CN200947435Y - 宽照射角照明用发光二极管 - Google Patents

宽照射角照明用发光二极管 Download PDF

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CN200947435Y
CN200947435Y CNU2006200772173U CN200620077217U CN200947435Y CN 200947435 Y CN200947435 Y CN 200947435Y CN U2006200772173 U CNU2006200772173 U CN U2006200772173U CN 200620077217 U CN200620077217 U CN 200620077217U CN 200947435 Y CN200947435 Y CN 200947435Y
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孙世荣
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Nanjing Tech University
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Nanjing Tech University
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型是宽照射角照明用发光二极管，发光晶片安装在负极上，正极通过引线连接到发光晶片上，透明环氧树脂封装体将发光晶片和负极、正极的上端连同引线封装成一个整体，其顶部为半球体，半径2.5mm；下部为圆柱体，直径5mm，高6.2mm，圆柱体的底部有一直径5.8mm、高1mm的飞边；整个透明环氧树脂封装体高为8.7mm，发光晶片被封装在顶部半球的球心位置。优点：发光晶片在透明环氧树脂封装体中从原来的底部起高3mm的位置提高到6.2mm，当发光晶片只有一点时，从发光晶片发出的光线以垂直于透明环氧树脂封装体顶部半球体切线的角度穿出，发出的光线不产生折射，向半球的各个方向均匀照射，照射半功率角达180度。

Description

宽照射角照明用发光二极管
技术领域
本实用新型涉及的是一种宽照射角照明用发光二极管，属于晶体管元器件技术领域。
背景技术
目前发光二极管(LED)已被大量应用于照明技术，已有LED手电筒及外形各异的LED灯泡、LED日光灯、LED台灯、LED装饰灯、LED庭院灯以及LED交通信号灯等，其中只有少量灯具要求较窄的照射角，如手电筒、交通信号灯等，也有部分灯具要求有中等的照射角，如台灯、射灯等，但大量应用场所的照明要求是广角照明，要求照射角尽量要达到180度，没有照射盲区，如室内照明用的各种灯泡、日光灯、装饰灯及道路照明用的庭院灯等。但目前常用的Φ5mm发光二极管元件多为窄照射角封装，只有利于极少场所的应用，而为了得到较大的照射角，灯具生产厂家不得不在发光二极管前增加散射毛玻璃、散射透镜或多角度安装发光二极管，由此带来增加生产成本、降低发光效率、照度不均匀等缺点，限制了发光二极管的应用。
衡量照射角大小的指标叫半功率角，其值为发光二极管所发光的照度值等于最大照度值的一半时的二条射线所形成的夹角，在半功率角的照射范围内具有较均匀的光照强度。
目前常见的Φ5mm发光二极管结构如图1所示，主要由负极，正极，发光晶片，负极引线和透明环氧树脂封装体组成。发光晶片安装在负极上，正极通过引线连接到发光晶片，透明环氧树脂封装体将发光晶片和负极、正极的上端连同引线封装成一个整体，其形状：上部为半球体，半径＝2.5mm；下部为圆柱体，直径＝5mm，高＝6.2mm，其圆柱体的底部有一直径＝5.8mm、高＝1mm飞边，俗称帽沿；整个透明环氧树脂封装体高为8.7mm，发光晶片被封装在从底部起高3mm的位置。
对于发光晶片而言，透明环氧树脂封装体顶部的半球体相当于凸透镜，而透明环氧树脂封装体下部的圆柱体相当于柱状凹透镜。由于凸透镜的作用，射向前部的光线被汇聚成一束，而射向透明环氧树脂封装体圆柱体侧面的光线被向偏后的方向散射，造成只有前方很小的角度照度很高而其他部位照度很小，照射半功率角约为25度左右。照射角的分析见图2。
发明内容
本实用新型的目的在于针对上述存在的缺陷，提出一种具有宽照射角照明用发光二极管，使得发光二极管本身具备极广的照射角，便于发光二极管在广照射角场所照明的应用。
本实用新型的技术解决方案：其结构是发光晶片安装在负极上，正极通过引线连接到发光晶片上，透明环氧树脂封装体将发光晶片和负极、正极的上端连同引线封装成一个整体，其形状：顶部为半球体，半径＝2.5mm；下部为圆柱体，直径＝5mm，高＝6.2mm，其圆柱体的底部有一直径＝5.8mm、高＝1mm的飞边，俗称帽沿；整个透明环氧树脂封装体高为8.7mm，发光晶片被封装在顶部半球的球心位置。
本实用新型的优点：所述的宽照射角照明用发光二极管的结构、外形与目前常见的Φ5mm发光二极管相同，只改变发光晶片在透明环氧树脂封装体中的位置，从原来的从底部起高3mm的位置提高到6.2mm，也就是透明环氧树脂封装体顶部半球的球心位置，当发光晶片(发光点)只有一点时，从发光晶片发出的光线以垂直于透明环氧树脂封装体顶部半球体切线的角度穿出，由于光线是垂直穿出，所以发出的光线并不产生折射，向半球的各个方向均匀照射，照射半功率角可达180度。
附图说明
附图1是目前常见的Φ5mm发光二极管结构图；
附图2是目前常见的Φ5mm发光二极管照射角的分析图；
附图3是本实用新型的宽照射角照明用发光二极管结构图；
附图4是本实用新型的宽照射角照明用发光二极管照射角的分析图。
图中的1是负极、2是正极、3是发光晶片、4是引线、5是透明环氧树脂封装体。
具体实施方式
对照附图3，其结构是发光晶片3安装在负极1上，正极2通过引线4连接到发光晶片3上，透明环氧树脂封装体5将发光晶片3和负极1、正极2的上端连同引线4封装成一个整体，其形状：顶部为半球体，半径＝2.5mm；下部为圆柱体，直径＝5mm，高＝6.2mm，其圆柱体的底部有一直径＝5.8mm、高＝1mm的飞边，俗称帽沿；整个透明环氧树脂封装体高为8.7mm，发光晶片被封装在顶部半球的球心位置。
对照附图4，照射角的分析：发光晶片被封装在顶部半球的球心位置，当发光晶片(发光点)只有一点时，从发光晶片发出的光线以垂直于透明环氧树脂封装体顶部半球体切线的角度穿出，由于光线是垂直穿出，所以发出的光线并不产生折射，向半球的各个方向均匀照射，照射半功率角可达180度。

Claims (1)

1、宽照射角照明用发光二极管，其特征是发光晶片安装在负极上，正极通过引线连接到发光晶片上，透明环氧树脂封装体将发光晶片和负极、正极的上端连同引线封装成一个整体，其形状：顶部为半球体，半径＝2.5mm；下部为圆柱体，直径＝5mm，高＝6.2mm，其圆柱体的底部有一直径＝5.8mm、高＝1mm的飞边；整个透明环氧树脂封装体高为8.7mm，发光晶片被封装在顶部半球的球心位置。
CNU2006200772173U 2006-09-20 2006-09-20 宽照射角照明用发光二极管 Expired - Fee Related CN200947435Y (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114606880A (zh) * 2022-04-14 2022-06-10 维特瑞交通科技有限公司 一种可变双面主动发光道路交通标志

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114606880A (zh) * 2022-04-14 2022-06-10 维特瑞交通科技有限公司 一种可变双面主动发光道路交通标志

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