CN201029013Y

CN201029013Y - LCD device reducing contraposition departure caused by carrying after assembling

Info

Publication number: CN201029013Y
Application number: CNU2006200477863U
Authority: CN
Inventors: 徐亮
Original assignee: SVA Group Co Ltd
Current assignee: SVA Group Co Ltd
Priority date: 2006-11-14
Filing date: 2006-11-14
Publication date: 2008-02-27
Anticipated expiration: 2016-11-14

Abstract

The utility model discloses a liquid crystal display device that can reduce the contrapuntal deviation caused from the transportation process after assembly, which consists of an upper base plate and a lower base plate. The corresponding place of the upper and lower base plate is provided with plural pairs of mutually matched lugs and grooves which form a retaining clip structure when the upper and lower base boards are at the assembled state. During the process that the the base boards are transported to the UV hardening device at the edge, when the transportation manipulator accelerates or decelerates, the side wall of the retaining clip can prevent the upper and lower base boards from moving relatively, and the friction at the contact part of the retaining clip can bring much resistance so as to effectively reduce contrapuntal deviation during the transportation process of the upper and lower base boards and avoid the bad phenomena from occurring such as light leakage and decrease of contrast.

Description

Reduce the liquid crystal indicator that the back conveyance of fitting causes contraposition to depart from

Technical field

The utility model relates to a kind of liquid crystal indicator, particularly relates to a kind of liquid crystal indicator that the back conveyance of fitting causes contraposition to depart from that reduces.

Background technology

Present liquid crystal indicator (LCD) usually is made up of upper and lower substrate and the liquid crystal that is filled in the middle of the upper and lower base plate, and peripheral part utilization between upper and lower base plate is sealed frame glue liquid crystal is encapsulated.Adopt pouring-inly in traditional LCD processing procedure, utilize capillarity, allow liquid crystal enter liquid crystal cell.But there is long, the low problem of liquid crystal utilization factor of production cycle in this method for large-sized display panels, therefore, adopts ODF (One Drop Fill in the present LCD manufacturing process usually; The liquid crystal drip-injection method) technology, Fig. 1 is the work synoptic diagram of ODF technology, with reference to Fig. 1, ODF technology is coated on the infrabasal plate 2 by sealing frame glue 5, uses liquid crystal drop lower nozzle 4 to splash into liquid crystal 3, finish the injection of liquid crystal by operations such as vacuum contraposition applyings at last at the upper surface of infrabasal plate 2 then.Compare with traditional liquid crystal injection mode, the great advantage of ODF technology is exactly the output capacity height, liquid crystal utilization factor height.

After ODF technology was finished, the upper and lower base plate that posts will take out from vacuum forming apparatus, transferred to UV sclerosis of envelope frame glue and thermmohardening device place by mechanical arm, finished the sclerosis fully of frame.By follow-up cutting, Polarizer attaches the final products of producing into the box engineering, sends into module (Module) then.Vacuum abutted operation is extremely important for the liquid crystal indicator product, with reference to figure 2a and Fig. 2 b, Fig. 2 a is the do not fit synoptic diagram of offset of upper and lower base plate, and the synoptic diagram of Fig. 2 b after for the skew of upper and lower base plate occurrence positions is formed with light shield layer BM11 on the upper substrate 1, infrabasal plate 2 is provided with signal wire 21, incident ray 6 is vertically injected from infrabasal plate 2, if in vacuum abutted process, and upper and lower base plate 1 and the skew of 2 applying occurrence positions, meeting light leak shown in Fig. 2 b, degradation is bad under the contrast.

With reference to figure 3a, 3b and 3c, Fig. 3 a is the top view of substrate on mechanical arm; Fig. 3 b is the side view of substrate on mechanical arm; Fig. 3 c is that mechanical arm quickens, upper and lower base plate dislocation synoptic diagram during deceleration, upper and

lower base plate

1 and 2 finish vacuum abutted after, upper and lower base plate 1 only links to each other by the frame material that does not have sclerosis with 2, or the part liquid crystal indicator can be on a small amount of position, frame material is carried out the sclerosis of some point-like, after substrate is vacuum abutted, transfer in the conveyance process of frame UV curing system, shown in Fig. 3 c, the bottom-right direction of arrow is the mechanical arm acceleration direction, the upper left direction of arrow is the upper substrate dislocation direction, and along with the acceleration or the deceleration of mechanical arm 7, some dislocation will inevitably take place upper and

lower base plate

1 and 2, thereby bring light leak, degradation is a series of bad under the contrast.

Summary of the invention

Thereby the purpose of this utility model provides and causes contraposition to depart from a kind of upper and lower base plate conveyance process that reduces after the applying to avoid the light leak that causes thus, the liquid crystal indicator that contrast descends.

