CN1881499A - Sheet with ratchet spring, and its production method and switch - Google Patents
Sheet with ratchet spring, and its production method and switch Download PDFInfo
- Publication number
- CN1881499A CN1881499A CN 200610091253 CN200610091253A CN1881499A CN 1881499 A CN1881499 A CN 1881499A CN 200610091253 CN200610091253 CN 200610091253 CN 200610091253 A CN200610091253 A CN 200610091253A CN 1881499 A CN1881499 A CN 1881499A
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- CN
- China
- Prior art keywords
- ratchet spring
- chip part
- pressing force
- sheet material
- transferring elements
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Push-Button Switches (AREA)
- Manufacture Of Switches (AREA)
Abstract
One kind of switch with ratchet spring and sheet possesses capacity of transferring pressure reliably to the ratchet spring, simple manufacture and low cost. The switch has one sheet part, one ratchet spring kept to one side of the sheet part, and one pressure transferring unit made of synthetic resin material fused on the other side of the sheet part to transfer pressure to the ratchet spring. When laser or ultrasonic wave is applied to the superposed part between the sheet part and the pressure transferring unit, the superposed part will be fused to fixed the pressure transferring unit to the sheet part.
Description
Technical field
The present invention relates to the switch that below sheet material side is pasted with the sheet material that has ratchet spring and the manufacture method thereof of ratchet spring (click spring) and uses it.
Background technology
As the existing sheet material of ratchet spring and the structure of switch of having, known sheet material that has ratchet spring and the switch that following structure is arranged, have: below sheet material, utilize bonding agent or adhesive be pasted with ratchet spring the sheet material that has ratchet spring, with utilize to be shaped or methods such as printing are arranged at this pressing force transmission above sheet material protuberance, utilize this protuberance to push the center at the surperficial top of ratchet spring, with this ratchet spring that overturns, carry out the switching (reference example as, patent documentation 1) of switch.
This existing sheet material of ratchet spring and structure such as Fig. 7, shown in Figure 8 of switch of having.Fig. 7 is the existing stereogram that has the sheet material of ratchet spring, and Fig. 8 is the profile of the same sheet material that has ratchet spring.
In the drawings, the sheet material 20 that has a ratchet spring have the assembling sheet material 21 of protuberance 22 by metal ratchet spring 31, in the position corresponding with the center of metal ratchet spring 31 and in hole portion 25 the perforate sheet material 23 of chimeric installation metal ratchet spring 31 constitute.
Assembling sheet material 21 is sheet materials of film, and a plurality of assembling sheet material protuberances 22 utilize shaping or print the position that is formed on corresponding to the top of metal ratchet spring 31.Again, assembling sheet material protuberance 22 forms with the material of light transmission, so that not shown button also can be implemented by illuminated.Perforate sheet material 23 posts adhesive below, with processing release paper 26 protections.
The assembling that has the sheet material 20 of ratchet spring can be carried out as follows: assembling metal ratchet spring 31 in the hole portion 25 of the perforate sheet material 23 that posts processing release paper 26, utilize bonding agent or adhesive to fit and assemble sheet material 21 on top.
In addition, the sheet material 20 that has ratchet spring is made of metal ratchet spring 31, the assembling sheet material 21 with protuberance and perforate sheet material 23, but also can utilize metal ratchet spring 31 and the assembling sheet material 21 with protuberance to constitute.
For with the above-mentioned sheet material 20 that has a ratchet spring as the console switch of type of button and assemble, peel off processing release paper 26, make the switch portion of metal ratchet spring 31 corresponding to not shown switch substrate, and fit to install, the side only is embedded in the button of lid etc. by installation and can carries out assembling to console switch from it.
Because the above-mentioned sheet material 20 that has ratchet spring has metal ratchet spring 31 and has the installation sheet material 21 of protuberance in the position corresponding with the center of metal ratchet spring 31, so can easily assemble with the structure of not sacrificing the ratchet performance.In addition, when button is installed, form smooth simple structure below can making.
[patent documentation 1] spy opens flat 11-317125 communique
But, in the above-mentioned existing sheet material and switch that has a ratchet spring, waiting under the situation that forms protuberance with printing, because when sclerosis, need the time,, can not make this problem at an easy rate so there is process velocity slow.
Summary of the invention
The present invention addresses the above problem, its purpose is to provide a kind of can carry out the transmission of pressing force to ratchet spring reliably, can make simply, and sheet material that has ratchet spring that can provide at an easy rate and manufacture method thereof and use this to have the switch of the sheet material of ratchet spring.
In order to address the above problem, first aspect present invention provides a kind of sheet material that has ratchet spring, it makes following structure, possess: chip part, remain in a side's of this chip part the ratchet spring of face side, and be arranged on the face with the opposing party of the described chip part of this ratchet spring subtend, and transmit the pressing force transferring elements of pressing force to described ratchet spring, described chip part and described pressing force transferring elements, by forming by deposited mutually synthetic resin material, to superimposed irradiating laser of described chip part and described pressing force transferring elements or apply ultrasonic wave, make thus superimposed deposited, and fixing described chip part and described pressing force transferring elements.
Again, the sheet material that has ratchet spring of second aspect present invention makes following structure: described chip part and described pressing force transferring elements are formed by the synthetic resin material of same kind.
Again, the sheet material that has ratchet spring of third aspect present invention, make following structure: described chip part and described pressing force transferring elements, synthetic resin material by light transmission forms, face side a side of described chip part, the luminous sheet material that lamination has the face luminous component by sheet to constitute maintains described ratchet spring on this luminous sheet material.
Again, fourth aspect present invention provides a kind of manufacture method that has the sheet material of ratchet spring, it makes following method: the pressing force transferring elements that is made of the small pieces resin is supplied with in the position to the regulation of chip part, superimposed described chip part in one side and described pressing force transferring elements, and connect airtight with pressure-producing part pressurization that can printing opacity, pass through irradiating laser on one side, make this superimposed deposited, described pressing force transferring elements is fixed on the described chip part, then, utilize adhesive in mode, on described chip part, keep ratchet spring corresponding to described pressing force transferring elements.
Again, the manufacture method of the sheet material that has ratchet spring of fifth aspect present invention, make following method: the pressing force transferring elements that is made of the small pieces resin is supplied with in the position to the regulation of chip part, under the state of superimposed described chip part and described pressing force transferring elements, contact and pressurize with the ultrasonic wave coating parts and connect airtight, make thus this superimposed deposited, described pressing force transferring elements is fixed on the described chip part, then, utilize adhesive in mode, ratchet spring is remained on the described chip part corresponding to described pressing force transferring elements.
Again, the manufacture method of the sheet material that has ratchet spring of sixth aspect present invention makes following method: after being fixed in described pressing force transferring elements on the described chip part, and the described adhesive of coating on described chip part.
Again, seventh aspect present invention provides a kind of switch, it makes following structure, possess: as any described sheet material that has a ratchet spring in the technical scheme 1 to 3, with the circuit substrate that is provided with a pair of fixed contact of subtend, on described circuit substrate, so that the mode of described ratchet spring and described fixed contact subtend, lamination has the described sheet material that has ratchet spring.
As mentioned above, because the sheet material that has ratchet spring of the present invention has chip part, remain in a side's of chip part the ratchet spring of face side, and be arranged at face with the opposing party of the chip part of ratchet spring subtend, and ratchet spring is transmitted the pressing force transferring elements of pressing force, with synthetic resin material formation chip part and pressing force transferring elements that can be deposited mutually, by to superimposed irradiating laser of chip part and pressing force transferring elements or apply ultrasonic wave, thereby make superimposed deposited stator parts and pressing force transferring elements, so compare on the chip part with the pressing force transferring elements being fixed in by bonding agent or printing etc., can improve process velocity, can easily make, and the sheet material that has ratchet spring can be provided at an easy rate.
Because form chip part and pressing force transferring elements, can strengthen the intensity when engaging with the synthetic resin material of same kind again.
Again, because the synthetic resin material with light transmission forms chip part and pressing force transferring elements, the luminous sheet material that constitutes by the face luminous component of sheet at a side's of chip part face side lamination, on luminous sheet material, keep ratchet spring, so form chip part and pressing force transferring elements by synthetic resin with light transmission, just can not hinder the illumination functions of face luminescent material, so can easily obtain having the sheet material that has ratchet spring of illumination functions.
Again, because make following manufacture method, promptly, the pressing force transferring elements that is made of the small pieces resin is supplied with in position to the regulation of chip part, one side lamination layer parts and pressing force transferring elements, and connect airtight with pressure-producing part pressurization that can printing opacity, utilize on one side irradiating laser make superimposed deposited, the pressing force transferring elements is fixed on the chip part, then, on chip part, utilize adhesive to keep ratchet spring corresponding to the pressing force transferring elements, thus can utilize laser to carry out being close to of chip part and pressing force transferring elements reliably, thus can improve process velocity.
Again, because make following manufacture method, promptly, the pressing force transferring elements that is made of the small pieces resin is supplied with in position to the regulation of chip part, under the state of lamination layer parts and pressing force transferring elements, thereby make superimposed deposited the pressing force transferring elements to be fixed on the chip part by contacting with the ultrasonic wave coating parts and pressurizeing to connect airtight, then, on chip part, utilize adhesive to keep ratchet spring corresponding to the pressing force transferring elements, so can utilize ultrasonic wave coating to carry out being close to of chip part and pressing force transferring elements reliably, thereby can improve process velocity.
Again, because make following manufacture method, promptly, after being fixed in the pressing force transferring elements on the chip part, applying adhesive on chip part, so can reduce butt height inequality with ultrasonic wave coating parts butt, thereby can be deposited reliably by applying adhesive in the operation of back.
Again, because make following switch, promptly, have as first aspect present invention to one of any described sheet material that has ratchet spring of the third aspect, circuit substrate with a pair of fixed contact that is provided with subtend, so that the mode of ratchet spring and fixed contact subtend has the sheet material of ratchet spring at the circuit substrate superimposed layer, so can utilize the pressing force transferring elements that ratchet spring is transmitted pressing force reliably, thereby can access good card clatter (click) sense of touch, and because chip part and pressing force transferring elements utilize and depositedly fix, so bond strength improves, thereby can suppress because of coming off of causing such as peeling off.
Description of drawings
Fig. 1 is the profile that the switch of the sheet material that has a ratchet spring of the present invention has been used in expression;
Fig. 2 is the expression sheet material of ratchet spring and the exploded perspective view of circuit substrate of having of the present invention;
Fig. 3 is the expression stereogram that has the sheet material that has ratchet spring of protecting sheet material of the present invention;
Fig. 4 is the expression profile of switch of the sheet material that has ratchet spring of luminous sheet material that used lamination of the present invention;
Fig. 5 is the key diagram of the laser operation of the expression sheet material that has a ratchet spring of the present invention;
Fig. 6 is the key diagram of the ultrasonic wave operation of the expression sheet material that has a ratchet spring of the present invention;
Fig. 7 is the existing stereogram that has the sheet material of ratchet spring of expression;
Fig. 8 is the existing profile that has the sheet material of ratchet spring of expression.
Symbol description
1: chip part
2: the pressing force transferring elements
4: ratchet spring
4a: heave portion
4b: projection (contact)
4c: outer peripheral edges portion
5: partition
5a: hole
6: circuit substrate
7: fixed contact
7a: central contact
7b: peripheral contact
9: the protection sheet material
10: luminous sheet material
11: pressure-producing part
12: pressure-producing part
13: the ultrasonic wave coating parts
14: the ultrasonic wave coating parts
Embodiment
Below, embodiments of the present invention such as Fig. 1 are to shown in Figure 6.Fig. 1 is the profile that the switch of the sheet material that has a ratchet spring of the present invention has been used in expression; Fig. 2 is the expression sheet material of ratchet spring and the exploded perspective view of circuit substrate of having of the present invention; Fig. 3 is that expression has the stereogram that has the sheet material of ratchet spring of the present invention of protecting sheet material; Fig. 4 be expression used lamination luminous sheet material of the present invention have the profile of switch of the sheet material of ratchet spring; Fig. 5 is the key diagram of the laser operation of the expression sheet material that has a ratchet spring of the present invention, and Fig. 6 is the key diagram of the ultrasonic wave operation of the expression sheet material that has a ratchet spring of the present invention.
As shown in Figure 1 and Figure 2, the switch that has used the sheet material that has a ratchet spring of the present invention mainly by the chip part 1 of pressing force transferring elements 2 with convex, utilize attachings such as adhesive remain in the following side of this chip part 1 ratchet spring 4, have the hole of accommodating ratchet spring 4 and be attached at the partition 5 of following side of chip part 1 and the circuit substrate 6 that disposes a plurality of fixed contacts 7 constitutes.
Again, ratchet spring 4 is attached the following side that remains in chip part 1 by adhesive.This ratchet spring 4 is made of the thin-sheet metal plate of rubber-like conductivity, forms to have the dome-type toroidal of heaving the 4a of portion that can overturn.Again, side is formed with a plurality of (being 3 in the present embodiment) projection 4b below heaving the 4a of portion, and when the 4a of portion was heaved in upset pushing ratchet spring 4, this projection 4a contacted with the central contact 7a of the top a plurality of fixed contacts 7 that are disposed at circuit substrate 6.Again, the 4c of outer peripheral edges portion of the toroidal of ratchet spring 4 places on the circuit substrate 6 in the peripheral contact 7b state of contact download often with fixed contact 7.
On this a pair of fixed contact 7, the 4c of outer peripheral edges portion of ratchet spring 4 contacts with peripheral contact 7b often, projection (contact) 4b that heaves the following side of the 4a of portion with central contact 7a mounting under the state of subtend at interval, the partition 5 that is pasted with chip part 1 utilizes adhesive to be attached to this circuit substrate 6 superimposed layers, constitutes the switch that has used the sheet material that has ratchet spring with this.
Like this, formation is of the present invention has the sheet material of ratchet spring and uses this to have the switch of the sheet material of ratchet spring.
Therefore, can utilize 2 pairs of ratchet springs 4 of pressing force transferring elements to transmit pressing force reliably, thereby can access good card clatter sense of touch, and because chip part 1 and pressing force transferring elements 2 utilize and depositedly fix, so bond strength improves, thereby can suppress because of coming off of causing such as peeling off.
In addition, in the above-described embodiments,, chip part 1 that adhesive is pasted integratedly to utilize, pressing force transferring elements 2, ratchet spring 4 and partition 5 constitute the sheet material that has ratchet spring, but be not limited thereto, also can be under the prerequisite of not using partition 5, directly with adhesive with chip part 1 be attached at circuit substrate 6 above.
Then, the above-mentioned manufacture method that has the sheet material of ratchet spring is described.
At first, on a side's of chip part 1 face (upper face side), fixedly form the pressing force transferring elements 2 of convex with methods such as laser cladding or ultrasonic wave coatings.
Operation when Fig. 5 represents laser cladding, the pressing force transferring elements 2 that the transparent insulative resin material by small pieces constitutes is supplied with in the position of the regulation above transparent chip part 1, one side lamination layer parts 1 and pressing force transferring elements 2, and connect airtight with pressure-producing part 11,12 pressurizations that can printing opacity, utilize irradiating laser (not shown) to make superimposed P deposited on one side, pressing force transferring elements 2 is fixed on the chip part 1.
Then, the adhesive that side coating is made of bonding agent etc. below chip part 1 with viscosity.Under this situation, adhesive is coated on face of following side of chip part 1.
Then, by the chip part 1 that is coated with adhesive, be fixed with side position below the pressing force transferring elements 2, with the surperficial top of pressing force transferring elements 2 subtends ground, ratchet spring 4 is remained in the following side of chip part 1 with the 4a of the portion of heaving of adhesive attaching ratchet spring 4.
Then, utilize adhesive 3 to make the roughly whole surface of the 4a of the portion of heaving of the following side of chip part 1 and ratchet spring 4 be tacky state.
With this, the following side that is formed on chip part 1 maintains the sheet material that has ratchet spring of ratchet spring 4.
According to the above-mentioned manufacture method that has the sheet material of ratchet spring, just can utilize laser to carry out chip part 1 reliably and push connecting airtight of transferring elements 2, thereby can improve process velocity.
Operation when Fig. 6 represents ultrasonic Machining, the pressing force transferring elements 2 that the insulating resin material by small pieces constitutes is supplied with in the position of the regulation above chip part 1, under the state of lamination layer parts 1 and pressing force transferring elements 2, pressurize by pushing ultrasonic wave coating parts 13,14 and to connect airtight, superimposed P is deposited to be fixed in pressing force transferring elements 2 on the chip part 1 thereby make.
Then, the adhesive that side coating is made of bonding agent etc. below chip part 1 with viscosity.Under this situation, adhesive is coated on face of following side of chip part 1.
Then, by the chip part 1 that is coated with adhesive, be fixed with side position below the pressing force transferring elements 2, with the surperficial top of pressing force transferring elements 2 subtends ground, ratchet spring 4 is remained in the following side of chip part 1 with the 4a of the portion of heaving of adhesive attaching ratchet spring 4.
Then, utilize adhesive 3 to make the roughly whole surface of the 4a of the portion of heaving of the following side of chip part 1 and ratchet spring 4 be tacky state.
With this, the following side that is formed on chip part 1 maintains the sheet material that has ratchet spring of ratchet spring 4.
According to the above-mentioned manufacture method that has the sheet material of ratchet spring, just can utilize ultrasonic wave coating to carry out chip part 1 reliably and push connecting airtight of transferring elements 2, thereby can improve process velocity.Again, because after being fixed in pressing force transferring elements 2 on the chip part 1, applying adhesive on chip part 1, thus can reduce butt height inequality with ultrasonic wave coating parts 13,14 butts by applying adhesive in the operation of back, thus can be deposited reliably.
Fig. 2 represents to form chip part 1 and keep many group pressing force transferring elements 2 and the sheet material that has ratchet spring of ratchet spring 4 these states and the structure of switch rectangularly on this chip part 1 with the shared chip part of a slice.
Under this situation, because can operate integratedly, so operation is good in assembling procedure etc. by a plurality of ratchet springs 4 are remained on the shared chip part 1.
Again, Fig. 3 represents to have the structure of the sheet material that has ratchet spring of protecting sheet material.
Under this situation, side is pasted with the protection sheet material 9 of the film like that is made of PET etc. below partition 5, makes obturation contain the hole 5a of ratchet spring 4.This protection sheet material 9 utilize the adhesive of coating be attached at partition 5 below, prevent when carrying etc. that chip or foreign matter etc. enters projection (contact) 4b of ratchet spring 4.In addition, this protection sheet material 9 is peeled off below partition 5 in assembling procedure.
Again, Fig. 4 has represented to use lamination and has carried out the structure of switch of the sheet material that has ratchet spring of the luminous sheet material of function demonstration etc.
Under this situation, side is provided with the luminous sheet material 10 that has formed the film like luminescent layer that is made of EL etc., that be made of PET etc. below chip part 1.Thereby this function shows the luminous sheet material 10 of usefulness and utilizes following side that adhesive etc. is attached at chip part 1 lamination integratedly, is attached to the following of this luminous sheet material 10 above the 4a of the portion of heaving of ratchet spring 4 and is held.
Like this, in the above-described embodiments, because the synthetic resin material with light transmission forms chip part 1 and pressing force transferring elements 2, the side lamination is by the luminous sheet material 10 of face luminous component (EL) formation of sheet below chip part 1, on luminous sheet material 10, maintain ratchet spring 4, so form chip part 1 and pressing force transferring elements 2 by synthetic resin with light transmission, just can not hinder the illumination functions of face luminescent material (EL), so can easily obtain having the sheet material that has ratchet spring of illumination functions.
According to the sheet material that has ratchet spring of the invention described above and the structure of switch, because form chip part 1 and pressing force transferring elements 2 with synthetic resin material that can be deposited mutually, by to superimposed P irradiating laser of chip part 1 and pressing force transferring elements 2 or apply ultrasonic wave, thereby make superimposed deposited stator parts 1 of P and pressing force transferring elements 2, so with bonding agent or printing etc. the existing method that pressing force transferring elements 2 is fixed on the chip part 1 is compared, can improve process velocity, can easily make, and the sheet material that has ratchet spring can be provided at an easy rate.
Again, because (for example, PET) form chip part 1 and pressing force transferring elements 2, so can strengthen the intensity when engaging with the synthetic resin material of same kind.
Claims (7)
1. sheet material that has ratchet spring, it is characterized in that, possess: chip part, remain in a side's of this chip part the ratchet spring of face side, and be arranged on the face with the opposing party of the described chip part of this ratchet spring subtend, and transmit the pressing force transferring elements of pressing force to described ratchet spring, described chip part and described pressing force transferring elements, by forming by deposited mutually synthetic resin material, to superimposed irradiating laser of described chip part and described pressing force transferring elements or apply ultrasonic wave, make thus superimposed deposited, and fixing described chip part and described pressing force transferring elements.
2. the sheet material that has ratchet spring as claimed in claim 1 is characterized in that, described chip part and described pressing force transferring elements are formed by the synthetic resin material of same kind.
3. as claim 1 or the 2 described sheet materials that have ratchet spring, it is characterized in that, described chip part and described pressing force transferring elements, synthetic resin material by light transmission forms, face side a side of described chip part, the luminous sheet material that lamination has the face luminous component by sheet to constitute maintains described ratchet spring on this luminous sheet material.
4. manufacture method that has the sheet material of ratchet spring, it is characterized in that, the pressing force transferring elements that is made of the small pieces resin is supplied with in position to the regulation of chip part, superimposed described chip part in one side and described pressing force transferring elements, and connect airtight with pressure-producing part pressurization that can printing opacity, pass through irradiating laser on one side, make this superimposed deposited, described pressing force transferring elements is fixed on the described chip part, then, utilize adhesive in mode, on described chip part, keep ratchet spring corresponding to described pressing force transferring elements.
5. manufacture method that has the sheet material of ratchet spring, it is characterized in that, the pressing force transferring elements that is made of the small pieces resin is supplied with in position to the regulation of chip part, under the state of superimposed described chip part and described pressing force transferring elements, contact and pressurize with the ultrasonic wave coating parts and connect airtight, it is deposited to make folded this close portion thus, described pressing force transferring elements is fixed on the described chip part, then, utilize adhesive in mode, ratchet spring is remained on the described chip part corresponding to described pressing force transferring elements.
6. the manufacture method that has the sheet material of ratchet spring as claimed in claim 5 is characterized in that, after being fixed in described pressing force transferring elements on the described chip part, and the described adhesive of coating on described chip part.
7. switch, it is characterized in that, possess: as any described sheet material that has a ratchet spring in the claim 1 to 3, with the circuit substrate that is provided with a pair of fixed contact of subtend, on described circuit substrate, so that the mode of described ratchet spring and described fixed contact subtend, lamination has the described sheet material that has ratchet spring.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005169798A JP2006344511A (en) | 2005-06-09 | 2005-06-09 | Sheet with click spring, its manufacturing method and switch using it |
| JP2005169798 | 2005-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1881499A true CN1881499A (en) | 2006-12-20 |
Family
ID=37519642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610091253 Pending CN1881499A (en) | 2005-06-09 | 2006-06-08 | Sheet with ratchet spring, and its production method and switch |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006344511A (en) |
| CN (1) | CN1881499A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102629525A (en) * | 2012-05-03 | 2012-08-08 | 江苏下一代广电网物联网研究中心有限公司 | Metal elastic sheet |
| CN102664115A (en) * | 2012-05-03 | 2012-09-12 | 江苏下一代广电网物联网研究中心有限公司 | Positioning device of metal dome |
| CN106159538A (en) * | 2014-09-24 | 2016-11-23 | 阿尔卑斯电气株式会社 | Socket |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008078751A1 (en) * | 2006-12-26 | 2008-07-03 | Alps Electric Co., Ltd. | Push button switch, input device with the push button switch, and reversing spring-equipped sheet used to form the push button switch |
| JP2012059432A (en) * | 2010-09-07 | 2012-03-22 | Panasonic Corp | Push switch |
| EP2641252A1 (en) * | 2010-11-17 | 2013-09-25 | Koninklijke Philips N.V. | Seamless faceplate assembly for keypad device |
| JP5906377B2 (en) | 2011-09-08 | 2016-04-20 | パナソニックＩｐマネジメント株式会社 | Push switch |
| JP6465572B2 (en) * | 2014-06-23 | 2019-02-06 | シチズン電子株式会社 | Push switch and manufacturing method thereof |
| JP6341509B2 (en) * | 2014-09-26 | 2018-06-13 | アルプス電気株式会社 | Push switch |
| JP6738490B2 (en) * | 2017-06-19 | 2020-08-12 | アルプスアルパイン株式会社 | Seat with click spring, method of manufacturing seat with click spring, and switch device |
| CN109727802A (en) * | 2017-10-27 | 2019-05-07 | 珠海市惟达电子有限公司 | Push switch and its assemble method |
-
2005
- 2005-06-09 JP JP2005169798A patent/JP2006344511A/en not_active Withdrawn
-
2006
- 2006-06-08 CN CN 200610091253 patent/CN1881499A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102629525A (en) * | 2012-05-03 | 2012-08-08 | 江苏下一代广电网物联网研究中心有限公司 | Metal elastic sheet |
| CN102664115A (en) * | 2012-05-03 | 2012-09-12 | 江苏下一代广电网物联网研究中心有限公司 | Positioning device of metal dome |
| CN106159538A (en) * | 2014-09-24 | 2016-11-23 | 阿尔卑斯电气株式会社 | Socket |
| CN106159538B (en) * | 2014-09-24 | 2018-11-09 | 阿尔卑斯电气株式会社 | Socket |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006344511A (en) | 2006-12-21 |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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