CN1832122A - Detection card interface panel - Google Patents
Detection card interface panel Download PDFInfo
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- CN1832122A CN1832122A CN 200510098693 CN200510098693A CN1832122A CN 1832122 A CN1832122 A CN 1832122A CN 200510098693 CN200510098693 CN 200510098693 CN 200510098693 A CN200510098693 A CN 200510098693A CN 1832122 A CN1832122 A CN 1832122A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention is one detecting card interface plate, and the detecting card interface plate includes one base plate possessing in the first surface several conducting lugs, each of which includes one dielectric kernel and several contact wires with free end extending towards the center of the dielectric kernel and supported elastically with the dielectric kernel. The detecting card interface plate is mounted between one probe and one multilayer printed circuit board, and the conducting lugs ensure the electric contact to the probe. In one embodiment, the base plate is provided with several symmetrical conducting lugs in the other, or the second, surface and connected via conducting holes or conducting pins to different surfaces for electrical contact with the multilayer printed circuit board.
Description
Technical field
The invention relates to a kind of module type detecting card, particularly relevant for a kind of detection card interface panel.
Background technology
Existing known integrated circuit (IC) products all need be tested at wafer state and encapsulation state, to guarantee function and usefulness in manufacture process.Because it is complicated that the design of integrated circuit more is tending towards, and can visit the electrode that is depressed into a complete integrated circuit with the high-density probe of a detecting card (probe card), to test and to analyze an integrated circuit.The line design and the electric connection mode that have known detecting card now all can have influence on test result, so this detecting card has become the key component of integrated circuit testing equipment.And existing known integrated circuit testing equipment (IC test apparatus) has a measuring head (testhead), for the installing detecting card.Utilize the transmission interface of this detecting card as testing equipment and to-be-measured integrated circuit product.Under low cost was considered, known detecting card was for modularity designs, and normally inserted an interface panel (interposer) between a multilayer board and a detecting head (probe head).
United States Patent (USP) the 5th, 974, No. 662 " the most advanced and sophisticated flattening method of the detecting element of detecting card " disclosed a kind of interface panel, it includes a substrate and a plurality of interior Connection Element (interconnectionelements), Connection Element has a S core portion (core) and a hard shell portion (shell) in each, and the material of this core is to be metal, as gold (Au), and this shell portion is the hard metal that is placed on this S core portion for electroplating, as nickel (Ni) or copper (Cu).Yet when this interface panel had electrical contact to a detecting head or a printed circuit board (PCB), the little spacing connection pad that touches this printed circuit board (PCB) very can accurately be pressed in difficulty ground in unsettled tip of S shape of Connection Element in those, reached to electrically conduct.Therefore, because the unsettled most advanced and sophisticated firm support that lacks of Connection Element in those, so the displacement problem that produces can't solve.
In addition, TaiWan, China patent announcement No. 493756 " the general detecting card of wafer " has disclosed the general detecting card of a kind of wafer, the general detecting card of this wafer includes an interface panel, a printed circuit board (PCB) and a detecting head, wherein a surface of this interface card has a plurality of first pin marks, and another surface has a plurality of second pin marks, the spacing of those first pin marks is fixed, and those second pin mark spacings are fixed.This printed circuit board (PCB) is for replaceable, has a test circuit on it, one surface and the wafer pin of this printed circuit board (PCB) are surveyed board and are electrically connected, another surface has a plurality of first pin holes, for those first pin marks that engage this interface panel, this detecting head is for replaceable, has a plurality of chaining pins and a plurality of second pin hole, to engage those second pin marks of this interface panel, first pin mark of this interface panel and the structure of second pin mark rupture in the grafting process easily.
This shows that above-mentioned existing detection card interface panel obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the existing problem of detection card interface panel, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of detection card interface panel of new structure, just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing detection card interface panel exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of detection card interface panel of new structure, can improve general existing detection card interface panel, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing detection card interface panel exists, and provide a kind of detection card interface panel of new structure, technical problem to be solved is to make it be included in plural conductive projection on the substrate, each conductive projection includes a dielectric core (dielectric core) and a plurality of contact lead-wire (contact wire), each contact lead-wire has a stiff end with connection gasket that is fixedly arranged on this substrate and the dielectric core that is adjacent to correspondence, and one free end with extend towards those corresponding dielectric core centers and by resiliency supported on corresponding dielectric core, with a detecting head or a multilayer board that flexibly electrically contacts a modularity detecting card, can solve the on-plane surface contact problems and the problem of stress concentration of the interface card of known modularity detecting card.In addition, those dielectric cores have elasticity, and those contact lead-wires can be selected mems probe for use or by the bonding wire that routing forms, be difficult for caving in or displacement, and can reach electrically contact exactly.
Another object of the present invention is to, a kind of detection card interface panel is provided, technical problem to be solved is to make its upper and lower surface at a substrate be respectively arranged with the plural conductive projection, each conductive projection includes a dielectric core and a plurality of contact lead-wire, each contact lead-wire has a free end, those free ends be extend toward those corresponding dielectric core centers and by resiliency supported in corresponding dielectric core, and can vertically aim at and be electrically connected to those contact lead-wires at those contact lead-wires of this upper surface of base plate by a plurality of electrically conduct hole or conductive poles, and can make this interface panel can electrically contact a multilayer board and a detecting head of a modularity detecting card simultaneously up and down at this base lower surface.
A further object of the present invention is, a kind of detection card interface panel is provided, technical problem to be solved is to make its upper and lower surface of utilizing a substrate be formed with the connection gasket that connects with conductive pole respectively, those connection gaskets are provided with the contact lead-wire that a plurality of routings form, each contact lead-wire has a hanging part towards corresponding connection gasket center, and can constitute the rubber-like conductive projection.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of detection card interface panel that the present invention proposes, be in order to being installed between a multilayer board and the detecting head, this interface panel comprises: a substrate, it has the second surface of a first surface and a correspondence; And a plurality of first conductive projections, it is arranged at this first surface of this substrate, each first conductive projection comprises one first dielectric core (first dielectric core) and a plurality of first contact lead-wire, each first contact lead-wire has one first stiff end and one first free end, those first stiff ends of those first contact lead-wires are fixedly arranged on this first surface of this substrate and are adjacent to the first corresponding dielectric core, and those first free ends of those first contact lead-wires are to extend so that those first contact lead-wires can be by the corresponding first dielectric core resiliency supported in last toward those corresponding first dielectric core centers.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
Aforesaid detection card interface panel has the gap between 0.05 to 0.5 μ m between those first free ends of wherein said those first contact lead-wires first dielectric core corresponding with those.
Aforesaid detection card interface panel, it includes a plurality of second conductive projections in addition, its this second surface that is arranged at this substrate is also vertically in alignment with those first conductive projections, each second conductive projection comprises one second dielectric core (second dielectric core) and a plurality of second contact lead-wire, each second contact lead-wire has one second stiff end and one second free end, those second stiff ends of those second contact lead-wires are fixedly arranged on this second surface of this substrate, and those second free ends of those second contact lead-wires are to extend so that those second contact lead-wires can be by those second dielectric core resiliency supported toward those corresponding second dielectric core centers.
Aforesaid detection card interface panel, wherein said substrate have a plurality of holes that electrically conduct (electrical via) or conductive pole, and it electrically connects those first contact lead-wires and those second contact lead-wires.
Aforesaid detection card interface panel, the thickness of wherein said those first dielectric cores are between 60～180 μ m.
Aforesaid detection card interface panel, wherein said those first conductive projections are to be the trellis array.
Aforesaid detection card interface panel, wherein said those first contact lead-wires are bonding wire or the mems probes (MEMS probe) that form for routing.
The object of the invention to solve the technical problems adopts following technical scheme to realize in addition.A kind of detection card interface panel according to the present invention's proposition, it comprises: a substrate, it has the second surface of a first surface and a correspondence, this substrate includes a plurality of first connection gasket and a plurality of second connection gaskets at this second surface at this first surface, and wherein those first connection gaskets are to electrically connect and vertically in alignment with those second connection gaskets; And a plurality of first conductive projections, it is arranged on those first connection gaskets of this substrate, each first conductive projection comprises first contact lead-wire that a plurality of routings form, and each first contact lead-wire has a hanging part that extends towards the corresponding first connection gasket center.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of detection card interface panel according to the present invention's proposition, it comprises: a substrate, it has the second surface of a first surface and a correspondence, this substrate includes a plurality of first connection gaskets at this first surface, a plurality of second connection gasket at this second surface, and those first connection gaskets electrically connect and vertically in alignment with those second connection gaskets; And a plurality of first conductive projections, it is arranged on those first connection gaskets of this substrate, each first conductive projection comprises first contact lead-wire that a plurality of routings form, and each first contact lead-wire has the hanging part that two stiff ends and extend across the corresponding first connection gasket center.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
Aforesaid detection card interface panel, those hanging parts of wherein said those first contact lead-wires have the height of corresponding first connection gasket, 60～180 μ m of distance.
Aforesaid detection card interface panel, wherein said substrate have a plurality of holes that electrically conduct (electrical via) or conductive pole, to electrically connect those first connection gaskets and those second connection gaskets.
Aforesaid detection card interface panel, the length of wherein said those first connection gaskets are that hole or conductive pole are capped so that those electrically conduct greater than the electrically conduct diameter of hole or conductive pole of correspondence.
Aforesaid detection card interface panel, it includes a plurality of second conductive projections in addition, it is arranged at those second connection gaskets of this substrate, and vertically in alignment with those first conductive projections, wherein each second conductive projection comprises second contact lead-wire that a plurality of routings form, and each second contact lead-wire has a hanging part that is positioned on corresponding second connection gasket.
Aforesaid detection card interface panel, it includes a plurality of second conductive projections in addition, it is arranged at those second connection gaskets of this substrate, and vertically in alignment with those first conductive projections, each second conductive projection comprises second contact lead-wire that a plurality of routings form, and each second contact lead-wire has the hanging part that two stiff ends and extend across the corresponding second connection gasket center.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows: according to detection card interface panel of the present invention, it comprises a substrate and a plurality of first conductive projection, this substrate has the second surface of a first surface and a correspondence, those first conductive projections are arranged at this first surface of this substrate, each first conductive projection comprises a dielectric core and a plurality of contact lead-wire, each contact lead-wire has a stiff end and a free end, those stiff ends of those contact lead-wires are fixedly arranged on this first surface of this substrate and are adjacent to corresponding dielectric core, those free ends of those contact lead-wires be toward those corresponding dielectric core centers extensions so that those contact lead-wires by resiliency supported on corresponding dielectric core.
By technique scheme, detection card interface panel of the present invention has following advantage at least:
Detection card interface panel of the present invention, because it is included in the plural conductive projection on the substrate, each conductive projection includes a dielectric core (dielectric core) and a plurality of contact lead-wire (contact wire), each contact lead-wire has a stiff end with connection gasket that is fixedly arranged on this substrate and the dielectric core that is adjacent to correspondence, and one free end with extend towards those corresponding dielectric core centers and by resiliency supported on corresponding dielectric core, with a detecting head or a multilayer board that flexibly electrically contacts a modularity detecting card, so can solve the on-plane surface contact problems and the problem of stress concentration of the interface card of known modularity detecting card.In addition, because those dielectric cores have elasticity, the bonding wire that those contact lead-wires can be selected mems probe for use or be formed by routing, thus be not easy to cave in or displacement, thus can reach the effect that electrically contacts exactly.
Detection card interface panel of the present invention, because its upper and lower surface at a substrate is respectively arranged with the plural conductive projection, each conductive projection includes a dielectric core and a plurality of contact lead-wire, each contact lead-wire has a free end, those free ends be extend toward those corresponding dielectric core centers and by resiliency supported in corresponding dielectric core, and can vertically aim at and be electrically connected to those contact lead-wires by a plurality of electrically conduct hole or conductive poles at this base lower surface at those contact lead-wires of this upper surface of base plate, and can make this interface panel electrically contact a multilayer board and a detecting head of a modularity detecting card up and down simultaneously, thereby be suitable for practicality more.
Detection card interface panel of the present invention, because it utilizes the upper and lower surface of a substrate to be formed with the connection gasket that connects with conductive pole respectively, those connection gaskets are provided with the contact lead-wire that a plurality of routings form, each contact lead-wire has a hanging part towards corresponding connection gasket center, so can constitute the rubber-like conductive projection, thereby be suitable for practicality more.
In sum, the detection card interface panel of special construction of the present invention, it comprises a substrate, first surface at this substrate is provided with the plural conductive projection, each conductive projection includes a dielectric core and a plurality of contact lead-wire, wherein the free end of those contact lead-wires is toward the center extension of corresponding dielectric core and by this dielectric core resiliency supported, so this detection card interface panel can be installed between a detecting head and the multilayer board, those conductive projections can have electrical contact to this detecting head really.In one embodiment, be provided with the conductive projection of a plurality of symmetries at another second surface of this substrate, and with guide hole or conductive pole vertically to the conductive projection that is connected different surfaces, so can electrically contact this multilayer board.It has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing detection card interface panel has the multinomial effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is according to first specific embodiment of the present invention, is a kind of schematic cross-section of detecting card.
Fig. 2 is according to first specific embodiment of the present invention, is the schematic partial cross-sectional view of this detection card interface panel.
Fig. 3 is according to second specific embodiment of the present invention, is a kind of schematic cross-section of detecting card.
Fig. 4 is according to second specific embodiment of the present invention, is the schematic partial cross-sectional view of this detection card interface panel.
Fig. 5 is according to second specific embodiment of the present invention, is the surface local schematic diagram of this detection card interface panel.
Fig. 6 is according to the 3rd specific embodiment of the present invention, is a kind of schematic partial cross-sectional view of detection card interface panel.
Fig. 7 is according to the 3rd specific embodiment of the present invention, is the surface local schematic diagram of this detection card interface panel.
10: detecting head 11: visit contravention
12: connection gasket 13: circuit
14: guide hole 20: multilayer board
21: connection gasket 22: the pad of pegging graft
30: detecting head 31: probe
32: connection gasket 40: multilayer board
41: connection gasket 50: fill glue
60: clamping piece 100: interface panel
110: substrate 111: first surface
112: second surface 113: connection gasket
114: 120: the first conductive projections in hole electrically conduct
122: the first contact lead-wires of 121: the first dielectric cores
124: the first free ends of 123: the first stiff ends
131: the second dielectric cores of 130: the second conductive projections
133: the second stiff ends of 132: the second contact lead-wires
210: substrate 211: first surface
212: 213: the first connection gaskets of second surface
Connection gasket 215 in 214: the second: conductive pole
221: the first contact lead-wires of 220: the first conductive projections
223: the first free ends of 222: the first stiff ends
231: the second contact lead-wires of 230: the second conductive projections
233: the second free ends of 232: the second stiff ends
300: interface panel 310: substrate
311: first surface 312: second surface
314: the second connection gaskets of 313: the first connection gaskets
315: 320: the first conductive projections of conductive pole
Contact lead-wire 322 in 321: the first: stiff end
323: 330: the second conductive projections of hanging part
Contact lead-wire 332 in 331: the second: stiff end
333: hanging part
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of detection card interface panel, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Seeing also shown in Figure 1ly, is first specific embodiment of preferred embodiment of the present invention.This a kind of detection card interface panel 100 is to be applicable to a modularity detecting card, in order to be assemblied between a detecting head 10 and the multilayer board 20.
This detecting head 10, can be a silicon wafer, a ceramic substrate or a glass substrate, and this detecting head 10 has a plurality of spy contraventions 11, for example probe or projection, touch the electrode of a to-be-measured integrated circuit for spy, and be electrically connected to this detecting head 10 at another surperficial connection gasket 12 with guide hole 14 by the suitable circuit 13 of this detecting head 10.
This multilayer board 20, have a plurality of connection gaskets 21 and pad 22 (the pogo pad) that peg graft at different surfaces, both electrically connect, wherein those connection gaskets 21 are those connection gaskets 12 corresponding to this detecting head 10, and those pads 22 of pegging graft are to supply the spring needle (pogo pin) of the measuring head of an integrated circuit testing equipment to be electrically conducted.
See also shown in Figure 2ly again, this interface panel 100 mainly includes a substrate 110 and a plurality of first conductive projection 120, wherein:
Those first conductive projections 120 are arranged at a first surface 111 of substrate 110, and in order to flexibly and electrically to contact those connection gaskets 12 of detecting head 10, wherein those first conductive projections 120 are to should be the trellis array.Preferably, this interface panel 100 includes a plurality of second conductive projections 130 in addition, and it is arranged at a second surface 112 of substrate 110, in order to flexibly and electrically to contact those connection gaskets 21 of multilayer board 20.
This each first conductive projection 120 includes one first dielectric core 121 (first dielectriccore) and a plurality of first contact lead-wire 122.First contact lead-wire 122 of those first conductive projections 120 can vertically be aimed at and electrically connect with second contact lead-wire 132 of those second conductive projections 130 by the hole 114 that electrically conducts (electrical via) of substrate 110.
This substrate 110 is to be selected from one of them of ceramic substrate, glass substrate and silicon wafer, and this substrate 110 has a plurality of at the connection gaskets 113 of first surface 111 with second surface 112.In the present embodiment, those first dielectric cores 121 are to be selected from silica gel, rubber or other elastomeric material, those first dielectric cores 121 can be formed by mode of printing or photolithography in semiconductor imaging processing procedure, the thickness of those first dielectric cores 121 is between 30～500 μ m (micron), preferably is between 60～180 μ m (micron).
And this each first contact lead-wire 122, have one first stiff end 123 and one first free end 124, those first stiff ends 123 are to be fixed at those connection gaskets 113 of substrate 110 first surfaces 111 and to be adjacent to the first corresponding dielectric core 121, those first free ends 124 are to extend toward the center of those corresponding first dielectric cores 121, so that those contact lead-wires 122 can be by first dielectric core 121 of resiliency supported in correspondence, so that it sticks up the first surface 111 from substrate 110.Those first contact lead-wires 122 are to utilize MEMS (micro electro mechanical system) (Micro Electro Mechanical System, MEMS) mems probe of fabrication techniques (MEMS probe) or utilize the in addition lead-in wire of electroplating process of bonding wire that routing forms, the material of those first contact lead-wires 122 can be made up of with nickel or its alloy nickel, gold, copper, tungsten.In a specific embodiment, those first contact lead-wires 122 are to have between 10 to 30 * 10
-6(℃)
-1Thermal coefficient of expansion.Therefore, those first conductive projections 120 have that elasticity electrically contacts, durable and unshift effect, and go for the interface panel of a modularity detecting card.
Preferably, each first dielectric core 121 has an inclined plane, in order to the extension of those first contact lead-wires 122.In addition, those first dielectric cores 121 leave a gap with first free end 124 of corresponding those first contact lead-wires 122, and this gap is between 0.05 to 0.5 μ m.
In addition, those second conductive projections 130 that are arranged on the second surface 112 of substrate 110 are vertically in alignment with those first conductive projections 120, reach effect cheaply easily to reach to make, but its composed component is to be identical or inequality with those first conductive projections 120.In the present embodiment, each second conductive projection 130, comprise one second dielectric core 131 (second dielectric core) and a plurality of second contact lead-wire 132, each second contact lead-wire 132 has one second stiff end 133 and one second free end 134, those second stiff ends 133 of those second contact lead-wires 132 are fixedly arranged on those connection gaskets 113 on the second surface 112 of substrate 110, those second free ends 134 of those second contact lead-wires 132 are to extend toward those corresponding second dielectric core 131 centers, so that those second contact lead-wires 132 can be by those second dielectric core, 131 resiliency supported in last.The thermal coefficient of expansion of this second contact lead-wire 132 is the thermal coefficient of expansions that can be same as those first contact lead-wires 122.
Change by temperature rising in the test process, for example be increased to 125 ℃ or be increased to room temperature from subzero 45 ℃ from room temperature, those first dielectric cores 121 and those second dielectric core, 131 expanded by heating, first contact lead-wire 122 and second contact lead-wire 132 with the pushing tow correspondence, the extendable room of lead-in wire is provided between those first contact lead-wires 122 or gap between second contact lead-wire 132, make first free end 124 of those first contact lead-wires 122 more closely positively electrically contact those connection gaskets 12 of detecting head 10 and the connection gasket 21 of multilayer board 20 with second free end 134 of those second contact lead-wires 132, and can solve known product in probe temperature changes, difficulty removes electrically to contact nonplanar detecting head 10 or multilayer board 20.
Seeing also shown in Figure 3ly, is according to second specific embodiment of the present invention, is a kind of schematic cross-section of detecting card.Second specific embodiment of the present invention has disclosed a kind of modularity detecting card as shown in Figure 3, this modularity detecting card includes a detecting head 30, a multilayer board 40 and an interface panel 200, and this interface panel 200 is inserted between detecting head 30 and the multilayer board 40.One surface of this detecting head 30 is provided with plurality of probes 31, and another surface of this detecting head 30 is provided with a plurality of connection gaskets 32.This multilayer board 40 has a plurality of connection gaskets 41 on a surface, is electrically connected to those connection gaskets 32 of detecting head 30 by interface panel 200.Be to provide one to fill glue 50 earlier between interface panel 200 and detecting head 30, to form an assembly earlier with detecting head 30 in conjunction with this interface panel 200, guarantee that both electrically connect, in addition the assembly of this interface panel 200 and detecting head 30 is fixed in multilayer board 40, and can reduces the possibility of contraposition error by a clamping piece 60.
See also shown in Figure 4ly, this interface panel 200 mainly includes a substrate 210, a plurality of first conductive projection 220 and a plurality of second conductive projection 230.This substrate 210 has the second surface 212 of a first surface 211 and a correspondence, and this substrate 210 includes a plurality of first connection gaskets 213 at first surface 211, a plurality of in second connection gasket 214 and the plural conductive post 215 or the hole that electrically conducts of second surface 212, and those conductive poles 215 connect those first connection gaskets 213 and those second connection gaskets 214.In the present embodiment, those first connection gaskets 213 all should be greater than the diameter of corresponding conductive pole 215, to cover those conductive poles 215 with the length of those second connection gaskets 214.Those first conductive projections 220 are arranged on those first connection gaskets 213 of substrate 210, and those second conductive projections 230 are arranged on those second connection gaskets 214 of substrate 210, with vertically in alignment with each first conductive projection 220.This each first conductive projection 220 comprises first contact lead-wire 221 that a plurality of routings form, each first contact lead-wire 221 has one first stiff end 222 and one first free end 223, those first stiff ends 222 are to be fixedly arranged on corresponding first connection gasket 213, and those first free ends 223 are unsettled configurations and towards to center that should first connection gasket 213, those free ends 223 of those first contact lead-wires 221 are to have the height of corresponding first connection gasket 213 of distance at 60～180 μ m, flexibly and electrically to contact those connection gaskets 32 of detecting card 30.Preferably, see also shown in Figure 5, those first stiff ends 222 of those first contact lead-wires 221 are edge or the corners that are positioned at corresponding first connection gasket 213, and those free ends 223 are for hanging shape and extend central axis towards corresponding first connection gasket 213, to increase the probability of electrical contact.
In addition, similarly, this each second contact lead-wire 231 has one second stiff end 232 and one second free end 233, those second stiff ends 232 are fixedly arranged on corresponding second connection gasket 214, and those second free ends 233 are to be positioned at corresponding second connection gasket 214 tops, flexibly and electrically to contact those connection gaskets 41 of this multilayer board 40.
Seeing also Figure 6 and Figure 7, is according to the 3rd specific embodiment of the present invention.In the 3rd specific embodiment of the present invention, this another kind detection card interface panel 300 includes a substrate 310, a plurality of first conductive projection 320 and a plurality of second conductive projection 330.As the substrate in second specific embodiment 210, this substrate 310 has the second surface 312 of a first surface 311 and a correspondence, and this substrate 310 includes a plurality of first connection gaskets 313 at first surface 311, a plurality of second connection gasket 314 and plural conductive post 315 at second surface 312, and those conductive poles 315 connect those first connection gaskets 313 and those second connection gaskets 314.Those first conductive projections 320 are arranged on those first connection gaskets 313 of substrate 310, and those second conductive projections 330 are arranged on those second connection gaskets 314 of substrate 310, with vertically in alignment with each first conductive projection 320.This each first conductive projection 320 is made up of first contact lead-wire 321 that a plurality of routings form, this each first contact lead-wire 321 has first hanging part 323 in the middle of two first stiff ends 322 and, those first stiff ends 322 are fixedly arranged on corresponding first connection gasket 313, and those first hanging parts 323 are to be positioned at corresponding first connection gasket 213 tops, flexibly and electrically to contact a detecting card.Similarly, each second contact lead-wire 331 has two second stiff ends 332 and one second hanging part 333, those second stiff ends 332 are fixedly arranged on corresponding second connection gasket 314, and those second hanging parts 333 are the center tops that are hanging shape and cross corresponding second connection gasket 314, so those second conductive projections 330 are can be flexibly and contact a multilayer board electrically.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art are in the scope that does not break away from technical solution of the present invention, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (14)
1, a kind of detection card interface panel is in order to being installed between a multilayer board and the detecting head, it is characterized in that this interface panel comprises:
One substrate, it has the second surface of a first surface and a correspondence; And
A plurality of first conductive projections, it is arranged at this first surface of this substrate, each first conductive projection comprises one first dielectric core (first dielectric core) and a plurality of first contact lead-wire, each first contact lead-wire has one first stiff end and one first free end, those first stiff ends of those first contact lead-wires are fixedly arranged on this first surface of this substrate and are adjacent to the first corresponding dielectric core, and those first free ends of those first contact lead-wires are to extend so that those first contact lead-wires can be by the corresponding first dielectric core resiliency supported in last toward those corresponding first dielectric core centers.
2, detection card interface panel according to claim 1 is characterized in that having between those first free ends of wherein said those first contact lead-wires first dielectric core corresponding with those gap between 0.05 to 0.5 μ m.
3, detection card interface panel according to claim 1, it is characterized in that it includes a plurality of second conductive projections in addition, its this second surface that is arranged at this substrate is also vertically in alignment with those first conductive projections, each second conductive projection comprises one second dielectric core (second dielectric core) and a plurality of second contact lead-wire, each second contact lead-wire has one second stiff end and one second free end, those second stiff ends of those second contact lead-wires are fixedly arranged on this second surface of this substrate, and those second free ends of those second contact lead-wires are to extend so that those second contact lead-wires can be by those second dielectric core resiliency supported toward those corresponding second dielectric core centers.
4, detection card interface panel according to claim 3 is characterized in that wherein said substrate has a plurality of holes that electrically conduct (electrical via) or conductive pole, and it electrically connects those first contact lead-wires and those second contact lead-wires.
5, detection card interface panel according to claim 1, the thickness that it is characterized in that wherein said those first dielectric cores are between 60～180 μ m.
6, detection card interface panel according to claim 1 is characterized in that wherein said those first conductive projections are to be the trellis array.
7, detection card interface panel according to claim 1 is characterized in that wherein said those first contact lead-wires are bonding wire or the mems probes (MEMS probe) that form for routing.
8, a kind of detection card interface panel is characterized in that it comprises:
One substrate, it has the second surface of a first surface and a correspondence, this substrate includes a plurality of first connection gasket and a plurality of second connection gaskets at this second surface at this first surface, and wherein those first connection gaskets are to electrically connect and vertically in alignment with those second connection gaskets; And
A plurality of first conductive projections, it is arranged on those first connection gaskets of this substrate, each first conductive projection comprises first contact lead-wire that a plurality of routings form, and each first contact lead-wire has a hanging part that extends towards the corresponding first connection gasket center.
9, a kind of detection card interface panel is characterized in that it comprises:
One substrate, it has the second surface of a first surface and a correspondence, this substrate includes a plurality of first connection gaskets at this first surface, a plurality of second connection gasket at this second surface, and those first connection gaskets electrically connect and vertically in alignment with those second connection gaskets; And
A plurality of first conductive projections, it is arranged on those first connection gaskets of this substrate, each first conductive projection comprises first contact lead-wire that a plurality of routings form, and each first contact lead-wire has the hanging part that two stiff ends and extend across the corresponding first connection gasket center.
10, according to Claim 8 or 9 described detection card interface panels, it is characterized in that those hanging parts of wherein said those first contact lead-wires have the height of corresponding first connection gasket, 60～180 μ m of distance.
11, according to Claim 8 or 9 described detection card interface panels, it is characterized in that wherein said substrate has a plurality of holes that electrically conduct (electrical via) or conductive pole, to electrically connect those first connection gaskets and those second connection gaskets.
12, according to Claim 8 or 9 described detection card interface panels, the length that it is characterized in that wherein said those first connection gaskets is that hole or conductive pole are capped so that those electrically conduct greater than the electrically conduct diameter of hole or conductive pole of correspondence.
13, detection card interface panel according to claim 8, it is characterized in that it includes a plurality of second conductive projections in addition, it is arranged at those second connection gaskets of this substrate, and vertically in alignment with those first conductive projections, wherein each second conductive projection comprises second contact lead-wire that a plurality of routings form, and each second contact lead-wire has a hanging part that is positioned on corresponding second connection gasket.
14, detection card interface panel according to claim 9, it is characterized in that it includes a plurality of second conductive projections in addition, it is arranged at those second connection gaskets of this substrate, and vertically in alignment with those first conductive projections, each second conductive projection comprises second contact lead-wire that a plurality of routings form, and each second contact lead-wire has the hanging part that two stiff ends and extend across the corresponding second connection gasket center.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/076935 | 2005-03-11 | ||
| US11/076,935 US20060091510A1 (en) | 2004-03-11 | 2005-03-11 | Probe card interposer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1832122A true CN1832122A (en) | 2006-09-13 |
Family
ID=36994274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510098693 Pending CN1832122A (en) | 2005-03-11 | 2005-09-09 | Detection card interface panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1832122A (en) |
| TW (1) | TWI274165B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796623B (en) * | 2007-07-02 | 2012-04-04 | 李在夏 | Probe assembly and manufacturing method thereof |
| CN103260337A (en) * | 2011-11-08 | 2013-08-21 | 日本特殊陶业株式会社 | Ceramic substrate and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI392872B (en) * | 2009-04-10 | 2013-04-11 | Chipmos Technologies Inc | Probe card assembly and probe holder thereof |
-
2005
- 2005-09-09 CN CN 200510098693 patent/CN1832122A/en active Pending
-
2006
- 2006-03-10 TW TW95108106A patent/TWI274165B/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796623B (en) * | 2007-07-02 | 2012-04-04 | 李在夏 | Probe assembly and manufacturing method thereof |
| CN103260337A (en) * | 2011-11-08 | 2013-08-21 | 日本特殊陶业株式会社 | Ceramic substrate and method of manufacturing the same |
| CN103260337B (en) * | 2011-11-08 | 2016-05-18 | 日本特殊陶业株式会社 | Ceramic substrate and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200632328A (en) | 2006-09-16 |
| TWI274165B (en) | 2007-02-21 |
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