CN1970826A - Vacuum deposition device and method therefor - Google Patents
Vacuum deposition device and method therefor Download PDFInfo
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- CN1970826A CN1970826A CN 200510101739 CN200510101739A CN1970826A CN 1970826 A CN1970826 A CN 1970826A CN 200510101739 CN200510101739 CN 200510101739 CN 200510101739 A CN200510101739 A CN 200510101739A CN 1970826 A CN1970826 A CN 1970826A
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- vacuum deposition
- shower nozzle
- deposition apparatus
- vacuum
- worktable
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Abstract
The invention discloses a vacuum depositing device and method, which comprises the following parts: vacuum cavity, injector, gas supplying pipe, diffusing device and working bench, wherein the injector and working bench are set in the vacuum cavity with multiple air holes on the injector; the gas supplying pipe connects air hole; the diffusing device is fixed on the injector.
Description
[technical field]
The invention relates to a kind of vacuum deposition apparatus and vacuum deposition method, be meant a kind of vacuum deposition apparatus and vacuum deposition method that is used for the organic light emitting display film substrate especially.
[background technology]
Organic light emitting display (Organic Lighting Emitting Display, abbreviation OLED) generally includes multilayer film structures such as electron injecting layer, electron transfer layer, luminescent layer, hole transmission layer and hole injection layer, this multilayer film structure generally forms by film, and the film thickness distribution of its each layer film has bigger influence to the quality of organic electro-luminescent display.
Industry mainly comprises two kinds of films.A kind of is ink-jet (Ink-jet Printing) method, be about to shower nozzle and be full of liquid material to be plated,, it is sprayed onto in the substrate of desiring plated film by adding the thermogenesis bubble or other method is pushed this liquid material, this method requires droplets of materials small, accurately realizes even film forming thereby get ready.Another kind method is a vacuum vapour deposition, promptly under vacuum condition deposition material is heated, and makes its fusion, evaporation back pass through the shower nozzle uniform deposition in the substrate of desiring plated film, and the cooling back forms thin film at this substrate surface.
In vacuum vapour deposition, for improving the homogeneity of substrate evaporation thickness, general vacuum deposition apparatus utilizes a strip (Bar-Type) shower nozzle, this shower nozzle is provided with row's gas port, substrate is placed on the worktable of shower nozzle below, steam is derived by gas port, by the displacement between shower nozzle and its lower table, with the steam more uniform deposition in this substrate.
Please consult Fig. 1 and Fig. 2 simultaneously, Fig. 1 is the structural representation of prior art vacuum deposition apparatus, and Fig. 2 is the left view of vacuum deposition apparatus shown in Figure 1.This vacuum deposition apparatus 1 comprises a vacuum chamber 11, a shower nozzle 12, a worktable 13 and an airway 15.This shower nozzle 12 and this worktable 13 are oppositely arranged in this vacuum chamber 11, and this shower nozzle 12 is long strip shapes, and it has a cavity 122, and this cavity 122 is connected with this airway 15.Further be provided with a plurality of gas ports 121 on this shower nozzle 12, this gas port 121 equidistantly is distributed on this shower nozzle 12.
Adopt the vacuum deposition method of this vacuum deposition apparatus 1 as described below: at first, substrate 21 to be plated to be placed on this worktable 13; Secondly, provide an air extractor (figure does not show) that this vacuum chamber 11 is evacuated; At last, keep this vacuum chamber 11 and be vacuum state, provide steam by this airway 15 to this shower nozzle 12, simultaneously, this shower nozzle 12 begins to move with respect to this worktable 13 under mechanical arm (figure does not show) control, and steam is deposited in this substrate 21 by this cavity 122 and through these gas port 121 ejections.
See also Fig. 3, Fig. 3 is the flow of vapor action synoptic diagram of this vacuum deposition apparatus 1.Steam to be plated enters the cavity 122 of this shower nozzle 12 by this airway 15, is deposited in this substrate 21 by these gas port 121 ejections behind these cavity 122 internal diffusion.But, because this gas port 121 is a uniform distribution, and this steam is when this gas port 121 and non-uniform Distribution, bigger from the steam flow velocity and the density of gas port 121 ejection of centre part, less from the flow velocity and the density of the steam of gas port 121 ejection of peripheral portion, thereby cause the thickness of deposited film middle portion of this substrate 21 bigger easily, peripheral portion is less.
[summary of the invention]
In order to overcome the phenomenon of existing vacuum deposition apparatus evaporation inequality, provide a kind of inhomogeneity vacuum deposition apparatus of evaporation that improves in fact for necessary.
In order to overcome the phenomenon of existing vacuum deposition apparatus evaporation inequality, provide a kind of inhomogeneity vacuum deposition method of evaporation that improves in fact for necessary.
A kind of vacuum deposition apparatus comprises a vacuum chamber, a shower nozzle, a worktable, an airway and a dispersion device.This shower nozzle and this worktable are oppositely arranged in this vacuum chamber, and this shower nozzle is provided with a plurality of gas ports, and this airway is connected with this gas port, and this dispersion device is fixed on this shower nozzle.
A kind of vacuum deposition method may further comprise the steps: a vacuum deposition apparatus is provided, and this vacuum deposition apparatus has a vacuum chamber, a worktable, a shower nozzle and a dispersion device; One substrate to be plated is placed on this worktable; This vacuum chamber is evacuated; Keeping this vacuum chamber is vacuum state, provides a steam to enter this shower nozzle by this airway, slows down, is diffused as uniform distribution through this shower nozzle and this dispersion device, and simultaneously, this shower nozzle moves continuously with respect to this worktable, with the even evaporation of steam in this substrate.
Compared to prior art, the dispersion device of vacuum deposition apparatus of the present invention can slow down the effusive steam of shower nozzle and be diffused as than uniform distribution, thereby effectively improves the evaporation homogeneity.
[description of drawings]
Fig. 1 is the structural representation of the vacuum deposition apparatus of prior art.
Fig. 2 is the left view of vacuum deposition apparatus shown in Figure 1.
Fig. 3 is the flow of vapor action synoptic diagram of vacuum deposition apparatus shown in Figure 1.
Fig. 4 is the structural representation of vacuum deposition apparatus first embodiment of the present invention.
Fig. 5 is the left view of vacuum deposition apparatus shown in Figure 4.
Fig. 6 is the diffuser plate floor map of vacuum deposition apparatus shown in Figure 4.
Fig. 7 is the structural representation of vacuum deposition apparatus second embodiment of the present invention.
Fig. 8 is the floor map of the diffuser plate of vacuum deposition apparatus shown in Figure 7.
[embodiment]
Please consult Fig. 4 and Fig. 5 simultaneously, Fig. 4 is the structural representation of vacuum deposition apparatus first embodiment of the present invention, and Fig. 5 is the left view of evaporation coating device shown in Figure 4.Vacuum deposition apparatus 3 of the present invention comprises a vacuum chamber 31, a shower nozzle 32, a worktable 33, a diffuser plate 34 and an airway 35.
This vacuum chamber 31 is one can provide the cavity of vacuum condition, himself has air extractor (figure does not show), and this air extractor can continuous firing, keeps this vacuum chamber 31 and is vacuum state.This shower nozzle 32 is oppositely arranged in this vacuum chamber with this worktable 33, this shower nozzle 32 is provided with a plurality of gas ports 321, this airway 35 is connected with this gas port 321, and it provides steam to this shower nozzle 32 in the course of the work, and this diffuser plate 34 is fixed on this shower nozzle 32.Please consult Fig. 6 simultaneously, Fig. 6 is the plane structure chart of this diffuser plate 34, this diffuser plate 34 is provided with a plurality of perforates 341, this perforate 341 is distributed on this diffuser plate 34, its shape is cylindrical, this perforate 341 becomes region intermediate thinner according to the flow of vapor characteristics design, the distribution that outer peripheral areas is closeer, thus will be uniform distribution from these gas port 321 effusive vapor diffusion.
These vacuum deposition apparatus 3 used vacuum deposition methods may further comprise the steps: at first, a substrate 41 to be plated is placed on this worktable 33; Secondly, this vacuum chamber 31 is vacuumized; At last, keep this vacuum chamber 31 and be vacuum state, provide a steam successively by this airway 35, this shower nozzle 32 and 34 ejections of this diffuser plate, simultaneously, this shower nozzle 32 moves continuously with respect to this worktable 33, will be from the continuously even evaporation of the steam of these diffuser plate 34 ejections in this substrate 41.
With respect to prior art, the diffuser plate 34 of vacuum deposition apparatus 3 of the present invention can slow down the steam of the flow velocity of shower nozzle 32 ejection, density unevenness and be diffused as uniform distribution through the perforate 341 of the skewness of this diffuser plate 34, thereby effectively improves the evaporation homogeneity.
The perforate 341 of this vacuum deposition apparatus 3 can also be conical, other shapes such as cube taper or regular prism shape, and the pore size of this perforate 341 can be designed to inequality as required.This vacuum deposition apparatus 3 may further include a mask plate that is arranged in this vacuum chamber 31, in order to obtain needed evaporation figure.The steam that this airway 35 imports is the small molecule material steam.The diffuser plate 34 of the type also can be used in 41 sizable evaporation coating devices of shower nozzle 32 and substrate.
See also Fig. 7, Fig. 7 is the structural representation of vacuum deposition apparatus second embodiment of the present invention.The structural similitude of the structure of this vacuum deposition apparatus 5 and the vacuum deposition apparatus of first embodiment of the invention 3, it comprises a vacuum chamber 51, a shower nozzle 52, a worktable 53, a diffuser plate 54 and an airway 55.This vacuum deposition apparatus 5 is with the difference of this vacuum deposition apparatus 3: this diffuser plate 54 is one the diffuser plate of at least one slit to be set.See also Fig. 8, Fig. 8 is the floor map of this diffuser plate 54.This diffuser plate 54 is provided with at least one slit 541, these slit 541 parallel being distributed on this diffuser plate 54, its shape is a rectangle, it is provided with a plurality of flow-disturbings gap 542, these flow-disturbing gap two orthogonal wires of son 542 usefulness are fixed on this slit 541, it is the octahedral build, the surface is a smooth structure, its regularity of distribution is that region intermediate is closeer, both sides are thinner, and can this flow-disturbing gap 542 be moved along this slit 541 by the wire of regulating perpendicular to this slit 541, the effect of this flow-disturbing gap 542 is to slow down flow of vapor speed, makes steam slowly diffuse into uniform distribution.
Evaporation is carried out in 5 pairs of substrates of this vacuum deposition apparatus 61, and the used evaporation coating method of the evaporation coating device of its used evaporation coating method and first embodiment of the invention 3 is similar.Different is, this evaporation coating device 5 is to utilize a plurality of flow-disturbings gap 542 to slow down from the steam of shower nozzle 52 ejections and diffuse into uniform distribution, improves the inhomogeneity purpose of evaporation thereby reach.And the steam ejiction opening of this diffuser plate 54 is slits, and area is bigger, can prevent effectively that steam is deposited on this diffuser plate 54 and causes stopping up the phenomenon of steam ejiction opening.
Flow-disturbing gap 542 of this vacuum deposition apparatus 5 can also be an olive shape, and dish waits other shape, and the surface also can have other structures such as striped or screw thread.This flow-disturbing gap 542 also can be fixed on this slit 541 with trip.This vacuum deposition apparatus 5 can further include a mask plate that is arranged in this vacuum chamber 51, is used for obtaining needed evaporation pattern.The diffuser plate 54 of the type also can be used in shower nozzle 52 and 61 sizable evaporation coating devices of substrate.
Claims (10)
1. vacuum deposition apparatus, it comprises a vacuum chamber, a shower nozzle, a worktable and an airway, this shower nozzle is arranged in this vacuum chamber, it is provided with a plurality of gas ports, this worktable and this shower nozzle are oppositely arranged in this vacuum chamber, this airway is connected with this gas port, it is characterized in that: this vacuum deposition apparatus further comprises a dispersion device, and it is fixed on this shower nozzle.
2. vacuum deposition apparatus as claimed in claim 1 is characterized in that: this dispersion device is the diffuser plate that is provided with a plurality of perforates.
3. vacuum deposition apparatus as claimed in claim 2 is characterized in that: this perforate is distributed as region intermediate and dredges, and two side areas is close.
4. vacuum deposition apparatus as claimed in claim 1 is characterized in that: this dispersion device is to be provided with the diffuser plate that at least one slit and this slit are provided with a plurality of flow-disturbings gap.
5. vacuum deposition apparatus as claimed in claim 4 is characterized in that: close in the middle of this flow-disturbing gap is distributed as, dredge both sides.
6. vacuum deposition apparatus as claimed in claim 4 is characterized in that: this flow-disturbing gap is fixed on this slit place with wire or trip.
7. vacuum deposition apparatus as claimed in claim 1 is characterized in that: it further comprises a mask plate that is arranged on this worktable.
8. vacuum deposition method, it may further comprise the steps: a vacuum deposition apparatus is provided, it comprises a vacuum chamber, a shower nozzle, a worktable, an airway and a dispersion device, this shower nozzle and this worktable are relatively arranged in this vacuum chamber, this airway is connected with this shower nozzle, and this dispersion device is fixed on this shower nozzle; One substrate is placed on this worktable; This vacuum chamber is vacuumized; Provide a steam to import this evaporation coating device, be diffused as uniform distribution through this dispersion device by this airway, move simultaneously this shower nozzle with this steam continuously evenly evaporation in this substrate.
9. vacuum deposition method as claimed in claim 8 is characterized in that: this dispersion device is the diffuser plate that is provided with a plurality of perforates.
10. vacuum deposition method as claimed in claim 8 is characterized in that: this dispersion device is the diffuser plate that is provided with at least one slit, and this slit is provided with a plurality of flow-disturbings gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510101739 CN1970826A (en) | 2005-11-24 | 2005-11-24 | Vacuum deposition device and method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510101739 CN1970826A (en) | 2005-11-24 | 2005-11-24 | Vacuum deposition device and method therefor |
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| CN1970826A true CN1970826A (en) | 2007-05-30 |
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| CN 200510101739 Pending CN1970826A (en) | 2005-11-24 | 2005-11-24 | Vacuum deposition device and method therefor |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101816984A (en) * | 2010-05-06 | 2010-09-01 | 上海大学 | Mixed gas diffusion sprayer |
| CN103760696A (en) * | 2014-01-21 | 2014-04-30 | 深圳市华星光电技术有限公司 | Photo-resistor drying device |
| TWI572734B (en) * | 2015-11-11 | 2017-03-01 | 鴻海精密工業股份有限公司 | Vacuum evaporation device |
| TWI572730B (en) * | 2015-11-11 | 2017-03-01 | 鴻海精密工業股份有限公司 | Vacuum evaporation method |
| CN106944420A (en) * | 2017-05-16 | 2017-07-14 | 上海稷以科技有限公司 | Air-guide rod, vacuum chamber and vacuum plasma equipment |
| CN110665700A (en) * | 2019-11-17 | 2020-01-10 | 邳州润丰格物科技有限公司 | Spraying device for manufacturing conductive film |
-
2005
- 2005-11-24 CN CN 200510101739 patent/CN1970826A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101816984A (en) * | 2010-05-06 | 2010-09-01 | 上海大学 | Mixed gas diffusion sprayer |
| CN103760696A (en) * | 2014-01-21 | 2014-04-30 | 深圳市华星光电技术有限公司 | Photo-resistor drying device |
| TWI572734B (en) * | 2015-11-11 | 2017-03-01 | 鴻海精密工業股份有限公司 | Vacuum evaporation device |
| TWI572730B (en) * | 2015-11-11 | 2017-03-01 | 鴻海精密工業股份有限公司 | Vacuum evaporation method |
| CN106944420A (en) * | 2017-05-16 | 2017-07-14 | 上海稷以科技有限公司 | Air-guide rod, vacuum chamber and vacuum plasma equipment |
| CN110665700A (en) * | 2019-11-17 | 2020-01-10 | 邳州润丰格物科技有限公司 | Spraying device for manufacturing conductive film |
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