The liquid crystal indicator that causes contraposition to depart from the conveyance process after the minimizing that the utility model provides is fitted comprises a upper substrate, an infrabasal plate; The correspondence position of wherein said upper and lower substrate is provided with projection and the groove of plural number to mutual coupling.

Above-mentioned upper and lower base plate is under fit-state, and projection and groove form buckle structure.

Based on above-mentioned design, the liquid crystal indicator that causes contraposition to depart from the upper and lower base plate conveyance process after minimizing of the present utility model is fitted, by on the correspondence position of upper and lower base plate, making a series of projection and groove, after vacuum abutted, these projectioies just in time are stuck in the middle of the groove, form a kind of buckle structure, at substrate in the conveyance process of frame UV curing system, when carrying manipulator quickens or slows down, the sidewall of buckle can hinder upper and lower base plate relative motion takes place, the rubbing action of buckle contact position simultaneously also can bring significantly and hinder, effectively reduced in the upper and lower base plate conveyance process and contraposition to take place departed from, avoided the generation of degradation bad phenomenon under the light leak that causes thus and the contrast.

In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing.Yet accompanying drawing is only for reference and aid illustration usefulness, does not constitute restriction of the present utility model.

Description of drawings

Fig. 1 is the work synoptic diagram of existing ODF technology;

Fig. 2 a is the do not fit synoptic diagram of offset of existing upper and lower base plate;

Fig. 2 b is the synoptic diagram after the existing upper and lower base plate generation applying offset;

Fig. 3 a is the top view of existing substrate on mechanical arm;

Fig. 3 b is the side view of existing substrate on mechanical arm;

Fig. 3 c is that the existing mechanical hand quickens, upper and lower base plate dislocation synoptic diagram when slowing down;

Fig. 4 a is a upper substrate bump diagrams of the present utility model;

Fig. 4 b is an infrabasal plate groove synoptic diagram of the present utility model;

Fig. 4 c is after upper and lower base plate of the present utility model is fitted, the top view of groove and protruding position;

Fig. 4 d is after upper and lower base plate of the present utility model is fitted, the side view of groove and protruding position;

Fig. 5 a, 5 b, 5c are the structural representations of the utility model embodiment one;

Fig. 6 a, 6b, 6c are the structural representations of the utility model embodiment two;

Fig. 7 a, 7b, 7c are the structural representations of the utility model embodiment three.

Among the figure:

1. the protruding 10a. projection of upper substrate 10. 10b. grooves

11. light shield layer BM 12.R layer 13.G layer 14.B layer

(15.PS column bedding and padding)

2. infrabasal plate 20 groove 20a. groove 20b. projectioies

21. signal wire 22. gate insulators 23. insulating protective layers 24. grid layers

25. semiconductor layer 26. drain electrode layers

3. liquid crystal 4. liquid crystal drop lower nozzles 5. envelope frame glue 6. incident raies

7. mechanical arm

Embodiment

The utility model is described in further detail below in conjunction with accompanying drawing and exemplary embodiments.

Fig. 4 a is the upper substrate bump diagrams; Fig. 4 b is an infrabasal plate groove synoptic diagram; Fig. 4 c is after upper and lower base plate is fitted, the top view of groove and protruding position; Fig. 4 d is after upper and lower base plate is fitted, the side view of groove and protruding position.

With reference to Fig. 4 a and Fig. 4 b, reduce the liquid crystal indicator that causes contraposition to depart from the back conveyance process of fitting, comprise a upper substrate 1, one infrabasal plate 2; Upper and

lower substrate

1 and 2 correspondence position are provided with projection 10 and the groove 20 of plural number to mutual coupling.

With reference to Fig. 4 c and Fig. 4 d, under fit-state, projection 10 just in time is stuck in the middle of the groove 20, forms buckle structure.

Embodiment one

With reference to Fig. 5 a, upper substrate 1 comprises a transparent glass substrate, be formed on the light shield layer BM on the transparent glass substrate, the R of Xing Chenging, G, B chromatograph and PS (column bedding and padding) (not illustrating among the figure) in regular turn, upper substrate 1 is provided with protruding 10a, the correspondence position of infrabasal plate 2 is provided with groove 20a, and protruding 10a is made of BM 11, PS 15.

With reference to Fig. 5 b, be formed with gate insulator 22 and insulating protective layer 23 on the infrabasal plate 2, gate insulator 22 and insulating protective layer 23 materials can be SiO ₂Or SiNx, groove 20a forms by etching gate insulator 22 and insulating protective layer 23.

With reference to Fig. 5 c, under fit-state, protruding 10a just in time is stuck in the middle of the groove 20a, forms buckle structure.

Embodiment two

With reference to Fig. 6 a, upper substrate 1 comprises a transparent glass substrate, be formed on the light shield layer BM on the transparent glass substrate, the R of Xing Chenging, G, B chromatograph and PS (not illustrating among the figure) in regular turn, protruding 10a is set on the upper substrate 1, the correspondence position of infrabasal plate 2 is provided with groove 20a, and protruding 10a is made of successively BM11, R12, G13, B14 chromatograph and PS15.

With reference to Fig. 6 b, be formed with gate insulator 22 and insulating protective layer 23 on the infrabasal plate 2, gate insulator 22 and insulating protective layer 23 materials can be SiO ₂Or SiNx, groove 20a forms by etching gate insulator 22 and insulating protective layer 23.

With reference to Fig. 6 c, under fit-state, protruding 10a just in time is stuck in the middle of the groove 20a, forms buckle structure.

The another kind of structure of present embodiment; be formed with gate insulator 22 and insulating protective layer 23 on the described infrabasal plate 2; infrabasal plate 2 is provided with protruding 10a, and the correspondence position of upper substrate 1 is provided with groove 20a, and described protruding 10a constitutes (not illustrating among the figure) by gate insulator and insulating protective layer.Described gate insulator, insulating protective layer can be by SiO ₂Or the SiNx material constitutes.

Embodiment three

With reference to Fig. 7 a, upper substrate 1 comprises a transparent glass substrate, be formed on the light shield layer BM on the transparent glass substrate, the R of Xing Chenging, G, B chromatograph and PS (not illustrating among the figure) in regular turn, upper substrate 1 is provided with groove 10b, the correspondence position of infrabasal plate 2 is provided with protruding 20b, and groove 10b forms by etching BM layer 11 and PS layer 15.

With reference to Fig. 7 b, be formed with grid layer, semiconductor layer, drain electrode layer (not illustrating among the figure) on the infrabasal plate 2 successively, protruding 20b is made of successively grid layer 24, semiconductor layer 25, drain electrode layer 26, and semiconductor layer 25 can be the a-Si layer.

With reference to Fig. 7 c, under fit-state, protruding 20b just in time is stuck in the middle of the groove 10b, forms buckle structure.

By making the projection and the groove of coupling mutually at the correspondence position of upper and lower base plate, after vacuum abutted, projection just in time is stuck in the middle of the groove, form buckle structure, at substrate in the conveyance process of UV curing system, when mechanical arm quickens or slows down, the sidewall of buckle can hinder upper and lower base plate relative motion takes place, the rubbing action of buckle contact position simultaneously also can bring significantly and hinder, reduced effectively that upper and lower base plate generation contraposition departs from the back conveyance process of fitting, thus degradation bad phenomenon under the light leak of avoiding causing thus, contrast.

Claims

1. one kind is reduced the liquid crystal indicator that the back conveyance of fitting causes contraposition to depart from, and comprising:

One upper substrate;

One infrabasal plate;

The correspondence position of wherein said upper and lower substrate is provided with projection and the groove of plural number to mutual coupling.

2. liquid crystal indicator according to claim 1 is characterized in that described upper and lower base plate under fit-state, and projection and groove form buckle structure.

3. liquid crystal indicator according to claim 1 and 2, it is characterized in that described upper substrate comprises a transparent glass substrate, be formed on the light shield layer BM on the transparent glass substrate, the R of Xing Chenging, G, B chromatograph and PS in regular turn, upper substrate is provided with projection, the correspondence position of infrabasal plate is provided with groove, and described projection is made of BM, PS.

4. liquid crystal indicator according to claim 3 is characterized in that described projection is made of successively BM, R, G, B chromatograph, PS.

5. liquid crystal indicator according to claim 1 and 2; it is characterized in that being formed with on the described infrabasal plate gate insulator and insulating protective layer; infrabasal plate is provided with groove; the correspondence position of upper substrate is provided with projection, and described groove forms by etching gate insulator and insulating protective layer.

6. liquid crystal indicator according to claim 5 is characterized in that described gate insulator, insulating protective layer are by SiO ₂Or the SiNx material constitutes.

7. liquid crystal indicator according to claim 1 and 2; it is characterized in that being formed with on the described infrabasal plate gate insulator and insulating protective layer; infrabasal plate is provided with projection, and the correspondence position of upper substrate is provided with groove, and described projection is made of gate insulator and insulating protective layer.

8. liquid crystal indicator according to claim 7 is characterized in that described gate insulator, insulating protective layer are by SiO ₂Or the SiNx material constitutes.

9. liquid crystal indicator according to claim 1 and 2, it is characterized in that being formed with successively on the described infrabasal plate grid layer, semiconductor layer, drain electrode layer, infrabasal plate is provided with projection, the correspondence position of upper substrate is provided with groove, and described projection is made of successively grid layer, semiconductor layer, drain electrode layer.

10. liquid crystal indicator according to claim 9 is characterized in that described semiconductor layer is the a-Si layer.