CN1915645A - Hot-press - Google Patents
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- CN1915645A CN1915645A CN 200510091967 CN200510091967A CN1915645A CN 1915645 A CN1915645 A CN 1915645A CN 200510091967 CN200510091967 CN 200510091967 CN 200510091967 A CN200510091967 A CN 200510091967A CN 1915645 A CN1915645 A CN 1915645A
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- hot
- circuit board
- lower module
- press
- heater
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Abstract
A hot pressing machine is composed of at least one lower die block with a temp-adjustable heater, and at least one movable upper die block with a hot pressing unit.
Description
Technical field
The present invention relates to a kind of hot press, particularly relate to a kind of its lower module and include a heater that can carry out pre-hot work to prevent dry joint and to shorten the hot press of manufacture craft time.
Background technology
Various in recent years electronic products all require gently, thin, short, little, therefore the usage space of product is subjected to great restriction, all act LCDs, mobile computer, mobile phone or the like, so just must allow the Connection Element between circuit board can produce around song in limited space, soft circuit board just produces very important role under this manufacture craft environment.Relative, the hot pressing manufacture craft quality of rigid circuit board and soft circuit board then enjoys attention.Though this manufacture craft and machinery equipment have been developed the several years, also there are some bottlenecks not break, please refer to the following description:
Fig. 1 is the schematic diagram of existing soft circuit board 116 with rigid circuit board 100.As shown in Figure 1, one rigid circuit board 100 has can not be around song, it includes an epoxy resin fiberglass substrate 102, at least one active member 104, a plurality of passive device 106, a plurality of locating hole 108, a plurality of weld pad 110, a plurality of fixedly weld pad 112 and the big copper face 114 of a ground connection, wherein weld pad 110 and first fixedly weld pad 112 have tin lead metal and scaling powder.One soft circuit board 116 has can be around song, and it includes a phenolic resins substrate 118, a plurality of locating hole 120, a plurality of second fixedly weld pad 122, a plurality of part pin 124, a plurality of copper foil circuit 126, a plurality of big copper face 128 and a plurality of connecting end 130.Wherein, in the hot pressing process of carrying out rigid circuit board 100 and soft circuit board 116, the heat energy that big copper face 114 of ground connection and the quick extract heat pressure devices of big copper face 128 meetings (figure does not show) are provided, and make its temperature can't reach tin lead on the melting weld pad 110 fully, therefore cause rigid circuit board 100 and soft circuit board 116 bad connections, and the formation dry joint, reduce product percent of pass significantly.In addition, first and second fixedly weld pad 112 and design of 122 is all arranged on rigid circuit board 100 and the soft circuit board 116, its function is for increasing anti-pull intensity, but because of the restriction on the manufacture craft can't be finished welding job by same group of hot-press arrangement, and need by the outer artificial hand weldering of line, form the manpower waste.
Therefore, the research and development of machine of the present invention can be used in that each is soft, the hot pressing work of rigid circuit board, more can solve above listed two big problems, and make this manufacture craft operation more become perfect.
Summary of the invention
Main purpose of the present invention is to provide a kind of hot press, to solve the situation of the dry joint that produced in the prior art, to improve the qualification rate of product.
For reaching above-mentioned purpose, the invention provides a kind of hot press, it comprises at least one lower module and at least one movable upper module.Wherein, lower module has one can regulate temperature carrying out the heater of pre-hot work, and movable upper module has a hot-press arrangement, can move relative to the heater of lower module, to carry out a hot pressing operation on heater.In addition, hot press of the present invention comprises at least one upper cover plate in addition, the one soft circuit board and a rigid circuit board that will be positioned on the heater are pushed down, so that hot-press arrangement when carrying out the hot pressing operation, is unlikely allowing soft circuit board and rigid circuit board produce skew because of pressing down strength.Then with the preheating by heater of soft circuit board and rigid circuit board, and holding temperature is between 100 to 150 degree Celsius.At last utilize hot-press arrangement that a plurality of part pin on the soft circuit board are welded in respectively on a plurality of weld pads of rigid circuit board again.
Since the lower module that utilization of the present invention has the heater that can regulate temperature make soft circuit board and rigid circuit board temperature maintenance in Celsius 100 to 150 spend between, so when carrying out hot pressing, the heat energy of hot-press arrangement will can not absorbed by big copper face soft, rigid circuit board apace, therefore the part pin of soft circuit board possesses the situation generation that enough heat energy comes melting tin lead and is connected, and then prevents dry joint really with the weld pad of rigid circuit board.In addition, therefore the heater of regulating temperature of the present invention can reduce the required time of hot pressing, to reach the purpose that shortens the manufacture craft time in advance with soft circuit board and the heating of rigid circuit board before the hot pressing operation is carried out.
Your, see also following about detailed description of the present invention and accompanying drawing in order to make juror a nearlyer step understand feature of the present invention and technology contents.Yet the usefulness of appended graphic only for reference and aid illustration, it is not to use the present invention is limited.
Description of drawings
Fig. 1 is the schematic diagram of existing soft circuit board and rigid circuit board;
Fig. 2 is the schematic perspective view of the hot press of the present invention's first preferred embodiment;
Fig. 3 is the schematic perspective view of hot press hot pressing two circuit boards of the present invention's first preferred embodiment;
Fig. 4 is the thin portion schematic perspective view of the hot press of the present invention's first preferred embodiment;
Fig. 5 is the schematic diagram of the bull hot press of the present invention's second preferred embodiment.
The specific embodiment
At first sketch the essential structure and the operating principle of hot press of the present invention by Fig. 2 and Fig. 3.See also Fig. 2, Fig. 2 is the schematic perspective view of the hot press 30 of the present invention's first preferred embodiment.As shown in Figure 2, hot press 30 of the present invention includes a movable upper module 32 and a lower module 36.Wherein, movable upper module 32 has a hot-press arrangement 34, for example: thermal head, and include at least one high-resistance material (figure does not show) in the hot-press arrangement 34, and, can make hot-press arrangement 34 produce high temperature in moment by the high-resistance material that a high current module (figure does not show) provides a pulse current to give hot-press arrangement 34.Can regulate the heater 37 of temperature and lower module 36 has one, can establish a suitable heating-up temperature scope, after being heated to this temperature range, then be maintained at this temperature range according to user's different demands.In addition, hot press 30 includes at least one drive unit (figure does not show) in addition, can utilize as pneumatic mode and press down movable upper module 32, so that the hot-press arrangement 34 of movable upper module 32 can move relative to the heater 37 of lower module 36, on heater 37, to carry out a hot pressing operation.
Please refer to Fig. 3, Fig. 3 is hot press 30 hot pressings, two circuit boards 50 of the present invention's first preferred embodiment and 70 schematic perspective view.As shown in Figure 3, one rigid circuit board 50 is positioned over the surface, top of the heater 37 of lower module 36, above rigid circuit board 50, place a soft circuit board 70 again, wherein soft circuit board 70 includes a plurality of part pin 72, and rigid circuit board 50 includes the weld pad 52 of corresponding quantity at least, then place a upper cover plate 90 in rigid circuit board 50 with soft circuit board 70 tops again, two circuit boards 50 and 70 that will be positioned on the heater 37 are pushed down, so that when carrying out the hot pressing operation, being unlikely, hot-press arrangement 34 allowing soft circuit board 70 produce skew because of pressing down strength with rigid circuit board 50.
Because heater 37 can be maintained at the temperature range that sets, temperature range is set between 100 to 150 degree Celsius in this preferred embodiment, so that rigid circuit board 50 on the heater and soft circuit board 70 are preheated between 100 to 150 degree Celsius.Can't destroy the circuit board surface that contacts with heater in this temperature range, also can not make the scolding tin that originally is welded between circuit board and the electronic component on it produce molten again phenomenon.Certainly the temperature of the heater preheating of lower module of the present invention to exceed between 100 to 150 degree Celsius, can not be adjusted to a preferable temperature range according to material or user's demand of various boards.
Utilize drive unit (figure does not show) to drive movable upper module 32, so that hot-press arrangement 34 presses down, and carry out a hot pressing operation in the weld pad 52 of the part pin 72 of soft circuit board 70 and rigid circuit board 50, because rigid circuit board 50 and soft circuit board 70 all are heated between Celsius temperature 100 to 150 degree by the heater 37 that can regulate temperature in advance, therefore when hot-press arrangement 34 carries out hot pressing, the tin lead of each weld pad 52 can both obtain enough heats and quilt melting fully, and when having big copper face 80 on the soft circuit board 70, heat energy can promptly not absorbed by big copper face 80, make each part pin 72 be welded in really on each weld pad 52, the situation that does not have dry joint takes place, improve product percent of pass, this advantage is got over for a long time when the number of part pin 72 especially, and is all the more obvious.
It should be noted that, the heater 37 of the lower module 36 of hot press 30 of the present invention, the needs of visual manufacture craft are designed to the heater of an induction type, when two circuit boards 50 and 70 are positioned over lower module 36 tops and cover upper cover plate after 90s, begin to be heated to predetermined temperature again, perhaps be designed to the heater of a constant temperature, temperature is maintained at predetermined temperature always.Heater 37 in this preferred embodiment is a constant temperature heating device, and as shown in Figure 4, heater 37 includes a heating piece 66 and a heat insulation vacuum piece 64.Heating piece 66 is provided with a plurality of pilot pins 56, and main function is at location soft, rigid circuit board 70 and 50.And heating piece 66 is connected with a heating rod 94, control by an adjustable temperature controller 92,94 pairs of heat blocks 66 of heating rod are heated between 100 to 150 degree Celsius, and remain in this temperature range, carry out pre-hot work to be opposite to soft on the heat block 66, rigid circuit board 70,50.In addition, the heat insulation vacuum piece 64 of constant temperature, for be located at heat block 66 around, main function is that the thermal source that intercepts heat block 66 conducts to the other parts that are positioned at the outer circuit board 70,50 of heat block, and heat insulation vacuum piece 64 is provided with a plurality of vacuum holes 76, produce vacuum by a vacuum generator (figure does not show), have the function of the soft circuit board 70 of location, absorption and planarization.
Consult the action that the explanation of Fig. 4 and the following step can more cheer and bright soft, rigid circuit board hot binding of the present invention and the function of hot press again.
Step 1: at first a plurality of first locating holes 54 on the rigid circuit board 50 are aimed at a plurality of pilot pins (pin) 56 of lower module 36, rigid circuit board 50 is positioned on portion's product carrying platform of lower module 36.A plurality of second locating holes 74 on the soft circuit board 70 are aimed at corresponding pilot pin 56 in addition, be positioned over rigid circuit board 50 tops, and utilize vacuum generator generation vacuum to be adsorbed location and planarization through 76 pairs of soft circuit boards 70 of vacuum hole, at this moment, on soft, the rigid circuit board 70 and 50 second, first fixedly weld pad 78,58 and hot pressing district (being the weld pad 52 of part pin 72 and rigid circuit board on the soft circuit board 70) all is positioned on the heat block 66, and aims at mutually.
Step 2: when the location is aimed at regard to after continuous, one upper cover plate 90 moved on to the hot pressing district of soft, rigid circuit board 70 and 50 and push down soft circuit board 70 and rigid circuit board 50, soft to prevent, rigid circuit board 70 and 50 strength that press to the hot pressing district because of hot-press arrangement 34 produce skew.
Step 3: at the same time, adjustable temperature controller 92 provides temperature (100～150 degree Celsius approximately) to give heating piece 66 via heating rod 94, makes heating piece 66 continue to maintain a temperature constant state always.The main function of this step is the hot pressing district that provides thermal source to arrive rigid circuit board 50 to carry out pre-hot work, and the obstruct by the heat insulation vacuum piece 64 of constant temperature, prevents that the thermal source of heat block from conducting to the hot pressing district of soft, rigid circuit board 70 and 50 with exterior domain.
