraction;

The above is the explanation of each element structure of this new embodiment, configuration and correlation thereof.

Clearly demonstrate this novel various execution modes for asking, please cooperate shown in this novel each figure to describe:

In this new structure when running,, owing on this circuit substrate 20 this light refraction layer 30 is set, and the surface of this light refraction layer 30 is metallic mirror surface 31, and stopper 32 respective electrode weld pads 211 directions of this circuit substrate 20 are manufactured with leaded light inclined-plane 33; When this illuminating source 40 is luminous, can sees through this resin cladding 50 towards the light of direction of illumination and penetrate with lens 60; Basically the illumination effect that possesses general existing product;

Key is: the light that this illuminating source 40 sends towards this light refraction layer 30 is owing to can be cooperated the horizontal light of leaded light inclined-plane 33 refractions of this stopper 32 again by metallic mirror surface 31 reflections of light refraction layer 30; Therefore this novel light that can effectively reflect these illuminating source 40 all directions has been given play to the general better luminance of existing product.

In addition, the circuit substrate 20 of this new embodiment is with porous ceramic making, can bring into play the effect of high heat conduction by porous ceramic material, allows a plurality of illuminating source 40 chip heat energy effectively conduct cooling;

The stopper 32 of this light refraction layer 30 can limit resin cladding 50 laying scopes synchronously in addition, therefore after this novel employing metal sputtering, plating or surface diposition are made this light refraction layer 30, not only refracted ray is brought into play main high luminous efficiency effect, and the light refraction layer that goes out of metal sputtering 30 utilizes and protrudes the structure that stoppers 32 direct interlock systems go out to limit resin cladding 50 laying scopes, effectively reduces the complexity and the cost of manufacturing process.

See also Fig. 5 in addition, these novel lens 60 allocation positions can be transformed to and be positioned within the resin cladding 50, can effectively reflect the light of this illuminating source 40 equally;

Fig. 6 is that this novel diffusion layer 70 that uses in addition replaces lens form schematic diagrames, and this novel diffusion layer 70 is located on this resin cladding 50 equally, effectively spreads the evenly light of this illuminating source 40 with the cloudy surface structure; The technology of aforementioned diffusion layer 70 can be to adopt the mode of diffusion sheet, diffusant coating to form.

Feature effect after this sums up the utility model structural improvement again is in lower:

This novel in circuit substrate mutually should illuminating source the surface make a light refraction layer, utilize this light Refracting layer is effective sunlight with the invalid light refraction of illuminating source; Fill thus each that part this illuminating source of utilization sends Angle light, raising luminance.

2. this novel circuit substrate is with porous ceramic making, can bring into play the effect of high heat conduction, in addition should electricity The light refraction layer of base board possesses metallic mirror surface, utilizes the smooth metal minute surface of this light refraction layer can strengthen refraction Effect.

3. this novel light refraction layer can be restricted the stopper that resin cladding is laid scope by interlock system, effectively reduces and makes The complexity of process and cost.

Claims

1. the illuminating source packaging structure of a high luminous efficiency includes the resin cladding that a circuit substrate, light refraction layer, at least one illuminating source and cover cover this illuminating source, it is characterized in that:

This circuit substrate;

This light refraction layer is produced on this circuit substrate surface;

This illuminating source is installed on this circuit substrate, and the light of this illuminating source is effectively reflected by this light refraction layer; And

This resin cladding is filled out and is overlayed on outside this illuminating source.

2. the illuminating source packaging structure of high luminous efficiency according to claim 1, it includes lens in addition, it is characterized in that:

This circuit substrate is provided with a layer printed circuit board with electrode pad on it;

This light refraction layer is the metallic thin layer, and the surface of this light refraction layer is a metallic mirror surface, and the electrode pad laying scope that the light refraction layer mutually should circuit substrate convexes with stopper;

This illuminating source is a luminescence chip assembly, and illuminating source is positioned on this light refraction layer, the electrode pad location that this illuminating source mutually should circuit substrate, and illuminating source is electrically connected to the electrode pad on the layer printed circuit board of this circuit substrate with bonding wire;

This resin cladding is filled out and is overlayed on outside this illuminating source and the bonding wire, and resin cladding is limited in the stopper that this light refraction layer is convexly equipped with; And

These lens are positioned at outside this illuminating source and the bonding wire, and lens and this resin cladding are overlapping, with the light of effective this illuminating source of refraction.

3. the illuminating source packaging structure of high luminous efficiency according to claim 2 is characterized in that, the stopper respective electrode weld pad direction of this light refraction layer is manufactured with the leaded light inclined-plane.

4. the illuminating source packaging structure of high luminous efficiency according to claim 2 is characterized in that, the stopper respective electrode weld pad direction of this light refraction layer is manufactured with the leaded light cambered surface.

5. the illuminating source packaging structure of high luminous efficiency according to claim 1 is characterized in that, this light refraction layer adopts metal sputtering, plating or surface diposition to be produced on this circuit substrate surface.

6. the illuminating source packaging structure of high luminous efficiency according to claim 1 is characterized in that, this circuit substrate is with porous ceramic making.

7. the illuminating source packaging structure of high luminous efficiency according to claim 1, it includes a diffusion layer in addition, it is characterized in that:

This diffusion layer has cloudy surface, and diffusion layer is located on this resin cladding, with the effectively even light of this illuminating source of diffusion.

8. the illuminating source packaging structure of high luminous efficiency according to claim 7 is characterized in that, this diffusion layer adopts the mode of diffusion sheet or diffusant coating to form.

9. the illuminating source packaging structure of high luminous efficiency according to claim 7 is characterized in that, the stopper respective electrode weld pad direction of this light refraction layer is manufactured with the leaded light inclined-plane.

10. high luminous efficiency according to claim 7 illuminating source packaging structure, it is characterized in that the stopper respective electrode weld pad direction of this light refraction layer is manufactured with the leaded light cambered surface.