CN1942629A - 芳纶纸掺合物 - Google Patents
芳纶纸掺合物 Download PDFInfo
- Publication number
- CN1942629A CN1942629A CNA2005800111380A CN200580011138A CN1942629A CN 1942629 A CN1942629 A CN 1942629A CN A2005800111380 A CNA2005800111380 A CN A2005800111380A CN 200580011138 A CN200580011138 A CN 200580011138A CN 1942629 A CN1942629 A CN 1942629A
- Authority
- CN
- China
- Prior art keywords
- paper
- aramid fiber
- fiber paper
- floccule
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H13/26—Polyamides; Polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/005—Mechanical treatment
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/04—Physical treatment, e.g. heating, irradiating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paper (AREA)
Abstract
Description
实施例 | 纸组成(%重量) | 基重(g/m2) | 厚度(mm) | 密度(g/cm3) | 抗张强度(N/cm) | 模量(MPa) | Gurley空气阻力(秒) | ||||
对芳纶水溶性浆粕 | 间芳纶絮状物 | 沉析纤维 | PVA纤维 | 水溶性树脂 | |||||||
1 | 74 | 9 | 17 | 49.8 | 0.136 | 0.37 | 3.76 | 241 | 141 | ||
2 | 74 | 9 | 17 | 40.0 | 0.113 | 0.35 | 2.84 | 224 | 91 | ||
对比3 | 80 | 20 | |||||||||
对比4 | 74 | ||||||||||
5 | 74 | 9 | 17 | 49.2 | 0.061 | 0.80 | 8.50 | 1496 | 2700 | ||
6 | 74 | 9 | 17 | 40.0 | 0.046 | 0.86 | 7.80 | 1827 | 1170 | ||
7 | 74 | 9 | 17 | 45.4 | 0.102 | 0.45 | 5.25 | 223 | 86 | ||
8 | 74 | 9 | 17 | 49.5 | 0.077 | 0.65 | 6.24 | 1112 | 600 | ||
9 | 75 | 15 | 10 | 51.2 | 0.048 | 1.06 | 9.04 | 2751 | >300 | ||
10 | 90 | 10 | 0 | 51.2 | 0.043 | 1.19 | 6.65 | 2455 | 32.4 | ||
11 | 60 | 30 | 10 | 51.2 | 0.053 | 0.97 | 8.96 | 2013 | 112 | ||
12 | 90 | 5 | 5 | 51.2 | 0.046 | 1.12 | 7.12 | 2972 | >300 | ||
13 | 75 | 25 | 0 | 51.5 | 0.051 | 1.01 | 6.40 | 1751 | 11.8 | ||
14 | 60 | 25 | 15 | 44.7 | 0.076 | 0.59 | 16.90 | 1813 | 3.1 | ||
15 | 85 | 0 | 15 | 43.7 | 0.116 | 0.38 | 7.74 | 483 | 2.0 | ||
16 | 60 | 35 | 5 | 44.7 | 0.083 | 0.54 | 7.84 | 965 | 2.0 | ||
17 | 57 | 23.8 | 14.2 | 5 | 44.4 | 0.121 | 0.37 | 15.0 | 618 | 0.9 | |
18 | 80.8 | 0 | 14.2 | 5 | 44.7 | 0.121 | 0.37 | 9.47 | 362 | 1.7 |
实施例 | 纸种类 | 纸的比挺度((N/cm)/(g/m2)) | 树脂提取量(%,/纸重) | 复合材料的比挺度((N/cm)/(g/m2)) | 复合材料的比抗张指数((N/cm)/(g/m2)) | 复合材料与纸的比挺度之比 | 纸的平面热膨胀系数(ppm/C) | 复合材料的平面热膨胀系数(ppm/C) |
19 | 实施例5 | 18.5 | 81.8 | 96.9 | 1.42 | 5.2 | -1 | 4 |
20 | 实施例6 | 21.0 | 100 | 95.8 | 1.37 | 4.6 | -1 | 4 |
对比21 | 1.8N636 | 77.6 | 83.5 | 103.2 | 1.33 | 1.3 | -4 | -2 |
对比22 | 2.8N636 | 69.0 | 52.7 | 110.9 | 2.00 | 1.6 | -4 | -2 |
对比23 | 2T412 | 29.5 | 44.9 | 42.7 | 0.90 | 1.4 | 24 | 25 |
对比24 | 3T412 | 30.3 | 42.9 | 42.8 | 0.86 | 1.4 | 24 | 25 |
Claims (30)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/826,530 | 2004-04-16 | ||
US10/826,530 US20050230072A1 (en) | 2004-04-16 | 2004-04-16 | Aramid paper blend |
PCT/US2005/012996 WO2005103376A1 (en) | 2004-04-16 | 2005-04-15 | Aramid paper blend |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1942629A true CN1942629A (zh) | 2007-04-04 |
CN1942629B CN1942629B (zh) | 2010-04-07 |
Family
ID=34967398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800111380A Active CN1942629B (zh) | 2004-04-16 | 2005-04-15 | 芳纶纸掺合物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050230072A1 (zh) |
EP (1) | EP1756360B1 (zh) |
JP (2) | JP2007532798A (zh) |
CN (1) | CN1942629B (zh) |
BR (1) | BRPI0509409B8 (zh) |
CA (1) | CA2561329C (zh) |
WO (1) | WO2005103376A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103282412A (zh) * | 2011-01-04 | 2013-09-04 | 帝人芳纶有限公司 | 电绝缘纸 |
CN103476989A (zh) * | 2011-01-27 | 2013-12-25 | 深圳昊天龙邦复合材料有限公司 | 包含芳族合成纤维纸的半固化片和由其制得的印刷电路板 |
CN105579641A (zh) * | 2013-07-18 | 2016-05-11 | 帝人芳纶有限公司 | 阻燃片材 |
CN107849813A (zh) * | 2015-05-28 | 2018-03-27 | 可隆工业株式会社 | 芳族聚酰胺纸、制备方法及其用途 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7455750B2 (en) * | 2004-06-25 | 2008-11-25 | E.I. Du Pont De Nemours And Company | Meta- and para-aramid pulp and processes of making same |
JP4297163B2 (ja) * | 2004-10-08 | 2009-07-15 | パナソニック株式会社 | 多層回路基板の製造方法 |
KR20080083168A (ko) * | 2005-12-21 | 2008-09-16 | 이 아이 듀폰 디 네모아 앤드 캄파니 | Pipd 펄프를 포함하는 종이 및 이의 제조 방법 |
JP2009521624A (ja) * | 2005-12-21 | 2009-06-04 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Pipd紙およびそれから製造された部品 |
US7740741B2 (en) | 2005-12-21 | 2010-06-22 | E.I. Du Pont De Nemours And Company | Para-aramid pulp including meta-aramid fibrids and processes of making same |
US8444814B2 (en) * | 2005-12-21 | 2013-05-21 | Mikhail R. Levit | Paper comprising PIPD floc and process for making the same |
US7771810B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having a high melt point thermoplastic fiber |
US20080145602A1 (en) * | 2006-12-15 | 2008-06-19 | Gary Lee Hendren | Processes for making shaped honeycomb and honeycombs made thereby |
US8025949B2 (en) * | 2006-12-15 | 2011-09-27 | E.I. Du Pont De Nemours And Company | Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom |
US7771811B2 (en) * | 2006-12-15 | 2010-08-10 | E.I. Du Pont De Nemours And Company | Honeycomb from controlled porosity paper |
US7815993B2 (en) * | 2006-12-15 | 2010-10-19 | E.I. Du Pont De Nemours And Company | Honeycomb from paper having flame retardant thermoplastic binder |
US8268434B2 (en) * | 2007-11-30 | 2012-09-18 | E I Du Pont De Nemours And Company | Honeycomb having a high compression strength and articles made from same |
US7803247B2 (en) * | 2007-12-21 | 2010-09-28 | E.I. Du Pont De Nemours And Company | Papers containing floc derived from diamino diphenyl sulfone |
US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
US20090214818A1 (en) * | 2008-02-26 | 2009-08-27 | E. I. Du Pont De Nemours And Company | Core having a high shear strength and articles made from same |
US9666848B2 (en) | 2011-05-20 | 2017-05-30 | Dreamweaver International, Inc. | Single-layer lithium ion battery separator |
WO2013117462A1 (en) | 2012-02-07 | 2013-08-15 | Teijin Aramid B.V. | Aramid paper having increased strength and process for manufacturing thereof |
US9428864B2 (en) * | 2012-04-18 | 2016-08-30 | E I Du Pont De Nemours And Company | Multilayered sheet |
EP2838722B1 (en) * | 2012-04-18 | 2020-12-02 | E. I. du Pont de Nemours and Company | Multilayered sheet |
US9441326B2 (en) * | 2012-04-18 | 2016-09-13 | E I Du Pont De Nemours And Company | Multilayered sheet |
US8936878B2 (en) | 2012-11-20 | 2015-01-20 | Dreamweaver International, Inc. | Methods of making single-layer lithium ion battery separators having nanofiber and microfiber components |
KR102161429B1 (ko) * | 2012-11-23 | 2020-10-07 | 데이진 아라미드 비.브이. | 전기절연지 |
JP6217894B2 (ja) * | 2013-02-08 | 2017-10-25 | デュポン帝人アドバンスドペーパー株式会社 | 着色アラミド紙及びその製造方法 |
KR101524788B1 (ko) * | 2013-12-30 | 2015-06-01 | 도레이케미칼 주식회사 | 저평량 메타 아라미드 페이퍼 및 그 제조방법 |
KR101515307B1 (ko) * | 2013-12-30 | 2015-04-24 | 도레이케미칼 주식회사 | 고평량 메타 아라미드 페이퍼 및 그 제조방법 |
US9976258B2 (en) * | 2014-10-03 | 2018-05-22 | E I Du Pont De Nemours And Company | Honeycomb core having a high compression strength |
KR101547776B1 (ko) | 2014-11-24 | 2015-09-07 | 한국섬유개발연구원 | 허니컴용 아라미드 습식부직포 및 그 제조방법 |
JP6405583B2 (ja) * | 2014-12-26 | 2018-10-17 | 特種東海製紙株式会社 | 絶縁紙 |
KR101700827B1 (ko) * | 2015-05-28 | 2017-01-31 | 코오롱인더스트리 주식회사 | 적층 아라미드 종이 및 그 제조방법 |
US10245804B2 (en) | 2015-10-16 | 2019-04-02 | Hexcel Corporation | Fire retarded aramid fiber-based honeycomb |
US10767316B2 (en) * | 2017-11-01 | 2020-09-08 | Dupont Safety & Construction, Inc. | Paper comprising aramid pulp and a friction paper made therefrom |
KR102201806B1 (ko) * | 2018-02-22 | 2021-01-11 | 코오롱인더스트리 주식회사 | 전기 절연지용 전방향족 아라미드 종이 및 그의 제조방법 |
WO2019228972A1 (en) | 2018-05-28 | 2019-12-05 | Teijin Aramid B.V. | Aramid-based paper with improved properties |
US11078627B2 (en) | 2018-08-14 | 2021-08-03 | Dupont Safety & Construction, Inc. | High tensile strength paper suitable for use in electrochemical cells |
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NL246230A (zh) * | 1958-12-09 | |||
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US4729921A (en) * | 1984-10-19 | 1988-03-08 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
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US5026456A (en) * | 1990-06-14 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Aramid papers containing aramid paper pulp |
WO1995014815A1 (en) * | 1993-11-29 | 1995-06-01 | Akzo Nobel N.V. | Process for preparing para-aromatic polyamide paper |
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JP3340549B2 (ja) * | 1994-03-01 | 2002-11-05 | 帝人株式会社 | 多孔性アラミド成形物の製造方法 |
EP0739707B1 (en) * | 1995-04-28 | 2000-06-14 | Showa Aircraft Industry Co., Ltd. | Honeycomb core |
JPH10131017A (ja) * | 1996-02-21 | 1998-05-19 | Shin Kobe Electric Mach Co Ltd | 積層板用基材及びその製造法ならびにプリプレグ及び積層板 |
JPH1072752A (ja) * | 1996-05-15 | 1998-03-17 | Matsushita Electric Ind Co Ltd | プリント配線板用不織布基材とこれを用いたプリプレグ |
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US6120643A (en) * | 1999-10-27 | 2000-09-19 | E. I. Du Pont De Nemours And Company | Aramid and glass fiber absorbent papers |
JP3321141B2 (ja) * | 2000-04-03 | 2002-09-03 | 昭和飛行機工業株式会社 | アラミドハニカムおよびその製造方法 |
US6592963B1 (en) * | 2000-06-16 | 2003-07-15 | E. I. Du Pont De Nemours And Company | Honeycomb structure |
US6303221B1 (en) * | 2000-12-07 | 2001-10-16 | E. I. Du Pont De Nemours And Company | Two-component pulp reinforcement |
US20020142689A1 (en) * | 2001-01-23 | 2002-10-03 | Levit Mikhail R. | Non-woven sheet of aramid floc |
US6436236B1 (en) * | 2001-03-05 | 2002-08-20 | E. I. Du Pont De Nemours & Company | Electrically-conductive para-aramid pulp |
JP4287622B2 (ja) * | 2002-06-28 | 2009-07-01 | デュポン帝人アドバンスドペーパー株式会社 | コーティングセパレータ、その製造方法およびそれを用いた電気電子部品 |
US7459044B2 (en) * | 2002-08-26 | 2008-12-02 | E. I. Du Pont De Nemours And Company | Sheet material especially useful for circuit boards |
US20040071952A1 (en) * | 2002-10-01 | 2004-04-15 | Anderson David Wayne | Aramid paper laminate |
JP2005200545A (ja) * | 2004-01-15 | 2005-07-28 | Yokohama Rubber Co Ltd:The | ホース補強層間ゴム組成物およびこれを用いたホース |
US20050284595A1 (en) * | 2004-06-25 | 2005-12-29 | Conley Jill A | Cellulosic and para-aramid pulp and processes of making same |
US20060266486A1 (en) * | 2005-05-26 | 2006-11-30 | Levit Mikhail R | Electroconductive aramid paper |
-
2004
- 2004-04-16 US US10/826,530 patent/US20050230072A1/en not_active Abandoned
-
2005
- 2005-04-15 EP EP05739774A patent/EP1756360B1/en active Active
- 2005-04-15 BR BRPI0509409A patent/BRPI0509409B8/pt active IP Right Grant
- 2005-04-15 CA CA2561329A patent/CA2561329C/en active Active
- 2005-04-15 JP JP2007508603A patent/JP2007532798A/ja active Pending
- 2005-04-15 CN CN2005800111380A patent/CN1942629B/zh active Active
- 2005-04-15 WO PCT/US2005/012996 patent/WO2005103376A1/en not_active Application Discontinuation
-
2011
- 2011-07-22 JP JP2011161010A patent/JP5686688B2/ja active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103282412A (zh) * | 2011-01-04 | 2013-09-04 | 帝人芳纶有限公司 | 电绝缘纸 |
CN103282412B (zh) * | 2011-01-04 | 2018-04-10 | 帝人芳纶有限公司 | 电绝缘纸 |
CN103476989A (zh) * | 2011-01-27 | 2013-12-25 | 深圳昊天龙邦复合材料有限公司 | 包含芳族合成纤维纸的半固化片和由其制得的印刷电路板 |
CN105579641A (zh) * | 2013-07-18 | 2016-05-11 | 帝人芳纶有限公司 | 阻燃片材 |
CN105579641B (zh) * | 2013-07-18 | 2018-12-18 | 帝人芳纶有限公司 | 阻燃片材 |
CN109518519A (zh) * | 2013-07-18 | 2019-03-26 | 帝人芳纶有限公司 | 阻燃片材 |
CN109518519B (zh) * | 2013-07-18 | 2022-03-04 | 帝人芳纶有限公司 | 阻燃片材 |
CN107849813A (zh) * | 2015-05-28 | 2018-03-27 | 可隆工业株式会社 | 芳族聚酰胺纸、制备方法及其用途 |
CN107849813B (zh) * | 2015-05-28 | 2020-05-12 | 可隆工业株式会社 | 芳族聚酰胺纸、制备方法及其用途 |
Also Published As
Publication number | Publication date |
---|---|
CN1942629B (zh) | 2010-04-07 |
JP2011219913A (ja) | 2011-11-04 |
CA2561329A1 (en) | 2005-11-03 |
CA2561329C (en) | 2014-07-15 |
JP2007532798A (ja) | 2007-11-15 |
EP1756360B1 (en) | 2012-08-15 |
WO2005103376A1 (en) | 2005-11-03 |
BRPI0509409A (pt) | 2007-09-04 |
EP1756360A1 (en) | 2007-02-28 |
JP5686688B2 (ja) | 2015-03-18 |
BRPI0509409B8 (pt) | 2023-01-31 |
BRPI0509409B1 (pt) | 2015-12-22 |
US20050230072A1 (en) | 2005-10-20 |
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