Step 4: hot-press arrangement 34 presses down, make the corresponding hot pressing district combination of soft circuit board 70 and rigid circuit board 50, before hot-press arrangement 34 does not lift as yet, provide a pressure-air to brush tin lead in heat of cooling pressure device 34 and the hot pressing district by an air cooled tube 96, after finishing hot-press arrangement 34 is raised up to anchor point.
By the pre-hot work of heat block 66 before hot-press arrangement 34 presses down, the thermal source that can prevent hot-press arrangement 34 is absorbed by the big copper face 80 of soft, rigid circuit board 70 and 50 or conducts to lower module 36, the dry joint situation that the heat energy deficiency is produced when causing hot pressing.
See also Fig. 5, Fig. 5 is the schematic diagram of the bull hot press 200 of the present invention's second preferred embodiment.As shown in Figure 5, hot press 200 of the present invention can be a pulsed bull hot press, it includes 202,204 and 206, two groups of lower modules 214 of three groups of movable upper modules and 216, three groups of air cooled tubes 228,230 and 232, modular platform 234, an and slide rail 236 once.Wherein, movable upper module 202,204 and 206, lower module 214 and 216, and air cooled tube 228,230 is all described identical with first preferred embodiment with 232 structure and function, so do not repeat them here.Different is, this preferred embodiment has two lower modules 214,216 and is located on the lower module platform 234, and lower module platform 234 is slidedly arranged on the slide rail 236, can drive two lower modules 214,216 slides on slide rail, with in three movable upper modules, 202,204,206 down conversion positions, with corresponding, carry out the hot pressing operation with different upper modules 202,204,206.Certainly, hot press of the present invention also can be designed to dispose the movable upper module and the lower module of varying number according to the needs of actual job.
This preferred embodiment is to utilize upper module 202,206 to carry out soft, the part pin of rigid circuit board and the hot pressing operation of weld pad, carries out first and second fixedly true hot pressing operation of weld pad soft, rigid circuit board with upper module 204 in addition.
Respectively at lower module 214, desire engages on 216 one group is soft, rigid circuit board, by upper module 204 to lower module 214 pressings, soft with on the lower module 214, rigid circuit board (hereinafter to be referred as first group of circuit board) carries out first, the two fixedly hot pressing operations of weld pad, at the same time, upper module 206 is to lower module 216 pressings, soft with on the lower module 216, rigid circuit board (hereinafter to be referred as second group of circuit board) carries out the hot pressing operation of part pin and weld pad, after finishing above-mentioned hot pressing operation, after finishing the hot pressing of fixing weld pad, move on slide rail 236 by lower module platform 234, make lower module 214,216 difference dislocation upper modules 202, under 204, drive upper module 202 simultaneously, 204 to lower module 214,216 pressings are with respectively to first, two groups of circuit boards carry out part pin and weld pad, first, the two fixedly hot pressing operations of weld pad.Thus, hot press 200 of the present invention can be handled the hot pressing operation of two groups of soft, rigid circuit boards synchronously, has the advantage of saving man-hour.
Be compared to prior art, since the lower module of hot press utilization of the present invention with the heater that can regulate temperature make soft circuit board and rigid circuit board temperature maintenance in Celsius 100 to 150 spend between, so when carrying out hot pressing, the heat energy of hot-press arrangement will can not absorbed by big copper face soft, rigid circuit board apace, therefore the part pin of soft circuit board possesses enough heat energy and comes melting tin lead, and positively be connected, and then prevent that the situation of dry joint from taking place with the weld pad of rigid circuit board.In addition, therefore the heater of regulating temperature of the present invention can reduce the required time of hot pressing, to reach the purpose that shortens the manufacture craft time in advance with soft circuit board and the heating of rigid circuit board before the hot pressing operation is carried out.Fixedly weld pad on soft, the rigid circuit board also can be finished the hot pressing operation on same board simultaneously, can save the manpower waste of artificial hand weldering in a large number.In addition, hot press of the present invention can be handled soft, the rigid circuit board of many groups synchronously, so have the advantage of saving man-hour.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (10)
1. hot press, it includes:
One lower module has one and can regulate the heater of temperature; And
One movable upper module has a hot-press arrangement, can move relative to the heater of this lower module, to carry out a hot pressing operation on this heater.
