CN1856229A - Electronic circuit apparatus - Google Patents

Electronic circuit apparatus Download PDF

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Publication number
CN1856229A
CN1856229A CNA2006100737969A CN200610073796A CN1856229A CN 1856229 A CN1856229 A CN 1856229A CN A2006100737969 A CNA2006100737969 A CN A2006100737969A CN 200610073796 A CN200610073796 A CN 200610073796A CN 1856229 A CN1856229 A CN 1856229A
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CN
China
Prior art keywords
shell
thermal radiation
electronic
circuit board
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2006100737969A
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Chinese (zh)
Other versions
CN100556255C (en
Inventor
杉本圭一
中川充
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
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Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN1856229A publication Critical patent/CN1856229A/en
Application granted granted Critical
Publication of CN100556255C publication Critical patent/CN100556255C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/005—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An electronic circuit apparatus has a casing, a circuit board at which electronic members and power transistors are mounted, and a connector for connecting the circuit board with an external electrical circuit. The casing is insertion-molded by a resin, with the circuit board where the electronic members, the power transistors and the connector have been mounted being held at a predetermined position in a die for molding the casing through the resin. Thus, in the electronic circuit apparatus, damage to circuit components and noise due to a vibration excitation can be restricted, without increasing the number of construction members of the electronic circuit apparatus.

Description

Electronic circuit apparatus
Technical field
The present invention relates to a kind of electronic circuit apparatus.
Background technology
Usually, electronic circuit apparatus is used to control the operation that is installed on the various electric devices that vehicle etc. locates.
Fig. 7 shows Engine ECU 100 as the conventional type electronic circuit apparatus.The circuit board 101 of circuit element (not shown) above having, Engine ECU 100 is installed.Circuit board 101 is received in the shell 102 regularly.Shell 102 comprises and puts part 103 and lid 104.Circuit board 101 be held in put in the part 103 after, lid 104 is attached to and puts on the part 103.Therefore, circuit board 101 just is fixed in and puts in the part 103.
The connector 105 that is used to Engine ECU 100 is electrically connected with external circuit is attached to circuit board 101.Connector 105 covers 104 opening 104a and partly exposes to the outside of shell 102 from being arranged at, so that can be electrically connected with external circuit, circuit board 101 is fixed in the shell 102 simultaneously.
Yet, in this case, be difficult to prevent that foreign substance such as water from entering shell 102.And, between shell 102 and circuit board 101, there is small gap.Therefore, when Engine ECU 100 is subjected to external vibration when excitation, thereby circuit board 101 will vibrate in shell 102 and causes abnormal sound (noise), and perhaps circuit element will depart from circuit board 101, or the like.
In addition, because the member of formation quantity of conventional type electronic circuit apparatus is very big,, the amount of labour will increase so being installed.
Summary of the invention
Consider above shortcoming, an object of the present invention is to provide a kind of electronic circuit apparatus, wherein limited the noise and the infringement that circuit element are caused owing to the vibrational excitation of electronic circuit apparatus, and can not increase the quantity of its member of formation.
According to the present invention, a kind of electronic circuit apparatus is provided, be installed with above it has a plurality of circuit elements circuit board, be installed on circuit board and sentence and just make connector that circuit board is connected with external circuit and the shell that is formed from a resin.Shell is molded into the part of connector and the whole of circuit board and circuit element is sealed in the resin.
Therefore, be sealed in process in the resin by a part of carrying out single whole and connector with circuit board and circuit element, the process that is used for the process of molding outer casing and is used for printed circuit board (PCB) is fixed in shell just can be finished.Therefore, just can reduce the member of formation quantity and the attached amount of labour of electronic circuit apparatus.
And, because circuit board closely contacts shell, so owing to the caused noise of vibration (because the relative motion between circuit board and the shell causes) and the fault (for example: circuit element departs from circuit board) of electronic circuit apparatus will be restricted.
Therefore, the present invention can provide following electronic circuit apparatus, has wherein limited because vibrational excitation and the infringement that circuit element is caused and the noise of generation, and can not increase the quantity of the member of formation of electronic circuit apparatus.
Preferably, shell has from the outwardly directed thermal radiation part of shell.Circuit element comprises the electronic unit of heating.Thermal radiation partly is arranged at and corresponding position, the position of electronic unit.
For example, the power transistor of heating (for electronic unit) can be installed on the circuit board place.In this case, for the temperature with power transistor and other circuit element of being adjacent respectively remains in the predetermined temperature range of its operate as normal, the heat radiation that just needs to be produced by power transistor and so on is to outside.
In the conventional type electronic circuit apparatus, because the environment of circuit element is that air and circuit board are sealed in the shell with box shape, thus be difficult to the heat radiation that will produce by circuit element to the outside of shell so that the temperature of circuit element is remained in suitable value.And, in this case, when shell has the ventilating opening that is used for radiations heat energy, be difficult to make enclosure to keep clean.
According to the present invention, shell has the thermal radiation part, and its position is corresponding with the electronic component of heating and stretch out so that have from shell and for example to sieve shape.In this case, the electronic unit of heating is sealed in the resin that constitutes shell.That is, except its with surface that circuit board closely contacts, all surface of electronic unit all contacts with resin, and resin has the specific heat more much bigger than air.Therefore, the heat that is produced by electronic unit just is passed to the shell that is formed from a resin effectively, be passed to enclosure then and from the surface emissivity of the thermal radiation part that is formed at shell to air.
Therefore, the heat that is produced by electronic unit just can reach housing exterior effectively, so the temperature of electronic unit can remain in the preset range of electronic unit energy operate as normal basically.
More preferably, shell has at least one and is used for shell is fixed in attachment portion on the miscellaneous equipment.
In the conventional type electronic circuit apparatus, the carriage that is made of metallic plate is fixed on the shell.Electronic circuit apparatus is attached on the miscellaneous equipment by carriage.Like this, just increased the member of formation quantity of electronic circuit apparatus.And, under electronic circuit apparatus will be attached to situation in the vehicle of multiple model, need provide polytype carriage corresponding, so cost will increase with the multiple model of vehicle.According to the present invention, attachment portion is simultaneously molded in the process that is used for by resin molded shell.Therefore, attachment portion (for example carriage) just can be integrally molded with shell.Therefore, just can limit the increase of member of formation quantity.
Description of drawings
By reading the following detailed description of carrying out with reference to the accompanying drawings, understand above other purpose, the feature and advantage of reaching of the present invention with will be more readily apparent from, in the accompanying drawing:
Fig. 1 is the external perspective view that shows according to the Engine ECU of first embodiment of the invention;
The vertical cross section that Fig. 2 cuts open for the straight line II-II in Fig. 1;
The vertical cross section that Fig. 3 cuts open for the straight line III-III in Fig. 1;
The vertical cross section of Fig. 4 for cutting open along the straight line corresponding with II-II among Fig. 1 is used to illustrate the Engine ECU according to second embodiment of the invention;
The vertical cross section that Fig. 5 cuts open for the straight line V-V in Fig. 4;
Fig. 6 is the external perspective view that shows according to the thermal radiation unit of second embodiment; And
Fig. 7 is the external perspective view that shows according to the electronic circuit apparatus of relevant technologies.
Embodiment
Referring now to accompanying drawing example embodiment is described.
[first embodiment]
Be described referring now to Fig. 1-3 pair of electronic circuit apparatus according to first embodiment of the invention.For instance, this electronic circuit apparatus can suitably be used as the Engine ECU 1 (being electronic control unit) of vehicles.
Engine ECU 1 is fixed in the enging cabin or compartment of vehicle, is used to control the emitted dose of fuel and injecting time or the like, consistently the driving situation of vehicle is made optimal response so that guarantee engine.
Referring to Fig. 2, Engine ECU 1 has shell 4, printed circuit board (PCB) 2 and connector 5, and printed circuit board (PCB) 2 is the circuit board that is received in the shell 4, and connector 5 is used for Engine ECU 1 is connected with external circuit.
Printed circuit board (PCB) 2 can be made of the plate that is provided with wiring diagram.For example, this plate can be made by resin such as glass epoxy resin, pottery or the like.
