CN1849060A - Electronic assembly mounting device - Google Patents
Electronic assembly mounting device Download PDFInfo
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- CN1849060A CN1849060A CN 200610072636 CN200610072636A CN1849060A CN 1849060 A CN1849060 A CN 1849060A CN 200610072636 CN200610072636 CN 200610072636 CN 200610072636 A CN200610072636 A CN 200610072636A CN 1849060 A CN1849060 A CN 1849060A
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Abstract
The present invention provides an electronic component mounting apparatus with which erroneous adsorption of an electronic component is detected reliably with an inexpensive apparatus.The electronic component mounting apparatus is provided with an optical sensor (19) provided at a mounting head and consisting of a projector and a light receiver, a flow rate sensor(16) arranged at an air suction path connecting a suction nozzle with a vacuum generator, and a control means for making control for mounting the electronic component adsorbed by the suction nozzle on a substrate. The control means is provided with a process of obtaining height data of the sucked electronic component by the optical sensor, a process of measuring an air flow rate by the flow rate sensor(16), a comparing process of comparing measured values of them with a set value set in advance, and a judgment process of judging the presence/absence of suction of the electronic part based on the comparing process and judging propriety of an suction posture.
Description
Technical field
The present invention relates to a kind of electronic component mounting apparatus, it is by being arranged on adsorption mouth on the installation head and coming the attract electrons parts and attach it on the substrate, particularly a kind of electronic component mounting apparatus of absorption mistake that can detection electronics.
Background technology
In the past, adsorbed state as the identification electronic unit also detects the wrong electronic component mounting apparatus of absorption, and known have Japan to specially permit No. 3038905 (patent documentation 1), Japan's special permission No. 3269041 (patent documentation 2), TOHKEMY 2003-133791 number (patent documentation 3).
Electronic component mounting apparatus in the patent documentation 1 has the one dimension optical sensor that is made of the multi-strip scanning line, and this one dimension transducer setting and makes light-projecting portion and light accepting part opposed in vertical direction.And this electronic component mounting apparatus makes adsorbed electronic unit move in the mode of the scan line that crosses above-mentioned one dimension optical sensor, thus the two-dimensional image information of electron gain parts.
Electronic component mounting apparatus in the patent documentation 2 is measured the flow of suction air by flow sensor, and the design discharge of this actual flow with storage in advance compared, to detect adsorption mouth obstruction etc.
Electronic component mounting apparatus in the patent documentation 3 is measured the flow of suction air by flow sensor, and the design discharge of this actual flow with storage in advance compared, and has or not the quality of attract electrons parts or adsorbed state with detection.
Patent documentation 1: No. 3038905, Japan's special permission
Patent documentation 2: No. 3269041, Japan's special permission
Patent documentation 3: TOHKEMY 2003-133791 number
But the device in the patent documentation 1 in order to obtain two-dimensional image information, needs the processing time, and the price of device is also relatively more expensive.
Owing to only detect the quality that has or not attract electrons parts or adsorbed state by flow sensor, therefore under situations such as the increase and decrease that detects flow is small, there is the problem of poor reliability in device in the patent documentation 2,3.And, also have the problem that can't detect the horizontal absorption mistake upright or that tiltedly stand of parts reliably.
Summary of the invention
The present invention proposes in order to address the above problem, and its purpose is, a kind of cheap electronic component mounting apparatus is provided, and it can detect the absorption mistake of electronic unit reliably.
And its purpose also is, can detect the absorption mistake of electronic unit at short notice.
And, the present invention also aims to, duct member is not horizontal state such as upright or tiltedly upright, can both detect the absorption mistake reliably.
In order to address the above problem, a first aspect of the present invention is a kind of electronic component mounting apparatus, comprising: adsorption mouth 10, and it is used for the attract electrons parts; Move up and down unit 13, it is used to make above-mentioned adsorption mouth to move up and down; Installation head 7, but it keeps above-mentioned adsorption mouth and along continuous straight runs to move; Optical sensor 19,25,27,28, it is arranged on the above-mentioned installation head, is made of light-projecting portion and light accepting part; Flow sensor 16, it is configured in the air suction channel that connects above-mentioned adsorption mouth and device for vacuum generation; Control unit, its electronic unit that carries out being adsorbed by above-mentioned adsorption mouth is installed to the control on the substrate.
Above-mentioned control unit comprises following operation: the operation that obtains the altitude information of adsorbed electronic unit by above-mentioned optical sensor; Measure the operation of air mass flow by above-mentioned flow sensor; The comparison operation that measured value and predefined set point are compared; And the judgement operation, this operation is according to above-mentioned relatively operation, judge have or not the attract electrons parts with and the quality of absorption attitude.
A second aspect of the present invention, in the electronic component mounting apparatus of a first aspect of the present invention, above-mentioned control unit passes through the comparison to the altitude information of above-mentioned electronic unit, judge that electronic unit is in not absorption, horizontal upright and upright state, and, judge that electronic unit is in normal sorption and tiltedly upright state by comparison to above-mentioned air mass flow data.
A third aspect of the present invention, in the electronic component mounting apparatus of a first aspect of the present invention, second aspect, above-mentioned control unit is before the absorption of above-mentioned electronic unit and after the absorption, carry out the measurement with air mass flow of obtaining of altitude information, thus judge electronic unit fetch or the adsorption mouth of adsorption mouth is blocked.
The electronic component mounting apparatus of a fourth aspect of the present invention comprises: adsorption mouth 10, and it is used for the attract electrons parts; Move up and down unit 13, it is used to make above-mentioned adsorption mouth to move up and down; Installation head 7, but it keeps above-mentioned adsorption mouth and along continuous straight runs to move; Optical sensor 25, it is arranged on the above-mentioned installation head, is made of light-projecting portion and light accepting part; Control unit, its electronic unit that carries out being adsorbed by above-mentioned adsorption mouth is installed to the control on the substrate, this electronic component mounting apparatus has following structure: above-mentioned optical sensor has the detection range bigger than the shading area of the electronic unit of normal sorption, and the output valve of this optical sensor is variable according to the light income of its light accepting part, and, above-mentioned control unit comprises: measure operation, this operation is passed through above-mentioned optical sensor to adsorbed electronic unit irradiates light, and obtains output valve according to its light income; Judge operation, output valve and predefined set point that this operation will obtain in above-mentioned measurement operation compare, thus judge have or not the above-mentioned electronic unit of absorption with and adsorb the quality of attitude.
A fifth aspect of the present invention in the electronic component mounting apparatus of a fourth aspect of the present invention, has changing cell 22,29,30, and it can change the detection range of above-mentioned optical sensor according to the shape of above-mentioned electronic unit.
According to a first aspect of the invention, can reliably and at short notice detect the absorption mistake of electronic unit by cheap device.
According to a second aspect of the invention, can detect horizontal upright, the oblique absorption mistake such as upright of electronic unit reliably.
According to a third aspect of the invention we, can detect reliably electronic unit fetch or the adsorption mouth of adsorption mouth is blocked.
According to fourth, fifth aspect of the present invention, can in the shorter time, detect the absorption mistake of electronic unit.
Description of drawings
Fig. 1 is the stereogram of summary of the electronic component mounting apparatus of expression first execution mode.
Fig. 2 is the amplification stereogram of the installation head of first execution mode.
Fig. 3 is the stereogram of the configuration of expression adsorption mouth of first execution mode and flow sensor.
Fig. 4 is the flow chart of first execution mode.
Fig. 5 is the flow chart of first execution mode.
Fig. 6 is the front view of adsorbed state of the electronic unit of expression first execution mode.
Fig. 7 is the stereogram of the photoelectric sensor (optical sensor) of second execution mode.
Fig. 8 is the key diagram of the situation of carrying out electronic unit identification of second execution mode.
Fig. 9 is the transducer output of expression second execution mode and the key diagram of the relation of shading area.
Figure 10 is the amplification stereogram of the installation head of other execution modes.
Figure 11 is the details drawing of the adsorption mouth front end of other execution modes.
Figure 12 is the amplification stereogram of the installation head of other execution modes.
Label declaration
10: adsorption mouth; 13:Z axle motor (moving up and down the unit); 7: installation head; 19: photoelectric sensor (optical sensor); 16: flow sensor; 25: optical sensor; 27: optical sensor; 28: optical sensor; 22: slit spare (changing cell); 29: changing cell; 30: changing cell.
Embodiment
According to Fig. 1 to Fig. 6 first execution mode of the present invention is described.
Electronic component mounting apparatus is provided with a pair of feed track 2 on the directions X of the central portion of base station 1.Feed track 2 is carried the substrate 3 that is used to install electronic unit along directions X.And, be provided with not shown substrate maintaining part in the upper end of feed track 2.This substrate maintaining part is the device that institute's substrate conveying 3 is kept and is positioned at assigned position.
Dispose the supply unit 4 of electronic unit in the both sides of feed track 2.On each supply unit 4, be set side by side with a plurality of tape feeders 5.Tape feeder 5 supportings contain the band of electronic unit, and this band of stepping feeding (the ピ Star チ send り) is to supply with electronic unit.
At the both ends of base station 1 upper surface, on the Y direction, be provided with a pair of Y-axis framework 8.Y-axis framework 8 upper supports there are the both ends of X-axis framework 6 at this.On Y-axis framework 8, be provided with y-axis shift moving cell by means of not shown motor and driving-belt etc.When driving the y-axis shift moving cell, X-axis framework 6 moves horizontally along the Y direction.
On X-axis framework 6, be provided with installation head 7.On X-axis framework 6, be provided with X-axis mobile unit by means of not shown motor and driving-belt etc.When driving the X-axis mobile unit, installation head 7 moves along directions X.
Between the feed track 2 of the upper surface of base station 1 and supply unit 4, dispose video camera 9.Video camera 9 is configured to the mobile route of installation head 7 opposed.And video camera 9 is taken installation head 7 or adsorption mouth 10 from the below, with the identification electronic unit, thereby detects its offset.
Next, with reference to Fig. 2, the structure of installation head 7 is described.
Installation head 7 is compound installation head, is made of four groups of installation head 7a of unit.On constituent parts installation head 7a, be provided with suction nozzle shaft 11 along above-below direction.In the upper end of this suction nozzle shaft 11, be connected with the θ axle motor 12 of drive.When θ axle motor 12 rotated, suction nozzle shaft 11 was that rotate at the center with its axle center.
And suction nozzle shaft 11 is connected with the Z axle motor 13 that conduct moves up and down the unit by not shown gear, and when driving Z axle motor 13, suction nozzle shaft 11 moves up and down.End in each suction nozzle shaft 11 is equipped with adsorption mouth 10.
In the lower end side of adsorption mouth 10, on each installation head 7a of unit, be provided with 18 that constitute by light projector 17 and light-receiving device, as the photoelectric sensor 19 of optical sensor.
The light projector 17 and the light-receiving device 18 of photoelectric sensor 19 are installed in respectively on the installation head 7, and configuration point-blank, so that make the light that sends from light projector 17 can incide light-receiving device 18.In addition, photoelectric sensor 19 is to put luminous point type photoelectric sensor, and its optical axis can intersect with the lower end side of adsorption mouth 10.On installation head 7, dispose not shown substrate identification video camera, installation head 7 is moved, by taking base plate mark, the position of the substrate that discerning is positioned keeps with this substrate identification video camera.
Below, with reference to Fig. 3, the aspirating mechanism that is attached on the adsorption mouth 10 is described.
Next, the not shown controller (control unit) of control electronic component mounting apparatus is described.
Controller comprises: the microcomputer of control device integral body (CPU), RAM, ROM or flash memory.In these memories,, store altitude information or air mass flow data as predefined design load by each electronic unit.
And, on controller, be connected with: the motor of the motor of X-axis mobile unit, y-axis shift moving cell, θ axle motor 12, Z axle motor 13, photoelectric sensor 19, device for vacuum generation 15, flow sensor 16 etc.
Below, with reference to Fig. 4, Fig. 5, Fig. 6, the step of the adsorbed state of detection electronics is described.
By carrying out following action as the controller of control unit.
When the installation action of electronic unit begins, at first, substrate 3 to be moved on the feed track 2, substrate 3 is carried along directions X.Then, by not shown substrate maintaining part, substrate 3 location are remained on (S1) on the assigned position.
Afterwards, installation head 7 is moved, take base plate mark, with the be positioned position (S2) of the substrate that keeps of identification by not shown substrate identification video camera.
Next, make installation head 7 move (S3) towards supply unit 4.
Then, in the process that supply unit 4 moves, drive Z axle motor 13 in installation head 7 at the adsorption mouth 10 that does not have the attract electrons parts.Then, suction nozzle shaft 11 is descended gradually, under the output valve of photoelectric sensor 19 situation jumpy, from the encoder output Z axle height at this moment of Z axle motor 13.This Z axle height as Z0 the value of lower end (identification adsorption mouth), and is stored in the flash memory (S4).
Then, the adsorption mouth of the same type of previous use is measured, the Z0a value under the state of attract electrons parts not, compare with the Z0 value among the S4, poor at it | under the situation of Z0a-Z0| greater than set point, be judged to be unusual (electronic unit fetch etc.), and advance to S13, | under the situation of Z0a-Z0| in range of set value, advance to S6 (S5).
Then, in supply unit 4 moving process, drive device for vacuum generation 15 in installation head 7.And at the adsorption mouth 10 that does not have the attract electrons parts, use traffic transducer 16 is measured the flow of air suction channel.This air mass flow as F0, and is stored into (S6) in the flash memory.
Next, the adsorption mouth of the same type of previous use is measured, the F0a value under the state of attract electrons parts not, compare with the F0 value among the S7, poor at it | under the situation of F0a-F0| greater than set point, be judged to be unusual (adsorption mouth obstruction), and advance to S13, when | under the situation of F0a-F0| in range of set value, advance to S8 (S7).
Next, after installation head 7 moves to supply unit 4, adsorption mouth 10 is descended, after adsorption mouth 10 attract electrons parts, make adsorption mouth 10 risings (S8).
Next, in S9, when adsorption mouth 10 is risen, under the output valve of photoelectric sensor 19 situation jumpy, from the encoder output Z axle height at this moment of Z axle motor 13.Highly is this Z axle to make Z1 (value of the lower surface that is adsorbed with electronic unit of identification adsorption mouth), and is stored in the flash memory (S9).
Next, in S10, when adsorption mouth 10 is risen, drive device for vacuum generation 15.And at the adsorption mouth 10 that is adsorbed with electronic unit, use traffic transducer 16 is measured the flow of air suction channel.This air mass flow as F1, and is stored in (S10) in the flash memory.
Then, according to the flow chart of Fig. 5, use previous Z0, Z1, F0, the F1 value of measuring to judge the adsorbed state (S11) of electronic unit.
At first, poor with Z axle altitude information | Z0-Z1| (electronic unit thickness data) with by the predefined value of each variety of components (set point: Zx～Zy) compare, | under the situation of Z0-Z1| less than set point, be judged to be not absorption, | under the situation of Z0-Z1| greater than set point, be judged to be the setting shown in horizontal upright, the Fig. 6 (c) shown in Fig. 6 (b), | under the situation in the scope of Z0-Z1| in set point, enter next step S11B (S11A).
In addition, the horizontal upright state shown in Fig. 6 (b) is meant such state: a side of adsorption mouth attract electrons parts is a benchmark with the bottom surface, and adsorption mouth is than the usual Δ Z1 that risen.In addition, the state of the setting shown in Fig. 6 (c) is meant such state: other sides of adsorption mouth attract electrons parts are benchmark with the bottom surface, and adsorption mouth is than the usual Δ Z2 that risen.
Then, with before the electronic unit absorption and the output of the flow sensor after the absorption poor | F0-F1| with by the predefined value of each variety of components (set point: Fx) compare, poor at it | under the situation of F0-F1| smaller or equal to set point, be judged to be tiltedly standing shown in Fig. 6 (d), | under the situation of F0-F1| greater than set point, be judged to be the normal sorption (S11B) shown in Fig. 6 (a).
Shown in Fig. 6 (d), so-called tiltedly upright state is meant, the bight of adsorption mouth attract electrons parts is roughly the same when altitude information and normal sorption.
Then, return Fig. 4, whether the judging part adsorbed state is normal.In above-mentioned steps, do not having under absorption, the horizontal situation of standing, erect, tiltedly standing, it is undesired to be judged as, and advances to S13, under the situation of normal sorption, advances to S14 (S12).
In S5 under the abnormal situation of Z0 or in S7 under the abnormal situation of F0 or in S12 under the situation that is not normal sorption, be judged as the absorption attitude bad horizontal upright, erect, tiltedly upright, absorption such as absorption is wrong, adsorption mouth is installed bad or adsorption mouth is selected bad etc.And, stop installation action, notify unusually to the operation people by alarm device, after fault processing finishes, advance to S3 (S13).
Then, under the situation of normal sorption, make installation head 7 move to video camera 9 opposed positions after, carry out the identification (S14) of adsorbed electronic unit.
Then,, move to the assigned position of substrate 3 and drive after θ axle motor 12 carries out the position adjustment, drive Z axle motor 13, electronic unit is installed to (S15) on the substrate 3 in installation head 7 according to recognition result.
Afterwards, judge whether the installation of all parts is finished, under uncompleted situation, get back to S3, under situation about having finished, finish installation action.
According to above-mentioned first execution mode, has following operation:, obtain the operation of the altitude information of adsorbed electronic unit by optical sensor 19; Measure the operation of air mass flow by above-mentioned flow sensor 16; The comparison operation that described measured value and predefined set point are compared; Judge operation, this operation is according to above-mentioned relatively operation, judge have or not the attract electrons parts with and the quality of absorption attitude.Therefore, can be reliably and detect the absorption mistake of electronic unit at short notice.
In addition, the comparison of the altitude information by above-mentioned electronic unit judges that electronic unit is in not absorption and horizontal upright state, by the comparison of above-mentioned air mass flow data, judges that electronic unit is in normal sorption and tiltedly founds state.Therefore, can detect the horizontal upright absorption mistake that waits of electronic unit reliably.
Below, according to Fig. 7, Fig. 8, Fig. 9, second execution mode of the present invention is described.
What use in second execution mode is the optical sensor dissimilar with first execution mode, and only the judgement to its structure and adsorbed state describes, and the explanation of omitting other.
Fig. 7 is the stereogram of simulation output type photoelectric sensor (optical sensor).Fig. 8 discerns the figure that the situation of electronic unit describes to the optical sensor that uses the type.Fig. 9 is illustrated in the transducer output under the situation of the optical sensor that uses the type and the key diagram of the relation between the shading area.
Simulation output type photoelectric sensor (optical sensor) 25 is made of light-projecting portion 21 and not shown light accepting part.Light-projecting portion 21 is made of light source and slit spare (slit) (changing cell) 22, and above-mentioned light source is made of light-emitting diode etc., and above-mentioned slit spare has the rectangle window, and this rectangle window is to form in order to be limited in from the light that light source sends on the optical axis 23.And, not shown light accepting part be subjected to optical range roughly consistent with the light projector scope 22a of light-projecting portion.In addition, the light-projecting portion 21 and the light accepting part 22 of photoelectric sensor 25 are separately fixed on the installation head 7, and configuration point-blank, so that the light that sends from the light projector of photoelectric sensor 25 can be incided the light-receiving device.
Light sends from the light-projecting portion of photoelectric sensor 25, and the scope that the window of window that connects the light projector side on straight line and sensitive side is formed is as detection range 22a.Shown in Fig. 8 (a), detection range 22a is configured to have the rectangle of the shape identical with the side of the electronic unit 20 of normal sorption, and its size is set for more bigger than electronic unit.And under the tiltedly upright situation of the setting of Fig. 8 (c), Fig. 8 (d), electronic unit is outstanding from detection range 22a, and light income increases, thereby transducer output increases.In addition, under the horizontal upright situation of Fig. 8 (b), though electronic unit is outstanding from detection range 22a, light income reduces, thereby transducer output reduces.On the other hand, under the situation that does not have the attract electrons parts, electronic unit covers the area of optical axis, and promptly the shading area is 0, and transducer is output as maximum Gmax.
Next, the action of second execution mode is described.
Second execution mode is compared with first execution mode, and the judgement operation of absorption measuring position and adsorbed state is different.This different part is described, and omit other explanation.
Below action is by carrying out as the controller of control unit.
When driving Z axle motor 13, the adsorption mouth 10 of attract electrons parts 20 rises.And, when above-mentioned adsorption mouth 10 moves to the upper end consistent location of light projector scope 22a of the lower end of adsorption mouth 10 and photoelectric sensor 25, from photoelectric sensor 25 irradiates lights.In addition, according to the adsorbed state (dead area) of electronic unit, the light income of the light accepting part of photoelectric sensor 25 changes, thereby the output valve of photoelectric sensor 25 changes.Be Gb when for example, the sensor output value during normal sorption is Ga, horizontal upright absorption, when erectting absorption be Gc, tiltedly be Gd during upright absorption, be Gmax when not adsorbing.
Then, (Ga ± 0.5V) compare, the Ga value that is judged to be in the scope of Gx～Gy is a normal sorption with the set point Gx～Gy that is set in advance in the normal sorption in the controller to measured value.And can judge: the Gb in the scope of Gx1～Gy1 is horizontal upright absorption; Gd in the scope of Gx2～Gy2 is tiltedly upright absorption, and the Gc in the scope of Gx3～Gy3 is for erectting absorption, and Gmax is not absorption.
Compare with first execution mode, second execution mode can be judged the quality that has or not adsorption element and absorption attitude by adsorption mouth 10 is set in specified altitude, can shorten recognition time.And, in second execution mode, can change slit spare 22, thereby can change detection range 22a according to the shape of adsorbed electronic unit as changing cell.
In addition, in second execution mode, because have a plurality of light income set points, normal sorption setting range, erect adsorption range, horizontal upright adsorption range, tiltedly upright adsorption range, do not adsorb the setting range scope, therefore can in the shorter time, detect the normal sorption of electronic unit, horizontal upright absorption, erect absorption, tiltedly upright absorption, absorption mistake such as absorption.
The present invention is not limited to above-mentioned execution mode, can carry out various changes.
For example, in the first embodiment,, judge fetching of electronic unit by Z axle altitude information Z0 and Z0a under the state that does not have the attract electrons parts are compared.Replace this method, can easily expect following method: Z axle altitude information Z1 under the state of attract electrons parts and previous Z axle altitude information Z1a are compared, under the very big situation of data difference, be judged to be electronic unit and be retrieved.
In addition, in the first embodiment,, judge the obstruction of adsorption mouth by air mass flow F0 under the state that does not have the attract electrons parts and F0a are compared.Replace this method, can easily expect following method: an air mass flow F1 under the state of attract electrons parts and a preceding air mass flow F1a are compared, under the very big situation of data difference, be judged to be adsorption mouth and block.
And, can also easily expect: do not have under the situation of very big difference at Z1 and Z1a, F1 and F1a result relatively,, carry out next installation action being stored in after value in the flash memory covers respectively and preserve.
In addition, in the above-described embodiment, optical sensor 19,25 is arranged on each adsorption mouth, replace this method, can also easily expect following method: as shown in figure 10, one group of optical sensor 28,29 is set, make each Z axle motor 13 lifting, to discern the electronic unit that is adsorbed individually.
And the shape of the light projector scope 22a of second execution mode is not limited to rectangle, can carry out various changes.For example, as shown in figure 11, under the detection range situation excessive or too small, as shown in figure 12, can use the changing cell of variable detection range than adsorbed electronic unit.
This changing cell is made of a pair of shadow shield 29,30 that is provided with a plurality of slits.Also can easily expect following method:, this shadow shield 29,30 is rotated, so that can obtain optimum detection scope 22a according to the size of electronic unit.In addition, also can easily expect following method: under the situation of having dwindled detection range, improve the gain amplifier of optical sensor; Under the situation that has increased detection range, reduce the gain amplifier of optical sensor, so that detection sensitivity the best.
And, in second execution mode, have a plurality of light income set points, normal sorption setting range, erect adsorption range, horizontal upright adsorption range, tiltedly upright adsorption range, do not adsorb the setting range scope, but replace them, can easily expect setting for normal sorption setting range and absorption error range in addition.
And, can also easily expect: the optical sensor that uses second execution mode in the first embodiment.
In addition,, under the wrong situation of absorption, parts are cancelled, perhaps under the situation that adsorption mouth is blocked, can carry out the cleaning of adsorption mouth or the filter in the replacing suction nozzle shaft etc. about the fault processing of above-mentioned execution mode.
Claims (5)
1. electronic component mounting apparatus comprises: adsorption mouth, and it is used for the attract electrons parts; Move up and down the unit, it is used to make above-mentioned adsorption mouth to move up and down; Installation head, but it keeps above-mentioned adsorption mouth and along continuous straight runs to move; Optical sensor, it is arranged on the above-mentioned installation head, is made of light-projecting portion and light accepting part; Flow sensor, it is configured in the air suction channel that connects above-mentioned adsorption mouth and device for vacuum generation; Control unit, its electronic unit that carries out being adsorbed by above-mentioned adsorption mouth is installed to the control on the substrate, it is characterized in that,
Above-mentioned control unit comprises: the operation that obtains the altitude information of adsorbed electronic unit by above-mentioned optical sensor; Measure the operation of air mass flow by above-mentioned flow sensor; The comparison operation that measured value and predefined set point are compared; And the judgement operation, this operation is according to above-mentioned relatively operation, judge have or not the attract electrons parts with and the quality of absorption attitude.
2. electronic component mounting apparatus according to claim 1 is characterized in that,
Above-mentioned control unit passes through the comparison to the altitude information of above-mentioned electronic unit, judge electronic unit be in do not have absorption, the horizontal upright and state erect, and, judge that electronic unit is in normal sorption and tiltedly upright state by comparison to above-mentioned air mass flow data.
3. electronic component mounting apparatus according to claim 1 and 2 is characterized in that,
Above-mentioned control unit is before the absorption of above-mentioned electronic unit and after the absorption, carry out to obtain the operation of altitude information and measure the operation of air mass flow, thereby judge electronic unit fetch or the adsorption mouth of adsorption mouth is blocked.
4. electronic component mounting apparatus comprises: adsorption mouth, and it is used for the attract electrons parts; Move up and down the unit, it is used to make above-mentioned adsorption mouth to move up and down; Installation head, but it keeps above-mentioned adsorption mouth and along continuous straight runs to move; Optical sensor, it is arranged on the above-mentioned installation head, is made of light-projecting portion and light accepting part; Control unit, its electronic unit that carries out being adsorbed by above-mentioned adsorption mouth is installed to the control on the substrate, it is characterized in that,
Above-mentioned optical sensor has the detection range bigger than the shading area of the electronic unit of normal sorption, and the output valve of this optical sensor is variable according to the light income of its light accepting part;
And above-mentioned control unit comprises: measure operation, this operation is passed through above-mentioned optical sensor to adsorbed electronic unit irradiates light, and obtains output valve according to its light income; Judge operation, output valve and predefined set point that this operation will obtain in above-mentioned measurement operation compare, thus judge have or not the above-mentioned electronic unit of absorption with and adsorb the quality of attitude.
5. electronic component mounting apparatus according to claim 4 is characterized in that,
Have changing cell, it can change the detection range of above-mentioned optical sensor according to the shape of above-mentioned electronic unit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005108278A JP4634204B2 (en) | 2005-04-05 | 2005-04-05 | Electronic component mounting equipment |
| JP2005108278 | 2005-04-05 | ||
| JP2005-108278 | 2005-04-05 |
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| CN1849060A true CN1849060A (en) | 2006-10-18 |
| CN1849060B CN1849060B (en) | 2010-09-08 |
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| CN2006100726362A Expired - Fee Related CN1849060B (en) | 2005-04-05 | 2006-04-05 | Electronic assembly mounting device |
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| JP4023851B2 (en) * | 1996-06-27 | 2007-12-19 | 松下電器産業株式会社 | Electronic component mounting method |
| JP3269041B2 (en) * | 1999-02-23 | 2002-03-25 | 三洋電機株式会社 | Nozzle clogging detection device |
| EP1269813B1 (en) * | 2000-03-28 | 2007-05-30 | Siemens Aktiengesellschaft | Method and device for monitoring electric components in a pick-and-place device for substrates |
| JP2001291998A (en) * | 2000-04-06 | 2001-10-19 | Mitsubishi Electric Corp | Component mounter and method for detecting attitude of component |
| JP3846257B2 (en) * | 2001-10-25 | 2006-11-15 | 松下電器産業株式会社 | Pickup method in electronic component mounting apparatus |
| JP2003142888A (en) * | 2001-11-02 | 2003-05-16 | Matsushita Electric Ind Co Ltd | Electronic part mounting system and method therefor |
-
2005
- 2005-04-05 JP JP2005108278A patent/JP4634204B2/en not_active Expired - Fee Related
-
2006
- 2006-04-05 CN CN2006100726362A patent/CN1849060B/en not_active Expired - Fee Related
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| CN101378648B (en) * | 2007-08-30 | 2012-09-05 | Juki株式会社 | Method for inspecting adsorption component in component mounting device |
| CN104054411A (en) * | 2012-01-19 | 2014-09-17 | 富士机械制造株式会社 | Suction nozzle and abnormality detection device thereof |
| CN104054411B (en) * | 2012-01-19 | 2016-09-28 | 富士机械制造株式会社 | Suction nozzle and abnormal detector thereof |
| CN107450011A (en) * | 2016-06-01 | 2017-12-08 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| CN107450011B (en) * | 2016-06-01 | 2020-04-24 | 精工爱普生株式会社 | Electronic component conveying device and electronic component inspection device |
| JP2018006417A (en) * | 2016-06-28 | 2018-01-11 | 富士機械製造株式会社 | Determination device |
| CN113498315A (en) * | 2020-04-06 | 2021-10-12 | 株式会社富士 | Carrier tape determination device |
| CN113498315B (en) * | 2020-04-06 | 2023-02-14 | 株式会社富士 | Carrier tape determination device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4634204B2 (en) | 2011-02-16 |
| CN1849060B (en) | 2010-09-08 |
| JP2006287143A (en) | 2006-10-19 |
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