CN1945857B - 晶圆级影像模块 - Google Patents

晶圆级影像模块 Download PDF

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CN1945857B
CN1945857B CN2005101134502A CN200510113450A CN1945857B CN 1945857 B CN1945857 B CN 1945857B CN 2005101134502 A CN2005101134502 A CN 2005101134502A CN 200510113450 A CN200510113450 A CN 200510113450A CN 1945857 B CN1945857 B CN 1945857B
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photoreceptor
lenses
image module
adjustment part
order
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CN1945857A (zh
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戎柏忠
李孝文
林孜翰
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VisEra Technologies Co Ltd
Omnivision Technologies Inc
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Omnivision Technologies Inc
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Abstract

一种晶圆级影像模块，包含有一感光器、一透镜组，以及一调整件，感光器用以感应光线而输出电性讯号，透镜组用以将光线成像于感光器，调整件设于感光器与透镜组之间，调整件可用以控制透镜组与感光器之间的距离，进而补偿透镜成形及组装后的焦点偏移量误差，使透镜组将光线正确地聚焦于感光器，达到整体晶圆级影像模块的成像质量较佳的目的。

Description

晶圆级影像模块
技术领域
本发明与影像模块有关，特别是指一种晶圆级影像模块的组装方法、影像模块结构及其组装设备。
背景技术
如图12所示，为一般常见的CMOS影像模块(80)，其主要利用一镜片座(Lens Holder)(81)罩设于一感应芯片(82)，镜片座(81)设有一可旋转的镜片筒(Lens Barrel)(83)，镜片筒(83)中央设有一透镜组(84)，当透镜组(84)成像于感应芯片(82)时，由旋转镜片筒(83)可以改变透镜组(84)与芯片(82)之间的距离，进而使光线聚焦于感应芯片(82)。
如图13所示，亦有另一种如WO2004/027880号专利所述的影像模块，其包含有一影像撷取件(103)以及一透镜组(111、127)，透镜组(111、127)呈堆栈状地与影像撷取件(103)相互贴合，使光线可经由透镜组(111、127)成像于影像撷取件(103)，而该专利的特点在于，影像撷取件(103)与透镜组(111、127)皆利用集成电路工艺所制造，因而可缩小影像模块的体积，使影像模块适用于手机、PDA等消费性电子装置。
然而，在制造上述专利影像模块时，透镜组(111、127)常会受到工艺及温度的影响而产生变形，进而使得透镜组(111、127)实际制作后的成品焦距与设计理论焦距约有0～50μm的误差，当上述专利实行时，常常无法正确地将光线聚焦于影像撷取件(103)，造成透镜组(111、127)所成像的影像呈离焦(out-of-focus)状态(如图13中的虚线区域A或B)；而且，当透镜组(111、127)设于影像撷取件(103)上的时候，也会因为二者各自都具有不同的厚度尺寸变异，如玻璃晶圆每片约有0～20μm的厚度误差，因而造成堆栈后更不易控制透镜组(111、127)与影像撷取件(103)之间的距离，同样会产生透镜组(111、127)无法正确聚焦于影像撷取件(103)的问题。
发明内容
本发明的主要目的在于提供一种晶圆级影像模块，其具有一调整件，该调整件可补偿焦点偏移量，使影像模块的成像质量较佳。
本发明的另一目的在于提供一种晶圆级影像模块的组装设备，其可原地调整与测试影像模块，使影像模块的成像质量较佳。
本发明的又一目的在于提供一种晶圆级影像模块的制造方法，其可使影像模块的成像质量较佳。
为实现上述目的，本发明提供的晶圆级影像模块，包含有：
一感光器，该感光器用以感应光线而输出电性讯号；
一透镜组，该透镜组用以将光线成像于该感光器；以及
一调整件，该调整件设于该感光器与该透镜组之间，该调整件用以控制该透镜组与该感光器之间的距离，使该透镜组将光线聚焦(in-focus)于该感光器。
所述的晶圆级影像模块，其中该透镜组包含有呈透明状的一第一穿透部以及一第二穿透部，该第一穿透部及该第二穿透部之间利用一第一垫片相互接合，该第一穿透部接合于该调整件。
所述的晶圆级影像模块，其中该第二穿透部的顶面设有一第二垫片。
所述的晶圆级影像模块，其中该感光器与该调整件之间具有一呈透明状之间隔片。
所述的晶圆级影像模块，其中该间隔片具有一开口，该开口对应于该感光器的感光区域。
所述的晶圆级影像模块，其中该调整件具有玻璃球(Glass Ball Spacer)或是纤维材料(Fiber Spacer)。
所述的晶圆级影像模块，其中该感光器为互补性氧化金属半导体(Complementary Metal-Oxide Semiconductor，CMOS)。
所述的晶圆级影像模块，其中该调整件的厚度约为1～50μm。
所述的晶圆级影像模块，其中该调整件以厚膜光阻工艺制成。
本发明提供的晶圆级影像模块的制造方法，包含有下列步骤：
a.以集成电路工艺(Integrated Circuits Process)制备一感光器；
b.以集成光学工艺(Integrated Optics Process)制备一透镜组；
c.得出该透镜组的焦点偏移量，并且判断该感光器呈正焦(in-focus)或离焦(out-of-focus)状态；以及
d.制备一调整件，并使该调整件位于该透镜组与该感光器之间，该调整件用以补偿该焦点偏移量，以使该透镜组将光线聚焦于该感光器，进而使该感光器呈正焦状态。
所述的制法，该步骤c另包含有利用一讯号处理器区分出该离焦状态为远焦(far focal)或近焦(near focal)状态。
本发明提供的组装设备，用以原地(in-situ)组装及测试如权利要求1所述的晶圆级影像模块，该组装设备包含有：
一定位调整器，用以将该感光器定位于该透镜组，并具备将该调整件施放的功能；
一讯号撷取器，用以电性连接于该感光器；
一讯号处理器，电性连接于该讯号撷取器，该讯号处理器用以判断该影像模块的影像讯号是否呈聚焦状；以及
一接合器，用以结合该感光器、该调整件与该透镜组。
所述的组装设备，其中该定位调整器另包含一夹具单元，该夹具单元用以将经该定位调整器定位完成的该感光器、该调整件及该透镜组进行钳紧(clamp)，并用以进入该接合器。
所述的组装设备，其中该定位调整器另包含有一测试台，该测试台用以承置该晶圆级影像模块，并且带动该晶圆级影像模块电性连接于该讯号撷取器。
所述的组装设备，其中该讯号撷取器具有一探针卡，该探针卡电性连接于该晶圆级影像模块的感光器。
由此，本发明即可利用调整件的结构，达到使该晶圆级影像模块的成像质量较佳的目的。
附图说明
图1为本发明第一较佳实施例的剖视图；
图2为本发明第一较佳实施例中所使用的组装设备的立体图；
图3为本发明第一较佳实施例的示意图，主要显示晶圆级影像模块预定位于组装设备的状态；
图4为本发明第一较佳实施例的示意图，主要显示晶圆级影像模块设于测试台的状态；
图5为显示成像于感光器的影像系呈离焦状态；
图6类同于图4，其中调整件设于第一晶圆(感光器)与第二晶圆(透镜组)之间；
图7显示调整件设于晶圆级影像模块后的感光器的成像状态；
图8显示成像于感光器的影像呈正焦状态；
图9为本发明第二较佳实施例的剖视图；
图10为本发明第三较佳实施例的剖视图；
图11为本发明第四较佳实施例的剖视图；
图12为一公知影像模块的示意图；以及
图13为另一公知影像模块的示意图。
具体实施方式
以下配合附图举若干较佳实施例，用以对本发明做详细说明，
请参阅图1所示，为本发明第一较佳实施例所提供的晶圆级影像模块(10)，晶圆级影像模块(10)包含有一感光器(20)、一调整件(25)，以及一透镜组(30)，该感光器(20)可为互补性氧化金属半导体(ComplementaryMetal-Oxide Semiconductor，CMOS)，或是感光耦合组件(Charge CoupledDevice，CCD)，感光器(20)可因感应到光线而输出电性讯号，感光器(20)的顶侧设有一可透光之间隔片(22)，该间隔片(22)主要用以保护感光器(20)免于受到外界污染及水气侵入；该调整件(25)具有玻璃球(Glass Ball Spacer)或是纤维材料(Fiber Spacer)，调整件(25)是以溅镀、点胶或是网印的方式涂布在感光器(20)之间隔片(22)顶面，调整件(25)的厚度约为1～50μm，其厚度依据焦深要求及焦点偏移量而决定；另外，调整件(25)亦可利用厚膜光阻工艺设于间隔片(22)，或是直接以玻璃板制成；当然亦可制作于透镜层(30)上。
该透镜组(30)可利用透明UV聚合材料模制成形，或是以蚀刻(Etching)方式制成，透镜组(30)覆设于调整件(25)上方，使调整件(25)介于透镜组(30)与感光器(20)之间，用以控制透镜组(30)与感光器(20)之间的距离，外界光线可经由穿过透镜组(30)而成像于感光器(20)，由于透镜组(30)成像于感光器(20)的焦点偏移量约为0～50μm，因此，当调整件(25)设于透镜组(30)与感光器(20)之间时，由调整件(25)本身所具有的厚度，即可补偿透镜组(30)的焦点偏移量，使透镜组(30)的聚焦精度控制于焦深要求以内，如对于光圈值(FNO)等于2.8及感应器像素大小为3.6μm的影像模块，其聚焦精度要求约为10μm，由调整件(25)补偿光线可正确地聚焦(in-focus)于感光器(20)。
当要制造上述晶圆级影像模块(10)的时候，主要利用一组装设备(40)进行原地(in-situ)组装及测试晶圆级影像模块(10)的制造工作，以下先针对组装设备(40)的细部结构进行说明。
请参阅图2至图4所示，组装设备(40)包含有一定位调整器(42)、一讯号撷取器(43)、一讯号处理器(46)，以及一接合器(bonding)(48)；定位调整器(42)包括一基座(50)以及一测试台(51)，基座(50)设有一可滑移的托盘(52)与一夹具单元(54)，托盘(52)可相对于基座(50)移出或收入，以取放晶圆级影像模块(10)，夹具单元(54)用以定位晶圆级影像模块(10)，并使晶圆级影像模块(10)置放于测试台(51)；讯号撷取器(43)包含有一探针卡(44)，讯号撷取器(43)设于定位调整器(42)的基座(50)内，讯号处理器(46)则电性连接于讯号撷取器(43)，讯号处理器(46)用以判断晶圆级影像模块(10)所撷取的影像讯号是否呈聚焦状，而接合器(48)用以结合晶圆级影像模块(10)的感光器(20)、调整件(25)与透镜组(30)。
以下将说明利用上述组装设备(40)制造晶圆级影像模块(10)的制造方法，包含有下列步骤：
步骤一：以集成电路工艺(Integrated Circuits)制备一第一晶圆(56)，如图2所示，第一晶圆(56)具有多数感光器(20)，各感光器(20)具有一第一对准标记(First Alignment Mark)。
步骤二：以集成光学工艺(Integrated Optics)制备一第二晶圆(58)，第二晶圆(58)具有多数透镜组(30)，各透镜组(30)具有一第二对准标记(SecondAlignment Mark)。
步骤三：先将第一晶圆(56)设于组装设备(40)的托盘(52)内，再使第二晶圆(58)迭合于第一晶圆(56)，各透镜组(30)的第二对准标记对正于各感光器(20)的第一对准标记；接着如图3所示，利用夹具单元(54)预定位(pre-bonding)第一晶圆(56)及第二晶圆(58)，并且使第一晶圆(56)及第二晶圆(58)置放于测试台(51)，第一晶圆(56)的各感光器(20)对应于探针卡(44)。
步骤四：如图4所示，测试台(51)带动晶圆级影像模块(10)电性连接于探针卡(44)，同时，测试台(51)可依测试需求而平移晶圆级影像模块(10)，或使其呈倾斜状。
步骤五：利用讯号处理器(46)接收讯号撷取器(43)的电性讯号，进而得到各透镜组(30)成像于各感光器(20)的焦点偏移量，用以判断感光器(20)是呈正焦(in-focus)或离焦(out-of-focus)状态(如图5所示)，以及区分出离焦状态为远焦(far focal)或近焦(near focal)状态。
步骤六：将托盘(52)移出基座(50)，并于第一晶圆(56)及第二晶圆(58)之间涂布调整件(25)，使调整件(25)位于各透镜组(30)与各感光器(20)之间，如图6所示，再使晶圆级影像模块(10)电性连接于探针卡(44)。
步骤七：如是感光器(20)所产生的影像将如图7所示影像质量改善，若仍呈现稍微离焦状态时，则再重复步骤四至步骤六，直到所使用调整件(25)可补偿上述的焦点偏移量至如图8所示的正焦状态为止。
步骤八：利用夹具单元(54)钳紧已补偿焦点偏移量的第一晶圆(56)与第二晶圆(58)，再利用接合器(48)结合第一晶圆(56)、调整件(25)，与第二晶圆(58)。
步骤九：切割第一晶圆(56)与第二晶圆(58)，即可成形晶圆级影像模块(10)。
经由上述组装设备(40)及制法的说明，当各透镜组(30)迭合于各感光器(20)时，利用讯号处理器(46)判断出感光器(20)所接收到的光线是否呈聚焦状态，如果感光器(20)呈离焦状态时，则可进一步改变调整件(25)的厚度，使感光器(20)呈正焦状态，以确保晶圆级影像模块(10)的成像质量，同时，利用控制调整件(25)设于感光器(20)的厚度，即可调整透镜组(30)与感光器(20)之间的距离，补偿透镜组(30)及感光器(20)之间的焦点偏移量，使透镜组(30)较为正确地聚焦于感光器(20)。
由此，本发明即可利用调整件的结构，达到使影像模块的成像质量较佳的目的。
再如图9所示，为本发明第二较佳实施例所提供的晶圆级影像模块(60)，其结构与第一较佳实施例大致相同，包含有一感光器(61)、一透镜组(62)，以及一介于二者之间的调整件(63)，特点在于：透镜组(62)包含有呈堆栈状的一第一穿透部(64)以及一第二穿透部(65)，第一穿透部(64)及第二穿透部(65)之间利用一第一垫片(66)相互接合，第二穿透部(65)的顶面设有一第二垫片(67)，第一穿透部(64)接合于调整件(63)，使透镜组(62)与感光器(61)相互迭合，第一穿透部(64)及第二穿透部(65)皆呈透明状，并且可将光线成像于感光器(61)，以使影像模块具有更多的影像特性。
而如图10所示，为本发明第三较佳实施例所提供的晶圆级影像模块(70)，其组成构件与第二较佳实施例大致相同，特点则在于：感光器(71)之间隔片(72)具有一开口(73)，开口(73)对应于感光器(71)的感光区域；另如图11所示，为本发明第四较佳实施例所提供的晶圆级影像模块(75)，其特点则在于调整件(76)直接设于感光器(77)的表面，而透镜组(78)的第一穿透部(79)则贴合于调整件(76)，由此，上述较佳实施例皆可达到本发明的发明目的。

Claims (6)

1.一种晶圆级影像模块的制造方法，包含有下列步骤：
a.以集成电路工艺制备一感光器；
b.以集成光学工艺制备一透镜组；
c.得出该透镜组的焦点偏移量，撷取该感光器的影像讯号并且判断该感光器呈正焦或离焦状态；以及
d.制备一调整件，并使该调整件位于该透镜组与该感光器之间，该调整件用以补偿该焦点偏移量，以使该透镜组将光线聚焦于该感光器，进而使该感光器呈正焦状态。
2.依据权利要求1所述的制造方法，其特征在于，该步骤c另包含有利用一讯号处理器区分出该离焦状态为远焦或近焦状态。
3.一种组装设备，用以原地组装及测试一晶圆级影像模块，其中该晶圆级影像模块包含有：
一感光器，该感光器用以感应光线而输出电性讯号；
一透镜组，该透镜组用以将光线成像于该感光器；以及
一调整件，该调整件设于该感光器与该透镜组之间；
该组装设备包含有：
一定位调整器，用以将该感光器定位于该透镜组，并具备将该调整件施放的功能；
一讯号撷取器，用以电性连接于该感光器；
一讯号处理器，电性连接于该讯号撷取器，该讯号处理器用以判断该影像模块的影像讯号是否呈聚焦状；以及
一接合器，用以结合该感光器、该调整件与该透镜组。
4.依据权利要求3所述的组装设备，其特征在于，其中该定位调整器另包含一夹具单元，该夹具单元用以将经该定位调整器定位完成的该感光器、该调整件及该透镜组进行钳紧，并用以进入该接合器。
5.依据权利要求3所述的组装设备，其特征在于，其中该定位调整器另包含有一测试台，该测试台用以承置该晶圆级影像模块，并且带动该晶圆级影像模块电性连接于该讯号撷取器。
6.依据权利要求3所述的组装设备，其特征在于，其中该讯号撷取器具有一探针卡，该探针卡电性连接于该晶圆级影像模块的感光器。
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