CN1870859B - Manufacturing method of two-face exposed flexible circuit board - Google Patents
Manufacturing method of two-face exposed flexible circuit board Download PDFInfo
- Publication number
- CN1870859B CN1870859B CN2006100819121A CN200610081912A CN1870859B CN 1870859 B CN1870859 B CN 1870859B CN 2006100819121 A CN2006100819121 A CN 2006100819121A CN 200610081912 A CN200610081912 A CN 200610081912A CN 1870859 B CN1870859 B CN 1870859B
- Authority
- CN
- China
- Prior art keywords
- wiring pattern
- circuit board
- flexible circuit
- conductor layer
- photosensitive polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A method for manufacturing a double access-type flexible circuit board is provided. The invention is to provide the double access-type flexible circuit board excellent in mechanical characteristics, chemical resistance, insulation reliability, and size stability. The manufacturing method of the double access-type flexible circuit board is characterized by comprising a step of forming a laminated board by disposing a first photosensitive base layer (2) made of photosensitive polyamide on one surface of a conductor layer (1), forming a wiring pattern by subjecting the conductor layer to etching processing, disposing a second coated layer (3) made of photosensitive polyimide on an exposed surface of the wiring pattern, opening the first and the second coated layers by photoetching processing, and forming a connection land (4) on both surfaces of the wiring pattern.
Description
Technical field
The present invention relates to the conductor layer two sides and form to connect manufacturing approach, relate in particular to the manufacturing approach of covering the flexible circuit board that copper flexible circuit board structure is the basis with single face with two-face exposed (double access) type flexible circuit board of peristome.
Background technology
As the manufacturing approach that exposed type printed substrate terminal pad, two-sided also is set at basal plane, the pre-punching method of record in document (Nikkan Kogyo Shimbun, history work " the high density flexible substrate is crossed the threshold " was ground in distribution storehouse, natural pond in 1998) is arranged.Wherein, paste when making copper-clad laminated board (3 layers of member), use the basement membrane of the band bonding agent of implementing perforation processing in advance, thereby can make the flexible circuit board that can connect from the conductor two sides through the bonding agent between Copper Foil and basement membrane.
In recent years, copper-clad laminated board is in order to tackle the requirement that all slimmings of thermal endurance or circuit, Halogen and flame retardancy two are stood, and the scope of application of the adhesive-free copper-clad plate of adhesive-free between its Copper Foil and the polyimide layer (being called 2 layers of member) is more and more wider.Formation method when adopting 2 layers of member to make two-face exposed type printed circuit board (PCB) to the terminal pad of base membrane layer; There is screen painting etc. to avoid terminal pad portion and coating polyimide varnish and in addition dry method, but has the low problems of design freedom such as to carry out minute opening.
In addition, useful laser processing, plasma process form the method for terminal pad at base membrane layer, but because laser processing is a single hole handles and productivity is low, and need remove operation attached to the sintering foreign matter on the dish, so production cost rises.In addition, but the plasma process Unified Treatment, but need cover the pre-treatment of operation, so productivity is low.
In order to address these problems, in patent documentation 1 (with reference to TOHKEMY 2000-156555 communique), put down in writing at conductor circuit with metal forming single face coating polyimide presoma varnish, through the dry polyimide precursor layer that forms; Apply photoetching process with photoresist at polyimide precursor; Through exposure, develop and dish is set exposes and use peristome, then, behind etching method manufactured copper pattern; With the imidization at high temperature of polyimide precursor layer, thereby make two-face exposed flexible circuit board.
In addition, the basement membrane as 2 layers of member of said method also can use the photosensitive polyimide with photoresist function.Concrete example as photosensitive polyimide; Have on the polyimide precursor by ester bond or ionic bond import the sensitization base the negative-type photosensitive polyimide precursor, the positive type photosensitive polyimide (with reference to TORAY RESESARCHCENTER, distribution on January 5th, 2003 " エ レ Network ト ロ ニ Network ス with the up-to-date trend of レ ヅ ス ト ") of adjacent nitrobenzyl ester group structure is arranged on side chain.
Summary of the invention
Adopt polyimide precursor to form successively in the technology of insulating barrier, more crisp as the polyimide precursor of lining material, and form in the alkalescent liquid that is impregnated into photoresist developing in the operation at wiring pattern and can add water decomposition and the top layer deterioration.Therefore, form in the operation, exposing the conductor layer that exposes with peristome in order in soup, to protect insulating barrier and protection at wiring pattern, need be with weak stickup band as diaphragm, its productivity poor (mechanical property, chemical proofing).
In addition; Form in the operation at wiring pattern; The face of the polyimide precursor that exposes because of the etching of the copper of conductor layer receives the water decomposition that adds of strong acid to form fragile layer, and adherence, the insulating reliability of its cap rock (cover coat) becomes problem (mechanical property, chemical proofing).Also have,, warpage (dimensional stability) possibly take place because development is carried out maybe avoiding the volume contraction (dimensional stability) in the imidization by each single face with the thermmohardening operation successively.
The present invention considers that the problems referred to above design forms, and aims to provide the good two-face exposed flexible circuit board of mechanical property, chemical proofing, insulating reliability and dimensional stability.
In order to reach above-mentioned purpose, the present invention provides a kind of manufacturing approach of two-face exposed flexible circuit board, it is characterized in that:
Dispose coating and the cambium layer lamination of the negative-type photosensitive polyimides of organic solvent develop type in the one side of conductor layer; Said conductor layer is carried out etching and processing and forms wiring pattern; The coating that face configuration is made up of the negative-type photosensitive polyimides with the same organic solvent developable of said conductor layer that exposes at said wiring pattern; Said two coatings are carried out lithography process and form opening, and form terminal pad on said wiring pattern two sides.
In order to reach above-mentioned purpose, the present invention also provides the manufacturing approach of another kind of two-face exposed flexible circuit board, it is characterized in that:
At the coating of the positive type photosensitive polyimide of the one side of conductor layer configuration alkali-developable and the cambium layer lamination; Said conductor layer is carried out etching and processing and forms wiring pattern; The coating that face configuration is made up of the positive type photosensitive polyimide with the same alkali-developable of said coating that exposes at said wiring pattern; Said two coatings are carried out lithography process and form opening, and form terminal pad on said wiring pattern two sides.
The present invention is as above-mentioned; Be photosensitive polyimide and the cambium layer lamination that has excellent chemical proofing in the configuration of the one side of conductor layer; And after forming wiring pattern; Form the manufacturing approach of terminal pad on the two sides simultaneously, therefore when wiring pattern forms, do not have the deterioration of material, can improve mechanical property, chemical proofing and insulating reliability.In addition, owing to be to adopt the unified terminal pad in two sides of polyimides to form operation, improve volume contraction or warpage.
Description of drawings
Fig. 1 (a) to (e) is the key diagram of the operation of expression one embodiment of the present of invention.
(symbol description)
1 conductor layer, 2 photosensitive polyimide basic units, 3 photosensitive polyimide cover layers, 4 terminal pads.
Embodiment
Below, with reference to the description of drawings embodiments of the invention.
Embodiment 1
Below, just use the occasion of positive type photosensitive polyimide to describe as basal lamina material among the present invention.Positive type photosensitive polyimide used herein can carry out all selections according to the characteristic of its purpose also to be used.
Fig. 1 (a) to (e) illustrates operation in one embodiment of the present of invention in order.Initial operation in this Fig. 1 (a) expression the inventive method is in the one side formation photosensitive polyimide basic unit 2 of conductor layer 1.
Then, conductor layer 1 is carried out etching and processing and forms wiring pattern (Fig. 1 (b)).Then, the face that exposes at wiring pattern uses with photosensitive polyimide basic unit 2 same photosensitive polyimides and forms photosensitive polyimide cover layer 3 (Fig. 1 (c)).Photosensitive polyimide layer to the two sides carries out lithography process and opening (Fig. 1 (d)), thereby makes the two-face exposed flexible circuit board (Fig. 1 (e)) that its wiring pattern two sides forms terminal pad.
Roughly available 2 kinds of photosensitive polyimide basic unit 2 and photosensitive polyimide cover layer 3, that is, and the minus that organic solvent develops and the eurymeric of alkaline development.Photosensitive polyimide basic unit 2 and photosensitive polyimide cover layer 3 owing in the chemical composition of dielectric film, do not contain its chemical characteristic, mechanical property than linked such as the propylene of polyimides difference or epoxies, have the excellent specific property as dielectric film.
For example, the reaction developable photoresist (non-patent literature 2) of the solvable type polyimides of the solvent mixing quinone diazido compound of pair non-photosensitive as positive type photosensitive polyimide arranged as the concrete example of photosensitive polyimide.
Also have, preferably adopt in the photosensitive polyimide positive type photosensitive polyimide polyimides mixing quinone diazido compound.This positive type photosensitive polyimide can be commercially available general positive type photosensitive polyimide, also can mix the solvable type quinone of commercially available solvent diazido compound, gives photonasty.For example, as the positive type photosensitive polyimide of alkali-developable, can adopt the system RN-902 of the chemical society of daily output etc.
Then, each operation of the manufacturing approach of the present invention shown in the key diagram 1 (a) to (e).
At first the one side at Copper Foil 1 is provided with positive type photosensitive polyimide 2 (Fig. 1 (a)).This is through carrying out with screen painting method drying after the one side of Copper Foil 1 applies positive type photosensitive polyimide.Thereby, form photonasty basic unit 2 as the Copper Foil 1 of conductor layer.
Then, on the another side of Copper Foil 1,, and form the pattern of the photoresist corresponding through photoetching process with the conductor circuit pattern with the photoresist film lamination.Then, the another side through etching Copper Foil 1 forms wiring pattern, and forms conductor circuit (Fig. 1 (b)) through removing photoresist.
Then, on wiring pattern, apply positive type photosensitive polyimide layer 3 and in addition dry, form photosensitive cover lay 3 (Fig. 1 (c)) with the screen painting method.
Thereafter; Photonasty basic unit 2 and photosensitive cover lay 3 are made public from Copper Foil 1 two sides with high-pressure mercury-vapor lamp etc. across exposed mask (not shown); Then, develop, then use the aqueous solution or the warm water that comprise organic solvents such as alcohol to wash and remove exposed portion with alkaline solutions such as NaOH.Thereby, on photonasty basic unit 2, photosensitive cover lay 3, form terminal pad portion 4 (Fig. 1 (d)) simultaneously.
At last, in air atmosphere or blanket of nitrogen, photonasty basic unit 2 is volatilized except that desolvating and emulsion with the unified heating of polyimides of photosensitive cover lay 3.
Like this, the completion two-face exposed type single face flexible circuit board (Fig. 1 (e)) that can expose from basic unit 2 and cover layer 3.
Other embodiment
Adopted positive type photosensitive polyimide in the foregoing description, as long as but have acidproof, alkali resistance, can carry out all selections and using according to the characteristic of its purpose, also the negative-type photosensitive polyimides of developable with an organic solvent.For example, as the negative-type photosensitive polyimides of organic solvent developable, can adopt the Durimide7000 series of Fuji Photo film electronic material corporate system.
Claims (3)
1. the manufacturing approach of a two-face exposed flexible circuit board is characterized in that:
Dispose coating and the cambium layer lamination of the negative-type photosensitive polyimides of organic solvent develop type in the one side of conductor layer;
Said conductor layer is carried out etching and processing and forms wiring pattern;
The coating that face configuration is made up of the negative-type photosensitive polyimides with the same organic solvent developable of said conductor layer that exposes at said wiring pattern;
Said two coatings are carried out lithography process and form opening, and form terminal pad on said wiring pattern two sides.
2. the manufacturing approach of a two-face exposed flexible circuit board is characterized in that:
At the coating of the positive type photosensitive polyimide of the one side of conductor layer configuration alkali-developable and the cambium layer lamination;
Said conductor layer is carried out etching and processing and forms wiring pattern;
The coating that face configuration is made up of the positive type photosensitive polyimide with the same alkali-developable of said coating that exposes at said wiring pattern;
Said two coatings are carried out lithography process and form opening, and form terminal pad on said wiring pattern two sides.
3. the manufacturing approach of two-face exposed flexible circuit board as claimed in claim 2, it is characterized in that: the positive type photosensitive polyimide of said alkali-developable is for constituting the solvable type polyimides of organic solvent mixing quinone diazido compound.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005-134140 | 2005-05-02 | ||
| JP2005134140 | 2005-05-02 | ||
| JP2005134140A JP2006310689A (en) | 2005-05-02 | 2005-05-02 | Manufacturing method of double-access flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1870859A CN1870859A (en) | 2006-11-29 |
| CN1870859B true CN1870859B (en) | 2012-06-27 |
Family
ID=37444381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100819121A Expired - Fee Related CN1870859B (en) | 2005-05-02 | 2006-05-08 | Manufacturing method of two-face exposed flexible circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006310689A (en) |
| KR (1) | KR20060114647A (en) |
| CN (1) | CN1870859B (en) |
| TW (1) | TWI384915B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288422A (en) * | 2007-05-18 | 2008-11-27 | Kinsus Interconnect Technology Corp | Flexible printed wiring board, and manufacturing method thereof |
| US9161712B2 (en) * | 2013-03-26 | 2015-10-20 | Google Inc. | Systems and methods for encapsulating electronics in a mountable device |
| TWI577251B (en) * | 2015-12-01 | 2017-04-01 | 同泰電子科技股份有限公司 | Rigid-flex circuit board and manufacturing method thereof |
| KR102260413B1 (en) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | Fpcb manufacturing method of double access method |
| KR102260416B1 (en) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | Fpcb manufacturing method of double access method |
| KR102260412B1 (en) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | Fpcb manufacturing method of double access method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4883744A (en) * | 1988-05-17 | 1989-11-28 | International Business Machines Corporation | Forming a polymide pattern on a substrate |
| JP2002156758A (en) * | 2000-11-16 | 2002-05-31 | Ube Ind Ltd | Method for producing high-density flexible board using photosensitive polyimide |
| JP2002246732A (en) * | 2001-02-16 | 2002-08-30 | Nitto Denko Corp | Method of manufacturing wiring circuit board |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206677A (en) * | 1990-11-30 | 1992-07-28 | Hitachi Chem Co Ltd | Manufacture of double-access flexible printed wiring board |
| JP3750140B2 (en) * | 1994-05-10 | 2006-03-01 | 日立化成工業株式会社 | Wiring board manufacturing method |
| JP2869969B2 (en) * | 1995-04-28 | 1999-03-10 | ソニーケミカル株式会社 | Method for manufacturing flexible circuit board |
| JP3666955B2 (en) * | 1995-10-03 | 2005-06-29 | 日本メクトロン株式会社 | Method for manufacturing flexible circuit board |
| JPH10224013A (en) * | 1997-02-12 | 1998-08-21 | Nippon Mektron Ltd | Production of circuit board |
| JP3261064B2 (en) * | 1997-03-24 | 2002-02-25 | 日本メクトロン株式会社 | Method of manufacturing flexible circuit board for semiconductor device |
| JPH1117331A (en) * | 1997-06-26 | 1999-01-22 | Nippon Mektron Ltd | Manufacture of flexible circuit board |
| JP3541697B2 (en) * | 1998-11-20 | 2004-07-14 | ソニーケミカル株式会社 | Manufacturing method of flexible wiring board |
| JP2001313451A (en) * | 2000-04-28 | 2001-11-09 | Nitto Denko Corp | Manufacturing method for flexible wiring board |
| JP4459406B2 (en) * | 2000-07-27 | 2010-04-28 | ソニーケミカル＆インフォメーションデバイス株式会社 | Flexible wiring board manufacturing method |
| JP4673507B2 (en) * | 2001-06-29 | 2011-04-20 | オプトレックス株式会社 | Flexible wiring board alignment method |
-
2005
- 2005-05-02 JP JP2005134140A patent/JP2006310689A/en active Pending
-
2006
- 2006-05-01 TW TW095115470A patent/TWI384915B/en not_active IP Right Cessation
- 2006-05-01 KR KR1020060039241A patent/KR20060114647A/en not_active Application Discontinuation
- 2006-05-08 CN CN2006100819121A patent/CN1870859B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4883744A (en) * | 1988-05-17 | 1989-11-28 | International Business Machines Corporation | Forming a polymide pattern on a substrate |
| JP2002156758A (en) * | 2000-11-16 | 2002-05-31 | Ube Ind Ltd | Method for producing high-density flexible board using photosensitive polyimide |
| JP2002246732A (en) * | 2001-02-16 | 2002-08-30 | Nitto Denko Corp | Method of manufacturing wiring circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI384915B (en) | 2013-02-01 |
| CN1870859A (en) | 2006-11-29 |
| KR20060114647A (en) | 2006-11-07 |
| JP2006310689A (en) | 2006-11-09 |
| TW200640314A (en) | 2006-11-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20180508 |