For instance, various circuit elements are installed on the printed circuit board (PCB) 2 by welding.These circuit elements comprise the electronic unit 32 (for example power transistor) of electronic component 31 and heating.
For instance, electronic component 31 can be resistor, capacitor, diode, transistor, various integrated circuits or the like.Electronic component 31 also can have heating part, and they are at Engine ECU 1 duration of work, promptly generates heat under electric current flows through the state of electronic component 31.Yet even do not have the thermal radiation unit, the temperature rise of electronic component 31 is still very little.In other words, electronic component 31 temperature keep stable basically, the maximum temperature that its temperature keeps operate as normal to reach far below electronic component 31.
Here, the electronic unit 32 of heating refers to electronic unit 32 in Engine ECU 1 duration of work excessive heating, therefore if the thermal radiation unit is not provided, the possibility that the temperature of electronic unit 32 self surpasses maximum temperature (maximum temperature that electronic unit 32 keeps operate as normal to reach) is very high.The electronic unit 32 of heating may not only have power transistor, and also has other electronic unit, and for example electrical power is controlled used various semiconductors or the like.
Connector 5 be used for printed circuit board (PCB) 2 and external circuit for example the distribution (not shown) of the side of vehicle be connected, connector 5 is installed on printed circuit board (PCB) 2 places.As shown in Figure 2, connector 5 is made of housing 51 and stitch 52, and housing 51 is made by resin or the like, and stitch 52 is made by electric conducting material.One end of stitch 52 is attached to (for example by welding) on the printed circuit board (PCB) 2, and the other end of stitch 52 remains in the housing 51.
Shell 4 is made by resin or the like, and it is molded into printed circuit board (PCB) 2, all part that is installed on printed circuit board (PCB) 2 places of circuit element and connector 5 is sealed in the resin.Circuit element comprises the electronic unit 32 (for example power transistor) of electronic component 31 and heating.
In other words, the printed circuit board (PCB) 2 that electronic component 31, power transistor 32 and connector 5 have been installed is held in the pre-position of the cavity of the mould that is used for molding outer casing 4, then by utilizing resin to embed the molded shell 4 that constructs.
After molded the finishing of shell 4, printed circuit board (PCB) 2 and be installed on the electronic component 31 at printed circuit board (PCB) 2 places and power transistor 32 is embedded fully and constituted in the resin of shell 4.Will exposing from shell 4 with the connector (not shown) engaging portion at the distribution place that is installed on vehicular sideview of connector 5 is in the then complete embedded resin of its other parts.Like this, the circuit in the housing 4 is just by fully (airtightly) sealing, therefore just makes Engine ECU 1 waterproof fully.
According to first embodiment, the resin material that constitutes shell 4 for example can be for example epoxy resin or the like of thermosetting resin.Under shell 4 situation molded by mould by thermosetting resin, the temperature of mould will be configured to be suitable for the sclerous reaction of thermosetting resin.Shell 4 carries out molded under printed circuit board (PCB) 2 is inserted into situation in the mould, and connector 5, electronic component 31 and power transistor 32 have been installed on the printed circuit board (PCB) 2.
Therefore, it is abundantly lower than the fusing point of scolder that is used for connector 5, electronic component 31 and power transistor 32 are installed on printed circuit board (PCB) 2 places just to require the required temperature of the sclerous reaction of resin material.In the present embodiment, use resin material to construct shell 4 with sclerous reaction that meets this requirement temperature required (sclerous reaction temperature).Because the fusing point of scolder is approximately 240 ℃, so use epoxy resin to be used as constructing the resin material of shell 4 with about 170 ℃ of sclerous reaction temperature.
Usually, Engine ECU 1 is installed in the enging cabin of vehicle.According to first embodiment, structure forms the shell 4 of Engine ECU 1, so the reliability of Engine ECU 1 is improved by the epoxy resin with superior heat resistance and higher mechanical strength (for thermosetting resin).
According to first embodiment, except epoxy resin, shell 4 also can be configured to by other thermosetting resin, and condition is the fusing point that the sclerous reaction temperature of thermosetting resin is lower than scolder.
