CN1964025A

CN1964025A - Heat radiator

Info

Publication number: CN1964025A
Application number: CN 200510101256
Authority: CN
Inventors: 夏万林; 李涛; 校敏奇; 张军; 秦际云
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-11-10
Filing date: 2005-11-10
Publication date: 2007-05-16
Anticipated expiration: 2025-11-10
Also published as: CN100481408C

Abstract

The related radiator comprises: a base fit to contact with the electronic heating element, some fins on base, a first heat pipe with ends connected with the base and fins respectively, and a second heat pipe embedded on base. This invention applies two heat pipes to make heat distribute to whole radiator fast, and improves radiator performance.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, be meant a kind of heat-pipe radiating apparatus of cooling electronic components especially.

[background technology]

Along with developing rapidly of electronic industry, increase substantially as the arithmetic speed of electronic component in the computer, the heat of its generation also increases severely thereupon, and how the heat with electronic component distributes, and to guarantee its normal operation, is the essential problem that solves of dealer always.As everyone knows, the central processing unit that is installed on the motherboard is the core of computer system, and when computer moved, central processing unit produced heat.Too much heat can cause central processing unit normally to move.For effectively distributing the heat that central processing unit produces in running, install a heat abstractor thereon additional usually so that the heat of its generation is distributed.

Fig. 1 and Fig. 2 disclose a traditional heat abstractor, this heat abstractor comprises a radiator 100 and a pair of and radiator 100 hot linked heat pipes 200, radiator 100 is made by the thermal conductivity good metal, it comprises two flat base 102 of being separated by and being provided with, each pedestal 102 is provided with two holes (figure is mark not), some radiating fins 104 are folded between two pedestals 102, wherein a pedestal 102 places on the central processing unit 300, heat pipe 200 setting that takes the shape of the letter U, the two ends of heat pipe 200 connect corresponding hole on two pedestals 102 respectively.When this heat abstractor uses, place the pedestal 102 on the central processing unit 300 to absorb the heat that central processing units 300 produce, accumulate in the bottom that a heat part on the pedestal 102 is passed to radiating fin 104; Another part heat is passed on another relative pedestal 102 by heat pipe 200, then is passed to radiating fin 104 tops; Yet the pedestal 102 of this kind heat abstractor can not be distributed to whole pedestal 102 rapidly and uniformly with the heat that absorbs from central processing unit 300, thereby cause heat not to be passed to radiating fin 104 rapidly and effectively, this shows that the heat transfer efficiency of this heat abstractor is lower.

[summary of the invention]

In view of this, be necessary to provide a kind of heat-pipe radiating apparatus.

A kind of heat abstractor, comprise that one can and be located at some radiating fins on the pedestal with the heat-generating electronic elements substrate contacted, one first heat pipe, one end connects said base, and the other end contacts with radiating fin, and this heat abstractor also comprises second heat pipe that is embedded on the pedestal.

Compared to prior art, described heat abstractor comprises first and second heat pipe, wherein first heat pipe can be with heat transferred to the radiating fin top, second heat pipe is embedded at and can makes heat be distributed in whole pedestal fast on the pedestal, thereby promote the heat transmission of pedestal to radiating fin, the distribution mode of these two kinds of heat pipes is used in combination heat is distributed in the entire heat dissipation device fast, thereby makes the performance boost of entire heat dissipation device.

The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.

[description of drawings]

Fig. 1 is the combination schematic diagram of traditional heat-dissipating device.

Fig. 2 is the sectional view along Fig. 1 center line V-V.

Fig. 3 is the three-dimensional exploded view of heat abstractor of the present invention.

Fig. 4 is the constitutional diagram of pedestal and second heat pipe among Fig. 3.

Fig. 5 is the constitutional diagram of Fig. 1.

[embodiment]

See also Fig. 3 and Fig. 4, heat abstractor of the present invention is in order to place the heat-generating electronic elements 42 on the circuit board 40 to dispel the heat to one, this heat abstractor comprises that one places pedestal 12 on the heat-generating electronic elements 42, and the be separated by top board 14 that be provided with and be folded in pedestal 12 with some radiating fins 16, a pair of first heat pipe 20 top board 14 between be connected this pedestal 12 and radiating fin 16 and a pair of second heat pipe 30 that be embedded at pedestal 12 and bending extension parallel with pedestal 12, and wherein each radiating fin 16 relative two edges is welded to connect pedestal 12 and top board 14.

Pedestal 12 is by the thermal conductivity good metal, and for example copper or aluminium are made, the end face that this pedestal 12 has a bottom surface and is oppositely arranged with the bottom surface, and wherein this bottom surface is in order to contact with electronic component 42.Pedestal 12 central authorities are provided with a pair of straight and first groove 122 that is parallel to each other, pair of U-shaped second groove 124 places first groove, 122 both sides symmetrically, each second groove 124 comprises the one first vertical section of closing on and being parallel to first groove 122, this first vertically the terminal bending of section be provided with one and the horizontal segment of first vertical section approximate vertical, the terminal bending of this horizontal segment is provided with second a vertical section parallel with the first vertical section, and this second vertical section away from first groove 122.Top board 14 is provided with a pair of groove 142 towards the one side of radiating fin 16.Radiating fin 16 has an end face 164 and a bottom surface 162, and wherein end face 164 is provided with a pair of and groove 142 corresponding grooves 166 top board 14.

