CN200953344Y - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN200953344Y CN200953344Y CN 200620123185 CN200620123185U CN200953344Y CN 200953344 Y CN200953344 Y CN 200953344Y CN 200620123185 CN200620123185 CN 200620123185 CN 200620123185 U CN200620123185 U CN 200620123185U CN 200953344 Y CN200953344 Y CN 200953344Y
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- China
- Prior art keywords
- heat
- heat pipe
- described heat
- chip
- dissipation base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat-scattered device, in particular to a heat-scattered device with IC chips module and is based on the combination of a heat pipe and a heating fin, which comprises a heat-scattered base and a sealed hollow heat pipe. The heat-scattered base is fixed with the radiator surfaces of the IC chip. Inside wall of the heat pipe is provided with a capillary frame and is filled with liquid, the evaporation end of the heat pipe is fixed with heat-scattered base, and the condensation end is arranged outside the case through the box of the modules. As a medium, the liquid inside the heat pipe cools high-efficiency power amplifier modules and further cools it by adding the fin, which is high in cooling effect and stable. It also improves the heat radiation of the power amplifier chips, and ensures the great improvement of the power amplifier chips' functions.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly a kind of module that is used to have integrated circuit (IC) chip, the heat abstractor that combines based on heat pipe and fin.
Technical background
Comprise electronic products such as large scale integrated circuit (LSI), digital camera, mobile phone, mobile computer recent years, constantly develop towards high-density packages and multifunction direction, make the heat dissipation problem of components and parts, power model, integrated chip etc. become very thorny problem, wherein electronic building brick such as LSI is not if make appropriate heat radiation countermeasure, not only can't bring into play the performance of LSI, when serious even can cause consequences such as the heat of machine intimate explodes.
At present, power amplifier module generally adopts by the heat radiation of common fin or by highly heat-conductive material heat to be reached on the box body and dispels the heat, along with the user is more and more higher to requirements such as digital electronic product performance, outward appearances, traditional power amplifier module radiating mode can't satisfy the heat radiation requirement of existing electronic product.
The utility model content
The utility model has overcome above-mentioned shortcoming, and the heat pipe that provides a kind of utilization to have working fluid combines with radiating fin and realizes heat radiation, and heat abstractor simple in structure, that cooling effectiveness good, reliability is high.
The technical scheme in the invention for solving the technical problem is: a kind of heat abstractor, described heat abstractor comprises the hollow heat pipe of heat dissipation base and sealing, the radiating surface of described heat dissipation base and described integrated circuit (IC) chip is close to fixing, described heat pipe is at least one, its inwall is provided with capillary structure, and be filled with liquid, described heat pipe one end is an evaporation ends, the other end is a condensation end, the evaporation ends of described heat pipe is fixedlyed connected with described heat dissipation base, condensation end passes to the modular cartridge external body, and is nested with at least one fin.
The two ends of described heat pipe can by reflow soldering process with described heat dissipation base or/and described fin fixedly connected.
Described heat pipe evaporation ends can place described heat dissipation base inside.
Described heat pipe can be upright cylindricality or crooked cylindricality.
Also can be provided with the highly heat-conductive material layer between described heat dissipation base and the integrated circuit (IC) chip, described highly heat-conductive material layer comprises heat-conducting cream, carbon nano-tube, high-thermal conductive metal or diamond.
The non-radiating surface opposite position of described circuit board and integrated circuit (IC) chip can be hollow structure, and is filled with the highly heat-conductive material layer, and described highly heat-conductive material comprises heat-conducting cream, carbon nano-tube, high-thermal conductive metal or diamond.
Described heat pipe and described cover plate junction can be filled with highly heat-conductive material, and described highly heat-conductive material layer comprises heat-conducting cream, carbon nano-tube, high-thermal conductive metal or diamond.
Heat-conducting liquid in the described heat pipe can comprise water, liquefied ammonia or methyl alcohol.
Described hollow heat pipe can be copper sintered heat pipe.
Radiating surface shape, the area of the area of described heat dissipation base and described integrated circuit (IC) chip can be identical, and described heat dissipation base, integrated circuit (IC) chip and circuit board are connected by at least two screw.
The utility model passes through the interior flowing liquid of heat pipe as working media, the power amplifier module of cooling high power, by on heat pipe, installing fin additional power amplifier module is further dispelled the heat again, have advantages such as cooling effectiveness is good, reliability height, significantly improved the heat radiation level of power amplifier chip more, guaranteed for increasing substantially of power amplifier chip functions provides heat radiation.The utility model is owing to adopt passive radiating mode, and system does not have additional load to original module, and because there is not fan assembly, quiet fully, environmentally safe.In addition, the cooling system that utilizes this method to realize can be adjusted design and running along with the change of application conditions, uses the flexibility height.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Fig. 2 is the covering plate structure schematic diagram
Among the figure:
1, cover plate 2, fin 3, heat pipe
4, long spiro nail 5, heat dissipation base 6, thermal grease
7, thermal grease 8, power amplifier chip 9, circuit board
10, base plate 11, side plate 12, hole
Embodiment
Present embodiment is an example with the heat abstractor that combines with the power amplifier module that includes the power amplifier chip, and the utility model is described in detail.
