CN1941337A - Electronic equipment cooling plant and electronic equipment - Google Patents
Electronic equipment cooling plant and electronic equipment Download PDFInfo
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- CN1941337A CN1941337A CNA2006101516361A CN200610151636A CN1941337A CN 1941337 A CN1941337 A CN 1941337A CN A2006101516361 A CNA2006101516361 A CN A2006101516361A CN 200610151636 A CN200610151636 A CN 200610151636A CN 1941337 A CN1941337 A CN 1941337A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
- F25B1/04—Compression machines, plants or systems with non-reversible cycle with compressor of rotary type
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/006—General constructional features for mounting refrigerating machinery components
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Other Air-Conditioning Systems (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The object of the present invention is to provide a small cooling device using a refrigeration cycle and a notebook computer. The cooling device (40) which is incorporated in the housing (30) of the computer (10) is composed of a compressor (41), a condenser (42), an evaporator (44), a capillary tube (43) as an expansion means, and a blowing fan (45). These devices constituting the cooling device (40) are connected with one another by piping (46). Further, the compressor (41), the condenser (42), and the blowing fan (45) are arranged in different positions when viewed from above. The compressor (41) and the longitudinal side of the condenser (42) are arranged in a shape like a letter L in the proximity of the blowing fan (45). In this way, the size of the cooling device (40) viewed from above can be reduced and the cooling device (40) is prevented from inhibiting layout of other parts incorporated in the housing (30).
Description
Technical field
The present invention relates to the cooling device and the electronic equipment of electronic equipment, particularly used the cooling device and the electronic equipment of the electronic equipment of kind of refrigeration cycle.
Background technology
In recent years, the progress of the multifunction of notebook computer, miniaturization is very remarkable.Be accompanied by the multifunction of notebook computer, CPU (CPU) makes the heat that sends from CPU increase to high speed and multifunction development.
Given this, in the past for the temperature that suppresses CPU rises, in the mounted on surface of CPU the good fin of thermal diffusivity is arranged, the Air Blast fan by rotation is to the fin blow out air.And, after using heat pipe to carry out the heat conveying, carry out the heat radiation of fin.By carrying out such countermeasure, can be below the ascending temperature of the CPU about 60W is suppressed at about 70 ℃ with for example consumed power.
But nearest CPU caloric value for example increases to about 100W, in the heat dissipating method that has used above-mentioned Air Blast fan and heat pipe, exists the problem that CPU can be not sufficiently cooled.And then, exist and promptly enable CPU is fully cooled off, the problem that the cooling device of cooling CPU also can hugeization.
As suppressing the additive method that cpu temperature rises, the method for using the water-cooled circulation or the method for using kind of refrigeration cycle are arranged.These methods are compared with the method for above-mentioned use Air Blast fan, can more effectively cool off COU, so, below the temperature of CPU that can caloric value is bigger is suppressed at necessarily.In following patent documentation 1, disclose the technology contents that uses kind of refrigeration cycle cooling semiconductor device.
Patent documentation 1: the spy opens flat 2002-198478 communique
But, use the cooling device of above-mentioned kind of refrigeration cycle, because its complex structure, so exist the problem that is difficult to be built in the small-sized notebook computer.Particularly, in the cooling device that has used kind of refrigeration cycle, need be provided with compressed refrigerant compressor, from radiator obtain heat evaporator, from cold-producing medium obtain heat condenser, make expansion mechanism that cold-producing medium expands and Air Blast fan etc.On the other hand, in notebook computer, need take in a plurality of electronic units such as HDD (hard disk drive) and disk drive in small-sized framework, the space that can be used in cooling device is limited.Therefore, be difficult to and used the cooling device of the kind of refrigeration cycle of a plurality of parts of needs to be received in the framework of small-sized notebook computer.
And, in the cooling device that has used kind of refrigeration cycle, use fan heat removal from compressed high temperature refrigerant, so the temperature of the air of discharging from cooling device for example is 50 ℃～a high temperature more than 60 ℃.If computed user touches such high temperature air, then the user may be burnt.Therefore, exist the problem that the air that can not discharge from cooling device is discharged to any direction.
Summary of the invention
The present invention puts in view of the above problems and proposes, and its main purpose is to provide small cooling device and the electronic equipment that has used kind of refrigeration cycle.
The cooling device of electronic equipment of the present invention, it is characterized in that, have: the compressing mechanism of compressed refrigerant, from discharging the condensing mechanism that heat makes cold-producing medium liquefaction to the outside by the described cold-producing medium of described compressing mechanism compression, make the expansion mechanism that expands by the described cold-producing medium after the described condensing mechanism liquefaction, make the evaporation mechanism that accepts heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands, and wind pushing mechanism, described compressing mechanism and the different in the plane position of described condensing mechanism configuration, the length direction of described condensing mechanism and the length direction of described compressing mechanism are configured to L word shape.
And, the cooling device of electronic equipment of the present invention, it is characterized in that, have: the compressing mechanism of compressed refrigerant, from discharging the condensing mechanism that heat makes cold-producing medium liquefaction to the outside by the described cold-producing medium of described compressing mechanism compression, make expansion mechanism by the described cold-producing medium expansion of described condensing mechanism liquefaction, make the evaporation mechanism that accepts heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands, and wind pushing mechanism, described compressing mechanism, the position that the configuration of described condensing mechanism and described wind pushing mechanism is different in the plane, described compressing mechanism and described condensing mechanism be configured in described wind pushing mechanism near.
And, the cooling device of electronic equipment of the present invention, it is characterized in that, have: the compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside discharge heat make cold-producing medium liquefaction condensing mechanism, make the expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands and make and accept heat and the evaporation mechanism of the described cold-producing medium evaporation of expanding by described expansion mechanism from semiconductor element, at least a portion of the pipe arrangement that is connected with described evaporation mechanism is positioned at than the described position of mechanism above relying on of evaporating.
And, the cooling device of electronic equipment of the present invention, it is characterized in that, have: the compressing mechanism of compressed refrigerant, from discharging the condensing mechanism that heat makes cold-producing medium liquefaction to the outside by the described cold-producing medium of described compressing mechanism compression, make expansion mechanism by the described cold-producing medium expansion of described condensing mechanism liquefaction, with make the evaporation mechanism that accepts heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands, described compressing mechanism, described condensing mechanism and described evaporation mechanism are configured in the diverse location on the plane, described compressing mechanism is made of the Rotary Compressor with respect to described flat transverse configuration, described Rotary Compressor has the introduction part that imports described cold-producing medium, with the leading-out portion of deriving described cold-producing medium, described leading-out portion is arranged on the position that relies on top than the rotating shaft center of described Rotary Compressor.
And, the cooling device of electronic equipment of the present invention, it is characterized in that, have: the compressing mechanism of compressed refrigerant, from discharging the condensing mechanism that heat makes cold-producing medium liquefaction to the outside by the described cold-producing medium of described compressing mechanism compression, make expansion mechanism by the described cold-producing medium expansion of described condensing mechanism liquefaction, with make the evaporation mechanism that accepts heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands, described compressing mechanism, described condensing mechanism and described evaporation mechanism are configured in the diverse location on the plane, described compressing mechanism is made of the Rotary Compressor with respect to described flat transverse configuration, described Rotary Compressor has the introduction part that imports described cold-producing medium, with the leading-out portion of deriving described cold-producing medium, described introduction part is arranged on the position that relies on the bottom than the rotating shaft center of described Rotary Compressor.
Electronic equipment of the present invention has frame, and described frame is taken in the function element of following heating and moving, and it is characterized in that, the cooling device that uses kind of refrigeration cycle to cool off described function element is built in the described frame.
And, electronic equipment of the present invention, has frame, described frame is taken in and is followed heating and the function element of action, it is characterized in that, in described frame, be built-in with cooling device, this cooling device comprises: the compressing mechanism of compressed refrigerant, discharge the condensing mechanism that heat makes cold-producing medium liquefaction from described cold-producing medium to the outside of described frame by described compressing mechanism compression, make expansion mechanism by the described cold-producing medium expansion of described condensing mechanism liquefaction, make the evaporation mechanism that accepts heat and evaporate from described function element by the described cold-producing medium that described expansion mechanism expands, and wind pushing mechanism, the length direction of described condensing mechanism and described compressing mechanism is with respect to the side almost parallel configuration of described frame.
And, electronic equipment of the present invention, has frame, described frame is taken in and is followed heating and the function element of action, it is characterized in that, in described frame, be built-in with cooling device, this cooling device comprises: the compressing mechanism of compressed refrigerant, discharge the condensing mechanism that heat makes cold-producing medium liquefaction from described cold-producing medium to the outside of described frame by described compressing mechanism compression, make expansion mechanism by the described cold-producing medium expansion of described condensing mechanism liquefaction, make the evaporation mechanism that accepts heat and evaporate from described function element by the described cold-producing medium that described expansion mechanism expands, and wind pushing mechanism, this electronic equipment has: MA monitoring agency monitors the temperature of described function element; And controlling organization, based on the output of described MA monitoring agency, control the cooling capacity of described cooling device.
According to the cooling device of electronic equipment of the present invention, can make the cooling device miniaturization of adopting kind of refrigeration cycle.Particularly, the condenser and the compressor of formation cooling device are than relatively large parts.Therefore, by the large-scale like this condenser and the length direction of compressor are configured to L word shape, can make the cooling device integral miniaturization.
And, according to the present invention, be configured in the top of evaporator by the pipe arrangement that will be connected with evaporator, can be at evaporator or/and the internal storage liquid refrigerant of pipe arrangement.Therefore, even when cooling device is not worked, also can be by being stored in evaporator or/and the liquid refrigerant in the pipe arrangement absorbs the heat that produces from heaters such as CPU.
And, according to the present invention, take out the leading-out portion of cold-producing medium from the Rotary Compressor of landscape configuration, be configured in the position that relies on top than the rotating shaft center of Rotary Compressor.Therefore, the employed lubricating oil in inside that can be suppressed at Rotary Compressor is blended in the cold-producing medium of taking-up.
According to electronic equipment of the present invention, be accommodated in the framework by the cooling device that will adopt kind of refrigeration cycle, be accommodated at the many CPU of caloric value under the situation in the electronic equipment such as notebook computer, also can fully cool off CPU.
And according to electronic equipment of the present invention, the condenser of cooling device and the length direction of compressor are with the side almost parallel configuration of frame.Therefore, can compact take in the condenser and the compressor of large-scale as a comparison parts, thus, the shared space of the inner cooling device of framework is diminished.
And then, according to electronic equipment of the present invention, can be according to the variations in temperature of the function element that is built in frame, the cooling capacity of control cooling device.Therefore, can not occur cooling off under the not enough situation, the refrigerating function element, so, can save the electric power of function element cooling usefulness, and abundant refrigerating function element.
Description of drawings
Fig. 1 (A) is the vertical view of the related computer of expression embodiment of the present invention, and Fig. 1 (B) is the vertical view of the related cooling device of expression embodiment of the present invention.
Fig. 2 (A) is the stereogram of the cooling device of expression embodiment of the present invention, and Fig. 2 (B) is the stereogram from the computer of beneath embodiment of the present invention.
Fig. 3 (A) is the figure from the computer of forward observation embodiment of the present invention, and Fig. 3 (B) is the cutaway view that the part of cooling device is set.
Fig. 4 (A) is the vertical view of the Rotary Compressor of embodiment of the present invention, and Fig. 4 (B) is its cutaway view.
Fig. 5 (A) and Fig. 5 (B) are the vertical views of the cooling device of expression embodiment of the present invention.
Fig. 6 is the figure of electrical structure of the cooling device of expression embodiment of the present invention.
Among the figure: 10-computer, 20-display part, 30-frame, 31-mainboard, the 32-CDROM driver, 33-storage battery, 34-HDD, 35-FDD, 36-CPU, 37-exhaust outlet, 38-exhaust outlet, 39-air entry, the 40-cooling device, 41-compressor, 42-condenser, 43-capillary, the 44-evaporator, 45-Air Blast fan, 46-pipe arrangement, 47-leading-out portion, the 48-introduction part, 49-memory, 50-motor part, 51-pump portion, 52-terminal, 53-cylinder, 54-blade (vane), 55-cylinder chamber, 56-roller, the 57-housing, 58-rotating shaft center, 59-microcomputer, the 60-otch, 61-converter, 62-axle.
Embodiment
Below, with reference to accompanying drawing, describe embodiments of the present invention in detail.In the present invention, as an embodiment of electronic equipment, be that example describes with the notebook computer, still, present embodiment also can be used for other electronic equipment.For example, also present embodiment can be used for desktop computer or PAD (personal digital assistant) etc.
Fig. 1 is the figure of the notebook computer 10 (being designated hereinafter simply as computer) of expression present embodiment.Fig. 1 (A) is a vertical view of observing computer 10 from the top, and Fig. 1 (B) is the vertical view that expression is built in the cooling device 40 in the computer 10.
With reference to Fig. 1 (A), the computer 10 of present embodiment comprises: be built-in with CPU36 etc. follow heating function element frame 30 with rotate the display part 20 that is connected freely with frame 30.
The plane sizes of display part 20 and frame 30 is roughly the same, if display part 20 and frame 30 is folding, then integral body becomes a framework.The plane sizes of the computer 10 after frame 30 and display part 20 are folded for example is A4 size (210mm * 290mm) or B5 size (182mm * 257mm).In addition, though not shown at this, on frame 30, dispose indicating devices such as keyboard and sliding mouse.
With reference to Fig. 1 (B), the structure of cooling device 40 is described.Cooling device 40 comprises: compressor 41 (compressing mechanism), condenser 42 (condensing mechanism), evaporator 44 (evaporation mechanism), capillary 43 (expansion mechanism), Air Blast fan 45 (wind pushing mechanism).And these devices of formation cooling device 40 link mutually by tubulose pipe arrangement 46.
And compressor 41 possesses: import from the outside cold-producing medium introduction part 48, will export to outside leading-out portion 47 at the cold-producing medium of internal compression.In the present embodiment, the leading-out portion 47 of compressor 41 is configured in than the position of introduction part 48 near condenser 42.Thus, make that the leading-out portion 47 of compressor 41 and condenser 42 are approaching.Therefore, can will directly offer condenser 42 by the cold-producing medium after compressor 41 compressions.
Here, leading-out portion 47 not necessarily needs to be arranged at condenser 42 1 sides, according to the structure of compressor 41, can change the position of leading-out portion 47.That is, also leading-out portion 47 can be arranged on than the position of introduction part 48 away from condenser 42.In this case, on paper, leading-out portion 47 is arranged on than introduction part 48 near on the compressor 41 of bottom.
Here, compressor 41 in the left side (near the left end), and is configured to the side almost parallel of its length direction and frame 30 in the internal configurations of frame 30, still, also variable should configuration.That is, compressor 41 is also configurable in the right side (near the right-hand end) in the inside of frame 30, and is configured to the parallel sided of its length direction and frame 30.
Capillary 43 has the function of the condensation of refrigerant of making.Here, capillary 43 is rolled into circle and disposes above Air Blast fan 45.By capillary 43 being configured in the top of Air Blast fan 45, can reduce the plane sizes of cooling device 40.
The electronic unit thermal that evaporator 44 and CPU36 etc. are accompanied by heating together.Therefore, accept to make cold-producing medium become gaseous state from liquid condition by evaporator 44 in the inside of evaporator 44 from the heat of CPU36 generation.Here, evaporator 44 is configured in the position overlapped with CPU36.
Air Blast fan 45 has the air that is taken into low temperature from the outside of frame 30, and the air of this low temperature is blown to the function of condenser 42 and compressor 41.By accepting the air that heat becomes high temperature, be discharged to the outside from the side of frame 30 from condenser 42 and compressor 41.
The action of the cooling device 40 of Gou Chenging is as described below as described above.If cooling CPU36 etc. and make cooling device 40 work, then at first cold-producing medium becomes the state of high temperature, high pressure by compressor 41.The cold-producing medium of high temperature, high pressure conditions is sent to condenser 42 via pipe arrangement 46.In condenser 42,, make cold-producing medium liquefaction by the cooling effect of the Cryogenic air sent from Air Blast fan 45.The cold-producing medium of liquid condition is sent in the capillary 43 via pipe arrangement 46.In capillary 43, cold-producing medium expands becomes the state of low pressure, low temperature, and this cold-producing medium is sent to evaporator 44.In evaporator 44, from cooled dose of acceptance of heat of CPU36 generation.As a result, the cold-producing medium evaporation becomes gaseous state, and the cold-producing medium of this gaseous state is sent in the compressor 41 once more.
As described above, by cooling device 40 work, CPU36 is cooled.In the present embodiment, by adopting the cooling device 40 of refrigerating system, can make consumed power for example is that CPU36 about 60W～200W fully cools off.
The cooling device 40 of present embodiment, its compressor 41, condenser 42 and the different in the plane position of Air Blast fan 45 configurations, the length direction of compressor 41 and condenser 42 is configured to L word shape near Air Blast fan 45.Thus, make the plane sizes compactness of cooling device 40, can suppress cooling device 40 and hinder the layout that is built in the miscellaneous part in the frame 30.And near the place beyond also can be Air Blast fan 45 is configured to L word shape with the length direction of compressor 41 and condenser 42.
Particularly, compressor 41 and condenser 42 also are than relatively large parts in the parts that constitute cooling device 40.Therefore, if with the outstanding towards periphery configuration of these large components, then in the inside of frame 30, the area that can cause cooling device 40 to be occupied becomes big, the layout of restriction miscellaneous part.Therefore, the mode that is L word shape by the length direction with compressor 41 and condenser 42 is configured, and makes the plane sizes densification of cooling device 40, does not have outstanding part.
And compressor 41 and condenser 42 are the parts by Air Blast fan 45 coolings.Therefore, by with compressor 41 and condenser 42 with L word shape be configured in Air Blast fan 45 near, also exist the advantage that can increase the cooling effect that brings by Air Blast fan.
And then cooling device 40 is the integrated end that is disposed at the rear, left side in the inside of frame 30.By cooling device 40 is configured in such position, can prevent because the heat that produces from cooling device 40, make other electronic unit such as HDD34 be subjected to the harmful effect of the heat that self-cooling set 40 produced.Here, the also configurable place beyond at the rear, left side of cooling device 40.That is, the place of configuration cooling device 40 can be rear, right side, the place ahead, left side, the place ahead, right side in the inside of frame 30.
And, the configuration of also replaceable condenser 42 and compressor 41.That is, compressor 41 is configured in the rear of frame 30 inside, and its length direction is configured to parallel sided with frame 30.And, also condensation part 42 can be configured in the right side or the left side of frame 30 inside, and its length direction is configured to parallel sided with frame 30.
With reference to Fig. 2, then, being the center with Air Blast fan 45 describes the structure of computer 10.Fig. 2 (A) is the stereogram that is built-in with the part of cooling device 40 in the expression computer 10, and Fig. 2 (B) expression is from the stereogram of oblique beneath computer 10.
With reference to Fig. 2 (A), condenser 42 in the internal configurations of frame 30 near rear end.And, almost parallel ground, the side configuration at the length direction of condenser 42 and frame 30 rears.Thus, blow to the air of condenser 42, accept heat and after becoming high temperature, be discharged to the outside from the rear of frame 30 from condenser 42 by Air Blast fan 45.Here, as mentioned above, the position relation between also replaceable condenser 42 and the compressor 41.
And compressor 41 is configured near the left end of frame 30, and the length direction of compressor 41 is configured to the left lateral sides almost parallel with frame 30.Therefore, the air that blows to compressor 41 from Air Blast fan 45 is discharged to the outside of frame 30 behind the heat of having accepted compressor 41.
As mentioned above, follow the action of cooling device 40 and the condenser 42 and the compressor 41 that generate heat, be configured in the periphery of frame 30.Thus, can make by Air Blast fan 45 and blow out and the air that becomes high temperature directly is discharged to the outside of frame 30.Therefore, can suppress to make the integral body of frame 30 become high temperature by the heating of condenser 42 and compressor 41.
With reference to Fig. 2 (B), Air Blast fan 45 is taken into the Cryogenic air of outside the inside of frame 30 from the air entry 39 of the bottom surface that is arranged on frame 30.And,, be discharged to the outside from the exhaust outlet 37,38 of the side that is arranged on frame 30 because of cooler condenser 42 and compressor 41 become the air of high temperature.By air entry 39, exhaust outlet 37,38, on frame 30, be provided with a plurality of holes with slit-shaped.
By exhaust outlet 38 being arranged on the rear portion of frame 30, accept the heat of condenser 42 and heated high temperature air can be discharged to the rear of computer 10.Therefore, owing to the air after the heating is not discharged towards the user who is positioned at computer 10 the place aheads, so, can prevent that the user is subjected to injuries such as burn.And, also can make the heat of accepting condenser 42 and the air that becomes high temperature, be discharged to the outside from the side, right side or the side, left side of frame 30.
And, by left side exhaust outlet 37 is set at frame 30, can make cooling compressor 41 and the air that becomes high temperature is discharged to the outside from the left side side of computer 10.On the other hand, general user is by indicating devices such as right-hand operated mouses.Therefore, because the high temperature air of discharging from exhaust outlet 37 can not touch the hand that the user uses mouse, so, can prevent that the user from burning.And exhaust outlet 37 also can be arranged on the right side of frame 30.
As mentioned above, the air from the cooling device 40 that has used kind of refrigeration cycle is discharged becomes the high temperature about for example 50 ℃～60 ℃.Therefore, be arranged on the left side side and the rear of frame 30, make the user not contact exhaust, concerning the user, can obtain safe computer configuation by the exhaust outlet 37,38 that will discharge high-temperature gas.
With reference to Fig. 3, the structure with pipe arrangement is that the center illustrates computer 10 especially.Fig. 3 (A) is the figure from forward observation computer 10, and Fig. 3 (B) is the cutaway view that disposes the part of cooling device 40.
With reference to Fig. 3 (A) and Fig. 3 (B), the compressor 41, condenser 42, capillary 43 and the evaporator 44 that constitute cooling device 40 interconnect by pipe arrangement 46.The heat that produces from CPU36 is transported to condenser 42 via the cold-producing medium that circulates pipe arrangement 46, and is discharged to the outside.
In the present embodiment, make at least a portion of the pipe arrangement 46A that connects capillary 43 and evaporator 44 be positioned at the position that relies on the top than evaporator 44.And, make at least a portion of the pipe arrangement 46B that connects evaporator 44 and compressor 41 also be positioned at the position that relies on the top than evaporator 44.Thus, exist following advantage, promptly the internal storage at pipe arrangement 46A, 46B, evaporator 44 has aqueous cold-producing medium, carries out the cooling of CPU36 by this stored liquid cold-producing medium (aqueous cold-producing medium).
Particularly, pipe arrangement 46A, 46B are that tubulose is made with metal formings such as for example copper, and at least a portion is positioned at than the position that relies on the top above the evaporator 44 that makes the CPU36 cooling.During cooling device 40 work, cold-producing medium is passed through in the inside of pipe arrangement 46A, 46B.And, shut down computer 10, after cooling device 40 stops, residual in the inside of pipe arrangement 46A, 46B and evaporator 44 have an aqueous cold-producing medium.And, make computer 10 work once more after, by residuing in the liquid refrigerant of pipe arrangement 46A, 46B and evaporator 44 inside, use evaporator 44 to cool off CPU36.
Particularly, when computer 10 started, CPU36 moved the most actively and be heated.Its reason is, in order to satisfy this requirement that the user wishes that computer starts as early as possible, moves actively when computer starting and set CPU36 for.
Though as long as start synchronously with computer 10, cooling device 40 move at once, the cooling of carrying out CPU36 gets final product, in fact, sometimes from computer 10 start to cooling device 40 move between life period poor.Thus, if moment behind the computer starting, CPU36 is action actively at once, and does not carry out the cooling based on cooling device 40, then exists the danger that CPU36 exceedingly becomes high temperature.Given this, in the present embodiment, make to pipe arrangement 46A, the 46B of the evaporator 44 the supply system cryogens that cool off CPU36 to be positioned at the position that relies on the top than evaporator 44.Thus, if cooling device 40 is stopped, then aqueous liquid refrigerant can be stored in the inside of pipe arrangement 46A, 46B and evaporator 44.Then, when computer is restarted,,, also can make CPU36 cooling certain hour by being stored in the liquid refrigerant in pipe arrangement 46A, 46B and the evaporator 44 even cooling device 40 is failure to actuate.Therefore, CPU36's is overheated in the time of can preventing that computer from restarting.
In the above description, the two is positioned at the position that relies on the top than evaporator 44 to make pipe arrangement 46A, 46B, still, also can only make the position of a certain orientation above relying on than evaporator 44 among pipe arrangement 46A, the 46B.And the two is positioned at the position that relies on the top than evaporator 44 if make pipe arrangement 46A, 46B, then owing to can store more substantial liquid refrigerant, so, have above-mentioned cooling effect and become big advantage.
With reference to Fig. 4, describe the Rotary Compressor 41 that adopts as the compressor of present embodiment in detail.Fig. 4 (A) is the vertical view of the structure of expression Rotary Compressor 41, and Fig. 4 (B) is the cutaway view of the pump portion of Rotary Compressor.
With reference to Fig. 4 (A), Rotary Compressor 41 has: motor part 50 and the pump portion 51 that is driven by motor part 50.Motor part 50 is built-in with the motor that rotates by the electric power of supplying with from terminal 52.Pump portion 51 is the positions that make the cold-producing medium compression that imports from the outside, moves based on the actuating force of motor part 50.Introduction part 48 is the positions that the cold-producing medium after expanding imported Rotary Compressor 41 from the outside.Leading-out portion 47 is to be fetched into outside position by the cold-producing medium after Rotary Compressor 41 compressions.In addition, constitute each key element of motor part 50 and pump portion 51, be accommodated in the inside of the housing 57 of approximate circle tubular.
With reference to Fig. 4 (B), the structure of pump portion 51 is described.Pump portion 51 has: be accommodated in housing 57 inside cylinder 53, be built in the cylinder 53 and the roller 56 of rotation.In the inside of cylinder 53, and roller 56 between be provided with cylinder chamber 55.In addition, in the inside of roller 56, be provided with the cross section and be circular axle 62, this position of 62 is fixed.And, in the inside of cylinder 53,, be provided with blade 54 in order to divide residing cylinder chamber 55 of cold-producing medium and the residing cylinder chamber 55 of not compressed cold-producing medium after the compression.Blade 54 is arranged to and can be carried out sliding motion along vertical direction.
In the inside of cylinder 53, by the roller 56 eccentric rotations of inwall with axle 62 butts, will be from the cold-producing medium compression of introduction part 48 importings.And, at the compressed cold-producing medium in the inside of cylinder chamber 55, be filled into the inside of housing 57, and be discharged to the outside from leading-out portion 47 from otch 60.Otch 60 is to be used for that cold-producing medium with cylinder chamber 55 inside is transplanted on housing 57 and part that the part of cylinder 53 is cut away.In addition, for the rotation that makes roller 56 becomes easily, taken in lubricating oil in the inside of housing 57.
In the present embodiment, the cold-producing medium after the compression is exported to outside leading-out portion 47, be arranged on position than the rotating shaft center 58 close tops of Rotary Compressor 41.Here, so-called rotating shaft center 58 is centers of spindle 62, in other words is meant the center of housing 57.Thus, can suppress lubricating oil is blended into from leading-out portion 47 and is discharged to the outside cold-producing medium.
Particularly, Rotary Compressor 41 as shown in Figure 1, with respect to flat transverse configuration of mounting condenser 42 and Air Blast fan 45 etc.Therefore, the lubricating oil that is positioned at housing 57 inside is owing to the influence of gravity is positioned at the bottom.Thus, if will be used for cold-producing medium is fetched into the bottom that outside leading-out portion 47 is arranged on Rotary Compressor 41, then may sneak into a large amount of lubricating oil in the cold-producing medium of Qu Chuing.If sneak into a large amount of lubricating oil in the cold-producing medium that takes out, then may cause the lubricants capacity of Rotary Compressor 41 to reduce, make the function reduction of compressor, thereby can not fully cool off CPU.Given this, in the present embodiment, leading-out portion 47 is arranged on the top of housing 57.Thus, can prevent that a large amount of lubricating oil from sneaking in the cold-producing medium of being derived.
In addition, owing to divide cylinder chamber 55 by blade 54 as described above,, introduction part 48 relies on the housing 57 of bottom so being configured in than rotating shaft center 58.
With reference to Fig. 5, other modes of cooling device 40 are described.Fig. 5 (A) and Fig. 5 (B) are the figure of the cooling device 40 of other modes of expression.
With reference to Fig. 5 (A),, be provided with two Air Blast fan 45A, 45B here.By two Air Blast fan 45A, 45B are set like this, can increase air capacity, so the function that cooling device 40 is cooled off improves to condenser 42 air-supplies.Here, though two Air Blast fan 45A, 45B in abutting connection with configuration, but also devices spaced apart configuration.And then, 3 above Air Blast fans also can be set.
With reference to Fig. 5 (B), here, pipe arrangement 46C and memory 49 butts that compressor 41 is connected with evaporator 44.Thus, the cold-producing medium that the heat that is produced by memory 49 is passed through in the inside of pipe arrangement 46C is accepted, and makes memory 49 be cooled.Here, by pipe arrangement 46C cooling memory 49, but also can be by the electric equipment beyond the pipe arrangement 46C cooling memory.For example, can be by pipe arrangement 46C cooling by the element that carries out chip setting and figure control of CPU control etc.
With reference to Fig. 6, being the center with the cooling effect of CPU describes the action of computer 10.Here, microcomputer 59 is controlled the rotation of compressor 41 and Air Blast fan 45 based on the temperature information of CPU36.Thus, when the temperature of CPU36 is low and higher, make the rotating speed difference of Air Blast fan 45 and compressor 41.
Particularly, as mentioned above, the heat of following the function element of heating to produce from CPU36 etc. is via 44 cooled doses of acceptance of evaporator of cooling device 40.And in the inside of cooling device 40, cold-producing medium expands repeatedly, compresses and circulate between evaporator 44, compressor 41, condenser 42 and capillary 43.And, by Air Blast fan 45 air blowing to condenser 42, the heat with cold-producing medium is discharged to the outside thus.In addition, the motor that is built in the compressor 41 is controlled by converter 61.
According to the formation of above-mentioned present embodiment, the temperature of CPU36 can be suppressed at certain following (for example below 70 ℃).But the caloric value of CPU36 might not.That is, if CPU36 moves actively, the quantitative change of then generating heat is many, and when CPU36 moved inactively, caloric value reduced.Thus, slow as if the rotary speed of motor that is had at compressor 41 and Air Blast fan 45, when then the temporary transient change of the caloric value of CPU36 is big, may cause the cooling capacity of cooling device 40 inadequate, thereby make the temperature of CPU36 rise.In addition, if prevent this phenomenon, make the rotary speed of motor that compressor 41 had and Air Blast fan 45 very fast all the time, rise though then can suppress the temperature of CPU36, exist the big possibility of electric power change that causes cooling device 40 to consume.
Given this, in the present embodiment, control the motor that compressor 41 had and the rotary speed of Air Blast fan 45 according to the temperature of CPU36.That is,, accelerate the rotary speed of the two along with the temperature of CPU36 uprises.Thus, can make the temperature of CPU36 between for example 50 ℃～70 ℃.Its details is as described below.
The temperature of CPU36 is monitored that by the sensor part that is built in CPU36 self (MA monitoring agency) temperature information of expression CPU36 temperature is admitted in the microcomputer 59 (controlling organization).The rotating speed of microcomputer 59 control change devices 61 and Air Blast fan 45.
For example, as described below under situation the about as described above temperature of CPU36 being located between 50 ℃～70 ℃, by the rotating speed of microcomputer 59 control change devices 61 and Air Blast fan 45.
When the temperature of CPU36 was lower than 55 ℃ (the 1st temperature), based on the indication of microcomputer 59, the rotating speed of converter 61 and Air Blast fan 45 was retained as necessarily.The rotating speed of this moment is for example for making the rotating speed that moves from the action sound of Air Blast fan 45 and compressor 41 generations in quiet scope.
When the temperature of CPU36 is 55 ℃～65 ℃, increase with the temperature of the CPU36 rotating speed that makes converter 61 and Air Blast fan 45 pro rata that rises.Thus, in the time of between 55 ℃～65 ℃, according to the variations in temperature of CPU36, the cooling capacity of scalable cooling device 40.Therefore, as implied above, the temperature of CPU36 can be controlled between 50 ℃～70 ℃.
In the temperature of CPU36 is 65 ℃ (the 2nd temperature) when above, and the rotating speed of converter 61 and Air Blast fan 45 remains necessarily, that is, the motor that compressor 41 and forced draft fan 45 are had rotates with maximum rotative speed.Thus, the temperature that can suppress CPU36 rises.
It more than is the explanation of action to the computer 10 of cooling CPU36.
Claims (24)
1, a kind of cooling device of electronic equipment has:
The compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside discharge heat make cold-producing medium liquefaction condensing mechanism, make expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands, make evaporation mechanism and the wind pushing mechanism accepting heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands
Described compressing mechanism and the different in the plane position of described condensing mechanism configuration,
The length direction of described condensing mechanism and the length direction of described compressing mechanism are configured to L word shape.
2, the cooling device of electronic equipment according to claim 1 is characterized in that, described wind pushing mechanism is to described condensing mechanism and the air-supply of described compressing mechanism.
3, the cooling device of electronic equipment according to claim 1 is characterized in that, described compressing mechanism is a Rotary Compressor.
4, the cooling device of electronic equipment according to claim 1 is characterized in that, described compressing mechanism has from described evaporation mechanism and imports the introduction part of described cold-producing medium and the leading-out portion that described cold-producing medium is derived to described condensing mechanism,
Described leading-out portion is configured in than the position of described introduction part near described condensing mechanism.
5, a kind of cooling device of electronic equipment has:
The compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside discharge heat make cold-producing medium liquefaction condensing mechanism, make expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands, make evaporation mechanism and the wind pushing mechanism accepting heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands
Described compressing mechanism, described condensing mechanism and the different in the plane position of described wind pushing mechanism configuration,
Described compressing mechanism and described condensing mechanism be configured in described wind pushing mechanism near.
6, the cooling device of electronic equipment according to claim 5 is characterized in that, described wind pushing mechanism is to described condensing mechanism and the air-supply of described compressing mechanism.
7, the cooling device of electronic equipment according to claim 5 is characterized in that, described compressing mechanism is a Rotary Compressor.
8, the cooling device of electronic equipment according to claim 5 is characterized in that, described compressing mechanism has from described evaporation mechanism and imports the introduction part of described cold-producing medium and the leading-out portion that described cold-producing medium is derived to described condensing mechanism,
Described leading-out portion is configured in than the position of described introduction part near described condensing mechanism.
9, the cooling device of electronic equipment according to claim 5 is characterized in that, the length direction of described condensing mechanism and the length direction of described compressing mechanism are configured to L word shape.
10, a kind of cooling device of electronic equipment has:
The compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside discharge heat make cold-producing medium liquefaction condensing mechanism, make the expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands and make the evaporation mechanism that accepts heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands
At least a portion of the pipe arrangement that is connected with described evaporation mechanism is positioned at described top of evaporating mechanism.
11, the cooling device of electronic equipment according to claim 10 is characterized in that, described pipe arrangement is to connect the pipe arrangement of described compressing mechanism and described evaporation mechanism or/and be connected the pipe arrangement of described evaporation mechanism and described expansion mechanism.
12, the cooling device of electronic equipment according to claim 10 is characterized in that, when described compressing mechanism stopped, residual in the inside of described evaporation mechanism and/or described pipe arrangement had a liquid refrigerant,
Use residual described liquid refrigerant, by the heat of evaporation mechanism acceptance from semiconductor element.
13, a kind of cooling device of electronic equipment has:
The compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside discharge heat make cold-producing medium liquefaction condensing mechanism, make expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands, make the evaporation mechanism that accepts heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands
Described compressing mechanism, described condensing mechanism and described evaporation mechanism are configured in the diverse location on the plane,
Described compressing mechanism is made of the Rotary Compressor with respect to described flat transverse configuration,
Described Rotary Compressor has introduction part that imports described cold-producing medium and the leading-out portion of deriving described cold-producing medium,
Described leading-out portion is arranged on the position that relies on top than the rotating shaft center of described Rotary Compressor.
14, a kind of cooling device of electronic equipment has:
The compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside discharge heat make cold-producing medium liquefaction condensing mechanism, make the expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands and make the evaporation mechanism that accepts heat and evaporate from semiconductor element by the described cold-producing medium that described expansion mechanism expands
Described compressing mechanism, described condensing mechanism and described evaporation mechanism are configured in the diverse location on the plane,
Described compressing mechanism is made of the Rotary Compressor with respect to described flat transverse configuration,
Described Rotary Compressor has introduction part that imports described cold-producing medium and the leading-out portion of deriving described cold-producing medium,
Described introduction part is arranged on the position that relies on the bottom than the rotating shaft center of described Rotary Compressor.
15, a kind of electronic equipment has frame, and described frame is taken in the function element of following heating and moving, it is characterized in that,
The cooling device that uses kind of refrigeration cycle to cool off described function element is built in the described frame.
16, electronic equipment according to claim 15 is characterized in that, described cooling device is taken into air outside from the bottom surface of described frame,
With the described air that has absorbed behind the heat that produces from described function element, from the rear of described frame or/and the side discharge.
17, a kind of electronic equipment has frame, and described frame is taken in the function element of following heating and moving, it is characterized in that,
In described frame, be built-in with cooling device, this cooling device comprises: the compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside of described frame discharge heat make cold-producing medium liquefaction condensing mechanism, make expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands, make evaporation mechanism and the wind pushing mechanism accepting heat and evaporate from described function element by the described cold-producing medium that described expansion mechanism expands
The length direction of described condensing mechanism and described compressing mechanism is with respect to the side almost parallel configuration of described frame.
18, electronic equipment according to claim 17 is characterized in that, described condensing mechanism is configured near the rear of described frame, and the side almost parallel configuration of its length direction and described frame,
Described compressing mechanism is configured near the left side of described frame or near the right side, and the side almost parallel of its length direction and described frame disposes.
19, electronic equipment according to claim 17 is characterized in that, described condensing mechanism is configured near the left side of described frame or near the right side, and the side almost parallel of its length direction and described frame disposes,
Described compressing mechanism is configured near the rear of described frame, and the side almost parallel configuration of its length direction and described frame.
20, electronic equipment according to claim 17 is characterized in that, described wind pushing mechanism is taken into air outside from the bottom surface of described frame,
The described air that has passed through described condensing mechanism is discharged to the outside from the rear of described frame.
21, electronic equipment according to claim 17 is characterized in that, described wind pushing mechanism is taken into air outside from the bottom surface of described frame,
The described air that has passed through described compressing mechanism is discharged to the outside from the left side side or the right side side of described frame.
22, a kind of electronic equipment has frame, and described frame is taken in and followed heating and the function element of action,
In described frame, be built-in with cooling device, this cooling device comprises: the compressing mechanism of compressed refrigerant, from the described cold-producing medium by the compression of described compressing mechanism to the outside of described frame discharge heat make cold-producing medium liquefaction condensing mechanism, make expansion mechanism that the described cold-producing medium by described condensing mechanism liquefaction expands, make evaporation mechanism and the wind pushing mechanism accepting heat and evaporate from described function element by the described cold-producing medium that described expansion mechanism expands
Described electronic equipment has: MA monitoring agency monitors the temperature of described function element; With
Controlling organization based on the output of described MA monitoring agency, is controlled the cooling capacity of described cooling device.
23, electronic equipment according to claim 22 is characterized in that, described controlling organization is based on the output of described MA monitoring agency, makes motor that described compressing mechanism has or/and the rotation speed change of described wind pushing mechanism.
24, electronic equipment according to claim 22 is characterized in that, described controlling organization based on the output of the temperature of the described function element of the expression described MA monitoring agency higher than the 1st temperature, makes described motor or/and the rotating speed of described wind pushing mechanism increases,
Output based on the temperature of the described function element of the expression described MA monitoring agency higher than the 2nd temperature makes described motor or/and the rotating speed of described wind pushing mechanism is certain.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005286813A JP4738121B2 (en) | 2005-09-30 | 2005-09-30 | Electronic device cooling device and electronic device |
| JP2005286813 | 2005-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1941337A true CN1941337A (en) | 2007-04-04 |
Family
ID=37959329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101516361A Pending CN1941337A (en) | 2005-09-30 | 2006-09-07 | Electronic equipment cooling plant and electronic equipment |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20070204642A1 (en) |
| JP (1) | JP4738121B2 (en) |
| KR (1) | KR20070037300A (en) |
| CN (1) | CN1941337A (en) |
| TW (1) | TWI324722B (en) |
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| CN102122200A (en) * | 2010-01-08 | 2011-07-13 | 徐昌涣 | Apparatus for cooling computer body by introducing cooling air therein |
| CN101815869B (en) * | 2007-10-05 | 2013-03-06 | 艾默生环境优化技术有限公司 | Compressor assembly having electronics cooling system |
| CN107801353A (en) * | 2016-09-07 | 2018-03-13 | 宏碁股份有限公司 | Portable electron device |
| CN107801352A (en) * | 2016-09-06 | 2018-03-13 | 宏碁股份有限公司 | Radiating subassembly |
| CN108803814A (en) * | 2018-06-11 | 2018-11-13 | 何艺华 | A kind of counter body that smart home thermal diffusivity is good |
| CN110235334A (en) * | 2017-02-07 | 2019-09-13 | 株式会社自动网络技术研究所 | Equalization control device and vehicle-mounted power supply device |
| CN114415802A (en) * | 2021-11-23 | 2022-04-29 | 西安交通大学 | Notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling |
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| FR2945835B1 (en) * | 2009-05-25 | 2016-01-22 | Commissariat Energie Atomique | PRESSURE AND COMPRESSION TRANSFORMATION MICROSYSTEMS, SENSOR, WHEEL, CHIP, MICROMOTOR, BATTERY INCORPORATING THE MICROSYSTEM, AND METHOD OF MANUFACTURING THE MICROSYSTEM |
| CN101922774A (en) * | 2009-06-13 | 2010-12-22 | 刘万辉 | Open external heat exchanging type semiconductor air conditioner |
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| KR101118152B1 (en) * | 2010-01-08 | 2012-03-12 | 서창환 | Computer cooling system using cooling air |
| US20120162903A1 (en) * | 2010-12-23 | 2012-06-28 | Macdonald Mark | Electro-hydrodynamic cooling for handheld mobile computing device |
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- 2006-08-01 KR KR1020060072445A patent/KR20070037300A/en not_active Application Discontinuation
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815869B (en) * | 2007-10-05 | 2013-03-06 | 艾默生环境优化技术有限公司 | Compressor assembly having electronics cooling system |
| CN102122200A (en) * | 2010-01-08 | 2011-07-13 | 徐昌涣 | Apparatus for cooling computer body by introducing cooling air therein |
| CN107801352A (en) * | 2016-09-06 | 2018-03-13 | 宏碁股份有限公司 | Radiating subassembly |
| CN107801353A (en) * | 2016-09-07 | 2018-03-13 | 宏碁股份有限公司 | Portable electron device |
| CN107801353B (en) * | 2016-09-07 | 2019-08-06 | 宏碁股份有限公司 | Portable electronic device |
| CN110235334A (en) * | 2017-02-07 | 2019-09-13 | 株式会社自动网络技术研究所 | Equalization control device and vehicle-mounted power supply device |
| CN108803814A (en) * | 2018-06-11 | 2018-11-13 | 何艺华 | A kind of counter body that smart home thermal diffusivity is good |
| CN114415802A (en) * | 2021-11-23 | 2022-04-29 | 西安交通大学 | Notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200712849A (en) | 2007-04-01 |
| JP4738121B2 (en) | 2011-08-03 |
| JP2007096221A (en) | 2007-04-12 |
| TWI324722B (en) | 2010-05-11 |
| KR20070037300A (en) | 2007-04-04 |
| US20070204642A1 (en) | 2007-09-06 |
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