CN1878455A - Heat radiation member usable with a card type electronic component and display apparatus having the same - Google Patents

Heat radiation member usable with a card type electronic component and display apparatus having the same Download PDF

Info

Publication number
CN1878455A
CN1878455A CNA2006100842823A CN200610084282A CN1878455A CN 1878455 A CN1878455 A CN 1878455A CN A2006100842823 A CNA2006100842823 A CN A2006100842823A CN 200610084282 A CN200610084282 A CN 200610084282A CN 1878455 A CN1878455 A CN 1878455A
Authority
CN
China
Prior art keywords
electronic component
type electronic
card type
card
receiver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100842823A
Other languages
Chinese (zh)
Inventor
姜埈
赵真贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Samsung SDI Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN1878455A publication Critical patent/CN1878455A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat radiation member usable with a card type electronic component to cool the card type electronic component includes a heat radiator formed with a plurality of cooling fins, and a card mounting part coupled to the heat radiator and having a receiver to accommodate the card type electronic component to transfer heat. Thus, the heat radiation member usable with a card type electronic component that can be incorporated in a display apparatus reduces noise and saves expenses as efficiently cooling the card type electronic component by dissipating heat using heat conductivity with a cooling fin and without a cooling fan.

Description

The radiating component and the display device that together use with card type electronic component
Technical field
General plotting of the present invention relates to a kind of radiating component that can together use with card type electronic component, with a kind of display device with this radiating component, especially, relate to a kind of can with the radiating component and a kind of display device that together use such as the such card type electronic component of collocation point [aPoint of Deployment (POD)] card with this radiating component.
Background technology
The POD card is a kind of conditional access card, and refers to a kind of card that can receive the payable broadcasts signal when the membership information in utilizing cable TV, satellite broadcasting or the like is determined membership.
Usually, the POD card is a kind of personal computer memory card international federation (PCMCIA) type of card that comprises well-informed card, and be placed in the card installation portion that is arranged in the display device described display device such as LCD (LCD), plasma panel (PDP) or the like.
Fig. 1 is the perspective view that is used for the conventional radiating component of card type electronic component.With reference to Fig. 1 the mounting structure of POD card 40 is described below.POD card 40 is placed in the card installation portion 134 that is arranged in the display driver portion 115.Card installation portion 134 has and is used to the connector (not shown) that holds the receiver 133 of POD card 40 and be used for coupling together with POD card 40.On the side of receiver 133, be provided be used to extract the POD card 40 that held pull out card rod 137.
In card installation portion 134, be provided with cooling fan 130, be used for the heat that scatters and disappears and produced by POD card 40.On transverse side, be provided with suction hole 117 corresponding to the bonnet 112 of card installation portion 134.POD card 40 can in use produce heat, and when working as the heat that produced not by suitable cooling, these heats can be passed to display driver portion 115 and image displaying part, cause thus breaking down.Therefore, as shown in fig. 1, this conventional radiating component has cooling fan 130 at the upper end of card installation portion 134, and has utilized a kind of like this type of cooling, promptly by utilizing cooling fan 130 generation of forced convection current to come dissipated heat.
But, this conventional radiating component that is used for card type electronic component can be owing to cooling fan 130 produces noise, if and cooling fan 130 can't continue dissipated heat efficiently, picture quality can descend so, and display driver portion 115 and image displaying part can break down.Also have, manufacturing expense can increase when utilizing cooling fan.
Summary of the invention
General plotting of the present invention provides a kind of radiating component and a kind of display device with this radiating component that can together use with card type electronic component, its utilization is carried out heat conduction with fin and is not to utilize cooling fan to come card type electronic component is efficiently cooled off, and has reduced noise and has saved expense.
The others of general plotting of the present invention will partly be addressed in the following description, and part will be understood from the following description, perhaps can be understanded by implementing this general plotting.
Aforementioned and/or the others of general plotting of the present invention can together make the radiating component that is used for to this card type electronic component cools off be achieved with card type electronic component by providing a kind of, and this radiating component comprises: the radiator that is made into to have a plurality of fin; With the card installation portion, this card installation portion is linked on the described radiator and has in order to hold the receiver of described card type electronic component, and heat is passed to described radiator from described card type electronic component.
Described receiver can comprise the surface facing to described radiator, and this surface is uncovered and allow that the card type electronic component and the described radiator that are held come in contact.
Described receiver can also comprise elastic component, in order to the card type electronic component that is held is pressed to described radiator.
Described receiver can also comprise elastic component, in order to the card type electronic component that is held is pressed to this receiver.
Described card type electronic component can be the POD card.
Aforementioned and/or the others of general plotting of the present invention also can together make the radiating component that is used for to this card type electronic component cools off be achieved with card type electronic component by providing a kind of, this radiating component comprises: in order to hold the receiver of described card type electronic component, transmit heat; With the integrally formed fin of a plurality of and described receiver, in order to the heat that scatters and disappears and come from described card type electronic component transmission.
Described receiver can also comprise elastic component, in order to the card type electronic component that is held is pressed to this receiver.
Described card type electronic component can comprise the POD card.
Aforementioned and/or the others of general plotting of the present invention are also by providing a kind of display device to be achieved, this display device comprises: in order to the image displaying part of display image, in order to drive the display driver portion of described image displaying part, be arranged at the card type electronic component at described display driver portion place, be made into to have the radiator of a plurality of fin, and the radiating component that is used for described card type electronic component, this radiating component and described radiator connect, and has the card installation portion that is formed with receiver, described receiver is passed to described radiator with heat from described card type electronic component in order to hold described card type electronic component.
Described receiver is provided with the surface facing to described radiator, and this surface is uncovered so that hold described card type electronic component, and the card type electronic component and the described radiator that are held are come in contact.
Described receiver can also comprise elastic component, in order to the card type electronic component that is held is pressed to described radiator.
Described receiver can also comprise elastic component, in order to the card type electronic component that is held is pressed to this receiver.
Described card type electronic component can comprise the POD card.
This display device can also comprise protecgulum and bonnet, in order to hold described image displaying part and display driver portion respectively, and form the outward appearance of this display device, wherein, bonnet has the card jack, this card jack is corresponding to described card installation portion, and allows from the outside of this display device described card type electronic component is taken out.
Aforementioned and/or the others of general plotting of the present invention are also by providing a kind of card type electronic component installation system that can be used in the display to be achieved, described installation system comprises: cooling end, scatter and disappear by the heat that card type electronic component produced in order to utilize thermal convection; With the card installation portion that contacts with described cooling end, in order to supporting the card type electronic component that removably inserts wherein, being electrically connected on the described card type electronic component, and heat is passed to described cooling end from described card type electronic component.
Aforementioned and/or the others of general plotting of the present invention are also by providing a kind of display device with display and display driver portion to be achieved, this display device comprises the card type electronic component installation system, in order to support the card type electronic component that removably inserts wherein, being electrically connected on the described card type electronic component, and utilize thermal convection to scatter and disappear by the heat that described card type electronic component produced.
Aforementioned and/or the others of general plotting of the present invention also are achieved in order to the radiating component that electronic card is cooled off by providing a kind of, this radiating component comprises: in order to the card installation portion of described electronic card to be installed therein, with the fixedly heat transfer part of contiguous described card installation portion setting, in order to heat is transferred away from described electronic card.
Description of drawings
In conjunction with the accompanying drawings, by following description to embodiment, these of general plotting of the present invention and/or others will display and be easier to be understood, wherein:
Fig. 1 is the perspective view that is used for the conventional radiating component of card type electronic component.
Fig. 2 shows the structure of the radiating component that an embodiment of the general plotting according to the present invention can together use with card type electronic component.
Fig. 3 shows the separate part in the radiating component shown in Fig. 2.
Fig. 4 is a perspective view, shows the radiating component that another embodiment of the general plotting according to the present invention can together use with card type electronic component.
Fig. 5 is a decomposition diagram, and an embodiment who shows the general plotting according to the present invention has the display device of the radiating component that can together use with card type electronic component.
Embodiment
To the embodiment of general plotting of the present invention be elaborated below, its example is shown in the drawings, runs through these accompanying drawings, and identical Reference numeral refers to similar elements.In order to explain general plotting of the present invention, below with reference to the accompanying drawings embodiment is described.
Fig. 2 shows the structure of the radiating component 30 that an embodiment of the general plotting according to the present invention can together use with card type electronic component.Fig. 3 shows the separate part in the radiating component shown in Fig. 2 30.As shown in Fig. 2 and 3, can comprise the radiator 32 that is made into to have a plurality of fin 35 with the radiating component 30 that card type electronic component together uses; And comprise card installation portion 34, wherein card installation portion 34 has the receiver 33 that is bound up on the radiator 32 and holds described card type electronic component, so that will be by heat transferred that described card type electronic component produced to radiating component 30.Here, receiver 33 can have elastic component 36, in order to the card type electronic component that is held is pressed to radiator 32.
Card installation portion 34 comprises the receiver 33 in order to hold POD card 40.As shown in Figure 3, card installation portion 34 can be set in the display driver portion 15, but is not limited thereto, but can be arranged on any position, as long as card installation portion 34 is electrically connected with connector 17.Radiator 32 can be arranged on the side of card installation portion 32, so that the heat dissipation that will be produced by POD card 40 is to outside.On the side of card installation portion 34, can be provided with and pull out card rod 37, in order to POD card 40 is extracted from receiver 33.
Receiver 33 is arranged on the card installation portion 34, in order to hold POD card 40.Receiver 33 can be configured to through hole, and the both sides of receiver 33 are uncovered along the insertion path of POD card 40 direction of insertion; Perhaps can be configured to receive groove, a side of receiver 33 can be uncovered.When the both sides of receiver 33 were uncovered, the connector 17 that is used to be electrically connected POD card 40 was arranged on the opposite side of jack, and POD card 40 inserts in the described jack.If receiver 33 is configured to receive groove, it only uncoveredly has a jack so, connector 17 can be arranged on receiver 33 inwalls on that opposite side of jack.In other words, if receiver 33 is uncovered along insertion both sides, path, POD card 40 can insert in a side so, and connector 17 is set at an other side.But only a side is uncovered if receiver 33 is along inserting the path, and connector 17 can relatively be arranged on the described inwall with described jack so.
The side that connects with radiator 32 on the receiver 33 can uncovered (referring to Fig. 2).In this case, POD card 40 directly and radiator 32 come in contact, the heat efficient transfer that will be produced from POD card 40 is to radiator 32 thus.The elastic component 36 that is contained in the receiver 33 is pressed to radiator 32 with the POD card 40 that is held, thereby makes that POD card 40 is forced to closely contact with radiator 32.Elastic component 36 can be set up spring in blocks, and zone is towards radiator 32 bendings in the middle of it.Therefore, if POD card 40 is accommodated within the receiver 33, so POD card 40 will under the effect of described spring closely attached to radiator 32 on, the heat efficient transfer that will be produced from POD card 40 is to radiator 32 thus.Also have, elastic component 36 can be configured to such as the such cushion of sponge.
A plurality of fin 35 are arranged on the side of radiator 32, are passed to the heat of radiator 32 from POD card 40 in order to scatter and disappear.Fin 35 has bigger surface area, carries out the heat exchange maximization so that make with extraneous air.
As previously mentioned, can provide individual heat sinks 32 and card installation portion 34 with the radiating component that card type electronic component 30 together uses according to present embodiment, thereby be convenient to make the radiating component 30 that is used for card type electronic component.Also have, POD card 40 directly contacts with radiator 32, thereby heat transmits by conductibility, has strengthened cooling effect thus.Also have, the radiating component 30 in the present embodiment does not use cooling fan, has reduced noise thus and has saved extra charge.
Fig. 4 is a perspective view, show the radiating component 30 that another embodiment of the general plotting according to the present invention can together use with card type electronic component '.Therefore some element in the present embodiment can utilize identical Reference numeral to refer to similar with the element in the embodiment shown in 3 at Fig. 2.As shown in Figure 4, the radiating component 30 that can together use with card type electronic component ' comprise radiator 32 and card installation portion 34 according to present embodiment.Radiator 32 has the main body 31 that is made into to have a plurality of fin 35, and card installation portion 34 comprises the receiver 33 in order to hold POD card 40.Here, receiver 33 can comprise elastic component 36 ', (opposite with the embodiment shown in Fig. 2 and 3, in the embodiment shown in Fig. 2 and 3, elastic component is pressed to radiator 32 with POD card 40 to be used for that the POD card 40 that is held is pressed to receiver 33.
Main body 31 can comprise in order to the receiver 33 that holds POD card 40 and a plurality of in order to the heat dissipation that will be produced by POD card 40 to outside fin 35.Main body 31 can have the various shapes that are used to receive POD card 40.Also have, as shown in Figure 4, main body 31 can be bound up in the display driver portion 15 in the display device 10 (referring to Fig. 5), and can be bound up on the bonnet 12.Main body 31 can be made by Heat Conduction Material, such as aluminium, copper, titanium or the like.
Receiver 33 can be formed in the main body 31, in order to hold POD card 40.The shape of receiver 33 can be corresponding to the shape that is about to be contained in POD card 40 wherein.When utilizing dissimilar card type electronic components, receiver 33 can be corresponding to its shape and size.Receiver 33 can be corresponding to the size of POD card 40, thereby makes POD card 40 contact with the inwall of this receiver 33.In this case, the heat that is produced by POD card 40 conducts by receiver 33, to be passed to fin 35, thus by at fin 35 and be looped around and carry out between the extraneous air around the fin 35 that heat exchange is discharged and/or scatter and disappear.
As shown in Figure 4, radiating component 30 ' also comprise elastic component 36 ', in order to POD card 40 is pressed to receiver 33, thereby make POD card 40 closely contact with this receiver 33.For example, elastic component 36 ' can be set up spring type in blocks or backing plate type.Elastic component 36 ' exert pressure on POD card 40 increases the contact area between POD card 40 and the main body 31 thus, and more heat is conducted to fin 35.
Receiver 33 can be configured to through hole, and the side, two ends of this receiver 33 is all uncovered, and can be configured to receive groove, and a side of this receiver 33 is uncovered.When receiver 33 is configured to through hole, connector 17 can be arranged on the opposition side of the patchhole that is inserted with POD card 40, be electrically connected with POD card 40.When receiver 33 is configured to receive groove, connector 17 can be arranged on the inwall side of receiver 33.
Receiver 33 can have pull out card rod 37 (with embodiment illustrated in fig. 2 in identical), in order to extract POD card 40.When inserting POD card 40, pull out card rod 37 and can from receiver 33, projection come out.In this case, utilization is pulled out card rod 37 the POD card 40 that is inserted is released, to extract POD card 40 from receiver 33.
As previously mentioned, according to the radiating component 30 that can together use with card type electronic component of present embodiment ' in, in order to the receiver 33 that holds POD card 40 with in order to discharge and/or the fin 35 of the heat that produced from POD card 40 of scattering and disappearing integrally formed, minimize the volume of the radiating component that is used for card type electronic component thus, and by heat is passed to fin 35 efficiently from POD card 40, and strengthened cooling effect.Because the various embodiment of general plotting of the present invention do not use cooling fan, thus can not produce noise, and avoided owing to use the extra charge that cooling fan caused.
With reference to Fig. 5 the course of work that is incorporated into the radiating component (30 or 30 ') that can together use with card type electronic component in the display device 10 is described below.The previous embodiment of general plotting can be applied in the display device 10 shown in Fig. 5 with the radiating component (30 or 30 ') that card type electronic component together uses according to the present invention.
Fig. 5 is a decomposition diagram, shows display device 10, and it has in order to scatter and disappear by the radiating component 30 of the heat that card type electronic component produced (perhaps 30 ').As shown in the figure, display device 10 in the present embodiment comprises the image displaying part 13 in order to display image, in order to drive the display driver portion 15 of image displaying part 13, and protecgulum 11 and bonnet 12, described protecgulum and bonnet be respectively in order to holding image displaying part 13 and display driver portion 15, and in order to form the outward appearance of display device 10.
Display driver portion 15 is arranged on the back of image displaying part 13, and is provided with the connector (not shown) in the zone at display driver portion 15 places, in order to be electrically connected with POD card 40.Bonnet 12 is provided with the card jack 16 corresponding to receiver 33, thereby makes POD card 40 removably insert wherein from the outside of display device 10.
POD card 40 inserts within the receiver 33 in the radiating components 30 (perhaps 30 ') by being arranged at card jack 16 on the bonnet 12.The end of the POD card 40 that inserts is electrically connected with connector 17 by receiver 33, and the remainder of POD card 40 (except described end) keeps contacting with receiver 33.Elastic component 36 ' POD card 40 can be pressed to receiver 33 comes forcibly to produce between receiver 33 and POD card 40 and contacts, as with reference to description embodiment illustrated in fig. 4.Alternatively, elastic component 36 can be pressed to thermal radiation part 32 with POD card 40, describes as reference Fig. 2-3 illustrated embodiment.When radiating component 30 was provided with in as embodiment shown in Figure 2, the side that connects with radiator 32 on the receiver 33 can be uncovered.In this case, POD card 40 directly contacts with radiator 32, thus heat is passed to radiator 32 efficiently from POD card 40.Thus, the radiator 32 that the heat that is produced by POD card 40 passes through to be contacted is passed to fin 35, and these heats by be looped around extraneous air around the fin 35 and carry out heat exchange and lose.
Therefore, has the heat that the display device 10 of the radiating component 30 that can together use with card type electronic component (perhaps 30 ') can scatter and disappear and be produced by POD card 40 efficiently, thereby make the heat that is produced by POD card 40 can not be passed to display driver portion 15 or image displaying part 13, prevented that thus image quality decrease and display device 10 from breaking down.Also have, owing to do not use cooling fan, therefore can not produce noise, and avoid owing to the extra charge of using cooling fan to cause.
Although illustrated and described the minority embodiment of general plotting of the present invention, but the present technique field those skilled persons it will be understood that, under the condition of principle that does not break away from general plotting of the present invention and essence, can change these embodiment, the scope of general plotting of the present invention is described by claims and their equivalence and is limited.
The cross reference of related application
The application requires to enjoy in the priority that on June 8th, 2005 was committed to the korean patent application No.2005-48930 of Korea S Department of Intellectual Property, and inciting somebody to action wherein by reference at this, disclosed content all is incorporated into the present invention.

Claims (29)

1, a kind of can together making with card type electronic component is used for radiating component that this card type electronic component is cooled off, and this radiating component comprises:
Radiator is made into to have a plurality of fin; With
The card installation portion, it is linked on the described radiator, and has in order to hold the receiver of described card type electronic component, so that heat is passed to described radiator from described card type electronic component.
2, according to the radiating component described in the claim 1, wherein said receiver comprises:
Facing to the surface of described radiator, this surface is uncovered and allow that the card type electronic component and the described radiator that are held come in contact.
3, according to the radiating component described in the claim 2, wherein said receiver also comprises:
Elastic component is in order to press to described radiator with the card type electronic component that is held.
4, according to the radiating component described in the claim 1, wherein said receiver also comprises:
Elastic component is in order to press to this receiver with the card type electronic component that is held.
5, according to the radiating component described in the claim 1, wherein said card type electronic component comprises the POD card.
6, a kind of can together making with card type electronic component is used for radiating component that this card type electronic component is cooled off, and this radiating component comprises:
Receiver is in order to hold described card type electronic component, so that heat is transferred away from described card type electronic component; With
A plurality of fin, itself and described receiver are integrally formed, in order to the heat that scatters and disappears and come from described card type electronic component transmission.
7, according to the radiating component described in the claim 6, wherein said receiver also comprises:
Elastic component is in order to press to this receiver with the card type electronic component that is held.
8, according to the radiating component described in the claim 6, wherein said card type electronic component comprises the POD card.
9, a kind of display device comprises:
Image displaying part in order to display image;
In order to drive the display driver portion of described image displaying part;
Be arranged at the card type electronic component in the described display driver portion;
Be made into to have the radiator of a plurality of fin; And
Radiating component, this radiating component and described radiator connect, and comprise the card installation portion that is formed with receiver, and described receiver is passed to described radiator with heat from described card type electronic component in order to hold described card type electronic component.
10, according to the display device described in the claim 9, wherein said receiver comprises:
Facing to the surface of described radiator, this surface is uncovered holding described card type electronic component, and the card type electronic component and the described radiator that are held are come in contact.
11, according to the display device described in the claim 10, wherein said receiver also comprises:
Elastic component is in order to press to described radiator with the card type electronic component that is held.
12, according to the display device described in the claim 9, wherein said receiver comprises:
Elastic component is in order to press to this receiver with the card type electronic component that is held.
13, according to the display device described in the claim 9, wherein said card type electronic component comprises the POD card.
14, according to the display device described in the claim 9, also comprise:
Protecgulum and bonnet, in order to hold described image displaying part and display driver portion respectively, and form the outward appearance of this display device, wherein, bonnet has the card jack, this card jack is corresponding to described card installation portion, and allows from the outside of this display device described card type electronic component is taken out.
15, a kind of card type electronic component installation system that can be used in the display comprises:
Cooling end scatters and disappears by the heat that card type electronic component produced in order to utilize thermal convection; With
The card installation portion that contacts with described cooling end in order to supporting the card type electronic component that removably inserts wherein, being electrically connected to described card type electronic component, and is passed to described cooling end with heat from described card type electronic component.
16, according to the card type electronic component installation system described in the claim 15, wherein said card installation portion comprises:
Receiver is in order to support the card type electronic component that inserts wherein; With
Connector is in order to be electrically connected to described card type electronic component.
17, according to the card type electronic component installation system described in the claim 16, wherein said receiver comprises:
Through hole, its first side is inserted with described card type electronic component, is provided with described connector at the second side place, makes described card type electronic component insert at the first side place of this through hole, is connected on the described connector with the second side place at this through hole.
18, according to the card type electronic component installation system described in the claim 16, wherein said receiver comprises:
Groove, have the open-position-side that is inserted with described card type electronic component, with the inwall relative with described open-position-side, described connector is set at inwall, make described card type electronic component be inserted into, to be connected on the described connector at described inwall place at the open-position-side place of this groove.
19, according to the card type electronic component installation system described in the claim 16, wherein said card installation portion also comprises:
Elastic portion in order to described card type electronic component is pressed to described receiver, makes and conducts heat at most, and described receiver with heat transferred to described cooling end.
20, according to the card type electronic component installation system described in the claim 19, wherein said elastic component is a kind of in sheet spring and the cushion.
21, according to the card type electronic component installation system described in the claim 15, wherein said cooling end comprises:
Contact site has the surface towards described card installation portion; With
A plurality of fin, these fin are connected on the described contact site in parallel to each other along the direction that is substantially perpendicular to surface, described contact site place.
22, according to the card type electronic component installation system described in the claim 15, wherein said cooling end is made by metal material.
23, according to the card type electronic component installation system described in the claim 15, wherein said cooling end is by a kind of the making in aluminium, copper and the titanium.
24, according to the card type electronic component installation system described in the claim 15, also comprise:
Elastic portion in order to described card type electronic component is pressed to described cooling end, makes and conducts heat at most.
25, according to the card type electronic component installation system described in the claim 24, wherein said elastic component is a kind of in sheet spring and the cushion.
26, a kind of display device with display and display driver portion, this display device comprises:
The card type electronic component installation system in order to supporting the card type electronic component that removably inserts wherein, being electrically connected to described card type electronic component, and utilizes thermal convection to scatter and disappear by the heat that described card type electronic component produced.
27, according to the display device described in the claim 26, wherein said card type electronic component installation system comprises:
A plurality of fin scatter and disappear by the heat that card type electronic component produced in order to utilize thermal convection; With
Card bed has at least one in order to the jack of described card type electronic component to be installed therein, being electrically connected to described card type electronic component, and heat is passed to a plurality of fin from described card type electronic component.
28, according to the display device described in the claim 26, wherein said card type electronic component installation system is arranged in the described display driver portion, in order to heat is scattered and disappeared from described display.
29, a kind of radiating component in order to electronic card is cooled off, this radiating component comprises:
In order to the card installation portion of described electronic card to be installed therein; With
The fixedly heat transfer part that contiguous described card installation portion is provided with is in order to transfer away heat from described electronic card.
CNA2006100842823A 2005-06-08 2006-05-30 Heat radiation member usable with a card type electronic component and display apparatus having the same Pending CN1878455A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050048930A KR100653063B1 (en) 2005-06-08 2005-06-08 Heat radiation device for card type electronic component and display apparatus having the same
KR48930/05 2005-06-08

Publications (1)

Publication Number Publication Date
CN1878455A true CN1878455A (en) 2006-12-13

Family

ID=37510696

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100842823A Pending CN1878455A (en) 2005-06-08 2006-05-30 Heat radiation member usable with a card type electronic component and display apparatus having the same

Country Status (3)

Country Link
US (1) US20060278380A1 (en)
KR (1) KR100653063B1 (en)
CN (1) CN1878455A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102284761A (en) * 2010-06-17 2011-12-21 纬创资通股份有限公司 Electronic component desoldering method and heat conduction module
CN102376205A (en) * 2010-08-19 2012-03-14 夏普株式会社 Display apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011181731A (en) * 2010-03-02 2011-09-15 Molex Inc Electronic apparatus with socket for card type component
FR2995172B1 (en) * 2012-09-06 2015-11-20 Sagemcom Broadband Sas ELECTRONIC EQUIPMENT WITH AIR COOLING AND DEVICE FOR COOLING AN ELECTRONIC COMPONENT

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5475563A (en) * 1994-10-27 1995-12-12 Compaq Computer Corporation PCMCIA card heat removal apparatus and methods
JPH1044657A (en) 1996-08-08 1998-02-17 Seiko Epson Corp Card type electronic device
JP3318511B2 (en) 1997-06-30 2002-08-26 株式会社ピーエフユー Mounting structure of card type semiconductor device
KR100246847B1 (en) * 1997-11-13 2000-03-15 윤종용 Method of making the semiconductor package of a type of card
JPH11204966A (en) 1998-01-16 1999-07-30 Fujikura Ltd Cooling equipment for card of outdoor communication equipment
JP2000137544A (en) * 1998-11-02 2000-05-16 Fuji Photo Film Co Ltd Notebook-sized personal computer
KR100369821B1 (en) * 2000-12-27 2003-02-05 삼성전자 주식회사 Displaying Apparatus
KR100381787B1 (en) * 2000-12-27 2003-04-26 삼성전자주식회사 Displaying Apparatus
KR100412106B1 (en) * 2001-01-04 2003-12-24 삼성전자주식회사 Flat panel display
EP1286393A3 (en) * 2001-06-28 2004-03-03 F & K Delvotec Bondtechnik GmbH Circuit housing
KR100465789B1 (en) * 2002-01-25 2005-01-13 삼성전자주식회사 Combining Device for Electric Apparatuses including Display Apparatus
KR100471064B1 (en) * 2002-06-11 2005-03-10 삼성전자주식회사 Displaying apparatus
JP3920256B2 (en) * 2003-10-02 2007-05-30 日本航空電子工業株式会社 Card connector
US7133285B2 (en) * 2004-01-23 2006-11-07 Yamaichi Electronics U.S.A., Inc. Electronics connector with heat sink
JP3946707B2 (en) * 2004-03-29 2007-07-18 タイコエレクトロニクスアンプ株式会社 Card connector

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102284761A (en) * 2010-06-17 2011-12-21 纬创资通股份有限公司 Electronic component desoldering method and heat conduction module
CN102284761B (en) * 2010-06-17 2014-05-28 纬创资通股份有限公司 Electronic component desoldering method and heat conduction module
CN102376205A (en) * 2010-08-19 2012-03-14 夏普株式会社 Display apparatus
CN102376205B (en) * 2010-08-19 2014-09-10 夏普株式会社 Display apparatus

Also Published As

Publication number Publication date
US20060278380A1 (en) 2006-12-14
KR100653063B1 (en) 2006-12-01

Similar Documents

Publication Publication Date Title
CN100559925C (en) The display module that is used for the radiator structure of display floater and has this structure
US7508673B2 (en) Heat dissipating apparatus for plasma display device
US7667972B2 (en) Connector with a heat sink
US7369412B2 (en) Heat dissipation device
CN1797665A (en) Chassis structure for plasma display module and plasma display module including the chassis structure
CN100587766C (en) Plasma display device
CN1313990C (en) Plasma display device
CN1826042A (en) Plasma display device
CN1855455A (en) Dissipating apparatus for integrated circuit chip and display module including the same
EP1263040A3 (en) High performance heat sink for electronics cooling
US7414204B2 (en) Display device and heat dissipating means therefor
EP2426711A2 (en) Heat sink for a protrusion-type ic package
CN1379465A (en) Fin type heat radiator
CN1893769A (en) Drive circuit board and flat display apparatus including the same
US20020084060A1 (en) Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
CN1878455A (en) Heat radiation member usable with a card type electronic component and display apparatus having the same
JP3503349B2 (en) Plasma display panel
CN1761382A (en) Plasma display device
CN100452124C (en) Plasma display device
CN1773574A (en) Plasma display panel (PDP) supporting member and PDP including the supporting member
US20060203445A1 (en) Heat-dissipating structure for flat panel display
US20100243203A1 (en) Cooling device for add-on card
EP1347512A2 (en) Improved heatsink buffer configuration
CN209930781U (en) High heat conduction module and high heat conduction heat dissipation structure comprising same
JP2885147B2 (en) Plasma display device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication