CN1971586A - L-shaped twin-lens image collecting device used for paste solder printing - Google Patents
L-shaped twin-lens image collecting device used for paste solder printing Download PDFInfo
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- CN1971586A CN1971586A CN 200610123893 CN200610123893A CN1971586A CN 1971586 A CN1971586 A CN 1971586A CN 200610123893 CN200610123893 CN 200610123893 CN 200610123893 A CN200610123893 A CN 200610123893A CN 1971586 A CN1971586 A CN 1971586A
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Abstract
The invention discloses a L shape double lens image pick device for automatic vision tin cream printer which has two separated optical paths, collects separately the images of the steel mesh and the circuit board, each optical path includes: a beam splitter, a light source, a reflector, an image-forming lens and an imaging sensor, at each optical path, the reflector and the image-forming lens are on the two sides of the beam splitter, the imaging sensor behind the image-forming lens, the light source at other side of beam splitter, the optical axis of the image-forming lens and the light source are mutually perpendicular, the included angle between the beam splitter surface and the optical axis of the image-forming lens and the light source is 45degree, the included angle between the reflecting surface of reflector and the optical axis of the image-forming lens is 45degree. Two optical paths are separated and easy to adjust. It can collect the images of the steel mesh and the circuit board with high collecting speed at the same time.
Description
Technical field
The present invention relates to a kind of image collecting device, particularly relate to a kind of image collecting device that is used for paste solder printing.
Background technology
In the circuit board paste solder printing process that adopts the steel mesh typography, tin cream accurately is printed onto on the circuit board, the position that will print on the circuit board accurately need be aimed at the perforate on the steel mesh.The method that the aligning of steel mesh and circuit board generally adopts benchmark to aim at is being done mark in other words on steel mesh and the circuit board, when the markers align that guarantees in the processing when both correspondences, the position that will print on circuit board and the steel mesh is promptly aimed at the perforate on the steel mesh.The simplest benchmark alignment methods is a mechanical positioning, the benchmark of this method is the pilot hole of special processing on the circuit board, use one or several cylinder piston mechanism on the printing machine, during the location lance of piston is inserted in the pilot hole of PCB to reach the purpose of location.Its shortcoming is that bearing accuracy is poor, and speed is slow, because aperture, the location difference of different PCB, that have even do not have a pilot hole, therefore this method adaptation is poor, is difficult to adapt to high density, high production and the high-precision development trend that SMT produces, and this technology progressively is eliminated at present.
Along with electronic devices and components develop to directions such as chip type, microminiaturization, high density, more and more higher to the requirement of printing precision, speed and the reliability of stencil printer.Current in the SMT of high density circuit board production line, most defective is bad from the printing of tin cream.The main employing manual method of paste solder printing quality check, but artificial vision's inspection exists subjectivity strong, and repeatable poor, visual fatigue is easily brought problems such as erroneous judgement and omission.The artificial vision checks the supporting detection requirement that has been difficult to satisfy the SMT production line.
Adopt the stencil printer of machine vision technique can realize printing quality inspection in benchmark high-speed, high precision aligning, the printing process simultaneously.The image collecting device of the stencil printer of the type generally comprises low angle annular light source, two light sources, a spectroscope, a reflective mirror, an imaging len, an imageing sensor at present.During work, any one of two light sources that is arranged in different level is luminous, light source is through spectroscope irradiation irradiation steel mesh or circuit board, reflected back spectroscope then, again through the reflective mirror refraction of optical beam to imaging len, imaging on imageing sensor at last, the image of Huo Deing is the stack of circuit board and steel mesh image like this, by analysis image, can draw locating information.Also can control the switch of light source by timesharing, thereby timesharing photographs the image of steel mesh and PCB.The advantage of this method is that light path is simple and cost is low, but light path adjustment difficulty relatively, and the while is the image analysis algorithm complexity during images acquired, and the acquisition time image is then more consuming time, also has a small amount of ghost image; And device size on optical path direction up and down is bigger, like this benchmark aim at and during print inspection between circuit board and the steel mesh apart from corresponding also bigger.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art, a kind of compact conformation is provided, light path is separate, adjustment is easy, can gather the image of steel mesh and circuit board simultaneously, the image collecting device of steel mesh that picking rate is fast and circuit board reference measurement and paste solder printing process check.
For solving the problems of the technologies described above, the present invention is achieved through the following technical solutions:
A kind of L type double lens image acquisition apparatus that is used for paste solder printing, has the two independent light path, gather the image of steel mesh and circuit board respectively, each light path comprises a spectroscope, a light source, a catoptron, an imaging len and an imageing sensor.In each light path, catoptron and imaging len are positioned at the spectroscope both sides, after imageing sensor is positioned at imaging len, light source is positioned at spectroscopical opposite side, the optical axis of imaging len and light source is vertical mutually, the optical axis of spectroscopical light splitting surface and imaging len and the optical axis included angle of light source are 45 °, and the angle of the reflecting surface of catoptron and the optical axis of imaging len also is 45 °.
Described catoptron also can be two reflecting optics, can also be a right-angle prism that two reflectings surface are arranged.
Described spectroscope is two right-angle prisms that are stacked together, and also can be the spectroscope of a rectangular parallelepiped, can also be made up of one or two light splitting piece.
Described imageing sensor is the CCD camera or the CMOS camera of analog or digital.
As a kind of preferred structure of the present invention, this image collecting device also comprises a low angle annular light source.
As the further preferred structure of the present invention, the low angle annular light source is the LED annular light source.
The present invention compared with prior art has following advantage and beneficial effect:
The image collecting device that the present invention relates to has two independent light paths up and down, gather respectively steel mesh down with the image of circuit board towards upside, the light path adjustment is easy, can gather steel mesh and circuit board image simultaneously, image acquisition speed is fast, and compact conformation is easy to realize.
Description of drawings
Fig. 1 is the stereographic map of image collecting device of the present invention.
Fig. 2 is the vertical view of image collecting device of the present invention.
Fig. 3 is the front elevation of the image collecting device course of work of the present invention.
Fig. 4 is an image collecting device upward view of the present invention.
Fig. 5 is an image collecting device right view of the present invention.
Fig. 6 is image collecting device and image acquisition control and treating apparatus and a locating device formation structural representation among the embodiment.
Shown in the figure: 1 and the 2-catoptron; 3-low angle LED annular light source; 4 and the 5-spectroscope; 6 and the 7-LED light source; 8 and the 10-imaging len; 9 and the 11-imageing sensor; The described image collecting device of 12-this patent; The 13-steel mesh; The 14-circuit board; The 15-locating device; Control of 16-image acquisition and treating apparatus.
Embodiment
In order to understand the present invention better, the present invention is done to describe further below in conjunction with drawings and Examples.
Shown in Fig. 1,2,3,4,5, a kind of image collecting device that is used for paste solder printing comprises reflective mirror 1 and 2, low angle annular light source 3, spectroscope 4 and 5, light source 6 and 7, imaging len 8 and 10, imageing sensor 9 and 11.Device two light paths up and down is independent, gather steel mesh and circuit board image respectively, catoptron 1,2 and imaging len 8,10 lay respectively at the both sides of spectroscope 4,5, imaging len 8 (or 10) is vertical mutually with the optical axis of light source 6 (or 7), and spectroscope 4 and 5 light splitting surface and the optical axis included angle of imaging len 8 and light source 6,7 are 45 °; The emergent light of light source 6,7 is distinguished directive steel mesh 13 and circuit board 14 again through 90 ° of toward mirror 1,2 of spectroscope 4,5 reflections after mirror reflects, annular light source 3 is positioned at catoptron 2 belows, for circuit board 14 provides side lighting; Catoptron 2 downward beam reflected are passed annular light source 3 center pits and are shone circuit board 14; To spectroscope 4, the folded light beam of circuit board 14 shines bottom reflective mirror 2 after then passing the center pit of annular light source 3 earlier to the folded light beam of steel mesh 13, through its reflected back spectroscope 5 through 90 ° of catoptron 1 reflections; Catoptron 1 and 2 is two isosceles right-angle prisms that are stacked together, and catoptron also can be two reflecting optics, can also be a right-angle prism that two reflectings surface are arranged. Spectroscope 4 and 5 is two right-angle prisms that are stacked together, and also can be the spectroscope of a rectangular parallelepiped, can also be one or two light splitting piece; Partial reflection light from steel mesh or circuit board reflects 90 ° of irradiations to light source 6,7 through spectroscope 4,5, another part light then enters imaging len 8 and 10 through spectroscope 4,5 refractions, respectively in imageing sensor 9 and 11 imagings, imageing sensor 9 and 10 is the CCD camera or the CMOS camera of analog or digital, imageing sensor is analog voltage signal or digital signal with image transitions, sends Computer Processing to.
As shown in Figure 6, in order to cooperate image collecting device work of the present invention, also need image acquisition control and treating apparatus 16 and locating device 15.Image acquisition control and treating apparatus 16 are made up of with multi-purpose computer and storer shooting controller, image pick-up card, register control and image processing module.The controller of wherein making a video recording is connected with 11 with the led light source 6,7 and the imageing sensor 9 of image collecting device of the present invention respectively, controls the illumination of led light source 6,7 respectively, and the image acquisition of control chart image-position sensor 9 and 11.Image pick-up card is exported with 11 vision signal with imageing sensor 9 and is connected, and converts image video signal to digital signal.The locating device controller is connected with locating device 15, image collecting device 12 is installed on the locating device 15, during images acquired, according to specified coordinate information, locating device 15 is sent image collecting device 12 into assigned address between steel mesh 13 and the circuit board 14, image collecting device 12 is gathered steel mesh simultaneously towards board side and the circuit board image towards the steel mesh side, and image acquisition process is finished by procedure auto-control, and the image and the result of collection are kept in the storer.
When using image collecting device of the present invention, the light that led light source 6 and 7 sends reflects 90 ° of irradiations to reflective mirror 1 and 2 through spectroscope 4 and 5, catoptron 1 upwards reflexes to steel mesh 13 with light, catoptron 2 reflects light downwards, the center pit that light beam passes annular light source 3 shines on the circuit board 11, and annular light source provides side lighting for the circuit board collection.The light that reflects from steel mesh 10 reflects to spectroscope 4 through catoptron 1; The center pit that the light beam that reflects from circuit board 14 passes annular light source 3 shines catoptron 2, reflects to spectroscope 5 again.The reflected light about 50% of returning from catoptron 1 and 2 to light source 6 and 7,50% enters imaging len 8 and 10 through spectroscope 4 and 5 refractions through spectroscope 4 and 90 ° of irradiations of 5 reflections in addition, at last this up and down two-way light respectively in imageing sensor 9 and 11 imagings.
When being used for reference measurement, by image collecting device of the present invention, can collect the image that is positioned at the reference point on circuit board 14 and the steel mesh 13 simultaneously, convert digital signal input computing machine to through image pick-up card, can calculate the coordinate of two reference points, and carry out further variance analysis, and then can realize benchmark high-speed, high precision aligning.
When being used for the paste solder printing inspection, by image collecting device of the present invention, the image of collecting circuit board 14 and steel mesh 13 simultaneously, convert the picture signal of gathering to digital signal through image pick-up card, the input computing machine, and with computing machine in the standard form information of preserving compare, thereby but the mesh chocking-up degree of the paste solder printing quality of check circuit plate and steel mesh.
Image collecting device of the present invention has two independent light paths up and down, gathers the image of steel mesh downside and circuit board upside simultaneously.Light path is easy to adjust, easily gets a distinct image, and has higher image acquisition speed, and whole device is installed on the body, compact conformation.
Can better implement the present invention as mentioned above.
Claims (10)
1, a kind of L type double lens image acquisition apparatus that is used for paste solder printing, it is characterized in that: described image collecting device has the two independent light path, gather the image of steel mesh and circuit board respectively, each light path comprises spectroscope, light source, catoptron, each one of imaging len and imageing sensor, in each light path, catoptron and imaging len are positioned at the spectroscope both sides, after imageing sensor is positioned at imaging len, light source is positioned at spectroscopical opposite side, the optical axis of imaging len and light source is vertical mutually, the optical axis of spectroscopical light splitting surface and imaging len and the optical axis included angle of light source are 45 °, and the angle of the reflecting surface of catoptron and the optical axis of imaging len also is 45 °.
2, L type double lens image acquisition apparatus according to claim 1, it is characterized in that: described image collecting device also comprises a low angle annular light source, described low angle annular light source is between circuit board and catoptron, for circuit board provides side lighting, the downward beam reflected of catoptron is passed the annular light source center pit and is shone circuit board.
3, L type double lens image acquisition apparatus according to claim 2, it is characterized in that: described low angle annular light source is the LED annular light source.
4, L type double lens image acquisition apparatus according to claim 1, it is characterized in that: described catoptron is an isosceles right-angle prism.
5, L type double lens image acquisition apparatus according to claim 1 is characterized in that: described catoptron also can be the plane mirror sheet.
6, L type double lens image acquisition apparatus according to claim 1 is characterized in that: described catoptron can also have the right-angle prism of two reflectings surface to constitute by one.
7, L type double lens image acquisition apparatus according to claim 1, it is characterized in that: described imageing sensor is ccd sensor or cmos sensor.
8, L type double lens image acquisition apparatus according to claim 1, it is characterized in that: described spectroscope is to be made of or the spectroscope of a rectangular parallelepiped two right-angle prisms that are stacked together, or the spectroscope of being made up of one or two light splitting piece.
9, according to any described L type double lens image acquisition apparatus of claim 1～8, it is characterized in that: described catoptron, spectroscope, light source, imaging len and imageing sensor are for stacking formation up and down.
10, according to any described L type double lens image acquisition apparatus of claim 1～8, it is characterized in that: described light source is connected with the shooting controller of image acquisition control and treating apparatus respectively with imageing sensor, the switch of control light source, and and then the collection of control steel mesh and circuit board image; The VT of imageing sensor also with the image acquisition card connection of image acquisition control and treating apparatus, make the image video signal of collection convert digital signal to.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101238934A CN100421453C (en) | 2006-11-30 | 2006-11-30 | L-shaped twin-lens image collecting device used for paste solder printing |
| CA2594884A CA2594884C (en) | 2006-11-30 | 2007-07-26 | Imaging apparatus for fully automatic screen printer |
| US11/836,497 US8115973B2 (en) | 2006-11-30 | 2007-08-09 | Imaging apparatus for fully automatic screen printer |
| DE602007011382T DE602007011382D1 (en) | 2006-11-30 | 2007-09-21 | Imaging device for a fully automatic screen printer |
| EP07253746A EP1928219B1 (en) | 2006-11-30 | 2007-09-21 | Imaging apparatus for fully automatic screen printer |
| HK08111680.4A HK1121904A1 (en) | 2006-11-30 | 2008-10-23 | Imaging apparatus for fully automatic screen printer |
| US13/092,677 US20120098956A1 (en) | 2006-11-30 | 2011-04-22 | Imaging apparatus for fully automatic screen printer |
| US13/155,036 US20110234870A1 (en) | 2006-11-30 | 2011-06-07 | Imaging apparatus for fully automatic screen printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101238934A CN100421453C (en) | 2006-11-30 | 2006-11-30 | L-shaped twin-lens image collecting device used for paste solder printing |
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| Publication Number | Publication Date |
|---|---|
| CN1971586A true CN1971586A (en) | 2007-05-30 |
| CN100421453C CN100421453C (en) | 2008-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006101238934A Active CN100421453C (en) | 2006-11-30 | 2006-11-30 | L-shaped twin-lens image collecting device used for paste solder printing |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524916A (en) * | 2016-12-09 | 2017-03-22 | 东莞创视自动化科技有限公司 | Visual aligning module group for ghost-removing and method thereof |
| CN107270823A (en) * | 2017-07-28 | 2017-10-20 | 深圳市兴华炜科技有限公司 | A kind of steel mesh thickness detecting equipment and detection method |
| CN107678105A (en) * | 2017-10-24 | 2018-02-09 | 武汉电信器件有限公司 | A kind of optical assembly coupling device and its application method |
| CN109927401A (en) * | 2019-01-31 | 2019-06-25 | 中国科学院西安光学精密机械研究所 | A kind of high accuracy prints machine double light path machine vision device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2686534Y (en) * | 2002-05-16 | 2005-03-23 | 于翔 | Fiugerprint and palm print collecting instrument |
| CN1246801C (en) * | 2003-10-27 | 2006-03-22 | 苏州孔雀信天游电子有限公司 | Optical fingerprint collector |
| JP2006105926A (en) * | 2004-10-08 | 2006-04-20 | Nikon Corp | Inspection apparatus |
| CN200980119Y (en) * | 2006-11-30 | 2007-11-21 | 华南理工大学 | L-type dual-lens image-acquisition device for solder paste printing process |
-
2006
- 2006-11-30 CN CNB2006101238934A patent/CN100421453C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524916A (en) * | 2016-12-09 | 2017-03-22 | 东莞创视自动化科技有限公司 | Visual aligning module group for ghost-removing and method thereof |
| CN106524916B (en) * | 2016-12-09 | 2022-07-19 | 东莞创视自动化科技有限公司 | Double-image-removing visual alignment module and method thereof |
| CN107270823A (en) * | 2017-07-28 | 2017-10-20 | 深圳市兴华炜科技有限公司 | A kind of steel mesh thickness detecting equipment and detection method |
| CN107678105A (en) * | 2017-10-24 | 2018-02-09 | 武汉电信器件有限公司 | A kind of optical assembly coupling device and its application method |
| CN109927401A (en) * | 2019-01-31 | 2019-06-25 | 中国科学院西安光学精密机械研究所 | A kind of high accuracy prints machine double light path machine vision device |
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| CN100421453C (en) | 2008-09-24 |
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