As shown in fig. 1, by cover plate 1, base plate 10 and side plate 11 sealings constitute a module box body, in box body, circuit board 9 is close on the inwall of described base plate and is fixing, described power amplifier chip 8 is fixed with described circuit board 9, and non-radiating surface is towards described circuit board 9, heat dissipation base 5 and described power amplifier chip 8 radiating surface shapes, measure-alike, and on four drift angles, adopt four long spiro nails 4 and described power amplifier chip 8 and circuit board 9 to fix, the radiating surface of described power amplifier chip 8 is towards described heat dissipation base 5, and between described power amplifier chip 8 and described heat dissipation base 5, be provided with highly heat-conductive material layer 6, described circuit board 9 is a hollow structure at the non-radiating surface opposite position with power amplifier chip 8, and also be filled with highly heat-conductive material layer 7, described highly heat-conductive material layer can be heat-conducting cream, carbon nano-tube, material such as high-thermal conductive metal or diamond, what adopt in the present embodiment is thermal grease.Two heat pipes 3 are copper sintered heat pipe, through heat dissipation base 5, in cover plate 1 and the full aluminum thin heat radiation fin 2, and two ends fix with described heat dissipation base 5 and fin 2 respectively by reflow soldering process, space between described heat pipe 3 and the cover plate 1 is filled with and also is filled with highly heat-conductive material (not indicating among the figure), the end that described heat pipe 3 combines with heat dissipation base 5 is an evaporation ends, an end that combines with fin 2 is a condensation end, be filled with water in the described heat pipe 3, liquid such as liquefied ammonia or methyl alcohol, for guaranteeing the compound with regular structure of described heat abstractor, the shape of described fin, size can be consistent with described cover plate 1.
Power amplifier chip 8 produces heat in the course of the work, thermal grease layer 6 by low thermal resistance makes the heating of heat pipe 3 evaporation ends, heated liquid in heat pipe 3 evaporation ends becomes steam, described steam arrives the condensation end of heat pipe 3 under pressure, heat is passed to fin 2 and module cover 1, and make vapor condensation, liquid under the effect of gravity or capillary force after the condensation, get back to evaporation ends through the capillary structure of heat pipe 3 inwalls and finish once circulation, cover plate 1 and fin 2 and naturally heat exchange, non-radiating surface at power amplifier chip 8, closely link to each other with base plate 10 parts of module by thermal grease 7, the part heat that the power amplifier chip produces can be reached base plate 10 and carries out the nature heat exchange with environment.
Capillary structure in the described heat pipe mainly contains three effects: one provides the passage of condensation end liquid return evaporation ends, and two provide inwall and liquid is carried out heat conducting passage, and three provide liquid gas produces the necessary hole of capillary pressure.Capillary structure also can be divided into four kinds: silk screen, groove, powder sintered and fiber, thus satisfy different user demands.
Described heat abstractor can require to design according to the power amplifier module density of heat flow rate, when density of heat flow rate is not high, only need heat be directly conducted on the box body and dispel the heat by heat pipe 3, and save fin 2 structures, and in excessive heat current density power amplifier module is used, can increase the quantity of heat pipe 3 and fin 2, even the material of change fin 2, adopt the littler copper radiating fin of thermal conductivity coefficient to strengthen heat-sinking capability, satisfied temperature requirement more effectively, and heat pipe 3 can be pressed any direction bending as required, the size of heat pipe and relative position are by the power and the decision of other associated hot parameters of the power amplifier chip of needs heat radiation, therefore, can adjust design and running along with the change of application conditions according to design philosophy of the present utility model.
After the non-radiating surface of SMD power amplifier chip 8 is coated thermal grease 7, the power amplifier chip is installed on the circuit board, the non-radiating surface of power amplifier chip can fully contact with base plate 10 by thermal grease 7 like this, dispels the heat so that the part heat conducted on the base plate 10.In the entire heat dissipation process, the heat that power amplifier chip 8 distributes mainly is that the combining structure by described heat dissipation base, heat pipe and fin is dispersed in the ambient air, secondly is by thermal grease heat to be conducted on the box body to dispel the heat.
In addition, for the ease of installing, described cover plate is the two-piece type structure, as shown in Figure 2, be about to cover plate and be forming shape similar two parts 1-1 and 1-2, and two hole 1-3 are used to pass described heat pipe 3, after heat abstractor and power amplifier module fit together along the oblique line of centre, the power amplifier module cover plate is installed again, and the position corresponding to described long spiro nail 4 also is provided with the hole 12 of being convenient to install long spiro nail on the described fin.
For further strengthening heat-sinking capability, can in the production process of described power amplifier chip, make the radiating surface of described power amplifier chip adopt metal material, non-radiating surface adopts silicon or ceramic material etc.
More than heat abstractor provided by the utility model is described in detail, used specific case herein principle of the present utility model and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (10)
1. heat abstractor, be used for combining with the module that has integrated circuit (IC) chip, described module comprises box body and is arranged on the interior circuit board of box body, integrated circuit (IC) chip is fixed on the described circuit board, it is characterized in that: described heat abstractor comprises the hollow heat pipe of heat dissipation base and sealing, the radiating surface of described heat dissipation base and described integrated circuit (IC) chip is close to fixing, described heat pipe is at least one, its inwall is provided with capillary structure, and is filled with liquid, and described heat pipe one end is an evaporation ends, the other end is a condensation end, the evaporation ends of described heat pipe is fixedlyed connected with described heat dissipation base, and condensation end passes to the modular cartridge external body, and is nested with at least one fin.
2. heat abstractor according to claim 1 is characterized in that: the two ends of described heat pipe by reflow soldering process with described heat dissipation base or/and described fin fixedly connected.
3. heat abstractor according to claim 1 is characterized in that: described heat pipe evaporation ends places described heat dissipation base inside.
4. heat abstractor according to claim 1 is characterized in that: described heat pipe is upright cylindricality or crooked cylindricality.
5. according to claim 1 or 2 or 3 or 4 described heat abstractors, it is characterized in that: also be provided with the highly heat-conductive material layer between described heat dissipation base and the integrated circuit (IC) chip, described highly heat-conductive material layer comprises heat-conducting cream, carbon nano-tube, high-thermal conductive metal or diamond.
6. according to claim 1 or 2 or 3 or 4 described heat abstractors, it is characterized in that: the non-radiating surface opposite position of described circuit board and integrated circuit (IC) chip is a hollow structure, and being filled with the highly heat-conductive material layer, described highly heat-conductive material comprises heat-conducting cream, carbon nano-tube, high-thermal conductive metal or diamond.
7. according to claim 1 or 2 or 3 or 4 described heat abstractors, it is characterized in that: described heat pipe and described cover plate junction are filled with highly heat-conductive material, and described highly heat-conductive material layer comprises heat-conducting cream, carbon nano-tube, high-thermal conductive metal or diamond.
8. according to the heat abstractor of claim 1 or 2 or 3 or 4, it is characterized in that: the heat-conducting liquid in the described heat pipe comprises water, liquefied ammonia or methyl alcohol.
9. according to claim 1 or 2 or 3 or 4 described heat abstractors, it is characterized in that: described hollow heat pipe is copper sintered heat pipe.
10. according to claim 1 or 2 or 3 or 4 described heat abstractors, it is characterized in that: the area of described heat dissipation base is identical with radiating surface shape, the area of described integrated circuit (IC) chip, and described heat dissipation base, integrated circuit (IC) chip and circuit board are connected by at least two screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620123185 CN200953344Y (en) | 2006-08-17 | 2006-08-17 | Radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620123185 CN200953344Y (en) | 2006-08-17 | 2006-08-17 | Radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200953344Y true CN200953344Y (en) | 2007-09-26 |
Family
ID=38811647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620123185 Expired - Lifetime CN200953344Y (en) | 2006-08-17 | 2006-08-17 | Radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200953344Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101917835A (en) * | 2010-08-23 | 2010-12-15 | 上海中科深江电动车辆有限公司 | Large-power module cooling structure of electric vehicle controller |
| CN102315506A (en) * | 2010-07-06 | 2012-01-11 | 杨健 | Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| CN103597309A (en) * | 2011-05-24 | 2014-02-19 | 日本电气株式会社 | Sealed casing |
| WO2016095507A1 (en) * | 2014-12-16 | 2016-06-23 | 中兴通讯股份有限公司 | Heat dissipation device, circuit board, and terminal |
| CN109416183A (en) * | 2016-12-27 | 2019-03-01 | 惠而浦公司 | Nanometer in solid-state culinary art micro-wave oven is cooling |
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
-
2006
- 2006-08-17 CN CN 200620123185 patent/CN200953344Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315506A (en) * | 2010-07-06 | 2012-01-11 | 杨健 | Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| CN101917835A (en) * | 2010-08-23 | 2010-12-15 | 上海中科深江电动车辆有限公司 | Large-power module cooling structure of electric vehicle controller |
| CN103597309A (en) * | 2011-05-24 | 2014-02-19 | 日本电气株式会社 | Sealed casing |
| US20140083652A1 (en) * | 2011-05-24 | 2014-03-27 | Nec Corporation | Sealed casing |
| CN103597309B (en) * | 2011-05-24 | 2016-10-12 | 日本电气株式会社 | Seal casinghousing |
| WO2016095507A1 (en) * | 2014-12-16 | 2016-06-23 | 中兴通讯股份有限公司 | Heat dissipation device, circuit board, and terminal |
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
| CN109416183A (en) * | 2016-12-27 | 2019-03-01 | 惠而浦公司 | Nanometer in solid-state culinary art micro-wave oven is cooling |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070926 |
|
| EXPY | Termination of patent right or utility model |