CN1952209A - Copper and nickel preprocessing technology in ion implantation before polymer surface chemical plating - Google Patents
Copper and nickel preprocessing technology in ion implantation before polymer surface chemical plating Download PDFInfo
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- CN1952209A CN1952209A CN 200610097591 CN200610097591A CN1952209A CN 1952209 A CN1952209 A CN 1952209A CN 200610097591 CN200610097591 CN 200610097591 CN 200610097591 A CN200610097591 A CN 200610097591A CN 1952209 A CN1952209 A CN 1952209A
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- chemical plating
- plating
- ion implantation
- ion
- copper
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Abstract
An ion implanted copper, nickel pretreatment process of before polymer surface chemical plating, belongs to pretreating process of polymer surface chemical plating. Adding high molecular polymer into ion implanter, adding electrode to the polymers, switching on the energy injecting switch of the ion implanter, with a accelerating voltage of 10 kV-45 kV, injected dose of 2*10e17-5*10e17ions/cm2. The method combines the ion implantation and chemical plating, adopts injecting metal ion different from or the same as the chemical coating metal, make full use of the advantages of chemical plating and ion implantation, thus creats a uniform coating with small porosity, good appearance, improves bonding tightness of the coating and substrate, has simple process and does not need repeated treatment; there is no plating liquid during the pretreatment Process, no secondary pollution; no noble metals injection, reduces costs, enhances self-catalysis in chemical plating, improves the plating efficiency.
Description
Technical field
The present invention relates to a kind of at the copper-plated pretreatment technology of polymer surfaces, ion implantation copper, nickel preprocessing technology before particularly a kind of polymer surface chemical plating.
Background technology
Electroless plating is to utilize reductive agent in the chemical plating solution metal ion to be reduced to metal and to be deposited on to form coating on the matrix surface, the coating that obtains is even, porosity is little, outward appearance is good, and covering power is 100%, deep trouth and bulge-structure be plating evenly, thereby becomes the research focus of polymer metalization.But there is following shortcoming in electroless plating in the multiple polymers metallization technology: the first, and during plating, matrix need not activate by the surface adsorption catalyzing atom on having the katalysis matrix.And the sensitization-activation method of widespread use at present need experience multiple tracks liquid treatment step, this has strengthened the complicacy of technology on the one hand, has increased the chance of the contaminated and spuious forming core of chemical plating fluid on the other hand, makes the bath stability variation, influences coating performance; The second, for non-metallic material, coating is in conjunction with being to rely on mechanical bond but not atomic linkage in essence, and the bonding strength of electroless plating is relatively low.
Electroless plating technology comes down to a kind of process for treating surface.In actual applications, because each sufacing all has self characteristics and relative merits, single sufacing often can not satisfy the demand of different condition in the practical application.This just impels people to consider to adopt simultaneously two or more sufacing, they are carried out compound so that its relative merits can be replenished mutually.
Ion implantation assisted chemical plating is exactly to inject the metal ion with katalysis at nonmetallic surface, to form active center on the surface, induces electroless plating to carry out.Ion implantation assisted chemical plating can improve preceding 2 weak points of traditional chemical plating.The ion implantation liquid treatment step that has reduced traditional activation method has on the one hand reduced to pollute the chance of plating bath, injects ion and mixes with the matrix atom at matrix, and no sharp interface, input horizon can not peel off, so can not impact bath stability; On the other hand, because the general formed active center of activation method just is adsorbed on ceramic surface, can not make contributions for the bonding strength that improves coating and polymkeric substance, and the injection metal ion can increase the electroconductibility of polymer surfaces, improve the electronic migration at metal-polymer interface place, thereby its interface bond strength is improved.
The injection ionic species that people use is mainly precious metal palladium, and palladium has good catalysis forming core effect for electroless plating.And electroless plating is self-catalyzed reaction, and coated metal self also has catalysis to electroless plating reaction.It is precious metal that the ion that injects is adopted in above-mentioned pre-treatment before electroless plating, coated metal activating cost height, waste precious metal; Adopt the pretreatment technology environmental pollution of chemical plating method serious before the electroless plating.
Summary of the invention
The objective of the invention is to provide a kind of: do not have ion implantation copper, nickel preprocessing technology before plating bath, free from environmental pollution, the polymer surface chemical plating of saving precious metal before the electroless plating during pre-treatment.
The process technology scheme that solves its technical problem is:
High molecular polymer is put into to ion implanter, and added top electrode on high molecular polymer, the energy of opening ion implanter injects switch, and the control acceleration voltage is 10 kilovolts-45 kilovolts, and the control implantation dosage is at 2 * 10e
17～5 * 10e
17Ions/cm
2
Described electrode is copper electrode or nickel electrode.
Described high molecular polymer has tetrafluoroethylene or polyethylene.
Beneficial effect: in the such scheme, adopt ion implantation copper, nickel as the pretreatment technology that carries out electroless copper at polymer surfaces.The Chemical Pretreatment that does not need to pass through again other through ion implantation high molecular polymer surface, directly can in chemical plating fluid, carry out chemical plating technology, realize high molecular polymer surface chemistry plating, ion implantation and two kinds of Technologies of electroless plating are combined, with the Chemical Pretreatment technology on the existing electroless plating meaning of ion implantation replacement, finish the plating of the metallic membrane of polymer surfaces, ion implantation cost is low, do not have plating bath, free from environmental pollution when saving precious metal and processing, reached purpose of the present invention.
Ion implantation pretreatment technology as electroless plating can improve preceding 2 weak points that traditional chemical plates.The ion implantation liquid treatment step that has reduced traditional activation method has on the one hand reduced to pollute the chance of plating bath, and next injects ion and mixes with the matrix atom at matrix, and no sharp interface, input horizon can not peel off, so can not impact bath stability; On the other hand, because the general formed active center of activation method just is adsorbed on polymer surfaces, can not make contributions for improving coating and high base strength, and the injection metal ion can increase the electroconductibility of polymer surfaces, improve the electronic migration at metal-polymer interface place, thereby its interface bond strength is improved.
Ion implantation and electroless plating are organically combined, through repeatedly experiment showed, adopt inject with desire the chemical plating metallographic phase with or metal ion inequality, given full play to electroless plating and ion implantation both advantage, overcome unborn unfavorable factor.The coating that forms is even, porosity is little, and outward appearance is good, and coating and compound combine of matrix for metallurgy and machinery have improved coating and high base strength; Technological process is simple, does not need repeatedly re-treatment; Do not have plating bath in the whole preprocessing process process, do not produce secondary pollution; Do not need to inject precious metal, reduced cost, and brought into play the autocatalysis function of chemical plating metal, improved plating efficient.
Embodiment
Embodiment 1: select tetrafluoroethylene for use, ptfe surface is cleaned, deoil and remove the dirt of surface attachment; Ready tetrafluoroethylene is placed in the ion implantation device, connects the electrode pair polytetrafluoroethylmaterial material and carry out ion implantation; The ion implantation element of selecting is a copper, and the material copper during with afterwards electroless plating is identical; Injection parameter is: acceleration voltage 15KV, implantation dosage 2.25 * 10e
17Ions/cm
2Place chemical plating bath directly to carry out electroless copper the tetrafluoroethylene of finishing injection.Described electroless copper is the chemical-copper-plating process of prior art routine, slightly.
Ion implantation and two kinds of Technologies of electroless plating are combined,, finish the plating of the metallic membrane of polymer surface with the Chemical Pretreatment technology on the existing electroless plating meaning of ion implantation replacement.Ion implantation device is that multifunction ion injects enhancing equipment, is the commercially available prod, and model is MEVVA2000.
Embodiment 2: select polyethylene for use, the ion implantation element of selection is a nickel, and the injection parameter scope is: acceleration voltage 15KV, implantation dosage 2.25 * 10e
17Ions/cm
2Place chemical plating bath directly to carry out chemical nickel plating the polythene material of finishing injection.Other and embodiment 1 omit together.
Embodiment 3: the ion implantation element of selection is a copper, and the material iron during with afterwards electroless plating is inequality, and the injection parameter scope is: acceleration voltage is 45KV, implantation dosage 2.3 * 10e
17Ions/cm
2Place chemical plating bath directly to carry out chemical plating iron the tetrafluoroethylene of finishing injection.Other and embodiment 1 omit together.
Embodiment 4: the ion implantation element of selection is a nickel, and the injection parameter scope is: acceleration voltage 45KV, implantation dosage 2.3 * 10e
17Ions/em
2Place chemical plating bath directly to carry out chemical plating iron the polyethylene of finishing injection.Other and embodiment 1 omit together.
Embodiment 5: the ion implantation element of selection is a copper, and the injection parameter scope is: acceleration voltage 45KV, implantation dosage 5 * 10e
17Ions/cm
2Place chemical plating bath directly to carry out chemical plating iron the polyethylene of finishing injection.Other and embodiment 1 omit together.
Embodiment 6: the ion implantation element of selection is a nickel, and the injection parameter scope is: acceleration voltage 10KV, implantation dosage 2 * 10e
17Ions/cm
2Place chemical plating bath directly to carry out chemical plating iron the polyethylene of finishing injection.Other and embodiment 1 omit together.
Claims (3)
1, ion implantation copper, the nickel preprocessing technology before a kind of polymer surface chemical plating, it is characterized in that: high molecular polymer is put into to ion implanter, and on high molecular polymer, add top electrode, the energy of opening ion implanter injects switch, the control acceleration voltage is 10 kilovolts-45 kilovolts, and the control implantation dosage is at 2 * 10e
17～5 * 10e
17Ions/cm
2
2, ion implantation copper, the nickel preprocessing technology before the polymer surface chemical plating according to claim 1, it is characterized in that: described electrode is copper electrode or nickel electrode.
3, ion implantation copper, the nickel preprocessing technology before the polymer surface chemical plating according to claim 1, it is characterized in that: described high molecular polymer has tetrafluoroethylene or polyethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610097591 CN1952209A (en) | 2006-11-09 | 2006-11-09 | Copper and nickel preprocessing technology in ion implantation before polymer surface chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610097591 CN1952209A (en) | 2006-11-09 | 2006-11-09 | Copper and nickel preprocessing technology in ion implantation before polymer surface chemical plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1952209A true CN1952209A (en) | 2007-04-25 |
Family
ID=38058762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610097591 Pending CN1952209A (en) | 2006-11-09 | 2006-11-09 | Copper and nickel preprocessing technology in ion implantation before polymer surface chemical plating |
Country Status (1)
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|---|---|
| CN (1) | CN1952209A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012040993A1 (en) * | 2010-09-30 | 2012-04-05 | 富景资本有限公司 | Method for continuously producing flexible copper clad laminates |
| CN104744909A (en) * | 2013-12-31 | 2015-07-01 | 比亚迪股份有限公司 | Polymer product and ink composition and surface selective metallization method |
-
2006
- 2006-11-09 CN CN 200610097591 patent/CN1952209A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012040993A1 (en) * | 2010-09-30 | 2012-04-05 | 富景资本有限公司 | Method for continuously producing flexible copper clad laminates |
| US9587318B2 (en) | 2010-09-30 | 2017-03-07 | Richview Electronics Co., Ltd. | Method for continuously producing flexible copper clad laminates |
| CN104744909A (en) * | 2013-12-31 | 2015-07-01 | 比亚迪股份有限公司 | Polymer product and ink composition and surface selective metallization method |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |