CN1947939A - Processing method for flattening large dimension diamond diaphragm - Google Patents
Processing method for flattening large dimension diamond diaphragm Download PDFInfo
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- CN1947939A CN1947939A CN 200610134176 CN200610134176A CN1947939A CN 1947939 A CN1947939 A CN 1947939A CN 200610134176 CN200610134176 CN 200610134176 CN 200610134176 A CN200610134176 A CN 200610134176A CN 1947939 A CN1947939 A CN 1947939A
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Abstract
A method for smoothing and polishing a large-area diamond membrane includes such steps as fixing a CVD diamond membrane (2-5 inches in diameter) onto a bench by vacuum suction cup, installing a cup-shaped abrasive disc to the mainshaft of high-speed super-precision machine-tool, and making the mainshaft and bench to rotate in different directions at 1000-10000 rpm and 0-500 rpm respectively for grinding while controlling the surface temp of diamond membrane to 650-950 deg.C for preventing thermochemical reaction.
Description
Technical field
The invention belongs to the Ultraprecision Machining field.The processing method for flattening that relates to a kind of large dimension diamond diaphragm, particularly a kind of utilize the titanium-aluminium alloy base grinding wheel to large scale (φ 〉=1 inch) chemical vapour deposition diamond (CVD) thus film carries out the processing method for flattening that the high efficiency, low cost grinding obtains good diamond film surface quality.
Background technology
Since the nineties, the technology of preparing of CVD diamond thin and performance characterization etc. have been obtained many breakthroughs, with research preliminary phase ratio, sedimentation rate has improved nearly thousand times, preparation cost is also corresponding be reduced to original ten thousand/, the CVD diamond film has begun to move towards the commercial application stage from the experimental study stage.Yet the follow-up polishing technology of the diamond film that relatively lags behind has limited the diamond film extensive use, and especially the smooth technology of the polishing of diamond membrane with large area has become diamond film in a high-tech area key in application difficult problem.
Because diamond is the present known the highest and high chemically inert material of hardness, the thickness that adds diamond film is little, bulk strength is low, easily produce broken or the generation micro-crack, make and the planarization that in the ultraprecise manufacture field, extensively adopts be difficult to be applicable to the processing of diamond film as traditional chemically mechanical polishing, electrobrightening etc.Though developed CVD diamond film planarization such as laser beam polishing, ion beam polishing at present, be primarily aimed at the diamond film of small size (φ≤1 inch); Though mechanical lapping polishing, the polishing of hot iron dish, technology such as chemically mechanical polishing can both realize the polishing of large dimension diamond diaphragm, domestic first Large Area CVD Diamond Films thermo-chemical polishing machine of succeeding in developing as University of Science ﹠ Technology, Beijing can once be finished the polishing of the diamond film of 3 φ 110mm, but these methods need expensive firing equipment and vaccum-pumping equipment, equipment complexity usually, cost is higher, simultaneously, the polishing disk distortion has seriously influenced the surface figure accuracy of diamond film under the high temperature; Patent CN 1586815A discloses a kind of employing metal dish high speed polishing diamond film, utilize both frictional heat and the method that combines of polishing disk bottom surface low-temperature heat, make diamond film polished surface temperature reach diffusion temperature rapidly, thereby reach the purpose of thermo-chemical polishing, but this invention is not optimized the mechanical property of polishing disk material, but heat the surface figure accuracy that guarantees polishing disk with the thermograde that reduces polishing disk by the firing equipment bottom, therefore need firing equipment, energy resource consumption is big, this invention simultaneously needs vacuum equipment to increase the complexity and the cost of equipment, and when adopting the polishing of this method, the polishing disk wearing and tearing, oxidation is serious, surface figure accuracy is wayward, can't satisfy the high efficiency, low cost planarization process requirement of large scale CVD diamond film.
Summary of the invention
The purpose of this invention is to provide a kind of processing method to large scale CVD diamond film high efficiency, low cost grinding planarization.
The present invention adopts following technical scheme to realize: titanium-aluminium alloy base cup wheel is installed on the ultraprecise surface grinding machine main shaft, 2～5 inches diamond films of φ are fixed on the vacuum ceramic sucker, take vertical shaft cross grinding mode, speed of mainshaft n
w1000～10000r/min, emery wheel working diameter φ 150～320mm, face width 10～20mm; Little feed speed 0～1 μ m/min of grinding machine spindle; During grinding, workpiece and emery wheel turn round the diamond film rotation speed n around axis separately
s0～500r/min, both gyratory directions are identical or opposite, and axial compressive force is controlled in the 100N, and emery wheel does not have feeding or the grinding of little feeding dry type with respect to workpiece.Owing to be merely crush grinding of cup wheel, the contact length of emery wheel, contact area, entrance angle immobilize, therefore grinding force keeps constant, adjusts the ACTIVE CONTROL of angle (or depth of parallelism) the realization workpiece surface figure accuracy of emery wheel axis and diamond film workpiece turret axis by the main shaft angular adjustment apparatus.Owing to adopt the cup emery wheel end face partly to contact the dry type grinding, the violent friction of emery wheel and CVD diamond film contact zone makes the local instantaneous temperature of machining area reach the required temperature of thermal chemical reaction, utilize infrared radiation thermometer to detect the temperature of machining area, to regulate axial compressive force temperature is controlled between 650～950 ℃ by regulating axial feeding f, thereby the temperature that makes emery wheel integral body is controlled within the operating limit temperature of material, to guarantee to add the surface figure accuracy and the life-span of emery wheel in man-hour.
In Grinding Process,, influence thermal chemical reaction and diffuser efficiency because CVD diamond film carburization zone High temperature diffusion increases the concentration of carbon of wheel face gradually.By adopting the regular trimming wheel of fixed abrasive material oilstone dish Ginding process, not only can in time remove the carbon diffusion layer of wheel face, make the concentration of carbon of emery wheel working face remain on lower level, and can reduce or eliminate the surface figure accuracy error of the surface of the work that causes because of abrasion of grinding wheel by crushing.
Effect of the present invention and benefit are: Principle of Grinding and Cutting is introduced among the polishing planarization process of CVD diamond film, break through traditional grinding and polishing processing, under the normal temperature and pressure atmospheric environment, adopt high speed disc sharpener technology, utilize the titanium-aluminium alloy base grinding wheel to reach the required temperature of thermal chemical reaction in the processing district with the diamond film protruding peak-to-peak mutual friction mutually in surface, make diamond produce high temperature cabonization, oxidation and diffusive wear, and the carburization zone that surface of the work is removed in the mechanical friction effect by emery wheel has improved working (machining) efficiency, and do not need firing equipment and vacuum environment, realized low-cost high-efficiency processing under the normal temperature and pressure atmospheric environment of large dimension diamond diaphragm, for diamond film has been opened up road in the commercial application of high-tech area.
Description of drawings
Fig. 1 is a titanium-aluminium alloy base cup wheel schematic diagram.
Fig. 2 is with titanium-aluminium alloy base grinding wheel grinding large scale CVD diamond film schematic layout pattern.
Fig. 3 is a large scale CVD diamond film grinding principle schematic.
The specific embodiment
Be described in detail the specific embodiment of the present invention below in conjunction with technical scheme and accompanying drawing.
Technical scheme of the present invention is to adopt workpiece spinning grinding method, titanium-aluminium alloy base cup wheel (applying for a patent simultaneously with the present invention) is through being installed in after the finishing on the ultraprecise surface grinding machine electricity main shaft as shown in Figure 1, the diamond film of 2～3 inches of φ is fixed on the vacuum ceramic sucker, and both position relations as shown in Figure 2.Lathe is taked vertical shaft cross grinding mode, adopts vacuum ceramic sucker fixed diamond film workpiece, cup wheel is installed on the lathe air bearing electricity main shaft speed of mainshaft 2000～6000r/min, emery wheel working diameter φ 300～320mm; Adopt precision ball screw and aerostatic guide way to realize grinding machine spindle little feed motion vertically, little feed speed 0～1 μ m/min; During grinding, workpiece and emery wheel turn round around axis separately, diamond film rotating speed 0～500r/min, and both gyratory directions can be identical or opposite, and axial compressive force is controlled in the 60N, and emery wheel does not have feeding or the grinding of little feeding dry type with respect to workpiece.Owing to be merely crush grinding of cup wheel, the contact length of emery wheel, contact area, entrance angle immobilize, therefore grinding force keeps constant, adjusts the ACTIVE CONTROL of angle (or depth of parallelism) the realization workpiece surface figure accuracy of emery wheel axis and diamond film workpiece turret axis by the main shaft angular adjustment apparatus.As shown in Figure 3, owing to adopt the cup emery wheel end face partly to contact the dry type grinding, the violent friction of emery wheel and CVD diamond film contact zone makes the local instantaneous temperature of machining area reach the required temperature of thermal chemical reaction, utilize infrared radiation thermometer to detect the temperature of machining area, to regulate axial compressive force temperature is controlled between 650～950 ℃ by regulating the amount of feeding, thereby the temperature that makes emery wheel integral body is controlled within the operating limit temperature of material, to guarantee to add the surface figure accuracy and the life-span of emery wheel in man-hour.
Claims (2)
1. the processing method for flattening of a large dimension diamond diaphragm, it is characterized in that: cup wheel is installed on the grinding machine spindle, the diamond film of 2～5 inches of φ is fixed on the vacuum ceramic sucker, take vertical shaft cross grinding mode, the speed of mainshaft 1000～10000r/min, emery wheel working diameter φ 150～320mm, face width 10～20mm; Little feed speed 0～1 μ m/min of grinding machine spindle; During grinding, workpiece and emery wheel turn round around axis separately, diamond film rotating speed 0～500r/min, both gyratory directions are identical or opposite, axial compressive force is controlled in the 100N, and emery wheel does not have feeding or the grinding of little feeding dry type with respect to the CVD diamond film, utilizes infrared radiation thermometer to detect the temperature of machining area, and regulate the amount of feeding and with the control axial compressive force temperature on diamond film surface is controlled between 650～950 ℃, realize that emery wheel removes the thermal chemical reaction of CVD diamond film; The angle of adjusting emery wheel axis and workpiece turret axis is realized the ACTIVE CONTROL of workpiece surface figure accuracy.
2. the processing method for flattening of a kind of large dimension diamond diaphragm according to claim 1, its feature also is: when emery wheel was removed the thermal chemical reaction of CVD diamond film, the carbon on CVD diamond film surface was at high temperature to wheel face diffusion or graphitization and worn by emery wheel; The concentration of carbon of wheel face increases gradually, by adopting fixed abrasive material oilstone dish trimming wheel, removes the carbon diffusion layer of wheel face, reduces or eliminate the surface figure accuracy error of the surface of the work that causes because of abrasion of grinding wheel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610134176 CN1947939A (en) | 2006-11-02 | 2006-11-02 | Processing method for flattening large dimension diamond diaphragm |
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| CN 200610134176 CN1947939A (en) | 2006-11-02 | 2006-11-02 | Processing method for flattening large dimension diamond diaphragm |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528645A (en) * | 2012-02-15 | 2012-07-04 | 蔡桂芳 | Double-sided polishing method for large-sized ultra-thin quartz glass sheets |
| CN102699804A (en) * | 2012-06-14 | 2012-10-03 | 北京科技大学 | Method for leveling surface of diamond self-supporting membrane |
| CN102773802A (en) * | 2012-07-23 | 2012-11-14 | 宁波市鸿博机械制造有限公司 | Dressing method for grinding wheel |
| CN102941382A (en) * | 2012-11-26 | 2013-02-27 | 大连理工大学 | Molding grinding wheel for grinding small-hole threads of hard and brittle materials |
| CN105215856A (en) * | 2015-09-25 | 2016-01-06 | 安庆市凯立金刚石科技有限公司 | A kind of diamond film Jet Polishing method |
| CN109590811A (en) * | 2018-11-26 | 2019-04-09 | 南京航空航天大学 | A kind of method of laser assisted polishing cvd diamond |
| CN110774118A (en) * | 2019-10-23 | 2020-02-11 | 华侨大学 | Grinding method of large-size single crystal diamond |
| CN112975619A (en) * | 2019-12-18 | 2021-06-18 | 江苏宇瑞仕高端智能装备科技有限公司 | Grinding process method of silicon carbide plate |
| CN113681168A (en) * | 2021-09-10 | 2021-11-23 | 郑州磨料磨具磨削研究所有限公司 | Method for uniformly processing diamond film surface by using pulsed laser ablation |
| CN115302375A (en) * | 2022-06-29 | 2022-11-08 | 郑州磨料磨具磨削研究所有限公司 | Efficient high-precision composite processing equipment and method for diamond wafer |
-
2006
- 2006-11-02 CN CN 200610134176 patent/CN1947939A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528645A (en) * | 2012-02-15 | 2012-07-04 | 蔡桂芳 | Double-sided polishing method for large-sized ultra-thin quartz glass sheets |
| CN102699804A (en) * | 2012-06-14 | 2012-10-03 | 北京科技大学 | Method for leveling surface of diamond self-supporting membrane |
| CN102699804B (en) * | 2012-06-14 | 2015-06-10 | 北京科技大学 | Method for leveling surface of diamond self-supporting membrane |
| CN102773802A (en) * | 2012-07-23 | 2012-11-14 | 宁波市鸿博机械制造有限公司 | Dressing method for grinding wheel |
| CN102941382A (en) * | 2012-11-26 | 2013-02-27 | 大连理工大学 | Molding grinding wheel for grinding small-hole threads of hard and brittle materials |
| CN102941382B (en) * | 2012-11-26 | 2015-10-28 | 大连理工大学 | A kind of grinding hard brittle material aperture thread forming emery wheel |
| CN105215856A (en) * | 2015-09-25 | 2016-01-06 | 安庆市凯立金刚石科技有限公司 | A kind of diamond film Jet Polishing method |
| CN109590811A (en) * | 2018-11-26 | 2019-04-09 | 南京航空航天大学 | A kind of method of laser assisted polishing cvd diamond |
| CN109590811B (en) * | 2018-11-26 | 2022-03-25 | 南京航空航天大学 | Method for laser-assisted polishing of CVD diamond |
| CN110774118A (en) * | 2019-10-23 | 2020-02-11 | 华侨大学 | Grinding method of large-size single crystal diamond |
| CN110774118B (en) * | 2019-10-23 | 2021-04-30 | 华侨大学 | Grinding method of large-size single crystal diamond |
| CN112975619A (en) * | 2019-12-18 | 2021-06-18 | 江苏宇瑞仕高端智能装备科技有限公司 | Grinding process method of silicon carbide plate |
| CN113681168A (en) * | 2021-09-10 | 2021-11-23 | 郑州磨料磨具磨削研究所有限公司 | Method for uniformly processing diamond film surface by using pulsed laser ablation |
| CN115302375A (en) * | 2022-06-29 | 2022-11-08 | 郑州磨料磨具磨削研究所有限公司 | Efficient high-precision composite processing equipment and method for diamond wafer |
| CN115302375B (en) * | 2022-06-29 | 2024-03-22 | 郑州磨料磨具磨削研究所有限公司 | High-efficiency high-precision composite processing equipment and method for diamond wafer |
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