CN1826048B

CN1826048B - Method for binding IC chip and flexible circuitboard on panel display

Info

Publication number: CN1826048B
Application number: CN200610034619A
Authority: CN
Inventors: 朱景河
Original assignee: Truly Semiconductors Ltd
Current assignee: Truly Semiconductors Ltd
Priority date: 2006-03-21
Filing date: 2006-03-21
Publication date: 2010-05-12
Anticipated expiration: 2026-03-21
Also published as: CN1826048A

Abstract

This invention discloses a method for binding an IC chip and a soft CB on a panel display including: adhering an anisotropy conduction film on a metal lead region of a panel display and the conductionfilm can cover the binding pin positions of the CB, then aligning the IC chip then binding it on the film, then binding the CB on the pin positions just opposite to the conduction film, then pressingthe IC chip and the soft CB to solidify the conduction film to conduct the chip and the soft CB with the panel display and the film between the chip and the CB is in the state of the anisotropy conduction film edge.

Description

The process of binding integrated circuit chip and Flexible Printed Circuit on flat-panel monitor

Technical field;

The present invention relates to the anisotropic conductive film (ACF) in the display module manufacture craft, particularly a kind ofly utilize that the dual purpose anisotropic conductive film is disposable to be tied on glass and Flexible Printed Circuit is tied to technical process on glass to the integrated circuit chip.

Background technology

Early stage LCDs LCD is essentially letter and fixing image, now and following to the LCD display in the removable product, proposed to have the requirement of the VGA image of programmable, its available different size satisfies different instructions for uses.People have very strong cry to further making the LCD thin typeization and alleviating its quality.The present a kind of technology that can satisfy this demand that occurs, promptly brilliant glass tipping technology COG (chip on glass is tied to technical process on glass with the integrated circuit chip).In a LCD display that adopts the COG technology, integrated circuit chip (IC) device directly is mounted on the same glass substrate as the LCD part.The key that the COG technology successfully realizes is to have used anisotropic conductive film (ACF).And that FOG (Film On Glass is tied to technical process on glass with Flexible Printed Circuit) technology successfully is connected to wiring board is on glass.ACF is a kind of adhesive material, in the display module manufacturing technology, is used as and is used for satisfying the medium that integrated circuit chip and Flexible Printed Circuit are connected with glass.

In the prior art, be applied to the anisotropic conductive film (ACF) in the display module, be divided into COG-ACF and FOG-ACF two classes.COG-ACF is applied to the conducting of flat-panel monitor (Panel) and IC (integrated circuit chip); FOG-ACF is applied to the conducting of flat-panel monitor and Flexible Printed Circuit (FPC).The ACF of prior art can only make single-use, is applied to COG or is applied to FOG, and its technological process is as follows:

1, pastes COG-ACF; 2, binding IC; 3, COG-ACF master presses; 4, paste FOG-ACF; 5, binding FPC; 6, FOG-ACF master presses.

The shortcoming of above-mentioned technological process is, flow process is longer, required machine quantity is many, COG and FOG two class ACF need separate twice attaching (having the ACF edge between the two class ACF) and twice main pressing solidly, contact of staff in this process and secondary pollution are more, and can cause the metal pins line of the ACF edge on glass of certain module to disconnect and cause number of drawbacks such as the functions of modules demonstration is bad.

Summary of the invention

The technical problem to be solved in the present invention is at the defective that exists in the prior art, the process of a kind of making display module that reduces operating process, improves product quality and production efficiency that provides.

The present invention adopts following technical scheme:

A kind of process of binding integrated circuit chip and Flexible Printed Circuit on flat-panel monitor comprises the steps:

A. attach anisotropic conductive film in the metal lead wire zone of flat-panel monitor, and make this anisotropic conductive film can cover the binding pin position of integrated circuit chip binding pin position and Flexible Printed Circuit;

B. the integrated circuit chip is bundled in described anisotropic conductive film on described integrated circuit chip binding pin position;

C. again Flexible Printed Circuit is bundled in described anisotropic conductive film on the binding pin position of described Flexible Printed Circuit;

D. lead pressure to carrying out integrated circuit chip and Flexible Printed Circuit, solidify described anisotropic conductive film, make described integrated circuit chip and Flexible Printed Circuit and described flat-panel monitor conducting; And allow the anisotropic conductive film between described integrated circuit chip and Flexible Printed Circuit not have the gap, be the state at no anisotropic conductive film edge.

The described attaching anisotropic conductive film of step a is the anisotropic conductive film that disposable whole is opened the binding pin position that can cover integrated circuit chip binding pin position and Flexible Printed Circuit, perhaps is divided into twice and attaches the binding pin position that the integrated circuit chip is bound pin position and Flexible Printed Circuit respectively.

If attach the binding pin position of anisotropic conductive film to integrated circuit chip binding pin position and Flexible Printed Circuit for twice respectively, it is a bit of overlapping then to allow two anisotropic conductive film have at adjoiner, make main pressing solidly afterwards lap fuse mutually.

Compared with prior art, the present invention has following advantage: because the anisotropic conductive film of disposable attaching has COG and FOG double duty simultaneously, therefore can simplify technological process greatly and avoid because the correlation function demonstration that secondary pollution caused is bad; And because disposable attaching or separately attach but be no ACF rim condition between COG-ACF and the FOG-ACF, can also solve the functional defect that prior art causes because of the metal pins line disconnection of ACF edge on glass.

Description of drawings

Fig. 1 is not for pasting the vertical view of the flat-panel monitor of ACF as yet;

Fig. 2 is not for pasting the end view of the flat-panel monitor of ACF as yet;

Fig. 3 is for attaching the vertical view of the flat-panel monitor of COG-FOG dual purpose ACF;

Fig. 4 is to be the end view that has attached the flat-panel monitor of COG-FOG dual purpose ACF;

Fig. 5 goes up the vertical view of the flat-panel monitor of IC for attaching COG-FOG dual purpose ACF and binding;

Fig. 6 goes up the end view of the flat-panel monitor of IC for attaching COG-FOG dual purpose ACF and binding;

Fig. 7 goes up the vertical view of the flat-panel monitor of IC and FPC for attaching COG-FOG dual purpose ACF and binding;

Fig. 8 goes up the end view of the flat-panel monitor of IC and FPC for attaching COG-FOG dual purpose ACF and binding;

Fig. 9 is through be the vertical view of no ACF edge signal legend after main the pressure between COG-ACF and FOG-ACF;

Figure 10 is through be the end view of no ACF edge signal legend after main the pressure between COG-ACF and FOG-ACF.

Label declaration in the accompanying drawing: the 1. metal lead wire zone of flat-panel monitor; 11. integrated circuit (IC) chip binding pin position; 12. Flexible Printed Circuit binding pin position; 3. anisotropy conducting film; 4. integrated circuit (IC) chip; 5. Flexible Printed Circuit; 61. flat panel display glass protecgulum; 62. flat panel display glass bonnet; 7. flat-panel monitor liquid crystal cell.

Embodiment

Below in conjunction with the drawings and specific embodiments technical scheme of the present invention is elaborated.

1, the technological process embodiment of COG-FOG dual purpose ACF of the present invention

See figures.1.and.2, be ready to can above machine flat-panel monitor is formed by glass protecgulum (61), glass back cover (62) and middle liquid crystal cell (7), have integrated circuit (IC) chip (IC) to bind pin position 11 in the metal lead wire zone of its underpart (the ITO pin field) 1 and Flexible Printed Circuit (FPC) is bound pin position 12; Behind the last machine, paste anisotropic conductive film (ACF) 3, be the COG-FOG dual purpose ACF 3 that attaches under the condition of certain pressure, uniform temperature and certain hour on the metal pins zone 1 as shown in Figure 3 and Figure 4, ACF 3 has covered the binding pin position 11 of integrated circuit chip (IC) 4 and the zone of FPC binding pin position 12; Bind IC 4 then, after IC 4 contrapositions are correct, on COG-FOG dual purpose ACF 3, bind IC 4, as shown in Figure 5 and Figure 6; Bind FPC 5 at last again, promptly FPC 5 is carried out contraposition and binding FPC 5 on the FPC of COG-FOG dual purpose ACF 3 binding pin position 12; And then described IC 4 and FPC 5 led pressure (Fig. 7 and Fig. 8), final curing ACF 3 makes described IC 4 and described FPC 5 and flat-panel monitor conducting.More than operation all can be carried out on a machine.

2, the embodiment that is no ACF edge between COG-ACF and the FOG-ACF

With reference to Fig. 9 and Figure 10, COG-ACF need use the COG-ACF of big width, attaches toward FPC pin direction when attaching as far as possible, when attaching FOG-ACF fraction is covered on the COG-ACF; Flow process afterwards is identical with the flow process of Fig. 5 to Fig. 8; COG-ACF and FOG-ACF two class ACF are after finishing main pressing solidly, and contact portion fuses mutually, does not have the ACF gap between the two, is no ACF rim condition.The shape of ACF shown in Figure 9 is only for reference, and specifically the shape that attaches with reality is as the criterion.The metal pins line that the method that is no ACF edge between COG-ACF of the present invention and the FOG-ACF can solve because of ACF edge on glass disconnects the functional defect problem that causes.

Claims

1. a process of binding integrated circuit chip and Flexible Printed Circuit on flat-panel monitor is characterized in that this process comprises the steps:

A. attach anisotropic conductive film (3) in the metal lead wire zone (1) of flat-panel monitor, and make this anisotropic conductive film (3) can cover the binding pin position (12) of integrated circuit chip binding pin position (11) and Flexible Printed Circuit;

B. integrated circuit chip (4) is bundled in described anisotropic conductive film (3) on described integrated circuit chip binding pin position (11);

C. again Flexible Printed Circuit (5) is bundled in described anisotropic conductive film (3) on the binding pin position (12) of described Flexible Printed Circuit;

D. integrated circuit chip (4) and Flexible Printed Circuit (5) are led pressure, solidify described anisotropic conductive film (3), make described integrated circuit chip (4) and Flexible Printed Circuit (5) and described flat-panel monitor conducting, and allow anisotropic conductive film (3) between described integrated circuit chip (4) and Flexible Printed Circuit (5) be the state at no anisotropic conductive film edge.

2. process of on flat-panel monitor, binding integrated circuit chip and Flexible Printed Circuit according to claim 1, it is characterized in that: the described attaching anisotropic conductive film of step a (3) is the anisotropic conductive film (3) that whole of disposable attaching can cover the binding pin position (12) of integrated circuit chip binding pin position (11) and Flexible Printed Circuit, perhaps be divided into twice and attach the binding pin position (12) that the integrated circuit chip is bound pin position (11) and Flexible Printed Circuit respectively with anisotropic conductive film of binding the integrated circuit chip and the anisotropic conductive film of binding Flexible Printed Circuit, and have at adjoiner a bit of overlapping, make main pressing solidly afterwards lap fuse mutually.

3. process of binding integrated circuit chip and Flexible Printed Circuit on flat-panel monitor according to claim 1, it is characterized in that: the order of described step b and step c can be put upside down.