CN1905223A - 一种使用热电分离设计的低温共烧陶瓷的led光源封装结构 - Google Patents
一种使用热电分离设计的低温共烧陶瓷的led光源封装结构 Download PDFInfo
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- CN1905223A CN1905223A CNA2006100620086A CN200610062008A CN1905223A CN 1905223 A CN1905223 A CN 1905223A CN A2006100620086 A CNA2006100620086 A CN A2006100620086A CN 200610062008 A CN200610062008 A CN 200610062008A CN 1905223 A CN1905223 A CN 1905223A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006100620086A CN100397669C (zh) | 2006-08-07 | 2006-08-07 | 一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法 |
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CNB2006100620086A CN100397669C (zh) | 2006-08-07 | 2006-08-07 | 一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法 |
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Publication Number | Publication Date |
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CN1905223A true CN1905223A (zh) | 2007-01-31 |
CN100397669C CN100397669C (zh) | 2008-06-25 |
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CN (1) | CN100397669C (zh) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101409320B (zh) * | 2007-10-09 | 2010-06-23 | 富士迈半导体精密工业(上海)有限公司 | 基板制作方法 |
CN101514782B (zh) * | 2008-02-20 | 2011-06-22 | 丰田合成株式会社 | Led灯组件 |
CN101689590B (zh) * | 2007-04-18 | 2011-12-14 | 克里公司 | 半导体发光器件封装和方法 |
CN102368532A (zh) * | 2011-06-03 | 2012-03-07 | 王双喜 | 一种带金属散热片的led封装结构 |
CN101681904B (zh) * | 2008-05-30 | 2012-05-09 | 香港应用科技研究院有限公司 | 多芯片封装 |
CN101635285B (zh) * | 2008-07-24 | 2012-06-13 | 达方电子股份有限公司 | 具有散热功能的陶瓷基板结构及其制造方法 |
CN102790162A (zh) * | 2011-05-18 | 2012-11-21 | 三星Led株式会社 | 发光器件封装件及其制造方法 |
CN103531702A (zh) * | 2012-07-03 | 2014-01-22 | 深圳市蓝科电子有限公司 | 一种倒装晶片的led结构 |
CN104037305A (zh) * | 2014-07-01 | 2014-09-10 | 江阴长电先进封装有限公司 | 一种低热阻的晶圆级led封装方法及其封装结构 |
CN106793458A (zh) * | 2016-12-15 | 2017-05-31 | 北京小鸟看看科技有限公司 | 用于发热元器件的印制电路板、印制装配板及电子设备 |
CN108807357A (zh) * | 2018-06-19 | 2018-11-13 | 侯立东 | 一种led照明装置及其制造方法 |
WO2019100446A1 (zh) * | 2017-11-23 | 2019-05-31 | 广东金源照明科技股份有限公司 | 一种填埋热保护ic的cob封装及其封装方法 |
CN112103258A (zh) * | 2020-11-12 | 2020-12-18 | 珠海越亚半导体股份有限公司 | 一种双面开窗封装结构及其制造方法 |
TWI769090B (zh) * | 2021-10-03 | 2022-06-21 | 郭明騰 | 光源模組 |
TWI769932B (zh) * | 2021-10-03 | 2022-07-01 | 郭明騰 | 光源模組 |
TWI797845B (zh) * | 2021-11-24 | 2023-04-01 | 財團法人工業技術研究院 | 封裝散熱結構及包含其的晶片 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102644867A (zh) * | 2012-03-13 | 2012-08-22 | 广东奥其斯科技有限公司 | 一种具有高集成高光效的热电分离功率型发光二极体灯泡 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002359445A (ja) * | 2001-03-22 | 2002-12-13 | Matsushita Electric Ind Co Ltd | レーザー加工用の誘電体基板およびその加工方法ならび半導体パッケージおよびその製作方法 |
JP2003110044A (ja) * | 2001-07-25 | 2003-04-11 | Kyocera Corp | 半導体素子収納用パッケージ |
JP2003068954A (ja) * | 2001-08-28 | 2003-03-07 | Kyocera Corp | 半導体素子収納用パッケージ |
US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
JP2006108432A (ja) * | 2004-10-06 | 2006-04-20 | Sumitomo Metal Electronics Devices Inc | 発光素子収納用パッケージ |
-
2006
- 2006-08-07 CN CNB2006100620086A patent/CN100397669C/zh not_active Expired - Fee Related
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101689590B (zh) * | 2007-04-18 | 2011-12-14 | 克里公司 | 半导体发光器件封装和方法 |
US8053796B2 (en) | 2007-10-09 | 2011-11-08 | Foxsemicon Integrated Technology, Inc. | Solid state light emitting device |
CN101409320B (zh) * | 2007-10-09 | 2010-06-23 | 富士迈半导体精密工业(上海)有限公司 | 基板制作方法 |
CN101514782B (zh) * | 2008-02-20 | 2011-06-22 | 丰田合成株式会社 | Led灯组件 |
CN101681904B (zh) * | 2008-05-30 | 2012-05-09 | 香港应用科技研究院有限公司 | 多芯片封装 |
CN101635285B (zh) * | 2008-07-24 | 2012-06-13 | 达方电子股份有限公司 | 具有散热功能的陶瓷基板结构及其制造方法 |
US8841693B2 (en) | 2011-05-18 | 2014-09-23 | Samsung Electronics Co., Ltd. | Light emitting device package and manufacturing method thereof |
CN102790162B (zh) * | 2011-05-18 | 2015-11-18 | 三星电子株式会社 | 发光器件封装件及其制造方法 |
CN102790162A (zh) * | 2011-05-18 | 2012-11-21 | 三星Led株式会社 | 发光器件封装件及其制造方法 |
CN102368532A (zh) * | 2011-06-03 | 2012-03-07 | 王双喜 | 一种带金属散热片的led封装结构 |
CN103531702A (zh) * | 2012-07-03 | 2014-01-22 | 深圳市蓝科电子有限公司 | 一种倒装晶片的led结构 |
CN104037305A (zh) * | 2014-07-01 | 2014-09-10 | 江阴长电先进封装有限公司 | 一种低热阻的晶圆级led封装方法及其封装结构 |
CN106793458B (zh) * | 2016-12-15 | 2023-11-24 | 北京小鸟看看科技有限公司 | 用于发热元器件的印制电路板、印制装配板及电子设备 |
CN106793458A (zh) * | 2016-12-15 | 2017-05-31 | 北京小鸟看看科技有限公司 | 用于发热元器件的印制电路板、印制装配板及电子设备 |
WO2019100446A1 (zh) * | 2017-11-23 | 2019-05-31 | 广东金源照明科技股份有限公司 | 一种填埋热保护ic的cob封装及其封装方法 |
CN108807357A (zh) * | 2018-06-19 | 2018-11-13 | 侯立东 | 一种led照明装置及其制造方法 |
CN112103258B (zh) * | 2020-11-12 | 2021-03-09 | 珠海越亚半导体股份有限公司 | 一种双面开窗封装结构及其制造方法 |
CN112103258A (zh) * | 2020-11-12 | 2020-12-18 | 珠海越亚半导体股份有限公司 | 一种双面开窗封装结构及其制造方法 |
TWI769090B (zh) * | 2021-10-03 | 2022-06-21 | 郭明騰 | 光源模組 |
TWI769932B (zh) * | 2021-10-03 | 2022-07-01 | 郭明騰 | 光源模組 |
TWI797845B (zh) * | 2021-11-24 | 2023-04-01 | 財團法人工業技術研究院 | 封裝散熱結構及包含其的晶片 |
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