First and

second heat pipe

20,30 settings that all take the shape of the letter U, has capillary structure in it respectively, first and second heat pipe 20, be full of working fluid in 30, first and

second heat pipe

20,30 are formed with an endotherm section 22 respectively, 32 and be parallel to

endotherm section

22,32

heat release section

24,34, wherein the endotherm section 22 of first heat pipe 20 is contained in first groove 122 of pedestal 12, the heat release section 24 of first heat pipe 20 is contained in the groove 166 common holes that constitute of the groove 142 of top board 14 and radiating fin 16, and the distance between 2 first heat pipes, 20 heat release section 24 is greater than the distance between two endotherm sections 22.The endotherm section 32 of second heat pipe 30 and heat release section 34 are contained on the base 12 in corresponding second groove 124, and wherein endotherm section 32 is near first grooves 122, and heat release section 34 is away from first groove 122.

Please consult Fig. 5 simultaneously, radiating fin 16 places on the pedestal 12, and the end face 164 of radiating fin 16 contacts with the heat release section 24 of the top board 14 and first heat pipe 20; So, the endotherm section 22 of first heat pipe 20 is folded between the bottom surface 162 of pedestal 12 and radiating fin 16, the heat release section 24 of first heat pipe 20 is folded between the end face 164 and top board 14 of radiating fin 16, and whole second heat pipe 30 is folded between the bottom surface 162 of pedestal 12 and radiating fin 16.

In the present invention, being connected between first heat pipe 20 and pedestal 12, second heat pipe 30 and pedestal 12, first heat pipe 20 and top board 14, first heat pipe 20 and radiating fin 16 and second heat pipe 30 and the radiating fin 16 all adopted welding manner.

When heat abstractor of the present invention used, the heat part that heat-generating electronic elements 42 produces was passed to whole pedestal 12 and radiating fin 16 bottoms rapidly uniformly by second heat pipe 30, is dispersed in the ambient air by radiating fin 16 and then with heat; Another part heat then is passed to top board 14 and radiating fin 16 tops by first heat pipe 20, is dispersed in the ambient air by radiating fin 16 and then with heat.Being used in combination of first and second heat pipe 20 of the present invention, 30 two kind of distribution mode, effectively the heat that heat-generating electronic elements 42 is produced is uniformly distributed on the entire heat dissipation device, and by radiating fin 16 heat is distributed, and reaches the high efficiency and heat radiation performance.Especially second heat pipe 30 of the present invention can make the heat on the pedestal 12 distribute rapidly and uniformly in use, thereby makes heat be delivered to radiating fin 16 from pedestal 12 fast.

Be appreciated that ground, also can be embedded heat pipe on the top board 14 of the present invention, thereby the heat that makes first heat pipe 20 be passed to top board 14 is distributed on this top board 14 rapidly and uniformly, to strengthen heat conduction to radiating fin 16.

Claims

1. heat abstractor, comprise that one can and be located at some radiating fins on the pedestal with the heat-generating electronic elements substrate contacted, one first heat pipe, one end connects said base, and the other end contacts with radiating fin, it is characterized in that: this heat abstractor also comprises second heat pipe that is embedded on the pedestal.

2. heat abstractor as claimed in claim 1, it is characterized in that: described first heat pipe comprises that one connects the endotherm section and a heat release section that contacts with radiating fin of said base, described second heat pipe bending extension is embedded on the described pedestal, and this second heat pipe comprises an endotherm section and a heat release section.

3. heat abstractor as claimed in claim 2, it is characterized in that: described heat abstractor further comprises a top board of being separated by and being provided with pedestal, described radiating fin folder directly between pedestal and top board, the heat release section hot link described radiating fin top and the described top board of described first heat pipe.

4. heat abstractor as claimed in claim 3 is characterized in that: be embedded with heat pipe on the described top board in addition.

5. heat abstractor as claimed in claim 2 is characterized in that: described heat abstractor comprises 2 first heat pipes, and the distance between this 2 first heat pipe heat release section is greater than the distance between the endotherm section.

6. heat abstractor as claimed in claim 2, it is characterized in that: described pedestal is provided with straight first groove and pair of U-shaped second groove, this second groove places the first groove both sides symmetrically, the endotherm section of described first heat pipe is contained in this first groove, and described second heat pipe is contained in second groove.

7. heat abstractor as claimed in claim 6, it is characterized in that: described second groove comprises the one first vertical section and from this first vertical terminal bending of section second vertical section of extending of closing on and being parallel to first groove, this second vertical section is parallel to the first vertical section, the endotherm section of described second heat pipe is contained in the first vertical section of closing on first groove, and the heat release section of described second heat pipe is contained in the second vertical section.

8. heat abstractor as claimed in claim 6 is characterized in that: described first groove is positioned at the middle part of pedestal.

9. heat abstractor as claimed in claim 1 is characterized in that: described first and second heat pipe all takes the shape of the letter U.