CN1858143A - Electronic packaging material - Google Patents
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- CN1858143A CN1858143A CN 200510046366 CN200510046366A CN1858143A CN 1858143 A CN1858143 A CN 1858143A CN 200510046366 CN200510046366 CN 200510046366 CN 200510046366 A CN200510046366 A CN 200510046366A CN 1858143 A CN1858143 A CN 1858143A
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- electronic package
- package material
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Abstract
The electronic packaging material is prepared with nanometer metal as base material and adding carbon nanotube in 0-35 vol%. The base material may be nanometer aluminum. The present invention has the advantages of the synchronous heat expansion with silicon semiconductor to avoid heat stress and heat crack between the silicon semiconductor and packing aluminum material, excellent packaging performance, low cost and wide application.
Description
Technical field:
The present invention relates to Materials science, a kind of electronic package material is provided especially.
Background technology:
It is heat of mechanical support, seal protection, stray electron components and parts etc. that electronic package material mainly acts on.It is to belong to the low-expansion high heat conductivity material, and its performance requriements is: (1) has high thermal, and rapid heat dissipation is in case device heats up too high and lost efficacy; (2) certain thermal expansivity requires thermal expansivity (CTE) with device be complementary (mainly being and Si and GaAs) usually; (3) certain mechanical property.Along with the continuous development of aspects such as aerospace, large-scale integrated circuit, military communication, traditional simple substance electronic package material has not satisfied the requirement in these fields.And matrix material, particularly metal-base composites have the not available advantage of other packaged materials as electronic package material: (1) design freedom is big; (2) such material coefficient of thermal expansion coefficient is low, and can accomplish has high thermal conductivity and low density simultaneously again with being complementary of electronic device material; (3) has good relatively mechanical property; (4) the material manufacturing is flexible, and productive expense is not high, and price constantly reduces.Just because of this, the metal-base composites of studying the high thermal conductivity that thermal expansivity and stupalith, semiconductor material be complementary has now become metal-base composites and has developed one of most important direction to be used for electron device.People expect that the better electronic package material of performance occurs.
Summary of the invention:
The purpose of this invention is to provide a kind of novel electronic packaged material.
A kind of electronic package material of the present invention is characterized in that: be that matrix is made with the nano metal.For coarse grained metal, use nano metal to cooperate the thermal expansivity that can reduce electronic package material to a certain extent with nanometer additive as matrix.
Electronic package material of the present invention is characterized in that: described electronic package material is a matrix with the nano metal, makes as additive with CNT (carbon nano-tube).The additive that adds low thermal coefficient of expansion in metal matrix can reduce its thermal expansivity; Because CNT (carbon nano-tube) has high heat conductance, specific tenacity, specific rigidity and approaches zero thermal expansivity, so it can be used as a kind of effective additives.The present invention adds CNT (carbon nano-tube) as additive in the nano metal matrix, form the double nano composite structure, like this can be so that nano metal matrix and CNT (carbon nano-tube) have bigger interface volume fraction between the two, reduce the material coefficient of thermal expansion coefficient significantly, it is become and the synchronous thermal expansion material of semiconductor silicon, thereby effectively avoid thermal stresses and thermal crack between semiconductor silicon and the electronic package material, so it can be as the electronic package material of excellent performance.
Electronic package material of the present invention is characterized in that: described electronic package material moiety and content are: CNT (carbon nano-tube): volume ratio 0～35%; Nano metal: surplus.The above is effect when better, the mix proportion scheme of material composition.
Electronic package material of the present invention is characterized in that: described electronic package material moiety and content are: CNT (carbon nano-tube): volume ratio 5～20%; Nano metal: surplus.This content range is preferred, and effect is better.
Electronic package material of the present invention is characterized in that: described electronic package material is matrix with the nano aluminum.The thermal conductivity of metallic aluminium higher (230W/ (m.K)), thermal expansivity also high (23 * 10
-6/ K); With the enhancing body of its adding is that thermal expansivity is low, the material of good heat conductivity.Alumina-base material not only has characteristics such as specific tenacity, specific rigidity height, and good heat conductivity, simultaneously, and aluminium is metallic substance the most frequently used, the most cheap outside the deironing, as the selection of Electronic Packaging components and parts, has good Application and Development potentiality.For common coarse-grain aluminium, the electronic package material performance of nano aluminum matrix also makes moderate progress.
Electronic package material of the present invention is characterized in that: described electronic package material is a matrix with the nano aluminum, makes as additive with CNT (carbon nano-tube).At present, the main method of the thermal expansivity of reduction aluminium is the additive that adds low thermal coefficient of expansion in aluminium base.Studies have shown that because CNT (carbon nano-tube) has high heat conductance, specific tenacity, specific rigidity and approach zero thermal expansivity, it can be used as a kind of effective additive and is used for adding to the nano aluminum matrix and is used to make electronic package material.The aluminum matrix composite linear expansivity is adjustable, density is lower; Here, nano aluminum matrix and CNT (carbon nano-tube) form the double nano composite structure, the two phase coadaptation, make the interface volume fraction obviously increase, this electronic package material is become and the synchronous thermal expansion material of semiconductor silicon, thereby effectively avoid thermal stresses and thermal crack between semiconductor silicon and the aluminium base packaged material, so it can be as the electronic package material of excellent performance.
Electronic package material of the present invention is characterized in that: described electronic package material moiety and content are: CNT (carbon nano-tube): volume ratio 0～35%; Nano aluminum: surplus.The above is a kind of material mixture ratio scheme of effect when better.
Electronic package material of the present invention is characterized in that: described electronic package material moiety and content are: CNT (carbon nano-tube): volume ratio 10～20%; Nano metal: surplus.The above is the more excellent preferred content scope of effect.
Advantage of the present invention is:
1, as electronic package material, excellent property: because made material and semiconductor silicon can be realized synchronous thermal expansion fully, avoided forming between semiconductor silicon and the aluminium base packaged material thermal stresses and thermal crack, so it can be as the electronic package material of excellent performance;
2, the cost of material is low, with aluminium base as body material.
Description of drawings:
Fig. 1 nanometer aluminium powder and CNT (carbon nano-tube) additive blended transmission electron microscope photo;
Fig. 2 nano aluminum matrix adds the thermal expansivity figure of different content CNT (carbon nano-tube) matrix material;
Embodiment:
Embodiment 1
Prepare Single Walled Carbon Nanotube and nanometer Al powder respectively with semicontinuous hydrogen arc process and active hydrogen plasma evaporation method, carbon pipe after will purifying then mixes through the wet method ultrasonic dispersing in proportion with nanometer Al powder, coldmoulding at room temperature, handle through 380 ℃ of vacuum hotpressings again, prepare carbon pipe content and be 2.5wt.%, density is greater than 95% block composite sample.At 20 ℃～250 ℃ thermal expansivity of having tested matrix material is 11 * 10
-6/ K～18 * 10
-6/ K.
Embodiment 2
Prepare Single Walled Carbon Nanotube and nanometer Al powder respectively with semicontinuous hydrogen arc process and active hydrogen plasma evaporation method, carbon pipe after will purifying then mixes through the wet method ultrasonic dispersing in proportion with nanometer Al powder, coldmoulding at room temperature, handle through 380 ℃ of vacuum hotpressings again, prepare carbon pipe content and be 5wt.%, density is greater than 95% block composite sample.At 20 ℃～250 ℃ thermal expansivity of having tested matrix material is 8 * 10
-6/ K～12 * 10
-6/ K.
Embodiment 3
Prepare Single Walled Carbon Nanotube and nanometer Al powder respectively with semicontinuous hydrogen arc process and active hydrogen plasma evaporation method, carbon pipe after will purifying then mixes through the wet method ultrasonic dispersing in proportion with nanometer Al powder, coldmoulding at room temperature, handle through 380 ℃ of vacuum hotpressings again, prepare carbon pipe content and be 17.5wt.%, density is greater than 95% block composite sample.At 20 ℃～250 ℃ thermal expansivity of having tested matrix material is 5 * 10
-6/ K～7 * 10
-6/ K.
Claims (10)
1, a kind of electronic package material is characterized in that: be that matrix is made with the nano metal.
2, according to the described electronic package material of claim 1, it is characterized in that: described electronic package material is a matrix with the nano metal, makes as additive with CNT (carbon nano-tube).
3, according to the described electronic package material of claim 2, it is characterized in that: described electronic package material consists of:
CNT (carbon nano-tube): volume ratio 0～35%;
Nano metal: surplus.
4, according to the described electronic package material of claim 2, it is characterized in that: described electronic package material consists of:
CNT (carbon nano-tube): volume ratio 5～20%;
Nano metal: surplus.
5, according to the described electronic package material of claim 1, it is characterized in that: described electronic package material is that matrix is made with the nano aluminum.
6, according to the described electronic package material of claim 5, it is characterized in that: described electronic package material is a matrix with the nano aluminum, makes as additive with CNT (carbon nano-tube).
7, according to the described electronic package material of claim 6, it is characterized in that: described electronic package material consists of:
CNT (carbon nano-tube): volume ratio 0～35%;
Nano metal: surplus.
8, according to the described electronic package material of claim 6, it is characterized in that: described electronic package material consists of:
CNT (carbon nano-tube): volume ratio 5～20%;
Nano aluminum: surplus.
9, according to the described electronic package material of claim 6, it is characterized in that: prepare Single Walled Carbon Nanotube and nanometer Al powder respectively with semicontinuous hydrogen arc process and active hydrogen plasma evaporation method, carbon pipe after will purifying then mixes through the wet method ultrasonic dispersing in proportion with nanometer Al powder, coldmoulding at room temperature, handle through 380 ℃ of vacuum hotpressings again, prepare the CNT (carbon nano-tube) weight percent content and be 2.5%, density is greater than 95% block composite sample.
10, according to the described electronic package material of claim 6, it is characterized in that: prepare Single Walled Carbon Nanotube and nanometer Al powder respectively with semicontinuous hydrogen arc process and active hydrogen plasma evaporation method, carbon pipe after will purifying then mixes through the wet method ultrasonic dispersing in proportion with nanometer Al powder, coldmoulding at room temperature, handle through 380 ℃ of vacuum hotpressings again, prepare the CNT (carbon nano-tube) weight percent content and be 17.5%, density is greater than 95% block composite sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510046366A CN100577768C (en) | 2005-04-30 | 2005-04-30 | Electronic packaging material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510046366A CN100577768C (en) | 2005-04-30 | 2005-04-30 | Electronic packaging material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1858143A true CN1858143A (en) | 2006-11-08 |
| CN100577768C CN100577768C (en) | 2010-01-06 |
Family
ID=37297101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510046366A Expired - Fee Related CN100577768C (en) | 2005-04-30 | 2005-04-30 | Electronic packaging material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100577768C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102127721A (en) * | 2010-11-03 | 2011-07-20 | 映瑞光电科技(上海)有限公司 | Aluminum alloy material and preparation method of aluminum alloy back plate |
| CN103103403A (en) * | 2013-01-24 | 2013-05-15 | 西安交通大学 | Electronic packaging material |
| CN108140635A (en) * | 2015-09-30 | 2018-06-08 | 三星Sdi株式会社 | Semiconductor package assembly and a manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1186469C (en) * | 2002-06-06 | 2005-01-26 | 中国科学院金属研究所 | Nano carbon tube reinforced nano metal base composite material and preparation method |
-
2005
- 2005-04-30 CN CN200510046366A patent/CN100577768C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102127721A (en) * | 2010-11-03 | 2011-07-20 | 映瑞光电科技(上海)有限公司 | Aluminum alloy material and preparation method of aluminum alloy back plate |
| WO2012058847A1 (en) * | 2010-11-03 | 2012-05-10 | 映瑞光电科技(上海)有限公司 | Aluminium alloy material and method for preparing aluminium alloy back board |
| US8833431B2 (en) | 2010-11-03 | 2014-09-16 | Enraytek Optoelectronics Co., Ltd. | Aluminum alloy material and method of manufacturing aluminum alloy backboard |
| CN103103403A (en) * | 2013-01-24 | 2013-05-15 | 西安交通大学 | Electronic packaging material |
| CN108140635A (en) * | 2015-09-30 | 2018-06-08 | 三星Sdi株式会社 | Semiconductor package assembly and a manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN100577768C (en) | 2010-01-06 |
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Granted publication date: 20100106 Termination date: 20110430 |