As shown in figs. 1 and 2, shell 4 has position and the corresponding thermal radiation part of power transistor 32 (electronic unit of heating).For instance, thermal radiation part can be configured to by a plurality of thermal radiation fin 41, and each all extend out to the outside of shell 4 so that have roughly thin sheet form in them.Thermal radiation fin 41 can be provided with in parallel with each other with respect to the direction with the Surface Vertical of thermal radiation fin 41.In other words, thermal radiation part can have and for example roughly sieves shape.
Thermal radiation fin 41 is Unitarily molded with shell 4.The heat that is produced by power transistor 32 is sent to shell 4 by the part that contacts with shell 4 from power transistor 32, and the outer surface from thermal radiation fin 41 is radiated to air then.Therefore, the heat that is produced by power transistor 32 can be radiated to the outside of shell 4 expeditiously, so the temperature of power transistor 32 can remain in the preset range of power transistor operate as normal basically.
In this case, the area of setting thermal radiation fin 41, thickness, quantity or the like are so that make the temperature of power transistor 32 remain in the preset range basically.
Referring to Fig. 1, it is the external perspective view that shows Engine ECU 1, shell 4 has at least one attachment member 42 (for example, being total up to two in Fig. 1), and attachment member 42 is used for shell 4 is fixed in for example enging cabin (not shown) of vehicle of miscellaneous equipment.Attachment member 42 can be by constituting with the Unitarily molded carriage of shell 4.
Referring to Fig. 1 and 3, carriage 42 has and is essentially columnar packing ring 43, and this packing ring 43 forms one by embedding molded with carriage 43.Packing ring 43 can be made of pipe, this pipe by metal for example iron make.Shell 4 utilizes bolt (not shown) or the like to be fixed on the enging cabin (not shown) by the screw fastening means, and this bolt passes the perforation 43a that is limited by packing ring 43 and inserts.In this case, the screw axial force major part that produces owing to the screw fastening means all puts on the packing ring 43 that is fabricated from iron, and therefore can prevent that too much power from putting on the shell 4 that is formed from a resin.
As mentioned above, according to first embodiment, the part that is installed on printed circuit board (PCB) 2 places that the shell 4 of Engine ECU 1 is molded into printed circuit board (PCB) 2, entire circuit member 31 and power transistor 32 and connector 5 is sealed in the resin.In other words, be held at the printed circuit board (PCB) 2 that electronic component 31, power transistor 32 and connector 5 are installed under the situation of pre-position of the mould that is used for molding outer casing 4, shell 4 embeds molded by resin.
Therefore, by carrying out single embedding molding process, the process and being used for that is used for molding outer casing 4 is installed on printed circuit board (PCB) 2 process of shell 4 and just can finishes simultaneously, in this embedding molding process, be inserted under the situation of the mould that is used for molding outer casing 4 at printed circuit board (PCB) 2 (electronic component 31, power transistor 32 and connector 5 have been installed), by resin molded shell 4.Therefore, just can significantly reduce the member of formation quantity and the assembling amount of labour of Engine ECU 1.
And according to first embodiment, printed circuit board (PCB) 2 just is embedded in the resin material that constitutes shell 4 fully with electronic component 31 that is installed on printed circuit board (PCB) 2 places and power transistor 32.Therefore, the electronic circuit in the shell 4 is just sealed fully, therefore just can prevent that foreign substance such as water and dust from entering Engine ECU 1.Therefore, fault (inefficacy) that just can limiting engine ECU1 or the like.
And, because printed circuit board (PCB) 2 (circuit board) is sealed in the resin material of shell 4, so just can limit relative motion between printed circuit board (PCB) 2 and the shell 4.During excited vibration, just may cause relative motion owing to for example be passed to its engine luggine when Engine ECU 1.Therefore, because the abnormal sound (noise) that relative motion or the like causes just is subjected to remarkable restriction simultaneously.On the contrary, in the conventional type electronic circuit apparatus, when the electronic circuit apparatus excited vibration, because the relative motion between circuit board and the shell will produce noise.
According to the present invention, first embodiment can provide following this Engine ECU 1, wherein can limit because the vibration of Engine ECU 1 and the infringement that circuit element is caused and the noise of generation, and can not increase the member of formation quantity of Engine ECU 1.
Consider the noise resistance performance, regulate operating characteristics or the like, usually Engine ECU 1 is arranged at the position that is positioned as close to engine, for example in the enging cabin, temperature is very high and vibration Engine ECU 1 is serious as electronic circuit apparatus here.
According to first embodiment, Engine ECU 1 has the shell 4 that is made of epoxy resin (for thermosetting resin), so the heat resistance of shell 4 and mechanical strength just can be improved.Therefore, the unfailing performance of Engine ECU 1 accesses improvement.
And according to first embodiment, Engine ECU 1 has the thermal radiation part that is configured to by thermal radiation fin 41, and each all extend out to the outside of shell 4 so that have thin sheet form roughly and so in the thermal radiation fin 41.The thermal radiation part is Unitarily molded with shell 4, and is arranged at and corresponding position, the position of power transistor 32, and therefore the heat that is produced by power transistor 32 just can be radiated to the outside of shell 4 expeditiously.Therefore, the temperature of power transistor 32 can remain in basically power transistor 32 can the preset range of operate as normal in.
[second embodiment]
Be described referring now to Fig. 4-6 pair second embodiment of the present invention.In this case, shell 4 has at least one thermal radiation unit 6, but not Unitarily molded with shell 4 as described in the first embodiment thermal radiation fin 41.
According to second embodiment, as shown in Figure 4, thermal radiation unit 6 is made of panel material, this panel material by metal for example aluminium or the like make so that have good thermal conductivity.For instance, by drawing method, thermal radiation unit 6 has the shape shown in Fig. 6.
Thermal radiation unit 6 comprises that at least one is used for the thermal radiation fin 61 of radiations heat energy (for example Fig. 4 and 6 is total up to two) and a pair of being used for is fixed in clamping part 62 on the power transistor 32 with thermal radiation unit 6.Clamping part 62 clamps power transistor 32 so that making thermal radiation unit 6 be fixed is attached on the power transistor 32, and power transistor is installed on printed circuit board (PCB) 2 places.
Thermal radiation fin 61 separates manufacturing with the molding process of shell 4, is the element that is different from shell 4.On the contrary, the thermal radiation fin 41 among first embodiment when molding outer casing 4 and shell 4 integrally molded.
In this case, preferably, thermal radiation unit 6 closely contacts with power transistor 32 so that make the heat that is produced by power transistor 32 to be passed to thermal radiation unit 6 expeditiously.Thermal radiation gel, thermal radiation grease or the like can be arranged between power transistor 32 and the thermal radiation unit 6, so that improve the heat transmission from power transistor 32 thermotropism radiating elements 6.
In a second embodiment, be installed on after printed circuit board (PCB) 2 places and thermal radiation unit 6 be fixed on the power transistor 32 at electronic component 31, power transistor 32 and connector 5, be inserted into the situation lower mould shell 4 of the mould that is used for molding outer casing 4 at printed circuit board (PCB) 2.After molded shell 4, the part of thermal radiation unit 6, the major part of thermal radiation fin 61 is exposed to the outside of shell 4 in particular.
Therefore, according to second embodiment, Engine ECU 1 can have and is similar to those effects described in first embodiment.In other words, the member of formation quantity of the Engine ECU 1 and amount of labour is installed can significantly reduces, and can limit because the vibration of Engine ECU 1 and the infringement that circuit element is caused and the noise of generation.
And, because Engine ECU 1 has thermal radiation unit 6, so just can further improve radiation effects to the heat that produces by power transistor 32.Therefore, the temperature of power transistor 32 can remain in basically power transistor can the preset range of operate as normal in.
[other embodiment]
For instance, Engine ECU 1 (electronic circuit apparatus) can both have the thermal radiation fin 41 Unitarily molded with shell 4, had again as the thermal radiation fin 61 that is different from the element of shell 4.
And except thermosetting resin (for example epoxy resin), shell 4 also can be made by for example meeting other resin of the environment for use condition of electronic circuit apparatus.For example, shell 4 can be made by thermoplastic resin.In this case, the temperature that sets for soften resin in the process of molding outer casing 4 (resin softening temperature) is lower than the fusing point of scolder that is used for connector 5, electronic component 31 and power transistor 32 are installed on printed circuit board (PCB) 2 places.
In addition, the present invention is also applicable to the electronic circuit apparatus except Engine ECU 1.Electronic circuit apparatus can also be installed on except vehicle other the device on.

Claims (14)

1. an electronic circuit apparatus (1) comprising:
The circuit board (2) of at least one circuit element (31,32) is installed;
Be installed on circuit board (2) and sentence the connector (5) that circuit board (2) is connected with external circuit; And
The shell that is formed from a resin (4) is characterized in that
Shell (4) is molded into whole being sealed in the resin with the part of connector (5) and circuit board (2) and circuit element (31,32).
2. electronic circuit apparatus according to claim 1 (1), wherein:
Circuit element (31,32) comprises the electronic unit (32) of heating; And
Shell (4) has thermal radiation part (41), and it is protruding and be arranged at and the corresponding position, position of electronic unit (32) from shell (4).
3. electronic circuit apparatus according to claim 1 (1) also comprises
Thermal radiation unit (6), wherein:
Circuit element (31,32) comprises the electronic unit (32) of heating; And
Thermal radiation unit (6) is attached to circuit board (2) and goes up so that make heat to be passed to thermal radiation unit (6) from electronic unit (32); And
The part of thermal radiation unit (6) is exposed to the outside of shell (4).
4. according to each described electronic circuit apparatus (1) among the claim 1-3, wherein shell (4) has at least one and is used for shell (4) is fixed in attachment portion (42) on the miscellaneous equipment.
5. electronic circuit apparatus according to claim 2 (1), wherein thermal radiation partly comprises at least one thermal radiation fin (41), it has the shape that is essentially flat.
6. electronic circuit apparatus according to claim 5 (1), wherein thermal radiation fin (41) is with respect to parallel to each other with the direction of the Surface Vertical of thermal radiation fin (41).
7. electronic circuit apparatus according to claim 3 (1), wherein thermal radiation unit (6) comprise thermal radiation fin (61) and a pair of clamping part (62) that at least one is used for radiations heat energy, described clamping part (62) clamp electronic unit (32) in case with thermal radiation unit (6) attachment on electronic unit (32).
8. electronic circuit apparatus according to claim 7 (1), wherein thermal radiation unit (6) panel material of being made of metal constitutes.
9. electronic circuit apparatus according to claim 8 (1), wherein thermal radiation unit (6) are made of aluminum.
10. electronic circuit apparatus according to claim 4 (1), wherein:
Attachment portion is the carriage (42) Unitarily molded with shell (4); And
Carriage (42) has packing ring (43), and described packing ring (43) is made of metal and embeds and is overmolded in the carriage (42).
11. according to each described electronic circuit apparatus (1) among claim 1-3 and the 5-10, wherein
Shell (4) is made by the thermosetting resin with the sclerous reaction temperature that is lower than the scolder fusing point, and circuit element (31,32) and connector (5) are installed on circuit board (2) by scolder and locate.
12. electronic circuit apparatus according to claim 11 (1), wherein shell (4) is made by epoxy resin.
13. according to each described electronic circuit apparatus (1) among claim 1-3 and the 5-10, wherein
Shell (4) is made by the thermoplastic resin with the resin softening temperature that is lower than the scolder fusing point, and circuit element (31,32) and connector (5) are installed on circuit board (2) by scolder and locate.
14. according to each described electronic circuit apparatus (1) in claim 1-3,5-10 and 12, wherein
Be held at the circuit board (2) that circuit element (31,32) and connector (5) are installed under the situation of pre-position of the mould that is used for molding outer casing (4), shell (4) embeds molded forming by resin.
CNB2006100737969A 2005-04-19 2006-04-19 Electronic circuit apparatus Expired - Fee Related CN100556255C (en)

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KR20060110228A (en) 2006-10-24
CN100556255C (en) 2009-10-28
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US20060250756A1 (en) 2006-11-09
US7495183B2 (en) 2009-02-24
DE102006018457A1 (en) 2006-11-02

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