CN1845811A - Method for operating a gas laser system - Google Patents

Method for operating a gas laser system Download PDF

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Publication number
CN1845811A
CN1845811A CNA2004800246788A CN200480024678A CN1845811A CN 1845811 A CN1845811 A CN 1845811A CN A2004800246788 A CNA2004800246788 A CN A2004800246788A CN 200480024678 A CN200480024678 A CN 200480024678A CN 1845811 A CN1845811 A CN 1845811A
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CN
China
Prior art keywords
pulse
laser
high frequency
resonator
interval
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Pending
Application number
CNA2004800246788A
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Chinese (zh)
Inventor
亚历山大·希尔托
汉斯·J·梅尔
彼得拉·米青内克
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Via Mechanics Ltd
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Hitachi Via Mechanics Ltd
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Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1845811A publication Critical patent/CN1845811A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)

Abstract

The invention relates to a method for operating a gas laser system, especially with a CO2 laser. Predetermined pulse sequences (LPF1, LPF2, LPF3) are directed in a working phase (APH1, APH2, APH3) to a determined processing point of a substrate, and then laser deflection is adjusted onto the next working point in a transfer phase (SPH1, SPH2). High frequency pump energy (RF) is applied to the laser resonator in an intermittent manner during the transfer phase (SPH1, SPH2) in order to prevent variable cooling of the laser resonator and also varying hole qualities in the holes made by the laser due to uneven distances between the processing points and corresponding uneven long transfer phases, such that the power level in the resonator is maintained at approximately the same level as during the working phases (APH1, APH2, APH3).

Description

The method that is used for the operating gas Optical Maser System
Technical field
The present invention relates to a kind ofly be used to manipulate gas laser, particularly use CO 2The method of the Optical Maser System that laser instrument is processed substrate, wherein in the laser resonator of inflation, this laser resonator is used high frequency voltage, so that during the corresponding work stage (duty phase), produce predetermined pump power, and in this laser resonator, produce pulse laser beam with predetermined repetition frequency by the Q modulator, this laser beam correspondingly deflects into Working position by deflection unit, during working stage, produce the pulse of predetermined quantity at this Working position, when transition phase (jump phase), it is deflected into next Working position then by this deflection unit, wherein during the transition phase of next Working position, cut off laser beam from a Working position, and laser beam is not outwards exported pulse at each.
Background technology
The method of known multiple such process substrates.For example, DE10145184A1 has described a kind of method that is used for carrying out at circuit substrate laser drill, wherein preferably uses CO 2Laser instrument.When using CO 2When laser instrument was holed to circuit board, each hole needed the laser pulse of specific quantity, and this depends on application.This pulse train is also referred to as train of pulse (burst).The variation of impulse amplitude and absolute impulse amplitude are identical from a pulse train to the next pulse sequence in the quality requirements pulse train of consistent and reproducible hole.The time that emission has the pulse of certain pulses frequency is also referred to as duty factor with the pulse duty factor of exomonental time not.This duty factor must be no more than characteristic value, because when the high impulse power of laser may, otherwise gas no longer can be cooled, and therefore lowers efficiency.
WO02/082596A2 has described a kind of CO that is used for this application 2Lasing light emitter, wherein resonator has cooling device.For the ratio of the energy in the resonator during each pulse train, can adjust cooling, therefore make that temperature or the energy ratio in the resonator remains on par, and the pulse in this pulse train also has identical size.Yet, should be noted that when having too many pulse in pulse train, impulse amplitude reduces.
Yet, such problem has appearred, if in drilling program, and hole interval difference each other, this just means the transition phase that also has different length between pulse train, during this pulse train, laser instrument correspondingly cuts off various durations.Therefore, in high power range, a pulse train is different with the efficient and the level of the pulse of next pulse train, this be since in the laser resonator cool time of gas have different length.Therefore, this can influence the reproducibility of hole quality.
Though can compensate the negative effect of the unequal run duration in a hole and next hole by the corresponding additional wait time, and the duration interval that therefore guarantees the unanimity between the pulse train, but consequently, always must suppose between pulse train, to have maximum possible at interval.Like this, generally speaking, it is very slow that boring procedure will become, and output reduces.
Summary of the invention
Therefore, the objective of the invention is to improve the method for the type of mentioning in the beginning place, even make and have different interval at Working position, and laser beam correspondingly has under the situation of different break times, also can have consistent processing quality, and not have any additional period loss at all Working positions.
According to the present invention, this purpose realizes by off and on laser resonator being applied high frequency pumping voltage in during transition phase, makes to keep approximately uniform amplitude during energy level in the resonator and the working stage.
Activated high frequency voltage by what limit at laser resonator according to the present invention, it is approximately identical that pulse train and the pulse duty factor between the pulse spacing or duty factor also keep when laser instrument cuts off, make that the cooling of gas is also controlled in the mode that limits, so the energy level in the resonator also keeps identical in interim.Like this, when reclosing laser instrument, can export pulse immediately with the pulse train same magnitude of front.
Can realize using high frequency pumping voltage-activated resonator during the transition phase with different schemes.For example, can during these transition phase, modulate high frequency voltage constantly.Yet, cut off fully in the time of also can and/or finishing or connect the break time that RF power reaches qualification fully, and only during remaining time, apply modulated voltage with predetermined pulse duty factor in the beginning of transition phase.
And, can be with method expansion of the present invention, promptly not only processing particular process when zone during transition phase, and in longer interim, for example when a machining area changes to next machining area, perhaps during the standby operation state of system, continue the modulation of resonator place high frequency voltage.
In order to obtain necessary pulse duty factor, need to consider the characteristic of different standard, particularly specific laser resonator according to modulation of the present invention.Preferably, obtain this pulse duty factor by experiment, for example by different pulses/interval of high frequency voltage than situation under, use the laser instrument drilling testing hole of cut-out, and check their hole quality.Yet, test pulse that also can be by output laser and measure impulse amplitude and obtain main energy level in the resonator.During this process, can be by measurement impulse amplitudes such as photodiodes.
Description of drawings
Below, the embodiment by the reference accompanying drawing explains the present invention in more detail, wherein
The schematic diagram of the gas laser system of the inventive method is used in accompanying drawing 1 expression,
Accompanying drawing 2 is illustrated in the useful signal that is used to produce laser pulse in the laser resonator,
Have the sequential chart that in working stage and transition phase, is used for the sensitizing pulse of laser resonator in the accompanying drawing 3 expression conventional methods,
Accompanying drawing 4,5 represents to have in the method according to the invention the corresponding time sequence figure of the sensitizing pulse that is used for laser resonator with 6 with three kinds of different variants.
The specific embodiment
Accompanying drawing 1 expression is used for the Optical Maser System of the inventive method.At this, resonator 1 is set, this resonator comprises and is filled with admixture of gas, preferably is filled with CO 2The chamber, by electrode system 2 high frequency voltage RF is applied to resonator.And resonator 1 is by cooling system 3 coolings, and this cooling system comprises corresponding coolant interface.Q modulator 4-by the electrooptic modulator device form provides high frequency voltage by corresponding pulse activation device 5 to it, by means of the reflector apparatus 6 that equally only schematically shows, pulse is transmitted in the resonator 1 by window 7, and there by another reflector apparatus 8 guiding.The suitable arrangement of little space upper reflector has increased the effective length of movable resonator.Thus, produce laser pulse LP, this laser pulse goes out resonator by output window 9 deflections, and deflects on the workpiece 11 by the deflection unit 10 with removable reflector apparatus, so that this workpiece of processing, for example boring on corresponding working position there.Therefore workpiece 11 is set on the adjustable workbench 12, can be correspondingly the particular process zone of workpiece be moved in the scope of laser beam.Workbench 12 and deflection unit 10 are by navigation system 13 controls, and this navigation system is controlled by central controller 14.This central controller 14 is also coordinated the high frequency voltage RF on the resonator and is produced pulse by Q modulator 4 or its active device 5.System shown in 1 is known with reference to the accompanying drawings, and its primary element is described in WO 02/082596A2.
Accompanying drawing 2 is illustrated in traditional operator scheme the pulse diagram of the system shown in 1 with reference to the accompanying drawings.For the starting impulse sequence, control appliance 14 is applied to resonator at time tb1 with high frequency voltage RF, and resonator is in excitation state during this applies voltage.Then, if control device 5 is applied to Q modulator 4 with trigger impulse TP, the corresponding sequence of resonator output laser pulse LP then.
Corresponding pulses sequence (in accompanying drawing 3 to 6, all signals are represented as for example effectively low, certainly, also can be expressed as effectively high) when accompanying drawing 3 is illustrated on the circuit board and holes with different interval.In an example shown, each working stage APH1, APH2 and APH3 are used for boring, and between working stage, transition phase SPH1 and SPH2 realize the transfer of the beam deflection from first hole to second hole etc. respectively.Can see that from accompanying drawing 3 transition phase has different length, this is because the gap size difference in the hole that will bore.In fact, at interval for example can be in the scope of 200 μ m to 50mm, wherein shifting approximately needs 200 μ s to 300ms.Can see further that from accompanying drawing 3 during transition phase SPH1 and SPH2, not only laser beam self is cut off (by lacking trigger impulse), and the high frequency voltage RF on the resonator also is cut off.Therefore, corresponding to the transition phase of different length, obtain coolings different in the resonator and different energy level reductions.
First example of accompanying drawing 4 expression operations according to the instant invention patterns.At this, in transition phase, as in the past in the conventional method, by of the triggering de-energisation of Q modulator to laser instrument.Yet, in whole transition phase,, intermittently apply RF (high frequency) power with the duty factor of predetermined t1 to t2, make the overall ratio of transition phase SPH and working stage APH (" RF power OFF " and " RF power ON ") be balanced.Thus, compensated the voltage stage SPH bigger, and realized the energy level of balance than working stage APH.
Embodiment who slightly revises of accompanying drawing 5 expression, working stage APH1 has identical length to APH3 with the therebetween transition phase SPH1 and the example of SPH2 and front.In this example, when beginning, transition phase forms the intermittence modulation of RF power.Yet the predetermined interval PZ that length is t3 is cut off or is connected in exciting of resonator constantly, up to the beginning of next working stage.
As shown in Figure 6, in another kind of scheme, transition phase SPH1 or SPH2 can be respectively that the specific interval time PZ of t3 or different length begins with length, RF power intermittently are applied on the resonator to begin up to next working stage then.Equally can be with the scheme combination of accompanying drawing 5 and 6, just insert blanking time respectively in the beginning of transition phase with when finishing, between it, RF power intermittently is applied to resonator, make under any circumstance, when next working stage began, temperature in the resonator or energy level were corresponding to the ratio in the previous working stage.Laser pulse sequence LPF1, LPF2 and LPF3 and the working stage APH1, the APH2 that obtain thus also can have different length with APH3.

Claims (9)

  1. One kind be used for the operation be used for gas laser, particularly with the method for the gas laser system of CO2 laser instrument process substrates, wherein in the laser resonator (1) of inflation, high frequency voltage (RF) is applied on the laser resonator (1) of described inflation, so that during the corresponding work stage (APH), produce predetermined pump power, and in the laser resonator (1) of described inflation, produce pulse laser beam (LP) with predetermined repetition frequency by means of Q modulator (4), described pulse laser beam (LP) is deflected unit (10) and correspondingly deflects into Working position, there at working stage (APH1, APH2, APH3) pulse (LPF1 of output predetermined quantity during, LPF2, LPF3), then at transition phase (SPH1, SPH2) by described deflection unit (10) next Working position is arrived in the pulsed deflection of described predetermined quantity in, wherein during from a Working position to the transition phase of next Working position, described laser beam (LP) is cut off and does not outwards export pulse
    It is characterized in that, during described transition phase (SPH1, SPH2), described high frequency pump energy (RF) is applied to described laser resonator (1) off and on, make energy level in the described resonator remain on described working stage (APH1, APH2, APH3) during approximately uniform amplitude.
  2. 2. method according to claim 1 is characterized in that, during the whole transition phase (SPH1, SPH2) of described laser beam, with predetermined pulse/interval than (t1 t2) modulates described high frequency pump energy (RF).
  3. 3. method according to claim 1, it is characterized in that, at working stage (APH1, APH2, APH3) afterwards, in one section specified time interval respectively with predetermined pulse/interval than (t1, t2) modulation described high frequency pumping voltage (RF), connect described high frequency pumping voltage (RF) one section predetermined interval (PZ) internal cutting off or with limiting mode then, begin up to next working stage (APH2, APH3).
  4. 4. method according to claim 1, it is characterized in that, at working stage (APH1, APH2, APH3) afterwards, at first described high frequency pumping voltage (RF) is cut off one section predetermined interval (PZ), and then with specific pulse/interval than (t1, t2) modulation described high frequency pumping voltage (RF).
  5. 5. method according to claim 1, it is characterized in that, described high frequency pumping voltage (RF) is cut off or connects the one specific interval period (PZ) in the beginning of transition phase (SPH1, SPH2) and when finishing, and during remaining transition phase by with predetermined pulse/interval than modulating.
  6. 6. according to each described method in the claim 1 to 5, it is characterized in that, during the standby mode of operation of described Optical Maser System, also intermittently apply described high frequency pumping voltage (RF).
  7. 7. according to each described method in the claim 1 to 6, it is characterized in that, in order to be that the high frequency pump power at described intermittence is adjusted pulse/interval than (t2/t1), by the drilling testing hole also subsequently the quality of inspection opening determine energy level in the described resonator (1).
  8. 8. according to each described method in the claim 1 to 6, it is characterized in that, in order to be that the high frequency pump power at described intermittence is adjusted pulse/interval than (t2/t1), determine energy level in the described resonator (1) by the output test pulse and by the measurement impulse amplitude.
  9. 9. method according to claim 8 is characterized in that, measures described impulse amplitude by means of photodiode.
CNA2004800246788A 2003-09-30 2004-04-16 Method for operating a gas laser system Pending CN1845811A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10345543 2003-09-30
DE10345543.4 2003-09-30

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CN1845811A true CN1845811A (en) 2006-10-11

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KR (1) KR20060060672A (en)
CN (1) CN1845811A (en)
WO (1) WO2005032758A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101578155B (en) * 2007-01-05 2013-05-01 杰斯集团公司 System and method for multi-pulse laser processing
CN108515278A (en) * 2013-04-26 2018-09-11 维亚机械株式会社 Laser processing

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5396357B2 (en) 2010-09-14 2014-01-22 株式会社アマダ Laser processing apparatus and control method thereof
JP7153682B2 (en) * 2020-03-11 2022-10-14 パナソニックホールディングス株式会社 Cutting device and cutting method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002090037A1 (en) * 2001-05-09 2002-11-14 Electro Scientific Industries, Inc. Micromachining with high-energy, intra-cavity q-switched co2 laser pulses
DE10145184B4 (en) * 2001-09-13 2005-03-10 Siemens Ag Method for laser drilling, in particular using a shadow mask

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101578155B (en) * 2007-01-05 2013-05-01 杰斯集团公司 System and method for multi-pulse laser processing
CN108515278A (en) * 2013-04-26 2018-09-11 维亚机械株式会社 Laser processing

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Publication number Publication date
WO2005032758A1 (en) 2005-04-14
JP2007507870A (en) 2007-03-29
KR20060060672A (en) 2006-06-05

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