CN1945857B - 晶圆级影像模块 - Google Patents
晶圆级影像模块 Download PDFInfo
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Abstract
一种晶圆级影像模块,包含有一感光器、一透镜组,以及一调整件,感光器用以感应光线而输出电性讯号,透镜组用以将光线成像于感光器,调整件设于感光器与透镜组之间,调整件可用以控制透镜组与感光器之间的距离,进而补偿透镜成形及组装后的焦点偏移量误差,使透镜组将光线正确地聚焦于感光器,达到整体晶圆级影像模块的成像质量较佳的目的。
Description
技术领域
本发明与影像模块有关,特别是指一种晶圆级影像模块的组装方法、影像模块结构及其组装设备。
背景技术
如图12所示,为一般常见的CMOS影像模块(80),其主要利用一镜片座(Lens Holder)(81)罩设于一感应芯片(82),镜片座(81)设有一可旋转的镜片筒(Lens Barrel)(83),镜片筒(83)中央设有一透镜组(84),当透镜组(84)成像于感应芯片(82)时,由旋转镜片筒(83)可以改变透镜组(84)与芯片(82)之间的距离,进而使光线聚焦于感应芯片(82)。
如图13所示,亦有另一种如WO2004/027880号专利所述的影像模块,其包含有一影像撷取件(103)以及一透镜组(111、127),透镜组(111、127)呈堆栈状地与影像撷取件(103)相互贴合,使光线可经由透镜组(111、127)成像于影像撷取件(103),而该专利的特点在于,影像撷取件(103)与透镜组(111、127)皆利用集成电路工艺所制造,因而可缩小影像模块的体积,使影像模块适用于手机、PDA等消费性电子装置。
然而,在制造上述专利影像模块时,透镜组(111、127)常会受到工艺及温度的影响而产生变形,进而使得透镜组(111、127)实际制作后的成品焦距与设计理论焦距约有0~50μm的误差,当上述专利实行时,常常无法正确地将光线聚焦于影像撷取件(103),造成透镜组(111、127)所成像的影像呈离焦(out-of-focus)状态(如图13中的虚线区域A或B);而且,当透镜组(111、127)设于影像撷取件(103)上的时候,也会因为二者各自都具有不同的厚度尺寸变异,如玻璃晶圆每片约有0~20μm的厚度误差,因而造成堆栈后更不易控制透镜组(111、127)与影像撷取件(103)之间的距离,同样会产生透镜组(111、127)无法正确聚焦于影像撷取件(103)的问题。
发明内容
本发明的主要目的在于提供一种晶圆级影像模块,其具有一调整件,该调整件可补偿焦点偏移量,使影像模块的成像质量较佳。
本发明的另一目的在于提供一种晶圆级影像模块的组装设备,其可原地调整与测试影像模块,使影像模块的成像质量较佳。
本发明的又一目的在于提供一种晶圆级影像模块的制造方法,其可使影像模块的成像质量较佳。
为实现上述目的,本发明提供的晶圆级影像模块,包含有:
一感光器,该感光器用以感应光线而输出电性讯号;
一透镜组,该透镜组用以将光线成像于该感光器;以及
一调整件,该调整件设于该感光器与该透镜组之间,该调整件用以控制该透镜组与该感光器之间的距离,使该透镜组将光线聚焦(in-focus)于该感光器。
所述的晶圆级影像模块,其中该透镜组包含有呈透明状的一第一穿透部以及一第二穿透部,该第一穿透部及该第二穿透部之间利用一第一垫片相互接合,该第一穿透部接合于该调整件。
所述的晶圆级影像模块,其中该第二穿透部的顶面设有一第二垫片。
所述的晶圆级影像模块,其中该感光器与该调整件之间具有一呈透明状之间隔片。
所述的晶圆级影像模块,其中该间隔片具有一开口,该开口对应于该感光器的感光区域。
所述的晶圆级影像模块,其中该调整件具有玻璃球(Glass Ball Spacer)或是纤维材料(Fiber Spacer)。
所述的晶圆级影像模块,其中该感光器为互补性氧化金属半导体(Complementary Metal-Oxide Semiconductor,CMOS)。
所述的晶圆级影像模块,其中该调整件的厚度约为1~50μm。
所述的晶圆级影像模块,其中该调整件以厚膜光阻工艺制成。
本发明提供的晶圆级影像模块的制造方法,包含有下列步骤:
a.以集成电路工艺(Integrated Circuits Process)制备一感光器;
b.以集成光学工艺(Integrated Optics Process)制备一透镜组;
c.得出该透镜组的焦点偏移量,并且判断该感光器呈正焦(in-focus)或离焦(out-of-focus)状态;以及
d.制备一调整件,并使该调整件位于该透镜组与该感光器之间,该调整件用以补偿该焦点偏移量,以使该透镜组将光线聚焦于该感光器,进而使该感光器呈正焦状态。
所述的制法,该步骤c另包含有利用一讯号处理器区分出该离焦状态为远焦(far focal)或近焦(near focal)状态。
本发明提供的组装设备,用以原地(in-situ)组装及测试如权利要求1所述的晶圆级影像模块,该组装设备包含有:
一定位调整器,用以将该感光器定位于该透镜组,并具备将该调整件施放的功能;
一讯号撷取器,用以电性连接于该感光器;
一讯号处理器,电性连接于该讯号撷取器,该讯号处理器用以判断该影像模块的影像讯号是否呈聚焦状;以及
一接合器,用以结合该感光器、该调整件与该透镜组。
所述的组装设备,其中该定位调整器另包含一夹具单元,该夹具单元用以将经该定位调整器定位完成的该感光器、该调整件及该透镜组进行钳紧(clamp),并用以进入该接合器。
所述的组装设备,其中该定位调整器另包含有一测试台,该测试台用以承置该晶圆级影像模块,并且带动该晶圆级影像模块电性连接于该讯号撷取器。
所述的组装设备,其中该讯号撷取器具有一探针卡,该探针卡电性连接于该晶圆级影像模块的感光器。
由此,本发明即可利用调整件的结构,达到使该晶圆级影像模块的成像质量较佳的目的。
附图说明
图1为本发明第一较佳实施例的剖视图;
图2为本发明第一较佳实施例中所使用的组装设备的立体图;
图3为本发明第一较佳实施例的示意图,主要显示晶圆级影像模块预定位于组装设备的状态;
图4为本发明第一较佳实施例的示意图,主要显示晶圆级影像模块设于测试台的状态;
图5为显示成像于感光器的影像系呈离焦状态;
图6类同于图4,其中调整件设于第一晶圆(感光器)与第二晶圆(透镜组)之间;
图7显示调整件设于晶圆级影像模块后的感光器的成像状态;
图8显示成像于感光器的影像呈正焦状态;
图9为本发明第二较佳实施例的剖视图;
图10为本发明第三较佳实施例的剖视图;
图11为本发明第四较佳实施例的剖视图;
图12为一公知影像模块的示意图;以及
图13为另一公知影像模块的示意图。
具体实施方式
以下配合附图举若干较佳实施例,用以对本发明做详细说明,
请参阅图1所示,为本发明第一较佳实施例所提供的晶圆级影像模块(10),晶圆级影像模块(10)包含有一感光器(20)、一调整件(25),以及一透镜组(30),该感光器(20)可为互补性氧化金属半导体(ComplementaryMetal-Oxide Semiconductor,CMOS),或是感光耦合组件(Charge CoupledDevice,CCD),感光器(20)可因感应到光线而输出电性讯号,感光器(20)的顶侧设有一可透光之间隔片(22),该间隔片(22)主要用以保护感光器(20)免于受到外界污染及水气侵入;该调整件(25)具有玻璃球(Glass Ball Spacer)或是纤维材料(Fiber Spacer),调整件(25)是以溅镀、点胶或是网印的方式涂布在感光器(20)之间隔片(22)顶面,调整件(25)的厚度约为1~50μm,其厚度依据焦深要求及焦点偏移量而决定;另外,调整件(25)亦可利用厚膜光阻工艺设于间隔片(22),或是直接以玻璃板制成;当然亦可制作于透镜层(30)上。
该透镜组(30)可利用透明UV聚合材料模制成形,或是以蚀刻(Etching)方式制成,透镜组(30)覆设于调整件(25)上方,使调整件(25)介于透镜组(30)与感光器(20)之间,用以控制透镜组(30)与感光器(20)之间的距离,外界光线可经由穿过透镜组(30)而成像于感光器(20),由于透镜组(30)成像于感光器(20)的焦点偏移量约为0~50μm,因此,当调整件(25)设于透镜组(30)与感光器(20)之间时,由调整件(25)本身所具有的厚度,即可补偿透镜组(30)的焦点偏移量,使透镜组(30)的聚焦精度控制于焦深要求以内,如对于光圈值(FNO)等于2.8及感应器像素大小为3.6μm的影像模块,其聚焦精度要求约为10μm,由调整件(25)补偿光线可正确地聚焦(in-focus)于感光器(20)。
当要制造上述晶圆级影像模块(10)的时候,主要利用一组装设备(40)进行原地(in-situ)组装及测试晶圆级影像模块(10)的制造工作,以下先针对组装设备(40)的细部结构进行说明。
请参阅图2至图4所示,组装设备(40)包含有一定位调整器(42)、一讯号撷取器(43)、一讯号处理器(46),以及一接合器(bonding)(48);定位调整器(42)包括一基座(50)以及一测试台(51),基座(50)设有一可滑移的托盘(52)与一夹具单元(54),托盘(52)可相对于基座(50)移出或收入,以取放晶圆级影像模块(10),夹具单元(54)用以定位晶圆级影像模块(10),并使晶圆级影像模块(10)置放于测试台(51);讯号撷取器(43)包含有一探针卡(44),讯号撷取器(43)设于定位调整器(42)的基座(50)内,讯号处理器(46)则电性连接于讯号撷取器(43),讯号处理器(46)用以判断晶圆级影像模块(10)所撷取的影像讯号是否呈聚焦状,而接合器(48)用以结合晶圆级影像模块(10)的感光器(20)、调整件(25)与透镜组(30)。
以下将说明利用上述组装设备(40)制造晶圆级影像模块(10)的制造方法,包含有下列步骤:
步骤一:以集成电路工艺(Integrated Circuits)制备一第一晶圆(56),如图2所示,第一晶圆(56)具有多数感光器(20),各感光器(20)具有一第一对准标记(First Alignment Mark)。
步骤二:以集成光学工艺(Integrated Optics)制备一第二晶圆(58),第二晶圆(58)具有多数透镜组(30),各透镜组(30)具有一第二对准标记(SecondAlignment Mark)。
步骤三:先将第一晶圆(56)设于组装设备(40)的托盘(52)内,再使第二晶圆(58)迭合于第一晶圆(56),各透镜组(30)的第二对准标记对正于各感光器(20)的第一对准标记;接着如图3所示,利用夹具单元(54)预定位(pre-bonding)第一晶圆(56)及第二晶圆(58),并且使第一晶圆(56)及第二晶圆(58)置放于测试台(51),第一晶圆(56)的各感光器(20)对应于探针卡(44)。
步骤四:如图4所示,测试台(51)带动晶圆级影像模块(10)电性连接于探针卡(44),同时,测试台(51)可依测试需求而平移晶圆级影像模块(10),或使其呈倾斜状。
步骤五:利用讯号处理器(46)接收讯号撷取器(43)的电性讯号,进而得到各透镜组(30)成像于各感光器(20)的焦点偏移量,用以判断感光器(20)是呈正焦(in-focus)或离焦(out-of-focus)状态(如图5所示),以及区分出离焦状态为远焦(far focal)或近焦(near focal)状态。
步骤六:将托盘(52)移出基座(50),并于第一晶圆(56)及第二晶圆(58)之间涂布调整件(25),使调整件(25)位于各透镜组(30)与各感光器(20)之间,如图6所示,再使晶圆级影像模块(10)电性连接于探针卡(44)。
步骤七:如是感光器(20)所产生的影像将如图7所示影像质量改善,若仍呈现稍微离焦状态时,则再重复步骤四至步骤六,直到所使用调整件(25)可补偿上述的焦点偏移量至如图8所示的正焦状态为止。
步骤八:利用夹具单元(54)钳紧已补偿焦点偏移量的第一晶圆(56)与第二晶圆(58),再利用接合器(48)结合第一晶圆(56)、调整件(25),与第二晶圆(58)。
步骤九:切割第一晶圆(56)与第二晶圆(58),即可成形晶圆级影像模块(10)。
经由上述组装设备(40)及制法的说明,当各透镜组(30)迭合于各感光器(20)时,利用讯号处理器(46)判断出感光器(20)所接收到的光线是否呈聚焦状态,如果感光器(20)呈离焦状态时,则可进一步改变调整件(25)的厚度,使感光器(20)呈正焦状态,以确保晶圆级影像模块(10)的成像质量,同时,利用控制调整件(25)设于感光器(20)的厚度,即可调整透镜组(30)与感光器(20)之间的距离,补偿透镜组(30)及感光器(20)之间的焦点偏移量,使透镜组(30)较为正确地聚焦于感光器(20)。
由此,本发明即可利用调整件的结构,达到使影像模块的成像质量较佳的目的。
再如图9所示,为本发明第二较佳实施例所提供的晶圆级影像模块(60),其结构与第一较佳实施例大致相同,包含有一感光器(61)、一透镜组(62),以及一介于二者之间的调整件(63),特点在于:透镜组(62)包含有呈堆栈状的一第一穿透部(64)以及一第二穿透部(65),第一穿透部(64)及第二穿透部(65)之间利用一第一垫片(66)相互接合,第二穿透部(65)的顶面设有一第二垫片(67),第一穿透部(64)接合于调整件(63),使透镜组(62)与感光器(61)相互迭合,第一穿透部(64)及第二穿透部(65)皆呈透明状,并且可将光线成像于感光器(61),以使影像模块具有更多的影像特性。
而如图10所示,为本发明第三较佳实施例所提供的晶圆级影像模块(70),其组成构件与第二较佳实施例大致相同,特点则在于:感光器(71)之间隔片(72)具有一开口(73),开口(73)对应于感光器(71)的感光区域;另如图11所示,为本发明第四较佳实施例所提供的晶圆级影像模块(75),其特点则在于调整件(76)直接设于感光器(77)的表面,而透镜组(78)的第一穿透部(79)则贴合于调整件(76),由此,上述较佳实施例皆可达到本发明的发明目的。
Claims (6)
1.一种晶圆级影像模块的制造方法,包含有下列步骤:
a.以集成电路工艺制备一感光器;
b.以集成光学工艺制备一透镜组;
c.得出该透镜组的焦点偏移量,撷取该感光器的影像讯号并且判断该感光器呈正焦或离焦状态;以及
d.制备一调整件,并使该调整件位于该透镜组与该感光器之间,该调整件用以补偿该焦点偏移量,以使该透镜组将光线聚焦于该感光器,进而使该感光器呈正焦状态。
2.依据权利要求1所述的制造方法,其特征在于,该步骤c另包含有利用一讯号处理器区分出该离焦状态为远焦或近焦状态。
3.一种组装设备,用以原地组装及测试一晶圆级影像模块,其中该晶圆级影像模块包含有:
一感光器,该感光器用以感应光线而输出电性讯号;
一透镜组,该透镜组用以将光线成像于该感光器;以及
一调整件,该调整件设于该感光器与该透镜组之间;
该组装设备包含有:
一定位调整器,用以将该感光器定位于该透镜组,并具备将该调整件施放的功能;
一讯号撷取器,用以电性连接于该感光器;
一讯号处理器,电性连接于该讯号撷取器,该讯号处理器用以判断该影像模块的影像讯号是否呈聚焦状;以及
一接合器,用以结合该感光器、该调整件与该透镜组。
4.依据权利要求3所述的组装设备,其特征在于,其中该定位调整器另包含一夹具单元,该夹具单元用以将经该定位调整器定位完成的该感光器、该调整件及该透镜组进行钳紧,并用以进入该接合器。
5.依据权利要求3所述的组装设备,其特征在于,其中该定位调整器另包含有一测试台,该测试台用以承置该晶圆级影像模块,并且带动该晶圆级影像模块电性连接于该讯号撷取器。
6.依据权利要求3所述的组装设备,其特征在于,其中该讯号撷取器具有一探针卡,该探针卡电性连接于该晶圆级影像模块的感光器。
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