CN1988787A - Heat radiator and its producing method - Google Patents

Heat radiator and its producing method Download PDF

Info

Publication number
CN1988787A
CN1988787A CN 200510132373 CN200510132373A CN1988787A CN 1988787 A CN1988787 A CN 1988787A CN 200510132373 CN200510132373 CN 200510132373 CN 200510132373 A CN200510132373 A CN 200510132373A CN 1988787 A CN1988787 A CN 1988787A
Authority
CN
China
Prior art keywords
heat
radiator
conducting block
heat pipe
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200510132373
Other languages
Chinese (zh)
Inventor
陈国星
林暄智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huaxin Precision Co., Ltd.
Original Assignee
HEFU HEAT CONDUCTION CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEFU HEAT CONDUCTION CO Ltd filed Critical HEFU HEAT CONDUCTION CO Ltd
Priority to CN 200510132373 priority Critical patent/CN1988787A/en
Publication of CN1988787A publication Critical patent/CN1988787A/en
Pending legal-status Critical Current

Links

Images

Abstract

A radiator and its production method are to contact with the heat source of the electronic device in the way of adhesion, which includes the heat conduction block and at least one heat pipe. The direct contact of bottom edge of the heat pipe endothermic end with the surface of heat source, and the sealing connection between the heat pipes and heat conduction block greatly increase the rate of heat conduction and the efficiency of cooling.

Description

Radiator and its preparation method
Technical field
The present invention relates to a kind of Radiator and its preparation method, relate in particular to a kind of in order to attach the Radiator and its preparation method of contact on the pyrotoxin of electronic installation.
Background technology
At present industry is aspect the heat radiation of electronic building brick, is to utilize characteristics such as high capacity of heat transfer that heat pipe has, flash heat transfer, high thermoconductivity, in light weight, simple in structure and multipurpose, can transmit a large amount of heats and not consume electric power.Therefore the radiating requirements that is fit to very much electronic product, and the combination sealing effect of heat pipe and heat-conducting block, to directly have influence on the thermal conduction rate and the heat dissipation of integral heat sink device,, become the important topic that industry is studied so how to increase the sealing effectiveness that engages of heat pipe and heat-conducting block.
Known heat spreader structures mainly comprises heat-conducting block, at least one heat pipe and a plurality of fin.Its end face at tabular copper material heat-conducting block is coated with heat-conducting medium, again an end of heat pipe is arranged on the surface that heat-conducting block is coated with heat-conducting medium, by the heat fused mode heat pipe is welded on the heat-conducting block, at last, again with the stacked in regular turn winding of each fin on heat pipe, so be combined into heat-pipe radiator structure.
Yet, above-mentioned known heat spreader structures, under practical application, still exist following problems, because it is heat to be conducted to heat pipe through heat-conducting block that its heat passes the path again, and the thermal conduction rate of general heat pipe is more than the several times of thermal conduction rate of copper material heat-conducting block, therefore make heat pipe fast thermal conduction rate can't effectively obtain performance.In addition, heat conduction between heat-conducting block and heat pipe need be passed through the conduction of heat-conducting medium once more, and heat-conducting medium all adopts tin cream under various objective condition and cost consideration, and the conductive coefficient of this tin material is lower than the conductive coefficient of copper product, therefore thermal conduction rate is lowered once once more.Therefore, by the heat spreader structures that aforementioned manner is formed, the thermal conduction rate that can reach is subjected to sizable limitation, and significantly reduces the thermal conduction rate and the heat dissipation of integral heat sink device.
In view of the problem that above-mentioned known technology produced, then the inventor being engaged in the sector experience for many years, and in line with excelsior spirit, active research is improved, and a kind of Radiator and its preparation method is provided.
Summary of the invention
Main purpose of the present invention is to provide a kind of Radiator and its preparation method, its heat absorbing end root edge by heat pipe directly is contacted with on the surface of pyrotoxin, and being tightly connected between heat pipe and heat-conducting block, significantly increased the thermal conduction rate of radiator and promoted heat dissipation.
In order to realize above-mentioned purpose, the invention provides a kind of radiator, in order to attach contact on the pyrotoxin of electronic installation, it comprises:
Heat-conducting block comprises plate-like body, is provided with the non-open slot that at least one does not run through in the body bottom surface, is provided with perforation in the end of this non-open slot; And
At least one heat pipe comprises heat absorbing end and radiating end, and this radiating end passes the perforation of heat-conducting block, and by heat-conducting medium heat absorbing end is connected in the non-open slot of heat-conducting block.
In order to realize above-mentioned purpose, the invention provides a kind of manufacture method of radiator, its step comprises:
A) prepare radiator material, an end of heat pipe is passed the perforation of heat-conducting block, and the other end of heat pipe is embedded in the non-open slot of heat-conducting block;
B) heat-conducting block and the heat pipe after will making up is arranged on the groove of mould accordingly;
C) heat-conducting medium is injected from the perforation of heat-conducting block, and fill out the space that the depressed area surrounded that is distributed in heat pipe, heat-conducting block and mould;
D) to mold heated so that heat-conducting medium fusing is filled up aforesaid space and infiltrate, lower the temperature again and is cooled off so that heat-conducting block is connected with heat pipe; And
E) make it form the plane to the radiator bottom surface processed after the moulding.
Preferably, described heat-conducting block body is rectangular, and stretches out respectively at its apical margin and to be provided with flat board.
Preferably, the perforation top periphery of described heat-conducting block is provided with chamfering.
Preferably, described heat pipe is any of U-shaped pipe, U-shaped elliptical tube or U-shaped rectangular pipe.
Preferably, the root edge of described heat-conducting block and heat pipe is in the same plane.
Preferably, described radiator also comprises groups of fins, described groups of fins comprises a plurality of stacked fin mutually, and each described fin is provided with the through hole corresponding to the radiating end of described heat pipe, and the radiating end cross-under of described heat pipe is in the through hole of each described fin.
Preferably, the mode of heating in the described step d) is to heat in heating furnace, and cooling method is to cool off at normal temperatures.
Preferably, the processed in the described step e) is to grind in any mode in grinding machine, emery cloth, sand paper or abrasive band.
Preferably, the manufacture method of described radiator comprises that also step f) is socketed in groups of fins on the radiating end of heat pipe.
Description of drawings
Fig. 1 is the three-dimensional exploded view of radiator of the present invention;
Fig. 2 is the combination schematic diagram of radiator of the present invention;
Fig. 3 is another visual angle combination schematic diagram of Fig. 2 radiator;
Fig. 4 is the assembled sectional view of radiator of the present invention;
Fig. 5 is the combination schematic diagram that radiator of the present invention connects groups of fins, fan frame;
Fig. 6 is the user mode figure of heat sink applications of the present invention in pyrotoxin;
Fig. 7 is the assembled sectional view after the heat pipe of radiator of the present invention passes heat-conducting block;
Fig. 8 is that the heat pipe and the heat-conducting block of radiator of the present invention places on the mould, and the assembled sectional view behind the filling heat-conductive medium;
Fig. 9 is the assembled sectional view that take off from mould the radiator cooling back of Fig. 8.
In the accompanying drawing, the list of parts of each label representative is as follows:
Heat-conducting block 10
Body 11 non-open slots 12
13 chamferings 14 of boring a hole
Dull and stereotyped 15 location holes 16
Heat pipe 20
Heat absorbing end 21 radiating ends 22
Heat-conducting medium 30
Groups of fins 40
Fin 41 through holes 42
Framework 50
Fixed head 51
First fan, 60 second fans 61
Pyrotoxin 70
Mould 80
Groove 81 depressed areas 82
Embodiment
Relevant detailed description of the present invention and technology contents, accompanying drawings is as follows, yet accompanying drawing reference only is provided and be used for the explanation, be not to be used for the present invention is limited.
Referring to figs. 1 through shown in Figure 4, the invention provides a kind of radiator, it mainly comprises heat-conducting block 10 and at least one heat pipe 20, wherein:
Heat-conducting block 10 is made by the good material of thermal conductivity such as copper, and it comprises the body 11 of rectangular plate shape, is provided with the non-open slot 12 that at least one does not run through in the bottom surface of body 11.The non-open slot of present embodiment is made of four non-open slots 12 that are parallel to each other, and is provided with vertical perforation 13 respectively at the left and right both ends of non-open slot 12, has shaped chamfering 14 at each perforation apical margin of 13.In addition, the outside respectively horizontal-extending of apical margin is formed with flat board 15 around body 11, and is provided with a plurality of location holes 16 respectively at dull and stereotyped 15 place, left and right two ends.
The radical of heat pipe 20 depends on the height of the heat of pyrotoxin fully, present embodiment comprises four heat pipes, and these heat pipes 20 can be the kenel of U-shaped pipe, U-shaped elliptical tube, U-shaped rectangular pipe (as: temperature-uniforming plate) or other various different geometries, and it comprises heat absorbing end 21 and two radiating ends 22.Radiating end 22 is piercing in 4 holes 13 of wearing of heat-conducting block 10, and is connected in the non-open slot 12 of heat-conducting block 1 by the heat absorbing end 21 of heat-conducting medium 30 with heat pipe 20.
With reference to shown in Figure 5, radiator of the present invention also can comprise groups of fins 40.Groups of fins 40 is formed by a plurality of fin 41 mutual stacked combination, is provided with on each fin 41 corresponding to collinear through hole 42 (figure does not show).Through hole 42 wears connection for the radiating end 22 of each heat pipe 20.In addition, closed fan frame 50 at the exterior circumferential cover of heat pipe 20 and groups of fins 40, the bottom of fan frame 50 is concaved with fixed head 51.Fixed head 51 is provided with the hole of the location hole 16 of corresponding heat-conducting block 10, and is fixedly connected for fixation kits such as screw, rivets.
With reference to shown in Figure 6, can install first fan 60 and second fan 61 in the forward and backward both sides of fan frame 50 respectively, and radiator of the present invention is arranged on pyrotoxin 70 (as: central processing unit) top.Pyrotoxin 70 will produce high heat in operation, these heats will be directly from the surface conductive of pyrotoxin 70 on the heat absorbing end 21 and heat-conducting block 10 of each heat pipe 20, and by the gas-liquid phase heat transfer mechanism of each heat pipe 20 inside and the conduction of heat of heat-conducting block 10, with heat is derived fast band from, and by being serially connected in heat transmission, the diffusion of the groups of fins 40 on each heat pipe 20, reach the forced air supply of each fan 61,62, significantly promote the heat dissipation of radiator.
With reference to Fig. 7, Fig. 8 and shown in Figure 9, the invention provides a kind of manufacture method of radiator, its step is as follows:
A) at first, prepare radiator material, an end of heat pipe 20 is passed the perforation 13 of heat-conducting block 10, and the other end of heat pipe 20 is embedded in the non-open slot 12 of heat-conducting block 10.In this step, can be earlier at the heat absorbing end 21 inboard coated with thermally conductive media 30 of heat pipe 20, two radiating ends 22 with heat pipe 20 pass the perforation 13 of heat-conducting block 10 from lower to upper from the bottom of heat-conducting block 10 again, and the heat absorbing end 21 of heat pipe 20 is embedded in the non-open slot 12 of heat-conducting block 10.The top peripheral shape is corresponding cooperates for the heat absorbing end 21 of the peripheral shape of non-open slot 12 and heat pipe 20, so that heat pipe 20 is able to attach mutually contact (as shown in Figure 7) with 10 of heat-conducting blocks.
B) secondly, on the groove 81 that the heat-conducting block 10 after the combination and heat pipe 20 are arranged on mould 80 accordingly.In this step, owing to be provided with depressed area 82 (as shown in Figure 8) in the groove 81 of mould 80 and under the non-open slot 12 corresponding to heat-conducting block 10, so can be earlier in the depressed area 82 of heat absorbing end 21 outsides of heat pipe 20 and mould 80 each coated with thermally conductive medium 30, the flat board 15 of heat-conducting block 10 is crossed on the end face of mould 80, body 11 bottom surfaces of heat-conducting block 10 then are flattened on groove 81 surfaces of mould 80 again.
C) in addition, heat-conducting medium 30 is injected from the perforation 13 of heat-conducting block 10, and fill out the space that the depressed area 82 that is distributed in heat pipe 20, heat-conducting block 10 and mould 80 is surrounded.In this step, heat-conducting medium 30 can be made by materials such as tin creams, can heat-conducting medium 30 be injected from perforation 13 tops of heat-conducting block 10 by modes such as extruding, simultaneously by 13 chamferings 14 that are provided with of boring a hole, in the space that the depressed area 82 that makes heat-conducting medium 30 be easy to filling heat-conductive piece 10, heat pipe 20 and mould 80 is surrounded, heat-conducting medium 30 is covered with on chamfering 14, with replenishing as the heat-conducting medium 30 of heat fused.And moderately adjust the relativeness of heat pipe 20 and heat-conducting block 10, so that each heat pipe 20 is provided with perpendicular to heat-conducting block 10.
D) moreover, mould 80 heating so that heat-conducting medium 30 fusings are filled up aforesaid space and infiltrate, lower the temperature and is cooled off so that heat-conducting block 10 is connected with heat pipe 20.In this step, the heat-conducting block 10, heat pipe 20 and the mould 80 that are marked with heat-conducting medium 30 can be sent into the heating furnace heating, so that heat-conducting medium 30 is able to evenly infiltrate in the hole or slit of filling up 20 of heat-conducting block 10 and heat pipes, and, behind heat-conducting medium 30 expanded by heating, can make its liquid fluid not produce overflow phenomena by the chamfering 14 that perforation 13 is provided with.Cooling method then can place cooling under the normal temperature, again the radiator after this moulding is taken off (as shown in Figure 9) from mould 80.
E) in addition, make it form the plane to the radiator bottom surface processed after the moulding.In this step, because the heat-conducting medium 30 after the moulding protrudes from body 11 bottom surfaces of heat-conducting block 10, so can pass through surface grinding machine, emery cloth, sand paper or abrasive band etc., directly processing grinding is carried out in the bottom surface of radiator, and make the root edge of radiator in the same plane, wherein the heat-conducting medium 30 that is bonded at heat-conducting block 10 bottom surfaces can be removed fully, so that each root edge of heat-conducting block 10 and heat pipe 20 is in the same plane.
In addition, the manufacture method of radiator of the present invention can comprise that also step f) is socketed in groups of fins 40 on the radiating end 22 of heat pipe 20.In this step, be socketed in again on the heat pipe 20 after groups of fins 40 is can be with a plurality of fin 41 stacked mutually, or in regular turn with each fin 41 being socketed on the heat pipe 20 one by one.
Therefore, by above-mentioned steps flow chart, can obtain the manufacture method of radiator of the present invention.
By after the above-mentioned explanation as can be known, the present invention directly is contacted with on pyrotoxin 70 surfaces of electronic installation by heat absorbing end 21 root edges of heat pipe 20, and being tightly connected of 10 of heat pipe 20 and heat-conducting blocks, and is significantly increased the thermal conduction rate and the lifting heat dissipation of radiator.
Yet above-mentioned disclosed accompanying drawing and explanation are embodiments of the invention only, and the present invention is not limited thereto.Will be understood by those skilled in the art that according to feature category of the present invention, other equivalent transformation or the modification done all should be encompassed in the claim scope of the present invention.

Claims (10)

1. radiator, it comprises:
Heat-conducting block comprises plate-like body, is provided with the non-open slot that at least one does not run through in described body bottom surface, is provided with perforation in the end of described non-open slot; And
At least one heat pipe, it comprises heat absorbing end and radiating end, described radiating end passes the perforation of described heat-conducting block, and by heat-conducting medium described heat absorbing end is connected in the non-open slot of described heat-conducting block.
2. radiator as claimed in claim 1, wherein said heat-conducting block body is rectangular, and stretches out respectively at its apical margin and to be provided with flat board.
3. radiator as claimed in claim 1, the perforation top periphery of wherein said heat-conducting block is provided with chamfering.
4. radiator as claimed in claim 1, wherein said heat pipe are any of U-shaped pipe, U-shaped elliptical tube or U-shaped rectangular pipe.
5. radiator as claimed in claim 1, the root edge of wherein said heat-conducting block and described heat pipe is in the same plane.
6. radiator as claimed in claim 1, also comprise groups of fins, described groups of fins comprises a plurality of stacked fin mutually, and each described fin is provided with the through hole corresponding to the radiating end of described heat pipe, and the radiating end cross-under of described heat pipe is in the through hole of each described fin.
7. the manufacture method of a radiator, its step comprises:
A) prepare radiator material, an end of heat pipe is passed the perforation of heat-conducting block, and the other end of heat pipe is embedded in the non-open slot of heat-conducting block;
B) heat-conducting block and the heat pipe after will making up is arranged on the groove of mould accordingly;
C) heat-conducting medium is injected from the perforation of heat-conducting block, and fill out the space that the depressed area surrounded that is distributed in heat pipe, heat-conducting block and mould;
D) to mold heated so that heat-conducting medium fusing is filled up aforesaid space and infiltrate, lower the temperature again and is cooled off so that heat-conducting block is connected with heat pipe; And
E) make it form the plane to the radiator bottom surface processed after the moulding.
8. the manufacture method of radiator as claimed in claim 7, wherein the mode of heating in the step d) is to heat in heating furnace, cooling method is to cool off at normal temperatures.
9. the manufacture method of radiator as claimed in claim 7, wherein the processed in the step e) is to grind in any mode in grinding machine, emery cloth, sand paper or abrasive band.
10. the manufacture method of radiator as claimed in claim 7, it comprises that also step f) is socketed in groups of fins on the radiating end of heat pipe.
CN 200510132373 2005-12-21 2005-12-21 Heat radiator and its producing method Pending CN1988787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510132373 CN1988787A (en) 2005-12-21 2005-12-21 Heat radiator and its producing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510132373 CN1988787A (en) 2005-12-21 2005-12-21 Heat radiator and its producing method

Publications (1)

Publication Number Publication Date
CN1988787A true CN1988787A (en) 2007-06-27

Family

ID=38185374

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510132373 Pending CN1988787A (en) 2005-12-21 2005-12-21 Heat radiator and its producing method

Country Status (1)

Country Link
CN (1) CN1988787A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102065671B (en) * 2008-08-07 2012-07-18 鈤新科技股份有限公司 Method for combining evaporating ends of parallel heat pipes to fixed seat at same level
TWI410601B (en) * 2009-06-26 2013-10-01 Cpumate Inc A large area of ​​cooling fins, and a radiator with the fins
CN104080313A (en) * 2013-03-29 2014-10-01 奇鋐科技股份有限公司 Heat dissipation module
US9772143B2 (en) 2013-04-25 2017-09-26 Asia Vital Components Co., Ltd. Thermal module
CN107949174A (en) * 2017-12-04 2018-04-20 广州兴森快捷电路科技有限公司 The production method for burying copper billet circuit board
US10352625B2 (en) 2013-04-25 2019-07-16 Asia Vital Components Co., Ltd. Thermal module
CN110405411A (en) * 2019-04-04 2019-11-05 贵州航天风华精密设备有限公司 A kind of hinged shaft hole forming method of folding wing

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102065671B (en) * 2008-08-07 2012-07-18 鈤新科技股份有限公司 Method for combining evaporating ends of parallel heat pipes to fixed seat at same level
TWI410601B (en) * 2009-06-26 2013-10-01 Cpumate Inc A large area of ​​cooling fins, and a radiator with the fins
CN104080313A (en) * 2013-03-29 2014-10-01 奇鋐科技股份有限公司 Heat dissipation module
US9772143B2 (en) 2013-04-25 2017-09-26 Asia Vital Components Co., Ltd. Thermal module
US10352625B2 (en) 2013-04-25 2019-07-16 Asia Vital Components Co., Ltd. Thermal module
CN107949174A (en) * 2017-12-04 2018-04-20 广州兴森快捷电路科技有限公司 The production method for burying copper billet circuit board
CN110405411A (en) * 2019-04-04 2019-11-05 贵州航天风华精密设备有限公司 A kind of hinged shaft hole forming method of folding wing

Similar Documents

Publication Publication Date Title
CN104465562B (en) A kind of staggered MCA of chain type
CN1988787A (en) Heat radiator and its producing method
CN101533810A (en) Pulsating heat pipe radiator having foam
CN106887419B (en) Steam cavity combined radiator and electronic device
CN104167399A (en) Staggered complex micro-channel miniature heat exchanger
CN203276154U (en) Efficient heat dissipation device of computer CPU
CN104159437B (en) Composite heat dissipation device
CN111246708A (en) Heat sink and method for manufacturing the same
CN110662401B (en) Distance adjustable type's inside and outside double-deck high-efficient radiator between radiating fin
CN209297181U (en) A kind of high efficiency liquid circulation temperature control device
CN1988786A (en) Heat radiator and its producing method
CN105845648A (en) Microelectronic device tree-shaped radiator
CN203983257U (en) Complicated microchannel micro heat exchanger misplaces
CN207602730U (en) Water-cooled module
CN105101752A (en) Charger heat dissipation device
CN101619206A (en) Heat-conducting interface material and heat-radiating structure thereof
CN203814123U (en) Air-cooling heat dissipation device
CN206758609U (en) Battery heat-conductive assembly and there is its battery bag
CN105466261A (en) Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device
CN201166825Y (en) Water-cooled notebook computer radiator
CN209116853U (en) It is a kind of for producing the aluminium of radiator
CN101202255A (en) Semiconductor device radiator
CN210425391U (en) Cold and warm air conditioner
CN101155495B (en) Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device
CN109671690B (en) Multi-head spiral flow channel liquid cooler for heat dissipation of electronic component

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20070615

Address after: Taiwan, China

Applicant after: Huahong Precise Corp.

Address before: Taiwan, China

Applicant before: Hefu Heat Conduction Co., Ltd.

Co-applicant before: Chen Guoxing

Co-applicant before: Lin Xuanzhi

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: WATSON PRECISION CO.

Free format text: FORMER OWNER: HUAHONG PRECISE CORP.

Effective date: 20080926

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20080926

Address after: Chinese Taiwan Taipei City Beitou District Central Road 2 No. 37 3 floor

Applicant after: Huaxin Precision Co., Ltd.

Address before: Taiwan, China

Applicant before: Huahong Precise Corp.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20070627