2. hot press as claimed in claim 1, wherein this heater that can regulate temperature comprises heating piece and an adjustable temperature controller, this heating piece is arranged in this lower module, and this adjustable temperature controller is controlled this heating piece and maintained a temperature range.
3. hot press as claimed in claim 2, wherein this temperature range is between 100 to 150 degree Celsius.
4. hot press as claimed in claim 2, wherein this heater also includes one and is located at heat block heat insulation vacuum piece on every side.
5. hot press as claimed in claim 4, wherein this heat insulation vacuum piece is provided with a plurality of vacuum holes.
6. hot press as claimed in claim 1, wherein this hot press comprises a upper cover plate in addition, push down with a soft circuit board and a rigid circuit board that will be positioned on this heater, so that when carrying out this hot pressing operation, being unlikely, this hot-press arrangement allowing this soft circuit board and this rigid circuit board produce skew because of pressing down strength.
7. hot press as claimed in claim 4, wherein this hot press comprises at least one air cooled tube in addition, in order to cool off this hot-press arrangement and this hot-press arrangement with pressing place of this heater.
8. hot press as claimed in claim 1, other comprises at least one second movable upper module, can move relative to the heater of this lower module, carries out the hot pressing operation.
9. hot press as claimed in claim 8, other comprises one in order to carry the lower module platform of this lower module, an and slide rail of being located at this lower module platform below, this lower module by this lower module platform moving on this slide rail below this each movable upper module, so that each movable upper module carries out the hot pressing operation with this respectively.
10. hot press as claimed in claim 9, other comprises at least one second lower module of being located on the lower module platform, this each lower module moves to this each movable upper module below by this lower module platform on this slide rail, to carry out the hot pressing operation with corresponding movable upper module respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510091967 CN1915645A (en) | 2005-08-15 | 2005-08-15 | Hot-press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510091967 CN1915645A (en) | 2005-08-15 | 2005-08-15 | Hot-press |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1915645A true CN1915645A (en) | 2007-02-21 |
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ID=37736783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510091967 Pending CN1915645A (en) | 2005-08-15 | 2005-08-15 | Hot-press |
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| Country | Link |
|---|---|
| CN (1) | CN1915645A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104015353A (en) * | 2014-06-23 | 2014-09-03 | 苏州博众精工科技有限公司 | Grabbing-hot melting mechanism |
| CN110354511A (en) * | 2019-07-10 | 2019-10-22 | 东莞市文博工艺品有限公司 | A kind of silica gel male earner production line |
| CN111276790A (en) * | 2020-03-31 | 2020-06-12 | 西安理工大学 | Method for improving antenna performance of silk-screen printing RFID reader-writer |
| CN114333598A (en) * | 2022-01-10 | 2022-04-12 | 业成科技（成都）有限公司 | Display panel processing device |
-
2005
- 2005-08-15 CN CN 200510091967 patent/CN1915645A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104015353A (en) * | 2014-06-23 | 2014-09-03 | 苏州博众精工科技有限公司 | Grabbing-hot melting mechanism |
| CN110354511A (en) * | 2019-07-10 | 2019-10-22 | 东莞市文博工艺品有限公司 | A kind of silica gel male earner production line |
| CN111276790A (en) * | 2020-03-31 | 2020-06-12 | 西安理工大学 | Method for improving antenna performance of silk-screen printing RFID reader-writer |
| CN114333598A (en) * | 2022-01-10 | 2022-04-12 | 业成科技（成都）有限公司 | Display panel processing device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |